JP5626666B2 - Door valve - Google Patents

Description

  The present invention relates to a door valve. More specifically, the present invention is provided with an up-and-down actuating actuator section that mainly controls the vertical movement of the opening and closing member and a forward-reverse actuator section that mainly controls the movement in the front-rear direction. The present invention relates to a door valve that is operated by an L (L) motion.

  The present applicant has improved the arrangement structure of the sealing material arranged around the wafer moving passage through patent application 10-2003-0071906 (invention name: slit valve) to prevent damage to the sealing material sealing the moving passage. And filed a slit valve capable of confirming the operating state with an indicating device attached to the valve drive unit.

  FIG. 1 shows a sectional view of a slit valve according to the prior art. The slit valve of the application includes a sealing member 100 that opens and closes a wafer moving path, a housing bracket 200 that is formed separately from the sealing member 100, and a main shaft that extends between the sealing member 100 and the housing bracket 200. 400, an air cylinder 310 formed in the housing bracket 200 and driven by air pressure, a piston 320 formed in the air cylinder 310, and a piston shaft 330 coupled to the piston 320. , A moving unit 340 coupled to the piston shaft 330 and a valve driving unit 300 including a link coupled to the moving unit 340 and the main shaft 340 are provided.

  In the slit valve as described above, the piston 320 of the air cylinder 310 formed inside the housing bracket 200 is rotated up and down in accordance with a change in the pressure of compressed air input from the outside. As a result, the moving unit 340 is rotated up and down simultaneously with the piston, and the main shaft 400 connected to the moving unit 340 via the link 350 is also rotated to open and close the wafer moving passage by the sealing member 100.

  In addition, as shown in FIG. 2, the valve driver 300 of the slit valve as described above has a one-step operation for vertically rotating the main shaft 400 and the main shaft 400 is rotated vertically forward and rearward. The two-stage operation of opening and closing the semiconductor wafer moving path with the sealing member 100, that is, driven in an L (L) shape, and as described above, the guide groove is moved in an L (L) shape. ) It is formed in a letter shape.

  However, since the link 350 is rotationally moved structurally, the valve drive unit 300 is moved in an accurate L (L) shape in a conventional slit valve L (L) shape, that is, in a guide groove of a linear locus. There was a problem that it was difficult to guide.

  In addition, as shown in FIG. 2, when the link 350 is guided by an L-shaped guide groove 351, stress concentration due to repeated friction occurs at the corners of the link and the guide groove, and the link becomes a guide groove. As shown in FIG. 2, there is a problem that a fine gap is generated and the operation of opening and closing the semiconductor wafer passage with the sealing member is difficult to be accurately controlled.

  In addition, an O-ring made of rubber is installed in the groove on the contact surface of the opening / closing member that opens and closes the semiconductor wafer moving path using the link as described above. When such an O-ring contacts the semiconductor wafer moving path, fine rotation is generated in the upper (or lower) O-ring. Accordingly, the rotation of the O-ring may cause the O-ring to rotate while being installed in the groove and be detached from the groove or hardened.

    The present invention has been created to solve the above-described problems, and an object of the present invention is to provide an up-and-down actuating actuator section that mainly controls the vertical movement of the opening and closing member, and a forward-reverse actuator section that mainly controls the back-and-forth movement. Is provided, and an opening and closing member that opens and closes the wafer moving passage is accurately operated by an L (L) motion.

  In order to solve the above-described problems, the door valve according to the present invention is installed on an opening / closing member 100 for opening / closing a semiconductor wafer moving path; Is formed, the second channel 2 is formed on the front side, the front cylinder 221 is provided with a cover 221 on the front side, and the first channel 1 subject 2 is installed inside the first cylinder 210. A forward / reverse actuator portion 200 provided with a first piston 220 that operates back and forth by compressed air flowing into the flow path 2 and a connecting member B that connects the first piston 220 and the opening / closing member 100; A plurality of second cylinders 310, a second piston 320 installed in the second cylinder 310 and operated up and down by compressed air, and one side of the second piston 310 320, the other side is connected to the forward / reverse actuator part 200, and the compressed air is flowed therein, and the third flow path 3 and the second flow path 2 communicated with the first flow path 1 An upper and lower shaft 330 in which the fourth flow path 4 to be communicated is formed, a first compressed air inflow through hole 340 formed so that compressed air is introduced when the wafer moving passage of the opening and closing member 100 is closed; The second piston 320 is connected from the first compressed air inflow hole 340 to the lower part of the second cylinder 310 so that the second piston 320 is moved upward by the compressed air flowing in from the first compressed air inflow hole 340. The relief valve R1 and the second piston 320 which are selectively opened when the second piston 320 reaches the top dead center by the five flow paths 5 and the compressed air flowing into the fifth flow path 5 are bottom dead. If the check valve C1 is opened selectively, the compressed air is moved to the first flow path 1 when the relief valve R1 is opened. And an up-and-down actuating actuator section 300 provided with a fifth flow path 5 and a sixth flow path 6 communicated with the first flow path 1.

  In order to solve the above-described problems, a door valve according to another embodiment of the present invention includes an opening / closing member 100 for opening / closing a semiconductor wafer moving passage; The first flow path 1 is formed on the side, the second flow path 2 is formed on the front side, the first cylinder 210 on which the cover 221 is installed on the front, and the first cylinder 210 is installed inside the first cylinder 210. 1st flow path 1 task 2 1st piston 220 which operates back and forth by compressed air which flows into flow path 2, connection member B which connects the 1st piston 220 and opening-and-closing member 100, and connection member B A forward / reverse actuator portion 200 provided with a rear cover 201 for sealing the outside from the outside; a plurality of second cylinders 310 formed inside; and the second cylinder 310 installed inside the second cylinder 310 The second piston 320 is operated up and down by compressed air, one side is connected to the second piston 320, the other side is connected to the forward / reverse actuator unit 200, and compressed air flows inside, An up-and-down actuating actuator section 300 provided with a third flow path 3 communicating with the first flow path 1 and an upper and lower shaft 330 formed with a fourth flow path 4 communicating with the second flow path 2; It is characterized by including.

  In addition, compressed air is introduced so that the wafer moving passage is opened by the opening / closing member 100, and is installed to communicate with the fourth flow path 4 and the second flow path 2 in the vertical operation actuator unit 300. A second compressed air inflow through hole 350; communicated with the second compressed air inflow through hole 350, and the compressed air flowing into the second compressed air inflow through hole 350 causes the first piston 220 to reach a bottom dead center. In other words, a relief valve R2 that is selectively opened if it reaches the bottom dead center and a check valve C2 that is selectively opened if the first piston 220 reaches the bottom dead center are installed, and the second cylinder when the relief valve R2 is opened. And a seventh flow path 7 formed to allow compressed air to flow into the upper side of 320.

  A magnet member 321 installed on the second piston 320; a magnet-type sensor 360 installed on the up-and-down actuating actuator unit 300 for detecting the position of the second piston 320 by sensing the magnet member 321; Is further included.

  Further, a contact-type sensor that is installed in the vertical operation actuator unit 300 and detects the position of the second piston 320 by contacting the upper and lower surfaces of the forward / reverse actuator 200 that is operated up and down by the vertical operation actuator unit 300. 361 is further included.

  Further, the apparatus further includes a bellows 400 installed between the opening / closing member 100 and the forward / reverse actuator part 200 and between the forward / backward actuator part 200 and the vertical actuator part 300.

  Further, an upper cover 301 and a lower cover 302 for sealing the second cylinder 310 are formed at the upper and lower portions of the vertical operation actuator unit 300; the upper cover 301 is formed to guide the vertical shaft 330. A guide portion 303 that is installed inside the guide portion 303 and is in contact with the outer peripheral surface of the upper and lower shafts 330, and wears the upper and lower shafts 330 and the guide portion 303 when eccentricity occurs due to the load of the opening and closing member 100. And a bushing 304 for preventing.

  The check valves C1 and C2 are quick exhaust valves.

    According to the present invention as described above, the opening / closing member that opens and closes the wafer moving path is provided with the vertically operating actuator portion that mainly controls the vertical movement of the opening and closing member and the forward and backward actuator portion that mainly controls the movement in the front and rear direction. There is an advantage that it operates accurately in the L (L) motion.

It is a structure sectional view of the conventional slit valve. It is a state figure showing movement of a link of the conventional slit valve. 1 is a front perspective view of a door valve according to a preferred embodiment of the present invention. 1 is a rear perspective view of a door valve according to a preferred embodiment of the present invention. FIG. 4 is an exploded perspective view of FIG. 3. It is the front of the forward / reverse actuator part of the door valve by preferable embodiment of this invention, and AA and BB sectional drawing. It is a cross-sectional perspective view of the AA cross section of FIG. 6, and a cross-sectional perspective view of the BB cross section. FIG. 3 is a cross-sectional view, a plan view, and a bottom view of a vertical actuator for a door valve according to a preferred embodiment of the present invention. It is a cross-sectional perspective view of CC section of FIG. It is a side view which shows the state which this invention act | operates. It is a side view which shows the state which this invention act | operates. It is a side view which shows the state which this invention act | operates. It is a side view which shows the state which this invention act | operates. It is DD sectional drawing of FIG. It is EE sectional drawing of FIG. It is sectional drawing of the state which advances and reverses a forward / backward actuator. It is sectional drawing of the state which advances and reverses a forward / backward actuator. FIG. 3 is a cross-sectional view of a state in which the present invention is restored to the initial state at the same time as the semiconductor wafer moving passage is opened. FIG. 3 is a cross-sectional view of a state in which the present invention is restored to the initial state at the same time as the semiconductor wafer moving passage is opened. FIG. 3 is a cross-sectional view of a state in which the present invention is restored to the initial state at the same time as the semiconductor wafer moving passage is opened.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The same reference numerals provided in each drawing represent the same member. In the description of the present invention, a specific description relating to a known function or configuration will be omitted to clarify the gist of the present invention.

  3 is a front perspective view of a door valve according to a preferred embodiment of the present invention, FIG. 4 is a rear perspective view of the door valve according to a preferred embodiment of the present invention, FIG. 5 is an exploded perspective view of FIG. FIG. 7 is a front view and AA and BB cross-sectional views of a forward / backward actuator part of a door valve according to a preferred embodiment of the present invention, and FIG. 7 is a cross-sectional perspective view and a cross-sectional view of a BB cross section of FIG. FIG. 8 is a sectional view, a plan view, and a bottom view of a vertical actuator for a door valve according to a preferred embodiment of the present invention, and FIG. 9 is a sectional perspective view of a CC section of FIG.

  The door valve according to a preferred embodiment of the present invention includes an opening / closing member 100, a forward / reverse actuator unit 200, and a vertical actuator unit 300, and includes a first flow path 1, a second flow path 2, a third flow path 3, and a fourth flow. Path 4, fifth flow path 5, sixth flow path 6, seventh flow path 7, first cylinder 210, first piston 220, second cylinder 310, second piston 320, magnet member 321, vertical shaft 330, first The first compressed air inflow through hole 340, the second compressed air inflow through hole 350, the magnet type sensor 360, the contact type sensor 361, and the connecting member B may be further included.

  In addition, compressed air flows in a first flow path to a seventh flow path, which will be described later, and the forward / reverse actuator section 200 and the vertical operation actuator section are thus compressed by the compressed air flowing in the first flow path to the seventh flow path. 300 is driven.

  The opening / closing member 100 is installed in front of a forward / reverse actuator unit 200, which will be described later, and opens / closes a semiconductor wafer moving passage (not shown) while being moved forward or backward by compressed air flowing into the forward / backward actuator unit 200. In addition, it is preferable to install an O-ring on the surface that contacts the semiconductor wafer movement path.

  As shown in FIGS. 6 and 7, the forward / reverse actuator unit 200 includes a first cylinder 210, a first piston 220 installed in the first cylinder 210, and a central portion of the first piston 220. The connecting member B is connected to the back surface of the opening / closing member 100 and passes through the opening / closing member to transmit the back-and-forth movement of the first piston 220 to the opening / closing member.

  As shown in FIGS. 16 and 17, the first cylinder 210 has a first flow path 1 formed on the rear side and a second flow path 2 formed on the front side. Here, the side adjacent to the opening / closing member 100 is the front side.

  As shown in FIG. 5, the first piston 220 is installed in the first cylinder 210 as described above, and the first piston 220 is operated only in the first cylinder 210. A cover 221 that covers the front of the cylinder 210 is preferably installed.

  The first piston 220 is moved back and forth. When compressed air flows into the first flow path 1, it moves forward, and when compressed air flows into the second flow path 2, it moves backward.

  In addition, the first piston 220 has a connecting member B penetratingly installed, and serves to connect the first piston 220 and the opening / closing member 100 described above. Such a connecting member B is preferably made of, for example, a bolt or a connecting pin.

  As described above, the opening / closing member 100 coupled to the first piston 220 through the connecting member B opens and closes the semiconductor wafer moving passage while being operated by the forward and backward movements of the first piston 220.

  The vertical actuator actuator 300 includes a second cylinder 310, a second piston 320, a vertical shaft 330, a first compressed air inflow hole 340, and a second compressed air inflow hole 350.

  As shown in FIGS. 14, 15, and 18 to 20, the second cylinder 310 is installed in the vertical actuator unit 300. A second piston 320 is installed inside the second cylinder 310, and an upper and lower shaft 330 is installed at the center of the second piston 320.

  The second piston 320 is a member installed inside the second cylinder 310 and operated up and down by compressed air. The second piston 320 is a first compressed air inflow hole 340. Task 2 Compressed air inflow hole 350 It operates in the up and down direction by the compressed air that flows in.

  One side of the vertical shaft 330 is connected to the central portion of the second piston 320, and the other side is connected to the forward / reverse actuator portion 200. As a result, the vertical shaft 330 transmits the upward or downward movement of the second piston to the forward / reverse actuator unit 200 to raise or lower the opening / closing member 100 to a height matching the semiconductor wafer movement path or to the initial state. .

  As shown in FIG. 14, the first compressed air inflow hole 340 is a member into which compressed air is introduced when the opening / closing member 100 closes the semiconductor wafer moving passage. The compressed air that has flowed into 340 is supplied to a flow path that is involved in the forward movement of the opening / closing member 100 among a plurality of flow paths that will be described later. This will be described in detail later.

  As shown in FIG. 15, the second compressed air inflow hole 350 has a role opposite to that of the first compressed air inflow hole 340. That is, the open / close member 100 is a member into which compressed air flows when the semiconductor wafer moving passage is opened.

  The compressed air that has flowed into the second compressed air inflow through hole 350 as described above is supplied to a flow path that is involved in the backward movement of the opening and closing member 100 among a plurality of flow paths that will be described later. This will be described in detail later.

  Hereinafter, a procedure for operating a door valve according to a preferred embodiment of the present invention will be described with reference to FIGS.

  10 to 13 are side views showing a state in which the present invention is operated, FIG. 14 is a sectional view taken along line DD in FIG. 10, FIG. 15 is a sectional view taken along line EE in FIG. FIG. 17 is a cross-sectional view of the forward / backward movement of the forward / backward actuator, and FIGS. 18 to 20 are cross-sectional views of the present invention in which the semiconductor wafer moving passage is opened and restored to the initial state at the same time.

  In particular, the operation of the present invention by the flow of compressed air supplied to the first flow path to the seventh flow path will be mainly described. Further, the initial state to be described later is a state in which the opening / closing member 100 is completely moved downward as shown in FIGS. 10, 14, and 20.

  On the other hand, the first flow path 1 is formed below the first cylinder 210, the second flow path 2 is formed above the first cylinder 210, and the third flow path 3 is one of the two upper and lower shafts 330. The fourth flow path 4 is formed in the vertical direction inside the other vertical shafts in the two vertical shafts 330.

  Further, the fifth flow path 5 communicates with the first compressed air inflow hole 340 task 6 flow path 6. The sixth flow path 6 is provided with a relief valve R1 and a check valve C1 that are opened when a predetermined pressure or more is generated, and the seventh flow path 7 communicates with the second compressed air inflow hole 350. A relief valve R2 and a check valve C1 are also installed in the seventh flow path 7 as described above.

  First, the operation of closing the semiconductor wafer movement path using the opening / closing member 100 will be described.

  Compressed air is introduced from the first compressed air inflow through hole 340 in the initial state. When the compressed air starts to flow into the first compressed air inflow hole 340 as described above, the compressed air enters the fifth flow path 5 and the problem 6 flow path 6 communicated with the first compressed air inflow hole 340 at the same time. Thus, the process proceeds from the state of FIGS. 10 and 14 to the state of FIGS.

  At this time, the same pressure, that is, the same pressure is generated in the fifth channel 5 task 6 channel 6. The sixth flow path 6 is provided with a relief valve R1 that is selectively opened only when a predetermined pressure or more is generated, and the compressed air is introduced into the fifth flow path 5 first.

  The relief valve R1 is also installed in a seventh flow path 7 to be described later. The relief valves R1 and R2 have a first compressed air inflow through hole 340, task 2 and after withstanding the primary pressure generated by the compressed air flowing into the compressed air inflow through hole 350 flowing into the flow path, It is preferred that it be opened last. Accordingly, it is better to appropriately select the repulsion system number of the spring installed in the relief valve R1 when designing the present invention.

  As described above, the compressed air that has entered the fifth flow path 5 flows into the lower portion of the second cylinder 310 that communicates with the fifth flow path 5. As described above, when compressed air flows into the second cylinder 310, the second piston 320 is moved upward, whereby the vertical shaft 330 installed at the center of the second piston 320 is also upward. Moved to.

  At this time, it is natural that the relief valve R1 installed in the sixth flow path 6 is kept closed.

  As described above, when the second piston 320 is moved upward and reaches the top dead center as shown in FIGS. 11 and 15, the compressed air that has flowed into the first compressed air inflow hole 340 flows into the sixth flow. Concentrated on Road 6. As the compressed air continues to be supplied, the relief valve R1 begins to open gradually.

  As described above, when the relief valve R1 begins to open gradually, the compressed air flows into the first flow path 1 through the third flow path 3 formed inside the one-side upper and lower shafts. As described above, the first piston 220 advances by the compressed air flowing into the first flow path 1 as shown in FIGS.

  As a result, the semiconductor wafer moving passage is sealed while the opening / closing member 100 connected to the first piston 220 via the connecting member B is also advanced, and such a state is referred to as a sealed state.

  Next, the process of operating from the state where the semiconductor wafer moving passage is sealed with the opening / closing member to the initial state as described above will be described.

  As described above, when the semiconductor wafer is moved in a sealed state, the opening / closing member 100 must open the semiconductor wafer movement path. In such a case, the compressed air is caused to flow into the second compressed air inflow through hole 350.

  As described above, the compressed air that has flowed into the second compressed air inflow hole 350 flows simultaneously into the fourth flow path 4 problem 7 flow path 7 formed inside the other side upper and lower shafts. Since the relief valve R <b> 2 is installed in the seventh flow path 7, the compressed air flows into the fourth flow path 4 first. In this way, the compressed air that has flowed into the fourth flow path 4 flows into the second flow path 2 that communicates with the fourth flow path 4.

  As described above, when compressed air flows into the second flow path 2, the first piston 220 moves backward as shown in FIG. 17 while the connecting member B connected to the first piston 220 also moves backward. Thereby, the opening / closing member 100 connected to the connecting member B is also moved backward.

  As described above, when the opening / closing member 100 moves backward, the semiconductor wafer moving passage that has been kept in a sealed state is opened, and the first piston 220 is moved backward to the bottom dead center as shown in FIG.

  As described above, when the first piston 220 is moved to the bottom dead center, the compressed air flowing into the second compressed air inflow hole 350 is concentrated in the seventh flow path 7, and a pressure higher than a predetermined pressure is generated. Then, while the relief valve R2 begins to open gradually, the compressed air flows into the upper side of the second cylinder 310 via the seventh flow path 7 as shown in FIG.

  As described above, when compressed air is introduced into the upper side of the second cylinder 310, the second cylinder 310 located at the top dead center is moved downward and eventually moved to the bottom dead center. Return to the initial state.

  In addition, when compressed air flows into the second compressed air inflow through hole 350, it flows into the inside through the first compressed air inflow through hole 340 so that the back and forth shaft 230 moves backward and the vertical shaft 330 moves downward. The compressed air that has been discharged is discharged to the outside. Such a state is called an open state.

  Meanwhile, a magnet member 321 is preferably installed on the second piston 320 so that the position of the top dead center or the bottom dead center of the second piston 320 can be confirmed externally, and such a magnet member 321 is sensed. As shown in FIG. 4, the sensor 360 is preferably provided in the vertical operation actuator unit 300.

  In addition, it is preferable that an upper cover 301 and a lower cover 302 are detachably installed at the upper portion and the lower portion of the vertical actuator portion 300 so that the vertical actuator portion 300 can be easily maintained. It is preferable that a rubber sealing member O-ring (not shown) is installed at each coupling portion so that the inside of the two cylinders 310 is kept sealed.

  The lower cover 302 is formed with a straw-shaped tube as shown in FIG. Such a pipe is coupled so as to communicate with the inside of the third flow path 3 task 4 flow path 4 of the upper and lower shafts, and when the vertical shaft 330 moves in the vertical direction, the vertical shaft 330 is stably guided. Play a role in being able to

  As a result, the pipe is formed to have a length longer than the distance moved in the vertical direction of the vertical shaft 330, and even if the second piston 320 is moved to the top dead center, the third flow path 3 problem 4 It is preferable to communicate with the flow path 4.

  In addition, as shown in FIG. 5, the upper cover 301 is formed with a guide portion 303 protruding upward so as to accurately guide the vertical movement of the upper and lower shafts 330. It is preferable that a rubber sealing member (O-ring) is installed to seal the second cylinder 310.

  On the other hand, a bushing 304 is preferably installed inside the guide portion 303 as shown in FIG. The bushing 304 serves to attenuate stress generated by the contact between the upper and lower shafts 330 and the guide portion 303 by the eccentricity generated when the opening / closing member 100 moves forward and backward, and the second cylinder 310 together with the sealing member. It plays a role of sealing.

  Since the bushing 304 installed as described above is installed at a place where stress is directly generated, it is preferable that the bushing 304 is made of a material having relatively low hardness such as copper or plastic.

  In addition, it is preferable that bellows 400 is installed between the upper end of the guide portion 303 and the forward / reverse actuator portion 200 and between the opening / closing member 100 and the forward / backward actuator portion 200, respectively. Such a bellows 400 plays a role of attenuating vibration and noise generated during the operation of the present invention, and from the powder generated in the semiconductor manufacturing process when the present invention is installed in a vacuum state. Play a role in protecting.

  Next, the check valves C1 and C2 installed in the sixth flow path 6 task 7 flow path 7 will be described.

  Like the relief valves R1 and R2, check valves C1 and C2 installed in the sixth flow path 6 task 7 flow path 7 are members that are opened only in one direction. 1 Compressed air inflow hole 340 Task 2 Opened when compressed air that has flowed into the compressed air inflow hole 350 is discharged to the outside, and allows fluid flow in the direction opposite to the relief valves R1 and R2.

  More specifically, the check valve C1 installed in the sixth channel 6 is opened when the compressed air flowing into the first compressed air inflow hole 340 is discharged when the sealed valve is changed from the sealed state to the opened state. The check valve C <b> 2 installed in the seventh flow path 7 is opened when the compressed air flowing into the second compressed air inflow hole 350 is discharged when the open valve is changed to the sealed state.

  The check valves C1 and C2 can be replaced with a quick exhaust valve. In the case of replacement as described above, the time consumed for exhaust is remarkably reduced, and the semiconductor wafer moving passage can be opened and closed more quickly.

  Such a quick exhaust valve is a known technique as described in Korean Patent Application No. 10-2006-0023872 (name of invention: quick exhaust valve device), and thus detailed description thereof is omitted. To do.

  The best embodiments have been disclosed in the drawings and specification. Although specific terms are used herein, they are merely used for the purpose of describing the present invention, and are intended to limit the scope of the present invention described in the meaning limitation and claims. It was not used. It should be understood by those skilled in the art that various modifications and other equivalent embodiments are possible. Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

Claims (7)

An opening / closing member (100) for opening and closing the semiconductor wafer movement path; and installed on the back surface of the opening / closing member (100), a first channel (1) is formed on the rear side of the inside, and a second channel ( 2) is formed, and a front cylinder (210) on which a cover (221) is installed on the front, and the first flow path (1) and the second cylinder are installed inside the first cylinder (210) . A first piston (220) that operates back and forth by compressed air flowing into the flow path (2), and a connecting member (B) that connects the first piston (220) and the opening / closing member (100) are provided. A forward / reverse actuator unit (200); a plurality of second cylinders (310) formed therein; and a second piston (320) installed inside the second cylinder (310) and operated up and down by compressed air And one side is said The third piston (320) is connected to the second piston (320), the other side is connected to the forward / reverse actuator part (200), and the compressed air is flowed into the third channel (1). 3) and the upper and lower shafts (330) in which the fourth flow path (4) communicating with the second flow path (2) is formed, and when the wafer moving passage of the opening and closing member (100) is closed, the compressed air is The second piston (320) is moved upward by the first compressed air inflow hole (340) formed to flow in and the compressed air flowing in from the first compressed air inflow hole (340). The fifth flow path (5) connected from the first compressed air inflow hole (340) to the lower part of the second cylinder (310), and the compressed air flowing into the fifth flow path (5) The second piston (320) A relief valve (R1) that is selectively opened if it arrives and a check valve (C1) that is selectively opened if the second piston (320) reaches the bottom dead center are installed, and the relief valve ( When the R1) is opened, the first compressed air inflow through hole (340), the problem 5 flow path (5), and the first flow path (1) so that the compressed air is moved to the first flow path (1). A door valve characterized by comprising: a vertically actuating actuator part (300) provided with a sixth flow path (6) communicated; Compressed air is introduced so that the wafer moving passage is opened by the opening / closing member (100), and is communicated with the fourth flow path (4) and the second flow path (2) through the vertical actuator section (300). A second compressed air inlet hole (350) installed to be
Selected if the first piston (220) reaches the bottom dead center by the compressed air that is communicated with the second compressed air inflow hole (350) and flows into the second compressed air inflow hole (350). The relief valve (R2) that is opened automatically and the check valve (C2) that is selectively opened when the first piston (220) reaches bottom dead center are installed, and the relief valve (R2) is opened. The door valve according to claim 1, further comprising: a seventh flow path (7) formed to allow compressed air to flow into the upper side of the second cylinder (320). A magnet member (321) installed on the second piston (320); and installed on the up-and-down actuating actuator unit (300) to sense the magnet member (321) and determine the position of the second piston (320). The door valve according to claim 1 , further comprising a magnetic sensor (360) for detecting. The position of the second piston (320) is set by contacting the upper and lower surfaces of the forward / reverse actuator (200) which is installed in the vertical actuator part (300) and moves up and down by the vertical actuator part (300). The door valve according to claim 1 , further comprising a contact sensor (361) for detecting. A bellows (400) installed between the opening / closing member (100) and the forward / reverse actuator part (200) and between the forward / backward actuator part (200) and the vertical actuator part (300). The door valve according to claim 1 . An upper cover (301) and a lower cover (302) for sealing the second cylinder (310) are formed on the upper and lower portions of the vertical actuator unit (300), and the upper cover (301) is formed on the upper and lower covers. A guide part (303) that guides the shaft (330); and is installed inside the guide part (303) and is brought into contact with the outer peripheral surface of the upper and lower shafts (330). The door valve according to claim 1 , further comprising: a bushing (304) for preventing wear of the upper and lower shafts (330) and the guide portion (303) when eccentricity is caused by a load. Door valve according to claim 1 or 2, characterized in that said check valve is a quick exhaust valve.