JP5651511B2 - フォトマスクのパターンの輪郭抽出方法、輪郭抽出装置 - Google Patents

フォトマスクのパターンの輪郭抽出方法、輪郭抽出装置 Download PDF

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Publication number
JP5651511B2
JP5651511B2 JP2011063354A JP2011063354A JP5651511B2 JP 5651511 B2 JP5651511 B2 JP 5651511B2 JP 2011063354 A JP2011063354 A JP 2011063354A JP 2011063354 A JP2011063354 A JP 2011063354A JP 5651511 B2 JP5651511 B2 JP 5651511B2
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Japan
Prior art keywords
edge
correction value
value acquisition
edge position
pattern
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Expired - Fee Related
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JP2011063354A
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English (en)
Japanese (ja)
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JP2012198436A5 (enExample
JP2012198436A (ja
Inventor
栄二 山中
栄二 山中
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Toshiba Corp
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Toshiba Corp
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Publication date
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Priority to JP2011063354A priority Critical patent/JP5651511B2/ja
Priority to US13/427,206 priority patent/US8873830B2/en
Publication of JP2012198436A publication Critical patent/JP2012198436A/ja
Publication of JP2012198436A5 publication Critical patent/JP2012198436A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G03F1/86—Inspecting by charged particle beam [CPB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011063354A 2011-03-22 2011-03-22 フォトマスクのパターンの輪郭抽出方法、輪郭抽出装置 Expired - Fee Related JP5651511B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011063354A JP5651511B2 (ja) 2011-03-22 2011-03-22 フォトマスクのパターンの輪郭抽出方法、輪郭抽出装置
US13/427,206 US8873830B2 (en) 2011-03-22 2012-03-22 Method for extracting contour of pattern on photo mask, contour extraction apparatus, method for guaranteeing photo mask, and method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011063354A JP5651511B2 (ja) 2011-03-22 2011-03-22 フォトマスクのパターンの輪郭抽出方法、輪郭抽出装置

Publications (3)

Publication Number Publication Date
JP2012198436A JP2012198436A (ja) 2012-10-18
JP2012198436A5 JP2012198436A5 (enExample) 2013-06-13
JP5651511B2 true JP5651511B2 (ja) 2015-01-14

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JP2011063354A Expired - Fee Related JP5651511B2 (ja) 2011-03-22 2011-03-22 フォトマスクのパターンの輪郭抽出方法、輪郭抽出装置

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US (1) US8873830B2 (enExample)
JP (1) JP5651511B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102085522B1 (ko) 2013-11-14 2020-03-06 삼성전자 주식회사 패턴의 결함 탐지 방법
DE102013020705B4 (de) * 2013-12-10 2018-01-25 Carl Zeiss Smt Gmbh Verfahren zur Untersuchung einer Maske
CN107533017B (zh) * 2015-03-23 2021-01-08 泰科英赛科技有限公司 与成像装置中失真校正相关的方法、系统和装置
US9928316B2 (en) 2015-03-26 2018-03-27 International Business Machines Corporation Process-metrology reproducibility bands for lithographic photomasks
US10354373B2 (en) 2017-04-26 2019-07-16 Kla-Tencor Corporation System and method for photomask alignment and orientation characterization based on notch detection
KR20230064407A (ko) * 2021-11-03 2023-05-10 삼성전자주식회사 머신 러닝 기반 마스크 레이아웃 보정 방법, 및 그 보정 방법을 포함한 마스크 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3512621B2 (ja) * 1998-02-24 2004-03-31 株式会社東芝 パターン寸法測定方法およびパターン寸法測定処理プログラムを記録した記録媒体
JP2005309140A (ja) 2004-04-22 2005-11-04 Toshiba Corp フォトマスク製造方法、フォトマスク欠陥修正箇所判定方法、及びフォトマスク欠陥修正箇所判定装置
US7313781B2 (en) 2004-05-28 2007-12-25 Kabushiki Kaisha Toshiba Image data correction method, lithography simulation method, image data correction system, program, mask and method of manufacturing a semiconductor device
JP4008934B2 (ja) * 2004-05-28 2007-11-14 株式会社東芝 画像データの補正方法、リソグラフィシミュレーション方法、プログラム及びマスク
JP5069814B2 (ja) * 2004-11-19 2012-11-07 株式会社ホロン 測定値の判定方法
JP4675854B2 (ja) 2006-07-25 2011-04-27 株式会社東芝 パターン評価方法と評価装置及びパターン評価プログラム
JP4856047B2 (ja) * 2007-11-12 2012-01-18 株式会社東芝 マスクパターン寸法検査方法およびマスクパターン寸法検査装置
JP4801697B2 (ja) 2008-06-09 2011-10-26 株式会社日立ハイテクノロジーズ 画像形成方法，画像形成装置、及びコンピュータプログラム
JP5386502B2 (ja) * 2008-11-05 2014-01-15 株式会社日立ハイテクノロジーズ パターン寸法計測方法及びそれを用いた走査電子顕微鏡
DE112008004172T5 (de) * 2008-12-26 2012-03-15 Advantest Corporation Strukturmessgerät und Strukturmessverfahren
JP2011043458A (ja) 2009-08-24 2011-03-03 Hitachi High-Technologies Corp パターン寸法計測方法及びそのシステム
DE112009002638T5 (de) * 2009-10-30 2012-05-16 Advantest Corp. Strukturmessgerät und Strukturmessverfahren

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Publication number Publication date
US8873830B2 (en) 2014-10-28
JP2012198436A (ja) 2012-10-18
US20120243772A1 (en) 2012-09-27

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