JP5612418B2 - 基板貼合装置及び基板貼合方法 - Google Patents

基板貼合装置及び基板貼合方法 Download PDF

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JP5612418B2
JP5612418B2 JP2010216240A JP2010216240A JP5612418B2 JP 5612418 B2 JP5612418 B2 JP 5612418B2 JP 2010216240 A JP2010216240 A JP 2010216240A JP 2010216240 A JP2010216240 A JP 2010216240A JP 5612418 B2 JP5612418 B2 JP 5612418B2
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substrate
pressure
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vacuum chamber
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JP2012073300A (ja
JP2012073300A5 (enExample
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典之 横田
典之 横田
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2010216240A 2010-09-27 2010-09-27 基板貼合装置及び基板貼合方法 Active JP5612418B2 (ja)

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JP2010216240A JP5612418B2 (ja) 2010-09-27 2010-09-27 基板貼合装置及び基板貼合方法

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JP2012073300A JP2012073300A (ja) 2012-04-12
JP2012073300A5 JP2012073300A5 (enExample) 2013-11-07
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CN117390572B (zh) * 2023-12-11 2024-04-19 深圳蓝狐思谷科技有限公司 一种贴合的真空异常监测系统

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JP4249307B2 (ja) * 1998-12-28 2009-04-02 株式会社アルバック 真空蒸着装置における基板割れ検出装置及び検出方法
JP2003131241A (ja) * 2001-10-24 2003-05-08 Matsushita Electric Ind Co Ltd 液晶基板の貼り合わせ方法
JP2005189504A (ja) * 2003-12-25 2005-07-14 Kyoshin Engineering:Kk 液晶脱泡装置及び方法
JP4598463B2 (ja) * 2004-09-21 2010-12-15 芝浦メカトロニクス株式会社 真空装置、基板貼り合わせ装置、及び基板貼り合わせ方法
JP2006235603A (ja) * 2005-01-27 2006-09-07 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ判定方法及び基板貼り合わせ方法

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