JP5624614B2 - アビオニクスシャーシ - Google Patents
アビオニクスシャーシ Download PDFInfo
- Publication number
- JP5624614B2 JP5624614B2 JP2012516097A JP2012516097A JP5624614B2 JP 5624614 B2 JP5624614 B2 JP 5624614B2 JP 2012516097 A JP2012516097 A JP 2012516097A JP 2012516097 A JP2012516097 A JP 2012516097A JP 5624614 B2 JP5624614 B2 JP 5624614B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- thermally conductive
- avionics chassis
- rail
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/487,834 US8023267B2 (en) | 2009-06-19 | 2009-06-19 | Avionics chassis |
| US12/487,834 | 2009-06-19 | ||
| PCT/US2010/035177 WO2010147727A2 (en) | 2009-06-19 | 2010-05-18 | Avionics chassis |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012531039A JP2012531039A (ja) | 2012-12-06 |
| JP2012531039A5 JP2012531039A5 (enExample) | 2013-06-20 |
| JP5624614B2 true JP5624614B2 (ja) | 2014-11-12 |
Family
ID=42782281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012516097A Expired - Fee Related JP5624614B2 (ja) | 2009-06-19 | 2010-05-18 | アビオニクスシャーシ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8023267B2 (enExample) |
| JP (1) | JP5624614B2 (enExample) |
| CA (1) | CA2764975C (enExample) |
| DE (1) | DE112010002564B4 (enExample) |
| GB (1) | GB2484216B (enExample) |
| WO (1) | WO2010147727A2 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| US8059409B2 (en) | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
| US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
| US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
| FR2969379B1 (fr) * | 2010-12-17 | 2013-02-15 | Thales Sa | Refroidissement d'un equipement electronique |
| DE102011004801B4 (de) * | 2011-02-25 | 2013-11-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Selektiv beschichtete CFK-Bauteile und Verfahren zu deren Herstellung |
| TWI543702B (zh) * | 2012-02-08 | 2016-07-21 | 鴻準精密工業股份有限公司 | 散熱裝置 |
| US20130299131A1 (en) * | 2012-05-14 | 2013-11-14 | Alexander Timashov | Adjustable heat dissipation assembly for magnetic devices |
| US8976525B2 (en) | 2012-07-31 | 2015-03-10 | General Electric Company | Systems and methods for dissipating heat in an enclosure |
| US9818669B2 (en) * | 2014-08-06 | 2017-11-14 | Honeywell International Inc. | Printed circuit board assembly including conductive heat transfer |
| US9848697B2 (en) * | 2015-10-20 | 2017-12-26 | The Keyw Corporation | Modular aviation equipment rack |
| US10383261B2 (en) * | 2015-10-20 | 2019-08-13 | Ge Global Sourcing Llc | Heat transfer chassis and method for forming the same |
| FR3052629B1 (fr) * | 2016-06-08 | 2018-06-15 | Safran Electronics & Defense | Boitier pour equipement avionique comprenant une paroi en materiau composite et des drains thermiques metalliques |
| US10039203B2 (en) | 2016-07-12 | 2018-07-31 | Hamilton Sundstrand Corporation | Molded card guide chassis |
| FR3062246A1 (fr) * | 2017-01-24 | 2018-07-27 | Zodiac Aero Electric | Boitier de distribution de puissance electrique pour un aeronef |
| DE102018105173B3 (de) * | 2018-03-07 | 2019-06-19 | Framatome Gmbh | Modular aufgebaute Einschubwandlereinheit sowie Leittechnikstromversorgungssystem für ein Kernkraftwerk |
| EP3641514A1 (en) | 2018-10-15 | 2020-04-22 | ABB Schweiz AG | Modular ied |
| CN109665122A (zh) * | 2018-12-21 | 2019-04-23 | 吉林省大千电子科技有限公司 | 卫星通信电源信号综合电磁保护壳 |
| US11160184B2 (en) * | 2019-10-08 | 2021-10-26 | Hamilton Sundstrand Corporation | Vehicle circuit card assembly |
| CN113423246B (zh) * | 2021-06-29 | 2023-01-10 | 长光卫星技术股份有限公司 | 一种用于立方卫星电子设备高效散热的轻型装置 |
| US11839061B2 (en) * | 2022-04-25 | 2023-12-05 | Hamilton Sundstrand Corporation | Heat transfer interfaces for circuit card assembly (CCA) modules |
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| US494753A (en) * | 1893-04-04 | Combined flour and meal sifter | ||
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| DE2841076C2 (de) * | 1978-09-21 | 1980-02-14 | Basf Ag, 6700 Ludwigshafen | Verfahren zur Verflüssigung wäßriger Textilweichmacher |
| US4237514A (en) * | 1978-12-01 | 1980-12-02 | Dayton-Granger, Inc. | Lightning diverter strip |
| GB2042809B (en) | 1979-02-07 | 1984-02-08 | Thorn Automation Ltd | Mouting printed circuit boards |
| US4229687A (en) * | 1979-05-07 | 1980-10-21 | Utah Research & Development Corporation | Temperature maintained battery system |
| GB2145290A (en) | 1983-08-10 | 1985-03-20 | Smiths Industries Plc | Cooling avionics circuit modules |
| USH526H (en) * | 1985-02-26 | 1988-09-06 | The United States Of America As Represented By The Secretary Of The Air Force | Non-metallic chassis structure with electromagnetic field attenuating capability |
| US4628402A (en) | 1985-09-30 | 1986-12-09 | The Boeing Company | Lightning protection of fasteners in composite material |
| GB8601746D0 (en) * | 1986-01-24 | 1986-02-26 | British Telecomm | Heat sink |
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| US4953058A (en) * | 1989-09-01 | 1990-08-28 | General Dynamics Corporation, Space Systems Div. | Modular segment adapted to provide a passively cooled housing for heat generating electronic modules |
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| US6060166A (en) * | 1998-02-05 | 2000-05-09 | Raytheon Company | Flexible graphite fiber thermal shunt |
| FR2776358B1 (fr) * | 1998-03-23 | 2000-05-05 | Coflexip | Armure composite a base de fibres de carbone, pour conduite flexible |
| JP3070579B2 (ja) * | 1998-06-10 | 2000-07-31 | 日本電気株式会社 | 半導体装置の実装構造および実装方法 |
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| US6212075B1 (en) | 1998-12-30 | 2001-04-03 | Honeywell Inc. | Adapter kit to allow extended width wedgelock for use in a circuit card module |
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| US6052280A (en) * | 1999-01-19 | 2000-04-18 | Alliedsignal Inc. | Carbon/carbon heat spreader |
| JP3330558B2 (ja) * | 1999-02-25 | 2002-09-30 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ケーブルおよび放熱装置 |
| US6351383B1 (en) * | 1999-09-02 | 2002-02-26 | Raytheon Company | Heat conducting device for a circuit board |
| US6286591B1 (en) * | 1999-11-08 | 2001-09-11 | Space Systems/Loral, Inc. | Thermal harness using thermal conductive fiber and polymer matrix material |
| FR2803166B1 (fr) * | 1999-12-28 | 2002-05-31 | Thomson Csf Sextant | Module electronique a haut pouvoir de refroidissement |
| GB0008897D0 (en) * | 2000-04-12 | 2000-05-31 | Cheiros Technology Ltd | Improvements relating to heat transfer |
| JP2002010624A (ja) * | 2000-06-15 | 2002-01-11 | Hitachi Ltd | 電源装置 |
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| US8812169B2 (en) * | 2005-10-31 | 2014-08-19 | Hewlett-Packard Development Company, L.P. | Heat sink verification |
| KR20080114838A (ko) | 2006-04-27 | 2008-12-31 | 데이진 가부시키가이샤 | 탄소 섬유 복합 시트 |
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| WO2008033297A2 (en) | 2006-09-12 | 2008-03-20 | Cts Corporation | Heat transfer plate with retainer assembly |
| KR101449075B1 (ko) | 2006-11-01 | 2014-10-08 | 히타치가세이가부시끼가이샤 | 열전도 시트, 그 제조방법 및 열전도 시트를 이용한 방열장치 |
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| US7743763B2 (en) * | 2007-07-27 | 2010-06-29 | The Boeing Company | Structurally isolated thermal interface |
| US7652886B2 (en) * | 2007-07-31 | 2010-01-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fastener assembly for fastening the heat sink to an electronic component |
| US7508670B1 (en) | 2007-08-14 | 2009-03-24 | Lockheed Martin Corporation | Thermally conductive shelf |
| EP2061296B1 (en) * | 2007-11-16 | 2014-05-14 | GE Aviation Systems LLC | Conduction cooled circuit board assembly |
| US20090147472A1 (en) * | 2007-12-11 | 2009-06-11 | Honeywell International Inc. | Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System |
| US8297450B2 (en) * | 2008-01-16 | 2012-10-30 | Northrop Grumman Systems Corporation | Modular rack for mounting avionics equipment |
| US7869216B2 (en) | 2008-08-25 | 2011-01-11 | Honeywell International Inc. | Composite avionics chassis |
| US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
| US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
-
2009
- 2009-06-19 US US12/487,834 patent/US8023267B2/en active Active
-
2010
- 2010-05-18 GB GB1121057.2A patent/GB2484216B/en active Active
- 2010-05-18 WO PCT/US2010/035177 patent/WO2010147727A2/en not_active Ceased
- 2010-05-18 JP JP2012516097A patent/JP5624614B2/ja not_active Expired - Fee Related
- 2010-05-18 CA CA2764975A patent/CA2764975C/en not_active Expired - Fee Related
- 2010-05-18 DE DE112010002564.9T patent/DE112010002564B4/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE112010002564T5 (de) | 2012-09-27 |
| GB2484216B (en) | 2014-08-13 |
| WO2010147727A3 (en) | 2011-07-14 |
| DE112010002564B4 (de) | 2023-09-21 |
| JP2012531039A (ja) | 2012-12-06 |
| GB2484216A (en) | 2012-04-04 |
| US20100321890A1 (en) | 2010-12-23 |
| CA2764975C (en) | 2017-09-05 |
| CA2764975A1 (en) | 2010-12-23 |
| GB201121057D0 (en) | 2012-01-18 |
| US8023267B2 (en) | 2011-09-20 |
| WO2010147727A2 (en) | 2010-12-23 |
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