JP5644573B2 - 押出成形用絶縁性熱伝導性樹脂組成物及びそれを用いた押出成形品 - Google Patents
押出成形用絶縁性熱伝導性樹脂組成物及びそれを用いた押出成形品 Download PDFInfo
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- JP5644573B2 JP5644573B2 JP2011031851A JP2011031851A JP5644573B2 JP 5644573 B2 JP5644573 B2 JP 5644573B2 JP 2011031851 A JP2011031851 A JP 2011031851A JP 2011031851 A JP2011031851 A JP 2011031851A JP 5644573 B2 JP5644573 B2 JP 5644573B2
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 19
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- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 11
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- 239000004417 polycarbonate Substances 0.000 claims description 9
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- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 5
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
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- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
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Description
実際に行った押出成形について述べる。使用した押出成形用絶縁性熱伝導性樹脂組成物は表1に記載の材料である。断面形状が長方形(35×4.5mm)の押出成形品を得られる金型を用い、押出成形を行った。成形機には単軸押出機(池貝、PMS40−28、L/D=28)を用いた。成形にはブレーカープレートを使用し、成形温度は240℃とした。成形機先端の吐出口近傍における樹脂温度が250℃以下となったとき、押出成形品の外観に荒れ、ざらつきがなくなった。また、このとき不良現象の一つとして知られるダイ出口近傍に異物がたまる現象の観測もされなかった。
前述の押出成形に続き、図4に示す形状で、異形押出成形を行った。図中において各部の寸法の単位はmmである。使用した材料、装置は実施例1と同様である。押出成形品の表面を走査型電子顕微鏡(SEM)で観察した結果を図5に示す。本金型を用いた成形では、吐出口の樹脂温度が240℃程度になったときに成形品外観の荒れ、ざらつきがなくなった(図5(a))。一方、吐出口の樹脂温度が250℃以上のとき、成形品表面に荒れ、ざらつきが観測された(図5(b))。
Claims (6)
- ポリカーボネートとポリアミド66のアロイからなる高分子マトリクス中に、全体に対して25体積%以上の熱伝導性無機フィラーと、少なくとも2種の押出成形性を改善するアクリル系成形改質助剤を配合し、前記アクリル系成形改質助剤は、1種以上のアクリル系高分子外部滑剤と、1種以上の溶融弾性を付加するアクリル系高分子加工助剤とを含み、該アクリル系高分子加工助剤の少なくとも1種はエポキシ基を含み、且つアクリル系成形改質助剤全体に対するエポキシ価が1.0meq/g以下の範囲にあり、熱伝導率を1W/m・K以上としたことを特徴とする押出成形用絶縁性熱伝導性樹脂組成物。
- 前記無機フィラーを窒化ホウ素、炭酸マグネシウム、水酸化マグネシウム、酸化亜鉛、シリカ、窒化アルミニウム、酸化アルミニウムの内から選ばれた1種又は2種以上の組み合わせとした請求項1記載の押出成形用絶縁性熱伝導性樹脂組成物。
- 前記アクリル系高分子加工助剤の少なくとも1種はエポキシ基を含み、アクリル系成形改質助剤全体に対するエポキシ価が0.5〜0.9meq/gの範囲にある請求項1又は2記載の押出成形用絶縁性熱伝導性樹脂組成物。
- 前記アクリル系高分子加工助剤として、重量平均分子量が50万〜300万の範囲にあり、ポリマーの分子鎖と絡み合うことによって擬似架橋状態を形成する高分子量アクリル重合体と、重量平均分子量が11,000程度であり、1.6〜2.3meq/gのエポキシ価をもつアクリル系エポキシ基含有ポリマーを用いてなる請求項1〜3何れか1項に記載の押出成形用絶縁性熱伝導性樹脂組成物。
- 280℃以上において、見かけのせん断速度が100s-1のとき、せん断応力が0.1MPa以上を示し、かつ見かけの粘度が103(Pa・s)以上である請求項1〜4何れか1項に記載の押出成形用絶縁性熱伝導性樹脂組成物。
- 請求項1〜5何れか1項に記載の押出成形用絶縁性熱伝導性樹脂組成物を用いて、成形機先端の吐出口近傍における樹脂温度が250℃以下で押出成形したLED照明に用いられる放熱部材であることを特徴とする押出成形品。
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