JP5626666B2 - ドアバルブ - Google Patents
ドアバルブ Download PDFInfo
- Publication number
- JP5626666B2 JP5626666B2 JP2012548869A JP2012548869A JP5626666B2 JP 5626666 B2 JP5626666 B2 JP 5626666B2 JP 2012548869 A JP2012548869 A JP 2012548869A JP 2012548869 A JP2012548869 A JP 2012548869A JP 5626666 B2 JP5626666 B2 JP 5626666B2
- Authority
- JP
- Japan
- Prior art keywords
- compressed air
- flow path
- piston
- cylinder
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Actuator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sliding Valves (AREA)
- Details Of Valves (AREA)
- Fluid-Driven Valves (AREA)
- Check Valves (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0004247 | 2010-01-18 | ||
| KR1020100004247A KR100994761B1 (ko) | 2009-10-16 | 2010-01-18 | 도어밸브 |
| PCT/KR2010/004000 WO2011087190A1 (fr) | 2010-01-18 | 2010-06-21 | Vanne à clapet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013529369A JP2013529369A (ja) | 2013-07-18 |
| JP5626666B2 true JP5626666B2 (ja) | 2014-11-19 |
Family
ID=44305031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012548869A Active JP5626666B2 (ja) | 2010-01-18 | 2010-06-21 | ドアバルブ |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5626666B2 (fr) |
| CN (1) | CN102668022B (fr) |
| WO (1) | WO2011087190A1 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9086172B2 (en) * | 2012-07-19 | 2015-07-21 | Vat Holding Ag | Vacuum valve |
| US9086173B2 (en) | 2012-07-19 | 2015-07-21 | Vat Holding Ag | Vacuum valve |
| JP6150388B2 (ja) * | 2013-06-05 | 2017-06-21 | 入江工研株式会社 | ゲートバルブ及びチャンバ |
| TWI656293B (zh) * | 2014-04-25 | 2019-04-11 | 瑞士商Ｖａｔ控股股份有限公司 | 閥 |
| JP7245724B2 (ja) * | 2019-06-06 | 2023-03-24 | 入江工研株式会社 | 弁体および真空ゲートバルブ |
| JP7089245B1 (ja) | 2020-12-22 | 2022-06-22 | Smc株式会社 | デュアルゲートバルブ |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0343496Y2 (fr) * | 1987-11-25 | 1991-09-11 | ||
| JP3256490B2 (ja) * | 1998-05-14 | 2002-02-12 | イーグル工業株式会社 | ゲートバルブ |
| JP2000028013A (ja) * | 1998-07-13 | 2000-01-25 | Ckd Corp | ゲート式真空遮断弁 |
| US6913243B1 (en) * | 2000-03-30 | 2005-07-05 | Lam Research Corporation | Unitary slot valve actuator with dual valves |
| JP3425938B2 (ja) * | 2000-12-14 | 2003-07-14 | 入江工研株式会社 | ゲート弁 |
| JP3696103B2 (ja) * | 2001-02-23 | 2005-09-14 | Ｓｍｃ株式会社 | クッション機構付きシリンダにおける高速加圧方法及びその機構 |
| JP2004257527A (ja) * | 2003-02-27 | 2004-09-16 | Nippon Valqua Ind Ltd | 真空用ゲート弁およびシール部材の装着方法 |
| KR100448174B1 (ko) * | 2003-10-15 | 2004-09-13 | 주식회사 에스티에스 | 슬릿밸브 |
| KR100596332B1 (ko) * | 2004-01-05 | 2006-07-06 | 주식회사 에이디피엔지니어링 | 게이트 밸브 |
| KR200380587Y1 (ko) * | 2004-12-28 | 2005-03-31 | 아이시스(주) | 게이트 밸브 |
| KR20070113122A (ko) * | 2006-05-24 | 2007-11-28 | 배트 홀딩 아게 | 벽 내의 개구부의 진공 밀봉 폐쇄를 위한 폐쇄장치 |
| DE102006049724A1 (de) * | 2006-10-21 | 2008-04-24 | Robert Bosch Gmbh | Ventilanordnung mit Positionssensor |
| KR100772019B1 (ko) * | 2007-02-05 | 2007-10-31 | 주식회사 에스티에스 | 사각형 게이트 밸브 |
| US8763639B2 (en) * | 2007-05-18 | 2014-07-01 | Enfield Technologies, Llc | Electronically controlled valve and systems containing same |
| KR101017603B1 (ko) * | 2008-04-23 | 2011-02-28 | 프리시스 주식회사 | 양방향 게이트 밸브 |
-
2010
- 2010-06-21 CN CN201080055034.0A patent/CN102668022B/zh active Active
- 2010-06-21 WO PCT/KR2010/004000 patent/WO2011087190A1/fr active Application Filing
- 2010-06-21 JP JP2012548869A patent/JP5626666B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102668022A (zh) | 2012-09-12 |
| JP2013529369A (ja) | 2013-07-18 |
| CN102668022B (zh) | 2014-12-03 |
| WO2011087190A1 (fr) | 2011-07-21 |
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