JP5617416B2 - レーザ溶接方法とレーザ溶接装置 - Google Patents

レーザ溶接方法とレーザ溶接装置 Download PDF

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Publication number
JP5617416B2
JP5617416B2 JP2010173365A JP2010173365A JP5617416B2 JP 5617416 B2 JP5617416 B2 JP 5617416B2 JP 2010173365 A JP2010173365 A JP 2010173365A JP 2010173365 A JP2010173365 A JP 2010173365A JP 5617416 B2 JP5617416 B2 JP 5617416B2
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JP
Japan
Prior art keywords
filler
welding
laser beam
laser
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010173365A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012030263A (ja
JP2012030263A5 (enrdf_load_stackoverflow
Inventor
静波 王
静波 王
仁志 西村
仁志 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2010173365A priority Critical patent/JP5617416B2/ja
Publication of JP2012030263A publication Critical patent/JP2012030263A/ja
Publication of JP2012030263A5 publication Critical patent/JP2012030263A5/ja
Application granted granted Critical
Publication of JP5617416B2 publication Critical patent/JP5617416B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/16—Arc welding or cutting making use of shielding gas

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Arc Welding In General (AREA)
  • Laser Beam Processing (AREA)
JP2010173365A 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置 Expired - Fee Related JP5617416B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010173365A JP5617416B2 (ja) 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010173365A JP5617416B2 (ja) 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置

Publications (3)

Publication Number Publication Date
JP2012030263A JP2012030263A (ja) 2012-02-16
JP2012030263A5 JP2012030263A5 (enrdf_load_stackoverflow) 2013-08-01
JP5617416B2 true JP5617416B2 (ja) 2014-11-05

Family

ID=45844326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010173365A Expired - Fee Related JP5617416B2 (ja) 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置

Country Status (1)

Country Link
JP (1) JP5617416B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9683682B2 (en) * 2012-08-03 2017-06-20 Lincoln Global, Inc. Methods and systems of joining pipes
US10464168B2 (en) 2014-01-24 2019-11-05 Lincoln Global, Inc. Method and system for additive manufacturing using high energy source and hot-wire
US11027362B2 (en) 2017-12-19 2021-06-08 Lincoln Global, Inc. Systems and methods providing location feedback for additive manufacturing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232080A (ja) * 1985-04-09 1986-10-16 Nippon Kokan Kk <Nkk> レ−ザ溶接方法
JPH04157079A (ja) * 1990-10-16 1992-05-29 Mitsubishi Heavy Ind Ltd レーザー溶接方法
JP2002035968A (ja) * 2000-07-31 2002-02-05 Toshiba Corp 複合溶接方法
JP2002079371A (ja) * 2000-09-01 2002-03-19 Daihatsu Motor Co Ltd 板金ロー付方法及びロー付装置
JP2003112525A (ja) * 2001-10-02 2003-04-15 Aisin Seiki Co Ltd 自動車用ドアフレームの製造方法
JP4127614B2 (ja) * 2002-01-17 2008-07-30 本田技研工業株式会社 レーザ溶接装置および溶接方法
JP4848921B2 (ja) * 2006-10-13 2011-12-28 パナソニック株式会社 複合溶接方法と複合溶接装置
JP4952315B2 (ja) * 2007-03-16 2012-06-13 パナソニック株式会社 複合溶接方法と複合溶接装置
JP2009248159A (ja) * 2008-04-08 2009-10-29 Takeshi Hosoda ワイヤガイド先端チップ、ワイヤガイド及び肉盛り溶接用細径ワイヤ送給装置
US8592715B2 (en) * 2008-11-27 2013-11-26 Panasonic Corporation Hybrid welding method and hybrid welding apparatus
JP5600838B2 (ja) * 2010-07-12 2014-10-08 国立大学法人広島大学 レーザ溶接方法

Also Published As

Publication number Publication date
JP2012030263A (ja) 2012-02-16

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