WO2011087190A1 - Vanne à clapet - Google Patents

Vanne à clapet Download PDF

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Publication number
WO2011087190A1
WO2011087190A1 PCT/KR2010/004000 KR2010004000W WO2011087190A1 WO 2011087190 A1 WO2011087190 A1 WO 2011087190A1 KR 2010004000 W KR2010004000 W KR 2010004000W WO 2011087190 A1 WO2011087190 A1 WO 2011087190A1
Authority
WO
WIPO (PCT)
Prior art keywords
compressed air
piston
flow path
opening
closing member
Prior art date
Application number
PCT/KR2010/004000
Other languages
English (en)
Korean (ko)
Inventor
김배진
Original Assignee
프리시스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100004247A external-priority patent/KR100994761B1/ko
Application filed by 프리시스 주식회사 filed Critical 프리시스 주식회사
Priority to CN201080055034.0A priority Critical patent/CN102668022B/zh
Priority to JP2012548869A priority patent/JP5626666B2/ja
Priority to US13/511,637 priority patent/US8807527B2/en
Publication of WO2011087190A1 publication Critical patent/WO2011087190A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Definitions

  • the present invention relates to a door valve, and more particularly, an opening / closing actuator portion which controls the vertical movement of the opening / closing member and a forward / backward actuator portion which controls the movement in the front-back direction is provided. It relates to a door valve to be operated in the L (L) motion.
  • the present applicant improves the arrangement of the sealing material disposed around the wafer movement passage through Patent Application No. 10-2003-0071906 (name of the slit valve) to prevent the damage of the sealing material sealing the movement passage and mounted on the valve drive
  • the slit valve which can confirm the operation state by the indicator device is applied.
  • the slit valve of the present application is a sealing member 100 for opening and closing the wafer movement passage, and the housing bracket formed separately from the sealing member 100 ( 200, the main shaft 400 extending between the sealing member 100 and the housing bracket 200, and the air cylinder 310 formed in the housing bracket 200 and driven by air pressure.
  • a piston 320 formed inside the air cylinder 310, a piston shaft 330 coupled to the piston 320, a moving unit 340 coupled to the piston shaft 330, and the moving portion.
  • a valve driving unit 300 having a link coupled to the unit 340 and the main shaft 340 is provided.
  • the piston 320 of the air cylinder 310 formed inside the housing bracket 200 is rotated up and down according to the change in the pressure of the compressed air input from the outside. Accordingly, the moving unit 340 rotates up and down simultaneously with the piston, and the main shaft 400 connected to the moving unit 340 via the link 350 also rotates to open the wafer movement path to the sealing member 100. Open and close.
  • valve driving unit 300 of the slit valve as shown in FIG. 2 is a one-step operation to vertically rotate the main shaft 400 and the main shaft 400 is rotated vertically forward and backward to the closed Two-step operation of opening and closing the semiconductor wafer movement path with the member 100, that is, it is driven in the shape of the L (L), the guide groove is formed in the shape of the L (L) to drive the L (L) as described above have.
  • the link 350 is structurally rotated, the L-shaped shape of the conventional slit valve, that is, the linear L-shaped guide groove, guides the correct L-shaped motion of the valve driving part 300. There was a problem that was not easy.
  • an O-ring made of a rubber material is installed in a groove on the contact surface of the opening / closing member that opens and closes the semiconductor wafer movement path by the link as described above.
  • fine rotation is performed on the upper (or lower) O-ring. Is generated. Accordingly, the rotation of the O-ring is installed in the groove by the rotation of the O-ring, there was a fear that the departure or hardening from the groove.
  • an object of the present invention is to open and close the wafer movement path is provided with a vertical actuating actuator portion for controlling the vertical movement of the opening and closing member and the forward and backward actuator portion for controlling the movement of the front and rear direction.
  • the opening and closing member is to provide a door valve to be accurately operated in the L (L) motion.
  • the door valve according to the present invention the opening and closing member 100 for opening and closing the semiconductor wafer movement passage; And, installed on the back of the opening and closing member 100, the inner side of the first passage ( A first cylinder 210 having a second flow path 2 formed at a front side thereof and a cover 221 is installed at a front side thereof is installed inside the first cylinder 210, and the first flow path is formed in the first cylinder 210.
  • the first compressed air inlet hole 340 is formed so that the compressed air flows in when the wafer movement path is closed); and the second piston 320 by the compressed air introduced from the first compressed air inlet hole 340.
  • the fifth passage (5) connected to the lower portion of the second cylinder 310 from the first compressed air inlet hole 340 so as to move upwardly; and by the compressed air introduced into the fifth passage (5)
  • a relief valve R1 that is selectively opened when the second piston 320 reaches a top dead center and a check valve C1 that is selectively opened when the second piston 320 reaches a bottom dead center are installed.
  • the first compressed air inlet through hole 340 and the fifth channel 5 move the compressed air to the first channel 1.
  • a sixth flow passage (6) communicating with the first flow passage (1): a vertical actuating actuator portion (300) provided thereon.
  • the opening and closing member 100 for opening and closing the semiconductor wafer movement passage is installed on the back of the opening and closing member 100, A first cylinder 210 having a first flow path 1 formed at an inner rear side and a second flow path 2 formed at a front side thereof, and having a cover 221 provided at a front side thereof, and inside the first cylinder 210.
  • a first piston 220 installed and operated back and forth by compressed air flowing into the first flow passage 1 and the second flow passage 2; and connecting the first piston 220 and the opening and closing member 100 to each other.
  • compressed air is introduced to open the wafer movement path by the opening / closing member 100, and is installed to communicate with the fourth flow passage 4 and the second flow passage 2 in the vertical operation actuator 300.
  • a relief valve R2 that is selectively opened and a check valve C2 that is selectively opened when the first piston 220 reaches a bottom dead center are installed, and when the relief valve R2 is opened, It characterized in that it further comprises; a seventh flow path (7) formed so that the compressed air flows into the upper side of the two cylinder (320).
  • the magnet member 321 which is installed in the second piston 320; and is installed in the up and down actuator actuator 300, the magnet member 321 is detected by the position of the second piston 320 It characterized in that it further comprises a; magnetic sensor 360 for detecting the.
  • the vertical actuating actuator 300 is installed on the upper and lower surfaces of the second piston 320 in contact with the upper and lower surfaces of the forward and backward actuator 200 which is operated up and down by the vertical actuating actuator unit 300.
  • a touch sensor 361 for detecting the position.
  • a bellows 400 is provided between the opening and closing member 100 and the forward and backward actuator unit 200, and between the forward and backward actuator unit 200 and the up and down actuator unit 300, respectively. It is characterized by.
  • an upper cover 301 and a lower cover 302 for sealing the second cylinder 310 on the upper and lower portions of the up and down actuator unit 300; and formed on the upper cover 301, the A guide part 303 for guiding the upper and lower shafts 330; and installed in the guide part 303 to be in contact with the outer circumferential surface of the upper and lower shafts 330, depending on the load of the opening / closing member 100. It characterized in that it further comprises; bushing 304 to prevent the wear of the upper and lower shafts 330 and the guide portion 303 when the eccentricity occurs.
  • check valve (C1, C2) is characterized in that the rapid exhaust valve.
  • the opening and closing member for opening and closing the wafer movement path is provided with a vertical actuating actuator portion for controlling the vertical movement of the opening and closing member and the forward and backward actuator portion for controlling the movement in the front and rear direction is precisely L (L). It has the advantage of being operated in motion.
  • FIG. 1 is a cross-sectional view of a conventional slit valve
  • Figure 2 is a state diagram showing the movement of the link of the conventional slit valve
  • FIG. 3 is a front perspective view of a door valve according to a preferred embodiment of the present invention.
  • FIG. 4 is a rear perspective view of the door valve according to the preferred embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of FIG. 3;
  • FIG. 6 is a front and A-A, B-B cross-sectional view of the forward and backward actuator portion of the door valve according to the preferred embodiment of the present invention
  • Figure 7 is a cross-sectional perspective view of the A-A cross section and B-B cross section of Figure 6,
  • FIG. 8 is a cross-sectional view, a planar view, and a bottom view of a vertical actuating actuator of a door valve according to a preferred embodiment of the present invention
  • FIG. 9 is a cross-sectional perspective view of the C-C section of FIG. 8, FIG.
  • 10 to 13 is a side view showing a state in which the present invention works
  • 15 is a cross-sectional view taken along line E-E of FIG.
  • 16 to 17 are cross-sectional views of the forward and backward state of the forward and backward actuator
  • 18 to 20 are cross-sectional views of a state in which the present invention is restored to the initial state while opening the semiconductor wafer movement passage.
  • Figure 3 is a front perspective view of the door valve according to a preferred embodiment of the present invention
  • Figure 4 is a rear perspective view of the door valve according to a preferred embodiment of the present invention
  • Figure 5 is an exploded perspective view of Figure 3
  • Figure 6 is a preferred view of the present invention
  • Figure 7 is a cross-sectional perspective view of the AA cross-section of Figure 6 and a cross-sectional perspective view of the BB cross-section
  • Figure 8 is a view of the door valve according to a preferred embodiment of the present invention Sectional, top and bottom views of a vertical actuating actuator
  • FIG. 9 is a cross-sectional perspective view of section CC of FIG. 8.
  • the opening and closing member 100, the forward and backward actuator unit 200, the vertical actuating actuator unit 300 and includes a first flow path (1), the second flow path (2) , The third flow path (3), the fourth flow path (4), the fifth flow path (5), the sixth flow path (6), the seventh flow path (7), the first cylinder 210, the first piston 220, The second cylinder 310, the second piston 320, the magnet member 321, the upper and lower shaft 330, the first compressed air inlet hole 340, the second compressed air inlet hole 350, the magnetic sensor 360 ), The contact sensor 361 and the connection member (B) may be further included.
  • compressed air flows through the first to seventh flow paths to be described later, and the actuator unit 200 and the up and down actuator actuator 300 move forward and backward by the compressed air flowing into the first to seventh flow paths.
  • the opening and closing member 100 is installed at the front of the forward and backward actuator unit 200 to be described later to open or close the semiconductor wafer movement path (not shown) by moving forward or backward by the compressed air flowing into the forward and backward actuator unit 200.
  • the member to be formed it is preferable that an O-ring is provided on a surface of the semiconductor wafer movement path.
  • the forward and backward actuator unit 200 includes a first piston 220 and the first piston installed inside the first cylinder 210 and the first cylinder 210. It consists of a connecting member (B) coupled to the back of the opening and closing member 100 through the central portion of the 220, the connecting member (B) to transfer the front and rear movement of the first piston 220 to the opening and closing member Play a role.
  • the first cylinder 210 has a first flow path 1 formed at a rear side thereof and a second flow path 2 formed at a front side thereof. It is the front side.
  • the first piston 220 is installed inside the first cylinder 210, and the first piston 220 is operated only inside the first cylinder 210.
  • a cover 221 covering the front surface of the first cylinder 210 is installed.
  • the first piston 220 is moved back and forth. When the compressed air flows into the first flow passage 1, the first piston 220 moves forward, and when the compressed air flows into the second flow passage 2, the first piston 220 moves backward.
  • first piston 220 is a connecting member (B) is installed through the role of connecting the first piston 220 and the above-mentioned opening and closing member 100, such a connection member (B), for example, It is preferable to be made of bolts or coupling pins.
  • the opening and closing member 100 coupled to the first piston 220 through the connection member B is operated according to the forward and backward movement of the first piston 220 to open and close the semiconductor wafer movement path.
  • the up and down actuator unit 300 is composed of a second cylinder 310, the second piston 320, the upper and lower shaft 330, the first compressed air inlet hole 340, the second compressed air inlet hole 350. do.
  • the second cylinder 310 is installed inside the vertical actuating actuator part 300, and the second cylinder 310 is disposed inside the second cylinder 310.
  • the piston 320 is installed, and the upper and lower shafts 330 are installed at the center of the second piston 320.
  • the second piston 320 is a member installed inside the second cylinder 310 to be operated up and down by compressed air, the second piston 320 is the first compressed air inlet 340 and the second Compressed air is introduced in the vertical direction by the compressed air flowing into the inlet hole (350).
  • the upper and lower shafts 330 are connected to a central portion of the second piston 320 and the other side is connected to the forward and backward actuator unit 200. Accordingly, the upper and lower shafts 330 are formed of the second piston. The upward or downward movement is transmitted to the forward and backward actuator 200 to raise or lower the opening / closing member 100 to a height consistent with the semiconductor wafer movement path.
  • the first compressed air inflow hole 340 is a member into which compressed air at the time of closing the semiconductor wafer movement path of the opening / closing member 100 flows in the first compressed air inflow hole 340. Compressed air introduced into the) is supplied to the flow passage involved in the advancement of the opening and closing member 100 of the flow paths to be described later, a detailed description thereof will be described later.
  • the second compressed air inflow hole 350 plays a role opposite to that of the first compressed air inflow hole 340, that is, when the semiconductor wafer movement path of the opening and closing member 100 is opened. Compressed air flows in.
  • Compressed air introduced into the second compressed air inflow hole 350 as described above is supplied to a flow path that is involved in the backward of the opening and closing member 100 among the flow paths to be described later, which will be described later.
  • FIG. 10 to 13 is a side view showing the operation of the present invention
  • Figure 14 is a DD cross-sectional view of Figure 10
  • Figure 15 is an EE cross-sectional view of Figure 11
  • Figures 16 to 17 shows the forward and backward movement of the actuator 18 to 20 are cross-sectional views of a state in which the present invention is restored to the initial state while opening the semiconductor wafer movement passage.
  • the initial state which will be described later, is a state in which the opening and closing member 100 is completely moved downward as shown in FIGS. 10, 14, and 20.
  • first passage 1 is below the first cylinder 210
  • second passage 2 is above the first cylinder 210
  • third passage 3 is the two upper and lower shafts 330
  • fourth flow passage 4 is formed in the up and down direction inside the other up and down shaft among the two up and down shafts 330.
  • the fifth flow passage 5 is in communication with the first compressed air inlet through hole 340 and the sixth flow passage (6), but the sixth flow passage (6), the relief valve (R1) and the check valve that opens when a predetermined pressure or more occurs (C1) is provided, the seventh flow path (7) is in communication with the second compressed air inlet hole 350, the seventh flow path (7) is also provided with a relief valve (R2) and check valve (C1) have.
  • Compressed air flows into the first compressed air inlet hole 340 in an initial state.
  • the compressed air is introduced into the first compressed air inlet hole 340.
  • the fifth flow path 5 and the sixth flow path 6, which communicate with each other) and proceed from the state of FIGS. 10 and 14 to the state of FIGS. 11 and 15.
  • the fifth flow path 5 and the sixth flow path 6 are the same pressure, that is, the same pressure is generated, the sixth flow path 6, the relief valve (R1) that is selectively opened only when a predetermined pressure or more occurs Is installed so that the compressed air is first introduced into the fifth passage (5).
  • the relief valve (R1) is also installed in the seventh flow path (7) to be described later, these relief valves (R1, R2) are introduced into the first compressed air inlet through-hole 340 and the second compressed air inlet through (350) It is preferable to withstand the primary pressure generated by the flow of compressed air into the flow path and then open it at the end. Accordingly, in the design of the present invention, it would be desirable to appropriately select the repulsion coefficient of the spring installed in the relief valve R1.
  • the compressed air entering the fifth passage 5 flows into the lower portion of the second cylinder 310 communicating with the fifth passage 5, and thus compressed air flows into the second cylinder 310.
  • the vertical shaft 330 installed at the center of the second piston 320 is also moved upward.
  • the opening and closing member 100 connected through the first piston 220 and the connection member B is also advanced and the semiconductor wafer movement path is sealed, and this state is called a sealed state.
  • the opening and closing member 100 in order to move the semiconductor wafer in a sealed state, the opening and closing member 100 must open the semiconductor wafer movement passage, in which case the compressed air flows into the second compressed air inflow passage 350.
  • Compressed air introduced into the second compressed air inlet hole 350 as described above is simultaneously introduced into the fourth flow path 4 and the seventh flow path 7 formed inside the other upper and lower shafts, and the seventh flow path 7 Since the relief valve R2 is installed in the air, the compressed air flows into the fourth flow passage 4 first, and the compressed air introduced into the fourth flow passage 4 flows in communication with the fourth flow passage 4. Flows into (2).
  • the relief The valve R2 starts to open gradually, and compressed air flows into the upper side of the second cylinder 310 through the seventh flow passage 7 as shown in FIG. 20.
  • the compressed air flows in through the first compressed air inflow hole 340 so as to move backward and forward of the front and rear shafts 230 and the downward shaft 330.
  • the compressed air that was present is released to the outside, and this state is called an open state.
  • a magnet member 321 is installed on the second piston 320 so that the position of the top dead center or the bottom dead center of the second piston 320 can be checked from the outside, and the magnet member 321 is detected.
  • the sensor 360 may be provided in the up and down actuator unit 300.
  • the up and down actuator unit 300 is preferably installed so that the upper cover 301 on the upper portion of the up and down actuator actuator 300 to separate the lower cover 302 in the lower, so as to facilitate maintenance, It is preferable that a sealing member (O-ring) of rubber material (not shown) is installed at each coupling portion so as to keep the inside of the second cylinder 310 sealed.
  • the lower cover 302 is formed with a straw-shaped tube, which is coupled to communicate with the inside of the third passage 3 and the fourth passage 4 of the upper and lower shafts.
  • the vertical shaft 330 may be stably guided.
  • the tube is formed to have a length equal to or greater than a distance of vertical movement of the vertical shaft 330 so that the third passage 3 and the fourth passage 4 may be moved even when the second piston 320 is moved to the top dead center. It is preferred to communicate.
  • the upper cover 301 has a guide portion 303 upwardly projected to accurately guide the vertical movement of the upper and lower shafts 330. It is preferable that a sealing member (O-ring) of rubber material is installed inside to seal the second cylinder 310.
  • this bushing 304 is an eccentric generated when the front and rear of the opening and closing member 100 By reducing the stress generated by the contact between the upper and lower shafts 330 and the guide portion 303 and serves to seal the second cylinder 310 together with the sealing member.
  • the bushing 304 installed as described above is installed in a place where stress is directly generated, it may be made of a material having a relatively low hardness such as copper or plastic.
  • the bellows 400 is preferably provided between the upper end of the guide portion 303 and the forward and backward actuator unit 200 and between the opening and closing member 100 and the forward and backward actuator unit 200, respectively.
  • the bellows 400 serves to attenuate the vibration and noise generated during the operation of the present invention, as well as to protect the main part of the present invention from powder generated from the semiconductor manufacturing process during installation of the vacuum state. Do it.
  • the check valves C1 and C2 installed in the sixth flow path 6 and the seventh flow path 7 are members that open only in one direction, similar to the relief valves R1 and R2. C1 and C2 are opened when the compressed air introduced into the first compressed air inlet hole 340 and the second compressed air inlet hole 350 is discharged to the outside, and is opposite to the relief valves R1 and R2. Allow flow of fluid in the
  • the check valve (C1) is installed in the sixth flow path (6) is opened when the discharge of the compressed air introduced into the first compressed air inlet through hole 340, when switching from the closed state to the open state,
  • the check valve C2 installed in the seventh flow path 7 is opened when the compressed air introduced into the second compressed air inflow through hole 350 is discharged from the open state to the closed state.
  • check valves (C1, C2) may be replaced by a rapid exhaust valve, if it is replaced as described above, it will be able to open and close the semiconductor wafer movement path more quickly because the time consumed for exhaust is significantly reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Actuator (AREA)
  • Check Valves (AREA)
  • Fluid-Driven Valves (AREA)
  • Sliding Valves (AREA)
  • Details Of Valves (AREA)

Abstract

La présente invention concerne, d'une part une unité d'actionneur fonctionnant en montée et descente, qui gère les mouvements de montée et descente d'un élément d'ouverture et de fermeture, et d'autre part une unité d'actionneur avançant et reculant qui gère les mouvements d'avancée et de recul de l'élément d'ouverture et de fermeture, ces deux unités étant configurées de façon que l'élément d'ouverture et de fermeture, qui ouvre et ferme un chemin de déplacement de plaquette, puisse être mis en œuvre de façon précise selon un mouvement en L.
PCT/KR2010/004000 2009-10-16 2010-06-21 Vanne à clapet WO2011087190A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201080055034.0A CN102668022B (zh) 2010-01-18 2010-06-21 门阀
JP2012548869A JP5626666B2 (ja) 2010-01-18 2010-06-21 ドアバルブ
US13/511,637 US8807527B2 (en) 2009-10-16 2010-06-21 Door valve

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100004247A KR100994761B1 (ko) 2009-10-16 2010-01-18 도어밸브
KR10-2010-0004247 2010-01-18

Publications (1)

Publication Number Publication Date
WO2011087190A1 true WO2011087190A1 (fr) 2011-07-21

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PCT/KR2010/004000 WO2011087190A1 (fr) 2009-10-16 2010-06-21 Vanne à clapet

Country Status (3)

Country Link
JP (1) JP5626666B2 (fr)
CN (1) CN102668022B (fr)
WO (1) WO2011087190A1 (fr)

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CN103574084A (zh) * 2012-07-19 2014-02-12 Vat控股公司 真空阀
US9086173B2 (en) 2012-07-19 2015-07-21 Vat Holding Ag Vacuum valve

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JP6150388B2 (ja) * 2013-06-05 2017-06-21 入江工研株式会社 ゲートバルブ及びチャンバ
TWI656293B (zh) * 2014-04-25 2019-04-11 瑞士商Ｖａｔ控股股份有限公司 閥
JP7245724B2 (ja) * 2019-06-06 2023-03-24 入江工研株式会社 弁体および真空ゲートバルブ
JP7089245B1 (ja) 2020-12-22 2022-06-22 Smc株式会社 デュアルゲートバルブ

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KR20090112134A (ko) * 2008-04-23 2009-10-28 프리시스 주식회사 양방향 게이트 밸브

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103574084A (zh) * 2012-07-19 2014-02-12 Vat控股公司 真空阀
US9086173B2 (en) 2012-07-19 2015-07-21 Vat Holding Ag Vacuum valve
US9086172B2 (en) 2012-07-19 2015-07-21 Vat Holding Ag Vacuum valve
CN103574084B (zh) * 2012-07-19 2017-06-20 Vat 控股公司 真空阀

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CN102668022A (zh) 2012-09-12
JP5626666B2 (ja) 2014-11-19
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JP2013529369A (ja) 2013-07-18

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