JP5611052B2 - 放射放出デバイス - Google Patents
放射放出デバイス Download PDFInfo
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- JP5611052B2 JP5611052B2 JP2010537249A JP2010537249A JP5611052B2 JP 5611052 B2 JP5611052 B2 JP 5611052B2 JP 2010537249 A JP2010537249 A JP 2010537249A JP 2010537249 A JP2010537249 A JP 2010537249A JP 5611052 B2 JP5611052 B2 JP 5611052B2
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- 230000005855 radiation Effects 0.000 title claims description 99
- 239000004065 semiconductor Substances 0.000 claims description 209
- 230000008878 coupling Effects 0.000 claims description 41
- 238000010168 coupling process Methods 0.000 claims description 41
- 238000005859 coupling reaction Methods 0.000 claims description 41
- 230000005670 electromagnetic radiation Effects 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 230000003595 spectral effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 239000002800 charge carrier Substances 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910017911 MgIn Inorganic materials 0.000 claims description 2
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910007717 ZnSnO Inorganic materials 0.000 claims description 2
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 claims description 2
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 242
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 150000002927 oxygen compounds Chemical class 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 ZnO Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
- H01L33/0016—Devices characterised by their operation having p-n or hi-lo junctions having at least two p-n junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
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Description
Claims (17)
- ・第1の波長の電磁放射を放出し、端子電極(18,20)に直接コンタクトするように形成された第1の活性半導体層(12)と、
・前記第1の波長と異なる第2の波長の電磁放射を放出し、端子電極(18,20)に直接コンタクトするように形成された少なくとも1つの別の第2の活性半導体層(14)と
を有する放射放出デバイス(40)において、
前記両活性半導体層(12,14)は、2元化合物および3元化合物を含めて、InAlGaAs、InGaAlPおよび/またはInGaAlNから形成され、
前記第1の活性半導体層(12)と前記第2の活性半導体層(14)とは相互に積層されて配置されており、
・前記第1の活性半導体層(12)と前記第2の活性半導体層(14)とは相互に別個に作製されており、
・前記両活性半導体層(12,14)間に、第1の反射層(23)が更に配置されており、
・前記第1の反射層(23)は、酸化インジウムスズ(ITO)、酸化カドミウム、酸化チタン、ZnO、SnO2、In2O3、Zn2SnO4、CdSnO3、ZnSnO3、MgIn2O4、GaInO3、Zn2In2O5、In4Sn3O12、または、これらの混合物から形成されており、
・前記第1の反射層(23)により、前記両活性半導体層(12,14)とその周囲との間における屈折率のジャンプが、より小さい2つのジャンプにそれぞれ分割され、
・前記第1の活性半導体層(12)は、前記第1の反射層(23)が設けられた側に放射出力結合面(26)を有し、当該第1の活性半導体層(12)において前記放射出力結合面(26)と反対側に第2の反射層(22)が配置されており、
・前記第2の反射層(22)は金属層または誘電体層である
ことを特徴とする、放射放出デバイス(40)。 - 前記第1の活性半導体層(12)と前記第2の活性半導体層(14)とが接着またははんだ付けされており、
前記第1の活性半導体層(12)および前記第2の活性半導体層(14)は、支持層を備えない基板無しの層として設けられている、請求項1記載の放射放出デバイス(40)。 - 前記第1の活性半導体層(12)および前記第2の活性半導体層(14)は放熱層(24)に機械的に固定結合および熱伝導結合されている、請求項1または2記載の放射放出デバイス(40)。
- 前記放熱層(24)は、AlNを含む材料から成る、請求項3記載の放射放出デバイス(40)。
- 前記第2の反射層(22)は導電性であり、
前記第2の反射層(22)は、前記第1の活性半導体層(12)の端子電極である、請求項1から4までのいずれか1項記載の放射放出デバイス(40)。 - 前記放射放出デバイス(40)は片面放射型に構成されている、請求項1から5までのいずれか1項記載の放射放出デバイス(40)。
- 前記第2の反射層(22)は前記放熱層(24)に熱伝導結合されている、請求項3または4記載の放射放出デバイス(40)。
- 前記活性半導体層(12,14)間に複数の第1の反射層(23)が配置されており、
すべての前記第1の反射層(23)は導電性に形成されている、請求項1から7までのいずれか1項記載の放射放出デバイス(40)。 - 前記第2の活性半導体層(14)は第1の放射出力結合面(28)を有し、
前記第2の活性半導体層(14)において前記第1の放射出力結合面(28)と反対側に別の第2の放射出力結合面(30)が配置されている、請求項1から8までのいずれか1項記載の放射放出デバイス(40)。 - 前記第2の活性半導体層(14)の前記第1の放射出力結合面(28)または前記第2の放射出力結合面(30)のうち1つは、前記第1の活性半導体層(12)の放射出力結合面(26)に対向している、請求項9記載の放射放出デバイス(40)。
- 前記活性半導体層(12,14)は3μm〜20μmの厚さ(D)を有する、請求項1から10までのいずれか1項記載の放射放出デバイス(40)。
- 相互に積層された前記活性半導体層(12,14)全体の厚さ(D_T)は6μm〜30μmである、請求項1から11までのいずれか1項記載の放射放出デバイス(40)。
- 当該放射放出デバイス(40)は面状に形成されており、
当該放射放出デバイス(40)は、面積が少なくとも10mm2である放射放出面領域を有する、請求項1から12までのいずれか1項記載の放射放出デバイス(40)。 - 前記第1の活性半導体層(12)が設けられており、かつ前記第2の活性半導体層(14)は少なくとも2つであり、
前記活性半導体層(12,14)のうち少なくとも1つは、赤色スペクトル領域の電磁放射を放出するように形成されており、
前記活性半導体層(12,14)のうち少なくとも1つは、緑色スペクトル領域の電磁放射を放出するように形成されており、
前記活性半導体層(12,14)のうち少なくとも1つは、青色スペクトル領域の電磁放射を放出するように形成されている、請求項1から13までのいずれか1項記載の放射放出デバイス(40)。 - 前記第1の活性半導体層(12)および前記第2の活性半導体層(14)はそれぞれ、1つのp型ドーピングされた層と1つのn型ドーピングされた層とから成るか、
または、
前記第1の活性半導体層(12)および前記第2の活性半導体層(14)はそれぞれ、1つのp型ドーピング層と1つのn型ドーピング層と1つまたは2つの金属層とから成り、
それぞれ1つのp型ドーピング層と1つのn型ドーピング層との間に1つの電荷担体結合領域が形成されている、
請求項1から14までのいずれか1項記載の放射放出デバイス(40)。 - 前記第1の活性半導体層(12)と前記第2の活性半導体層(14)とは相互に合同で積層されており、
前記放射放出デバイス(40)は両面で放射を放出するように形成されている、
請求項1から15までのいずれか1項記載の放射放出デバイス(40)。 - 照明用および/または単色または多色のエレクトロルミネセンスディスプレイ用および/またはプロジェクション用に、請求項1から16までのいずれか1項記載の放射放出デバイス(40)を使用する方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007060257.1 | 2007-12-14 | ||
DE102007060257 | 2007-12-14 | ||
DE102008013030.3 | 2008-03-07 | ||
DE102008013030A DE102008013030A1 (de) | 2007-12-14 | 2008-03-07 | Strahlungsemittierende Vorrichtung |
PCT/DE2008/002026 WO2009076933A1 (de) | 2007-12-14 | 2008-12-03 | Strahlungsemittierende vorrichtung |
Publications (3)
Publication Number | Publication Date |
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JP2011507239A JP2011507239A (ja) | 2011-03-03 |
JP2011507239A5 JP2011507239A5 (ja) | 2011-09-29 |
JP5611052B2 true JP5611052B2 (ja) | 2014-10-22 |
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JP2010537249A Expired - Fee Related JP5611052B2 (ja) | 2007-12-14 | 2008-12-03 | 放射放出デバイス |
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US (1) | US8648357B2 (ja) |
EP (1) | EP2220693B1 (ja) |
JP (1) | JP5611052B2 (ja) |
KR (1) | KR101559601B1 (ja) |
CN (1) | CN101897042B (ja) |
DE (1) | DE102008013030A1 (ja) |
TW (1) | TWI423420B (ja) |
WO (1) | WO2009076933A1 (ja) |
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DE102008030815A1 (de) | 2008-06-30 | 2009-12-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementen |
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EP1953837A3 (de) | 2007-01-31 | 2014-01-15 | OSRAM Opto Semiconductors GmbH | Halbleiterbauelement mit einer optisch aktiven Schicht, Anordnung mit einer Vielzahl von optisch aktiven Schichten und Verfahren zur Herstellung eines Halbleiterbauelements |
DE102007017113A1 (de) | 2007-01-31 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement mit einer optisch aktiven Schicht, Anordnung mit einer Vielzahl von optisch aktiven Schichten und Verfahren zur Herstellung eines Halbleiterbauelements |
DE102007054039A1 (de) | 2007-09-12 | 2009-03-19 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Verfahren zur Einstellung des Farbortes bei einer Leuchtdiode |
DE102008012844A1 (de) | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung sowie Verfahren zur Herstellung einer Beleuchtungseinrichtung |
DE102008013898A1 (de) | 2007-12-14 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, Anordnung und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102008008599A1 (de) | 2007-12-20 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Halbleiteranordnung, insbesondere Leuchtdiodenanordnung und Leuchtmittelanordnung |
DE102007062042A1 (de) | 2007-12-21 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil, Verkapselung für ein optoelektronisches Bauteil und Herstellungsverfahren |
DE102008019612A1 (de) | 2008-04-18 | 2009-10-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
-
2008
- 2008-03-07 DE DE102008013030A patent/DE102008013030A1/de not_active Withdrawn
- 2008-12-03 CN CN2008801202925A patent/CN101897042B/zh not_active Expired - Fee Related
- 2008-12-03 JP JP2010537249A patent/JP5611052B2/ja not_active Expired - Fee Related
- 2008-12-03 WO PCT/DE2008/002026 patent/WO2009076933A1/de active Application Filing
- 2008-12-03 EP EP08861374.0A patent/EP2220693B1/de not_active Not-in-force
- 2008-12-03 US US12/747,459 patent/US8648357B2/en not_active Expired - Fee Related
- 2008-12-03 KR KR1020107015623A patent/KR101559601B1/ko active IP Right Grant
- 2008-12-11 TW TW097148130A patent/TWI423420B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2220693B1 (de) | 2017-02-08 |
CN101897042B (zh) | 2013-03-27 |
US8648357B2 (en) | 2014-02-11 |
US20100264843A1 (en) | 2010-10-21 |
TWI423420B (zh) | 2014-01-11 |
TW200937610A (en) | 2009-09-01 |
KR20100097214A (ko) | 2010-09-02 |
DE102008013030A1 (de) | 2009-06-25 |
EP2220693A1 (de) | 2010-08-25 |
CN101897042A (zh) | 2010-11-24 |
JP2011507239A (ja) | 2011-03-03 |
KR101559601B1 (ko) | 2015-10-12 |
WO2009076933A1 (de) | 2009-06-25 |
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