JP5640912B2 - コンタクトユニット、および、それを備えるプリント回路板用コネクタ - Google Patents
コンタクトユニット、および、それを備えるプリント回路板用コネクタ Download PDFInfo
- Publication number
- JP5640912B2 JP5640912B2 JP2011147319A JP2011147319A JP5640912B2 JP 5640912 B2 JP5640912 B2 JP 5640912B2 JP 2011147319 A JP2011147319 A JP 2011147319A JP 2011147319 A JP2011147319 A JP 2011147319A JP 5640912 B2 JP5640912 B2 JP 5640912B2
- Authority
- JP
- Japan
- Prior art keywords
- transmission
- contact
- printed circuit
- ground contact
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005540 biological transmission Effects 0.000 claims description 143
- 230000008054 signal transmission Effects 0.000 claims description 12
- 229920000106 Liquid crystal polymer Polymers 0.000 description 8
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 8
- 239000004697 Polyetherimide Substances 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 229920001601 polyetherimide Polymers 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011147319A JP5640912B2 (ja) | 2011-07-01 | 2011-07-01 | コンタクトユニット、および、それを備えるプリント回路板用コネクタ |
| US13/489,841 US8647151B2 (en) | 2011-07-01 | 2012-06-06 | Contact unit and printed circuit board connector having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011147319A JP5640912B2 (ja) | 2011-07-01 | 2011-07-01 | コンタクトユニット、および、それを備えるプリント回路板用コネクタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013016310A JP2013016310A (ja) | 2013-01-24 |
| JP2013016310A5 JP2013016310A5 (enExample) | 2014-02-20 |
| JP5640912B2 true JP5640912B2 (ja) | 2014-12-17 |
Family
ID=47391093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011147319A Expired - Fee Related JP5640912B2 (ja) | 2011-07-01 | 2011-07-01 | コンタクトユニット、および、それを備えるプリント回路板用コネクタ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8647151B2 (enExample) |
| JP (1) | JP5640912B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012138519A2 (en) * | 2011-04-04 | 2012-10-11 | Fci | Electrical connector |
| JP5904106B2 (ja) * | 2012-11-30 | 2016-04-13 | 日立金属株式会社 | ケーブルコネクタおよびケーブルアッセンブリならびにケーブルアッセンブリの製造方法 |
| JP5987721B2 (ja) * | 2013-02-15 | 2016-09-07 | 日立金属株式会社 | ケーブルコネクタおよびケーブルアッセンブリ |
| JP6112937B2 (ja) * | 2013-03-29 | 2017-04-12 | ヒロセ電機株式会社 | 中継電気コネクタ |
| DE102014223900A1 (de) * | 2014-11-24 | 2016-05-25 | Conti Temic Microelectronic Gmbh | Fahrzeug-Umfeld-Abtastung mittels eines phasengesteuerten Lasers |
| JP6145531B2 (ja) * | 2016-03-18 | 2017-06-14 | ヒロセ電機株式会社 | 中継電気コネクタ |
| JP2018010724A (ja) * | 2016-07-11 | 2018-01-18 | ヒロセ電機株式会社 | シールド板付き電気コネクタ |
| WO2018075777A1 (en) * | 2016-10-19 | 2018-04-26 | Amphenol Corporation | Compliant shield for very high speed, high density electrical interconnection |
| WO2021154702A1 (en) | 2020-01-27 | 2021-08-05 | Fci Usa Llc | High speed connector |
Family Cites Families (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4846727A (en) * | 1988-04-11 | 1989-07-11 | Amp Incorporated | Reference conductor for improving signal integrity in electrical connectors |
| US4975084A (en) * | 1988-10-17 | 1990-12-04 | Amp Incorporated | Electrical connector system |
| US5156554A (en) * | 1989-10-10 | 1992-10-20 | Itt Corporation | Connector interceptor plate arrangement |
| US5206656A (en) * | 1989-12-28 | 1993-04-27 | Hannan Peter W | Array antenna with forced excitation |
| US5243308A (en) * | 1992-04-03 | 1993-09-07 | Digital Equipment Corporation | Combined differential-mode and common-mode noise filter |
| US5215473A (en) * | 1992-05-05 | 1993-06-01 | Molex Incorporated | High speed guarded cavity backplane connector |
| JP3108239B2 (ja) * | 1993-02-19 | 2000-11-13 | 富士通株式会社 | インピーダンス整合型電気コネクタ |
| JP4031057B2 (ja) * | 1997-07-29 | 2008-01-09 | ハイブリコン コーポレーション | 改善されたクロストークと信号送信特性を持つコネクタ |
| US6394822B1 (en) * | 1998-11-24 | 2002-05-28 | Teradyne, Inc. | Electrical connector |
| US7037268B1 (en) * | 1999-03-01 | 2006-05-02 | Medacoustics, Inc. | Low profile acoustic sensor arry and sensors with pleated transmission lines and related methods |
| US6203376B1 (en) * | 1999-12-15 | 2001-03-20 | Molex Incorporated | Cable wafer connector with integrated strain relief |
| WO2001057963A2 (en) * | 2000-02-03 | 2001-08-09 | Teradyne, Inc. | High speed pressure mount connector |
| CN1322635C (zh) * | 2000-02-03 | 2007-06-20 | 泰拉丁公司 | 带屏蔽的连接器 |
| JP3491064B2 (ja) * | 2000-10-20 | 2004-01-26 | 日本航空電子工業株式会社 | 高速伝送用コネクタ |
| US6623302B2 (en) * | 2000-12-21 | 2003-09-23 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having printed substrates therein electrically contacting conductive contacts thereof by solderless |
| US6663401B2 (en) * | 2000-12-21 | 2003-12-16 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
| US6409543B1 (en) * | 2001-01-25 | 2002-06-25 | Teradyne, Inc. | Connector molding method and shielded waferized connector made therefrom |
| US6461202B2 (en) * | 2001-01-30 | 2002-10-08 | Tyco Electronics Corporation | Terminal module having open side for enhanced electrical performance |
| US6540522B2 (en) * | 2001-04-26 | 2003-04-01 | Tyco Electronics Corporation | Electrical connector assembly for orthogonally mating circuit boards |
| US6551140B2 (en) * | 2001-05-09 | 2003-04-22 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having differential pair terminals with equal length |
| US6692272B2 (en) * | 2001-11-14 | 2004-02-17 | Fci Americas Technology, Inc. | High speed electrical connector |
| JP4373215B2 (ja) * | 2001-11-14 | 2009-11-25 | エフシーアイ | 電気コネクタのためのクロストーク低減 |
| US7390200B2 (en) * | 2001-11-14 | 2008-06-24 | Fci Americas Technology, Inc. | High speed differential transmission structures without grounds |
| US6979215B2 (en) * | 2001-11-28 | 2005-12-27 | Molex Incorporated | High-density connector assembly with flexural capabilities |
| US6612856B1 (en) * | 2001-12-17 | 2003-09-02 | 3Com Corporation | Apparatus and methods for preventing cable-discharge damage to electronic equipment |
| NL1020115C2 (nl) * | 2002-03-05 | 2003-09-08 | Framatome Connectors Int | Connector die geschikt is voor het koppelen aan een header met één of meer zijmassapennen en connectorsamenstel omvattende dergelijke connectors. |
| US6705895B2 (en) * | 2002-04-25 | 2004-03-16 | Tyco Electronics Corporation | Orthogonal interface for connecting circuit boards carrying differential pairs |
| US6645009B1 (en) * | 2002-06-04 | 2003-11-11 | Hon Hai Precision Ind. Co., Ltd. | High density electrical connector with lead-in device |
| US6638079B1 (en) * | 2002-05-21 | 2003-10-28 | Hon Hai Precision Ind. Co., Ltd. | Customizable electrical connector |
| US6638110B1 (en) * | 2002-05-22 | 2003-10-28 | Hon Hai Precision Ind. Co., Ltd. | High density electrical connector |
| US6682369B1 (en) * | 2002-09-18 | 2004-01-27 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having retention system for precisely mounting plural boards therein |
| DE10245813A1 (de) * | 2002-10-01 | 2004-04-15 | Lindenmeier, Heinz, Prof. Dr.-Ing. | Aktive Breitbandempfangsantenne mit Empfangspegelregelung |
| JP3964353B2 (ja) * | 2003-05-22 | 2007-08-22 | タイコエレクトロニクスアンプ株式会社 | コネクタ組立体 |
| US7083432B2 (en) * | 2003-08-06 | 2006-08-01 | Fci Americas Technology, Inc. | Retention member for connector system |
| US6808419B1 (en) * | 2003-08-29 | 2004-10-26 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having enhanced electrical performance |
| US6884117B2 (en) * | 2003-08-29 | 2005-04-26 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having circuit board modules positioned between metal stiffener and a housing |
| US6872085B1 (en) * | 2003-09-30 | 2005-03-29 | Teradyne, Inc. | High speed, high density electrical connector assembly |
| US7108556B2 (en) * | 2004-07-01 | 2006-09-19 | Amphenol Corporation | Midplane especially applicable to an orthogonal architecture electronic system |
| US7131870B2 (en) * | 2005-02-07 | 2006-11-07 | Tyco Electronics Corporation | Electrical connector |
| US6986682B1 (en) * | 2005-05-11 | 2006-01-17 | Myoungsoo Jeon | High speed connector assembly with laterally displaceable head portion |
| US7163421B1 (en) * | 2005-06-30 | 2007-01-16 | Amphenol Corporation | High speed high density electrical connector |
| US7316585B2 (en) * | 2006-05-30 | 2008-01-08 | Fci Americas Technology, Inc. | Reducing suck-out insertion loss |
| US7708569B2 (en) * | 2006-10-30 | 2010-05-04 | Fci Americas Technology, Inc. | Broadside-coupled signal pair configurations for electrical connectors |
| WO2008124054A2 (en) * | 2007-04-04 | 2008-10-16 | Amphenol Corporation | Differential electrical connector with skew control |
| US7794278B2 (en) * | 2007-04-04 | 2010-09-14 | Amphenol Corporation | Electrical connector lead frame |
| JP5019174B2 (ja) * | 2007-08-03 | 2012-09-05 | 山一電機株式会社 | 高速伝送用コネクタ |
| JP4565031B2 (ja) | 2008-09-17 | 2010-10-20 | 山一電機株式会社 | 高速伝送用コネクタ、高速伝送コネクタ用プラグ、および、高速伝送コネクタ用ソケット |
| JP4629133B2 (ja) | 2008-09-22 | 2011-02-09 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
| US8172614B2 (en) * | 2009-02-04 | 2012-05-08 | Amphenol Corporation | Differential electrical connector with improved skew control |
| JP4919362B2 (ja) * | 2009-09-30 | 2012-04-18 | ヒロセ電機株式会社 | 電気コネクタ |
-
2011
- 2011-07-01 JP JP2011147319A patent/JP5640912B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-06 US US13/489,841 patent/US8647151B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US8647151B2 (en) | 2014-02-11 |
| JP2013016310A (ja) | 2013-01-24 |
| US20130005165A1 (en) | 2013-01-03 |
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Legal Events
| Date | Code | Title | Description |
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| A072 | Dismissal of procedure [no reply to invitation to correct request for examination] |
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| A977 | Report on retrieval |
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| LAPS | Cancellation because of no payment of annual fees |