JP5610009B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP5610009B2
JP5610009B2 JP2013035976A JP2013035976A JP5610009B2 JP 5610009 B2 JP5610009 B2 JP 5610009B2 JP 2013035976 A JP2013035976 A JP 2013035976A JP 2013035976 A JP2013035976 A JP 2013035976A JP 5610009 B2 JP5610009 B2 JP 5610009B2
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container
transport
load port
substrate
wafer
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JP2013035976A
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Japanese (ja)
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JP2013102235A (ja
JP2013102235A5 (https=
Inventor
上川　裕二
裕二 上川
孝文 土屋
孝文 土屋
江頭　浩司
浩司 江頭
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013035976A 2013-02-26 2013-02-26 基板処理装置 Active JP5610009B2 (ja)

Priority Applications (1)

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JP2013035976A JP5610009B2 (ja) 2013-02-26 2013-02-26 基板処理装置

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JP2013035976A JP5610009B2 (ja) 2013-02-26 2013-02-26 基板処理装置

Related Parent Applications (1)

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JP2009038431A Division JP5212165B2 (ja) 2009-02-20 2009-02-20 基板処理装置

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JP2013102235A JP2013102235A (ja) 2013-05-23
JP2013102235A5 JP2013102235A5 (https=) 2013-07-18
JP5610009B2 true JP5610009B2 (ja) 2014-10-22

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JP2013035976A Active JP5610009B2 (ja) 2013-02-26 2013-02-26 基板処理装置

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584351B (zh) * 2013-10-08 2017-05-21 東京威力科創股份有限公司 Liquid container exchange device, container-mounted module and exchange solution of chemical liquid container, substrate processing device
JP6420609B2 (ja) * 2013-11-21 2018-11-07 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送方法および基板処理装置
US10332770B2 (en) 2014-09-24 2019-06-25 Sandisk Technologies Llc Wafer transfer system
JP6601360B2 (ja) * 2016-09-30 2019-11-06 株式会社ダイフク 物品搬送設備
JP6862163B2 (ja) * 2016-12-09 2021-04-21 東京エレクトロン株式会社 基板処理装置
JP7093318B2 (ja) * 2019-02-18 2022-06-29 台湾大福高科技設備股▲分▼有限公司 物品保管設備
JP7460461B2 (ja) * 2020-06-22 2024-04-02 株式会社ディスコ 加工装置
US12347704B2 (en) * 2021-06-11 2025-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer alignment apparatus and method for multi-cassette load port

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176908A (ja) * 1997-12-15 1999-07-02 Tokyo Electron Ltd 容器の搬入出装置
JP2003168714A (ja) * 2001-12-03 2003-06-13 Kaijo Corp ウェハー搬送容器用オープナー及びこれを備えたウェハー処理装置
JP4266197B2 (ja) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 縦型熱処理装置
US7934898B2 (en) * 2007-07-16 2011-05-03 Semitool, Inc. High throughput semiconductor wafer processing
JP4980978B2 (ja) * 2008-04-17 2012-07-18 大日本スクリーン製造株式会社 基板処理装置
JP4887329B2 (ja) * 2008-05-19 2012-02-29 東京エレクトロン株式会社 基板処理システム

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JP2013102235A (ja) 2013-05-23

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