JP5647967B2 - プリント配線基板の製造方法、プリント配線基板 - Google Patents

プリント配線基板の製造方法、プリント配線基板 Download PDF

Info

Publication number
JP5647967B2
JP5647967B2 JP2011234664A JP2011234664A JP5647967B2 JP 5647967 B2 JP5647967 B2 JP 5647967B2 JP 2011234664 A JP2011234664 A JP 2011234664A JP 2011234664 A JP2011234664 A JP 2011234664A JP 5647967 B2 JP5647967 B2 JP 5647967B2
Authority
JP
Japan
Prior art keywords
copper
substrate
triazole
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011234664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012216759A (ja
Inventor
高一 南
高一 南
佐藤　真隆
真隆 佐藤
真也 荻窪
真也 荻窪
未奈子 原
未奈子 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2011234664A priority Critical patent/JP5647967B2/ja
Publication of JP2012216759A publication Critical patent/JP2012216759A/ja
Application granted granted Critical
Publication of JP5647967B2 publication Critical patent/JP5647967B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2011234664A 2010-11-05 2011-10-26 プリント配線基板の製造方法、プリント配線基板 Expired - Fee Related JP5647967B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011234664A JP5647967B2 (ja) 2010-11-05 2011-10-26 プリント配線基板の製造方法、プリント配線基板

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010248624 2010-11-05
JP2010248624 2010-11-05
JP2011071488 2011-03-29
JP2011071488 2011-03-29
JP2011234664A JP5647967B2 (ja) 2010-11-05 2011-10-26 プリント配線基板の製造方法、プリント配線基板

Publications (2)

Publication Number Publication Date
JP2012216759A JP2012216759A (ja) 2012-11-08
JP5647967B2 true JP5647967B2 (ja) 2015-01-07

Family

ID=46024375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011234664A Expired - Fee Related JP5647967B2 (ja) 2010-11-05 2011-10-26 プリント配線基板の製造方法、プリント配線基板

Country Status (5)

Country Link
JP (1) JP5647967B2 (ko)
KR (1) KR101590435B1 (ko)
CN (1) CN103202107B (ko)
TW (1) TWI508637B (ko)
WO (1) WO2012060260A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2736076A1 (en) * 2012-11-23 2014-05-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Apparatus and method for manufacturing a layered product
KR102104806B1 (ko) * 2016-01-29 2020-04-27 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 적층체의 제조 방법, 및 반도체 디바이스
TWI576030B (zh) * 2016-06-24 2017-03-21 南亞電路板股份有限公司 印刷電路板及其製作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266241A (ja) * 1985-05-21 1986-11-25 株式会社日立製作所 銅の表面処理法
JPS63160296A (ja) * 1986-12-23 1988-07-04 日立化成工業株式会社 印刷配線板の後処理方法
JPH01251785A (ja) * 1988-03-31 1989-10-06 Hitachi Chem Co Ltd 印刷配線板の後処理方法
JPH10321994A (ja) 1997-05-16 1998-12-04 Senju Metal Ind Co Ltd 電子機器の導電部におけるマイグレーション防止方法
JP3463045B2 (ja) * 2000-03-03 2003-11-05 Ｎｅｃエレクトロニクス株式会社 防食処理原液
JP2001257451A (ja) 2000-03-09 2001-09-21 Matsushita Electric Ind Co Ltd プリント配線板およびプリント配線板の製造方法
JP2005072276A (ja) * 2003-08-25 2005-03-17 Fujikura Ltd プリント配線板およびその製造方法
WO2009142126A1 (ja) * 2008-05-21 2009-11-26 日本高純度化学株式会社 はんだめっき用触媒付与液

Also Published As

Publication number Publication date
TW201220992A (en) 2012-05-16
KR20130132424A (ko) 2013-12-04
TWI508637B (zh) 2015-11-11
CN103202107A (zh) 2013-07-10
CN103202107B (zh) 2016-01-20
KR101590435B1 (ko) 2016-02-01
JP2012216759A (ja) 2012-11-08
WO2012060260A1 (ja) 2012-05-10

Similar Documents

Publication Publication Date Title
JP5667927B2 (ja) マイグレーション抑制層形成用処理液、および、マイグレーション抑制層を有する積層体の製造方法
TWI439364B (zh) A conductive layer and a base layer using the same, and a method of manufacturing the same
KR101156414B1 (ko) 프린트 배선 기판의 제조 방법 및 이 제조 방법에 의해 얻어진 프린트 배선 기판
JP5683516B2 (ja) プリント配線基板およびその製造方法、並びに、金属表面処理液
JP5647967B2 (ja) プリント配線基板の製造方法、プリント配線基板
JP4986081B2 (ja) プリント配線基板の製造方法
TWI630855B (zh) 積層體之蝕刻方法及使用其之印刷佈線基板之製造方法
JP2011166028A (ja) Ｃｏｆ基板の製造方法
WO2012161249A1 (ja) プリント配線基板、および、プリント配線基板を選択する方法
JP2013093359A (ja) 半導体チップ搭載用基板及びその製造方法
JP5938948B2 (ja) 半導体チップ搭載用基板及びその製造方法
JP2012231035A (ja) 成形回路基板およびその製造方法
JP5311070B2 (ja) 金属化ポリイミドフィルム、およびその評価方法
KR101324225B1 (ko) 인쇄회로기판의 제조방법
JP2012231034A (ja) ボンディングワイヤ、並びに、プリント回路板およびその製造方法
JP2008021942A (ja) 銅と樹脂の複合体製造方法
JP2012231033A (ja) 表面被覆配線付きプリント配線基板およびその製造方法
JP2013125797A (ja) 配線基板およびその製造方法、銀イオン拡散抑制層形成用水溶液
KR20100137362A (ko) 프린트 배선 기판 및 그 제조 방법
JP2011176034A (ja) フレキシブルプリント基板の製造方法とエッチング処理方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140715

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140717

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141028

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141110

R150 Certificate of patent or registration of utility model

Ref document number: 5647967

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees