JP5639617B2 - 貼付装置および貼付方法 - Google Patents

貼付装置および貼付方法 Download PDF

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Publication number
JP5639617B2
JP5639617B2 JP2012110098A JP2012110098A JP5639617B2 JP 5639617 B2 JP5639617 B2 JP 5639617B2 JP 2012110098 A JP2012110098 A JP 2012110098A JP 2012110098 A JP2012110098 A JP 2012110098A JP 5639617 B2 JP5639617 B2 JP 5639617B2
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JP
Japan
Prior art keywords
support
laminate
plate member
substrate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012110098A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013239499A (ja
JP2013239499A5 (enExample
Inventor
純一 桂川
純一 桂川
吉浩 稲尾
吉浩 稲尾
加藤　茂
茂 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2012110098A priority Critical patent/JP5639617B2/ja
Priority to PCT/JP2013/062408 priority patent/WO2013168611A1/ja
Priority to KR20147034704A priority patent/KR101508892B1/ko
Priority to TW102115907A priority patent/TWI499508B/zh
Publication of JP2013239499A publication Critical patent/JP2013239499A/ja
Publication of JP2013239499A5 publication Critical patent/JP2013239499A5/ja
Application granted granted Critical
Publication of JP5639617B2 publication Critical patent/JP5639617B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/32—Discharging presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Press Drives And Press Lines (AREA)
JP2012110098A 2012-05-11 2012-05-11 貼付装置および貼付方法 Active JP5639617B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012110098A JP5639617B2 (ja) 2012-05-11 2012-05-11 貼付装置および貼付方法
PCT/JP2013/062408 WO2013168611A1 (ja) 2012-05-11 2013-04-26 貼付装置および貼付方法
KR20147034704A KR101508892B1 (ko) 2012-05-11 2013-04-26 첩부 장치 및 첩부 방법
TW102115907A TWI499508B (zh) 2012-05-11 2013-05-03 貼附裝置及貼附方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012110098A JP5639617B2 (ja) 2012-05-11 2012-05-11 貼付装置および貼付方法

Publications (3)

Publication Number Publication Date
JP2013239499A JP2013239499A (ja) 2013-11-28
JP2013239499A5 JP2013239499A5 (enExample) 2014-11-06
JP5639617B2 true JP5639617B2 (ja) 2014-12-10

Family

ID=49550656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012110098A Active JP5639617B2 (ja) 2012-05-11 2012-05-11 貼付装置および貼付方法

Country Status (4)

Country Link
JP (1) JP5639617B2 (enExample)
KR (1) KR101508892B1 (enExample)
TW (1) TWI499508B (enExample)
WO (1) WO2013168611A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6291275B2 (ja) * 2014-02-13 2018-03-14 東京応化工業株式会社 貼付方法
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
CN114966145A (zh) * 2021-02-25 2022-08-30 上海为彪汽配制造有限公司 接触式ict测试针床及其测试方法
CN115195264B (zh) * 2022-08-01 2024-01-19 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 叠压工作台及叠压机

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP2005191535A (ja) * 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
JP4751612B2 (ja) * 2004-12-28 2011-08-17 芝浦メカトロニクス株式会社 基板貼り合わせ装置及び基板貼り合わせ方法
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
JP4671841B2 (ja) * 2005-11-09 2011-04-20 パナソニック株式会社 対象物間の脱ガス方法および脱ガス装置
JP4781802B2 (ja) * 2005-12-06 2011-09-28 東京応化工業株式会社 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
TWM317916U (en) * 2006-11-13 2007-09-01 Cheng Uei Prec Ind Co Ltd An organ of quickly mold change
JP2010010207A (ja) * 2008-06-24 2010-01-14 Tokyo Ohka Kogyo Co Ltd 剥離装置および剥離方法
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
KR101037633B1 (ko) * 2008-11-25 2011-05-30 세메스 주식회사 기판처리방법

Also Published As

Publication number Publication date
JP2013239499A (ja) 2013-11-28
KR101508892B1 (ko) 2015-04-07
TWI499508B (zh) 2015-09-11
KR20150005715A (ko) 2015-01-14
TW201404596A (zh) 2014-02-01
WO2013168611A1 (ja) 2013-11-14

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