JP5653990B2 - 半導体ウェハ表面保護用粘着テープの製造方法 - Google Patents

半導体ウェハ表面保護用粘着テープの製造方法 Download PDF

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Publication number
JP5653990B2
JP5653990B2 JP2012268817A JP2012268817A JP5653990B2 JP 5653990 B2 JP5653990 B2 JP 5653990B2 JP 2012268817 A JP2012268817 A JP 2012268817A JP 2012268817 A JP2012268817 A JP 2012268817A JP 5653990 B2 JP5653990 B2 JP 5653990B2
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Prior art keywords
meth
semiconductor wafer
pressure
sensitive adhesive
adhesive tape
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JP2012268817A
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Japanese (ja)
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JP2014116431A (ja
JP2014116431A5 (https=
Inventor
啓時 横井
啓時 横井
具朗 内山
具朗 内山
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2012268817A priority Critical patent/JP5653990B2/ja
Priority to CN201380006924.6A priority patent/CN104093802B/zh
Priority to PCT/JP2013/053289 priority patent/WO2013122060A1/ja
Priority to KR1020147020878A priority patent/KR101985049B1/ko
Priority to TW102105503A priority patent/TWI500732B/zh
Publication of JP2014116431A publication Critical patent/JP2014116431A/ja
Publication of JP2014116431A5 publication Critical patent/JP2014116431A5/ja
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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012268817A 2012-02-17 2012-12-07 半導体ウェハ表面保護用粘着テープの製造方法 Active JP5653990B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012268817A JP5653990B2 (ja) 2012-12-07 2012-12-07 半導体ウェハ表面保護用粘着テープの製造方法
CN201380006924.6A CN104093802B (zh) 2012-02-17 2013-02-12 半导体晶片表面保护用粘合带
PCT/JP2013/053289 WO2013122060A1 (ja) 2012-02-17 2013-02-12 半導体ウェハ表面保護用粘着テープ
KR1020147020878A KR101985049B1 (ko) 2012-02-17 2013-02-12 반도체 웨이퍼 표면 보호용 점착 테이프
TW102105503A TWI500732B (zh) 2012-02-17 2013-02-18 Insulating tape for semiconductor wafer surface protection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012268817A JP5653990B2 (ja) 2012-12-07 2012-12-07 半導体ウェハ表面保護用粘着テープの製造方法

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JP2014086918A Division JP5654157B2 (ja) 2014-04-18 2014-04-18 半導体ウェハ表面保護用粘着テープ

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JP2014116431A JP2014116431A (ja) 2014-06-26
JP2014116431A5 JP2014116431A5 (https=) 2014-08-07
JP5653990B2 true JP5653990B2 (ja) 2015-01-14

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JP2012268817A Active JP5653990B2 (ja) 2012-02-17 2012-12-07 半導体ウェハ表面保護用粘着テープの製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5718515B1 (ja) * 2014-01-23 2015-05-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
JP2016183241A (ja) * 2015-03-26 2016-10-20 株式会社サンエー化研 粘着剤組成物、並びにそれを用いた粘着フィルム及び表面保護シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919601B2 (ja) * 1990-11-21 1999-07-12 三井化学株式会社 ウエハ加工用フィルム
JPH10158617A (ja) * 1996-11-29 1998-06-16 Nitto Denko Corp 再剥離用水分散型感圧性接着剤組成物とこれを用いた再剥離用感圧性接着シ―ト類
JP4054113B2 (ja) * 1998-06-25 2008-02-27 三井化学株式会社 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
JP4663081B2 (ja) * 2000-09-06 2011-03-30 三井化学株式会社 半導体ウェハ裏面研削用粘着フィルム及びそれを用いる半導体ウェハ裏面研削方法
JP4054219B2 (ja) * 2002-05-22 2008-02-27 三井化学株式会社 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法

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