JP2012030263A5 - - Google Patents

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Publication number
JP2012030263A5
JP2012030263A5 JP2010173365A JP2010173365A JP2012030263A5 JP 2012030263 A5 JP2012030263 A5 JP 2012030263A5 JP 2010173365 A JP2010173365 A JP 2010173365A JP 2010173365 A JP2010173365 A JP 2010173365A JP 2012030263 A5 JP2012030263 A5 JP 2012030263A5
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JP
Japan
Prior art keywords
filler
laser beam
welding
laser
wire
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JP2010173365A
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English (en)
Japanese (ja)
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JP2012030263A (ja
JP5617416B2 (ja
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Priority to JP2010173365A priority Critical patent/JP5617416B2/ja
Priority claimed from JP2010173365A external-priority patent/JP5617416B2/ja
Publication of JP2012030263A publication Critical patent/JP2012030263A/ja
Publication of JP2012030263A5 publication Critical patent/JP2012030263A5/ja
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Publication of JP5617416B2 publication Critical patent/JP5617416B2/ja
Expired - Fee Related legal-status Critical Current
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JP2010173365A 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置 Expired - Fee Related JP5617416B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010173365A JP5617416B2 (ja) 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010173365A JP5617416B2 (ja) 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置

Publications (3)

Publication Number Publication Date
JP2012030263A JP2012030263A (ja) 2012-02-16
JP2012030263A5 true JP2012030263A5 (enrdf_load_stackoverflow) 2013-08-01
JP5617416B2 JP5617416B2 (ja) 2014-11-05

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JP2010173365A Expired - Fee Related JP5617416B2 (ja) 2010-08-02 2010-08-02 レーザ溶接方法とレーザ溶接装置

Country Status (1)

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JP (1) JP5617416B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9683682B2 (en) * 2012-08-03 2017-06-20 Lincoln Global, Inc. Methods and systems of joining pipes
US10464168B2 (en) 2014-01-24 2019-11-05 Lincoln Global, Inc. Method and system for additive manufacturing using high energy source and hot-wire
US11027362B2 (en) 2017-12-19 2021-06-08 Lincoln Global, Inc. Systems and methods providing location feedback for additive manufacturing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232080A (ja) * 1985-04-09 1986-10-16 Nippon Kokan Kk <Nkk> レ−ザ溶接方法
JPH04157079A (ja) * 1990-10-16 1992-05-29 Mitsubishi Heavy Ind Ltd レーザー溶接方法
JP2002035968A (ja) * 2000-07-31 2002-02-05 Toshiba Corp 複合溶接方法
JP2002079371A (ja) * 2000-09-01 2002-03-19 Daihatsu Motor Co Ltd 板金ロー付方法及びロー付装置
JP2003112525A (ja) * 2001-10-02 2003-04-15 Aisin Seiki Co Ltd 自動車用ドアフレームの製造方法
JP4127614B2 (ja) * 2002-01-17 2008-07-30 本田技研工業株式会社 レーザ溶接装置および溶接方法
JP4848921B2 (ja) * 2006-10-13 2011-12-28 パナソニック株式会社 複合溶接方法と複合溶接装置
JP4952315B2 (ja) * 2007-03-16 2012-06-13 パナソニック株式会社 複合溶接方法と複合溶接装置
JP2009248159A (ja) * 2008-04-08 2009-10-29 Takeshi Hosoda ワイヤガイド先端チップ、ワイヤガイド及び肉盛り溶接用細径ワイヤ送給装置
US8592715B2 (en) * 2008-11-27 2013-11-26 Panasonic Corporation Hybrid welding method and hybrid welding apparatus
JP5600838B2 (ja) * 2010-07-12 2014-10-08 国立大学法人広島大学 レーザ溶接方法

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