JP5604384B2 - Induction heating cooker - Google Patents

Description

  The present invention relates to a thin induction heating cooker that can cool the inside efficiently.

  In recent years, the trend of all-electric homes that electrify all home appliances is becoming prominent. As part of this, induction cookers that use eddy currents to heat the pan itself have been reviewed, and thin built-in types (built-in types) that are compatible with studio apartments and mini-kitchens are also becoming popular.

  In general, this type of thin induction heating cooker has only one or two induction heating coils and does not have a heating chamber (roaster) for cooking grilled fish or the like.

  In addition, in the induction heating cooker, heat is generated from the induction heating coil and the control board that controls the heating power of the induction heating coil during cooking, and therefore the induction heating coil and the control board are blown and cooled using a cooling fan (fan device). It is generally done.

  Conventional induction heating equipment uses an axial fan or multi-blade fan installed in the main body to take in air in the kitchen interior below the induction heating cooker and supply cooling air to the control board and induction heating coil. Cool down. The air that has cooled the control board and the induction heating coil is exhausted to the outside through the exhaust port on the top surface of the induction heating cooker.

  Such a thin induction heating cooker has a main body (metal case) height that narrows the kitchen storage section below the main body to reduce the storage volume, so that the main body height is about 80 mm to 100 mm. Many. Further, as shown in FIG. 8, the air cooling structure in the main body generally has an arrangement in which an induction heating coil and a control board are stacked below the top plate.

  That is, a general air cooling structure in this type of induction heating cooker is provided at the bottom of a metal outer case (metal case) as in the air cooling structure described in FIG. In this structure, air is sucked from the air inlet and blown into the outer case to suppress the temperature rise in the main body. In Patent Document 1, the air inlet on the bottom surface of the board case is fitted into the bottom surface of the outer case and protrudes, and the side wall is also sucked. It is a mouthful.

  On the other hand, Patent Document 2 is a tabletop induction heating cooker mainly used with a 100V power source for general households, and has a configuration in which a cooling fan (fan device) and a printed board (control board) are arranged below the induction heating coil. It is disclosed.

JP 2010-2551091 A JP 2007-287374 A

  When the number and volume of electronic components used in induction heating cookers increase due to improvements in specifications and functionality, such as improving the heating efficiency of induction heating cookers, increasing thermal power, and heating non-magnetic pots, Mounting density and heat generation increase.

  As a method for improving the cooling performance inside the induction heating cooker, a method of increasing the volume of the induction heating cooker and reducing the mounting density can be considered. However, in the built-in type induction heating cooker built in the kitchen, the opening that fits into the kitchen is standardized, and the width and depth dimensions of the induction heating cooker body are limited, so the width and depth dimensions should be increased. I can't. Therefore, it is necessary to increase the height of the induction heating cooker and reduce the mounting density. However, if the height of the induction heating cooker is increased, the kitchen storage section below will be narrowed. It is not desirable to increase the height.

  On the other hand, other methods for improving the cooling performance inside the induction heating cooker include increasing the air volume used for cooling the heating components such as the induction heating coil and the control board, and adding a heat sink to the heating components to cool the heating components. There are ways to increase efficiency. In this case, the problem that the height of an induction heating cooking appliance becomes large and a kitchen storage part is narrowed does not arise.

  However, when the fan device is enlarged to improve the air blowing performance, the mounting volume of the electronic components is reduced, and it is difficult to obtain the heat dissipation area of the heat sink installed in the high heat generating element. Further, if a higher rotation speed of the fan device is selected as a means for obtaining a large air volume, fan noise and vibration of the main body are likely to occur, and comfort during use is significantly impaired.

  Further, the conventional structure shown in FIG. 8 and the structure of Patent Document 1 can be applied to a structure with a low mounting density such as a control board housed in a metal case, and can completely correspond to a structure with high density mounting. In addition, the metal case of the induction heating cooker cannot be thinned to expand the storage space under the kitchen.

  In addition, these structures simply provide an induction heating coil and a control board in the space from the air inlet to the air outlet provided with the fan unit in between. There is no configuration that allows cooling air to flow efficiently.

  On the other hand, in an induction heating cooker with a small power input as in Patent Document 2, the dimensions and heat generation of electronic components used in the main body are both small, and a control board in which a high heating element is mounted below the induction heating coil, Other electronic components and a heat sink can be easily arranged, but cannot be easily adopted as an air cooling structure of a built-in induction heating cooker that requires high heating power.

  The present invention has been made in order to solve at least one of the above-described problems. By improving the arrangement of electronic components that generate a large amount of heat, the induction heating cooker can be made thinner and have sufficient cooling performance. It is intended to improve the usability of the kitchen user by making it possible to expand the kitchen storage section below the induction heating cooker by reducing the thickness of the induction heating cooker.

In order to solve the above-mentioned problem, in claim 1, it is a built-in induction heating cooker having a height of 80 mm to 100 mm, which does not have a heating chamber for performing oven heating or grill heating, and is built in a kitchen, A metal case forming a body outline to be incorporated in the kitchen, a top plate provided on the top surface of the body, an induction heating coil provided below the top plate, a control board for controlling the induction heating coil, and a base surface A heat sink having a fin portion, a fan device for cooling the control board, and an air inlet provided on the bottom surface of the metal case, the base surface on which the high heat generating element of the control board is installed is on the top plate side next, so that the fin part is the fan apparatus, arranged said heat sink in parallel the top plate and substantially, further, the Electrical heating coil, the control board, and, tripartite base surface of said heat sink, and arranged to be substantially the same height.

  ADVANTAGE OF THE INVENTION According to this invention, the induction heating cooking appliance accommodated in a kitchen can be reduced in thickness. Moreover, the kitchen storage part below the induction heating cooker can be enlarged, and the usability of the kitchen user can be improved.

The top view of the induction heating cooking appliance of Example 1. FIG. The exploded perspective view of the induction heating cooking appliance of Example 1. FIG. The exploded perspective view of the induction heating cooking appliance of Example 1. FIG. FIG. 3 is a side sectional view of the induction heating cooker according to the first embodiment. Side surface sectional drawing of the induction heating cooking appliance of Example 2. FIG. Side surface sectional drawing of the induction heating cooking appliance of Example 3. FIG. The exploded perspective view of the induction heating cooking appliance of Example 4. FIG. Side surface sectional drawing of the conventional induction heating cooking appliance.

  Hereinafter, a built-in thin IH cooking heater will be described as an example of the induction heating cooker of the present invention.

  A built-in two-port IH cooking heater that is an induction heating cooker according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4. In addition, the induction heating cooker of a present Example shall not have a heating chamber which can perform oven heating, grill heating, etc.

  FIG. 1 is a top view of the induction heating cooker according to the present embodiment, in which two pan mounting parts 90 a and 90 b are provided on a top plate 9. Here, the positional relationship between the two induction heating coils 2 provided below the pan mounting portions 90a and 90b and the control board 7 that controls the drive of the induction heating coil 2 is shown through the top plate 9. .

  FIG. 2 is an exploded perspective view of the induction heating cooker of the present embodiment, and constitutes a main body outline in which the top plate 9 is removed and the induction heating coil 2 and the control board 7 for supplying high frequency current to the induction heating coil 2 are housed. The arrangement | positioning of the components in the metal case 8 to perform is shown. FIG. 3 is an exploded view for explaining the structure below the parts in the metal case 8 after removing the parts.

  FIG. 4 is a side cross-sectional view including the induction heating coil 2 arranged below the left front pan mounting portion 9a of the induction heating cooker.

  As shown in FIG. 1, a top plate 9, an exhaust cover 91 provided at an exhaust port 81 for exhausting the air inside the main body, and cooking of a cooking pan, etc. An operation unit 90 is provided for operation.

  Below the top plate 9, induction heating coils 2 are respectively provided at substantially lower positions of the pan mounting portions 9a and 9b, and the cooking pots that can be induction-heated are mounted on the left and right pan mounting portions 9a and 9b. It can be placed and cooked.

  The top plate 9 provided on the upper surface of the main body and holding the metal case 8 has a structure in which the outer periphery is sandwiched between heat-resistant glass with a metal frame, and the exhaust port 81 is provided in the outer metal frame portion. An exhaust cover 91 provided with a plurality of small openings is arranged in the exhaust port 81 so that cooking accessories such as a spoon and food waste do not enter during cooking.

  In the metal case 8, there are a control board 7 and a circuit board 70 on which a plurality of electronic components for supplying high-frequency current to the induction heating coil 2 are mounted together with the induction heating coil 2, and fan devices 40 and 41 for cooling them. Installed. Here, the inverter circuit for supplying a high frequency current to the induction heating coil 2 includes a high heat generating element 5 having a particularly large calorific value such as an IGBT or a diode bridge. As shown in FIG. It arrange | positions so that it may protrude from the board | substrate part of the control board 7. FIG. The high heat generating element 5 is thermally connected to the flat surface of the heat sink 6, and the high heat generating element 5 can be effectively cooled by cooling the heat sink 6.

  Since the control board 7 and the circuit board 70 on which the electronic components are mounted are disposed so as to be insulated from the metal case 8, the control board 7 and the circuit board 70 are provided in the metal case 8 while being fixed to insulating members (substrate bases 7 a and 70 a) such as resin.

  As shown in FIGS. 3 and 4, in this embodiment, two fan devices 40 that mainly cool the induction heating coil 2 and a fan device 41 that mainly cools the heat sink 6 of the high heating element 5 are made of metal. The structure is provided above the air inlet 82 on the bottom surface of the case 8.

  Here, the fan devices 40 and 41 are axial fans with rotational axes provided substantially in the vertical direction of the main body, and the air inlet 82, the fan device 40, the induction heating coil 2, and the air inlet 82, the fan device 41, and the heat sink 6 are the main body. They are arranged so as to overlap each other in the vertical direction. By configuring a straight air path so that these component arrangements partially overlap, the intake air flow 10 drawn from the intake port 82 by the fan devices 40 and 41 is used for component cooling, and the exhaust port 81 is efficiently used. The induction heating coil 2 and the high heating element 5 can be cooled.

  Therefore, the induction heating coil 2 and the control board 7 are arranged in parallel in the vicinity of the top plate 9, the gap between the control board 7 and the top plate 9 forms a wide ventilation path, and less air is used to cool the induction heating coil 2 and the like. It can be led to the exhaust port 81 by ventilation resistance.

  The heat sink 6 is provided with the installation surface of the high heat generating element 5 facing the top plate 9 and substantially parallel to the top plate 9. The high heat generating element 5 is mounted on the substrate surface of the control board 7 on the top plate 9 side. The heat sink 6 is installed.

  In this embodiment, the control board 7 may be a single-sided mounting type in which the wiring pattern of the electronic component is only one side or a double-sided mounting type. That is, in the case of single-sided mounting, the pattern surface on which main electronic components such as the capacitor 51 are mounted is directed downward, and the high heat generating element 5 is mounted on the back surface of the substrate using the through holes. A single-sided board has the advantage of being cheaper than a double-sided board. On the other hand, in double-sided mounting, the board mounting area can be increased, which facilitates the layout design of electronic components.

  Here, if a heat transfer member such as a heat conductive grease or a heat conductive sheet is sandwiched and fixed between the heat sink 6 and the high heat generating element 5, the heat of the high heat generating element 5 is efficiently conducted to the heat sink 6, The part temperature can be lowered.

  In addition, a fan device 41 is disposed close to the heat sink 6, and the intake air flow 10 flowing from the air inlet 82 via the fan device 41 is directly blown to the heat sink surface on which the high heat generating element 5 is installed. Cooling with enhanced heat transfer. By providing the heat sink 6 at a position close to the fan device 41, high performance can be achieved by utilizing the disturbance caused by the rotation component (swirl flow) of the fan device 41. By improving the cooling efficiency, it is possible to reduce the operating noise by reducing the air volume and the rotation speed of the fan device, and reducing the cost by reducing the size of the heat sink.

  When the inverter circuit is employed in a full bridge circuit that requires a plurality of high heat generating elements 5, the heat sink 6 may be divided so as to hang over the fan device 41 and arranged so that the blown out air flows.

  The heat sink 6 is processed with a material having high thermal conductivity such as aluminum or copper. In this embodiment, the heat sink 6 has a flat fin structure in which a plurality of flat plates are set perpendicular to the installation surface of the high heat generating element 5. The thing is illustrated. The flat fin structure is very useful in that air blown out from the heat sink 6 can be used for cooling other parts because the outflow path of the air flowing between the fins is limited to the number of fins.

  Further, in this embodiment, the back surface (the base portion of the flat fin) opposite to the base surface of the heat sink 6 on which the high heat generating element 5 is installed is substantially matched with the height of the substrate surface of the control board 7. The air passage cross-sectional area is less changed with respect to the air passing between the fins, and the air flows more efficiently with low pressure loss.

  Therefore, the base surface of the heat sink 6 on which the high heat generating element 5 is installed is also arranged at the same height as the control board 7 and the induction heating coil 2, and the heat sink 6 is located above and below the control board 7 on which the high heat generating element 5 is mounted. It is arranged across.

  As another example of the heat sink 6, a pin fin structure in which a plurality of prismatic or cylindrical pins stand at right angles to the installation surface of the high heat generating element 5 may be used. What is necessary is just to provide a member.

  In the inverter circuit for supplying a high-frequency current, a large-volume electronic component such as a capacitor 51 (an electrolytic capacitor or a resonant capacitor) is mounted on the control board 7 together with a high heat generating element 5 such as an IGBT. In the present embodiment, the high heat generating element 5 and the capacitor 51 are mounted on the front and back of the control board 7. The capacitor 51 is laid out at the outer peripheral position of the fan device 41 and the heat sink 6 and is cooled by the air blown from the heat sink 6. .

  That is, the control board 7 on which the high heat generating element 5 is mounted is disposed on the outer periphery of the induction heating coil 2, the high heat generating element 5 is mounted on the control board on the top plate side, and other electronic components such as capacitors are mounted on the back surface thereof. As a result, the mounting volume of the heat sink 6 and the fan device 41 can be secured even if the height of the metal case 8 is low.

Therefore, all the parts are stored in the thin metal case 8, the storage space under the built-in kitchen can be expanded, and the usability of the kitchen user can be improved. As shown in the figure, the fan devices 40 and 41 are accommodated in a narrow metal case 8 for induction heating of one mouth. In the metal case 8, together with the control board 7, a circuit board 70 on which a small electronic component 50 is mounted is disposed below the induction heating coil 2.

  Here, since the circuit board 70 has a small component thickness, if the circuit board 70 is arranged not to be hung on the fan devices 40 and 41, the circuit board 70 is expanded not only below the induction heating coil 2 but also below the control board 7. 70 and the control board 7 may be arranged so as to overlap in the horizontal direction. The circuit board 70 may not be provided as long as all components can be mounted on the control board 7 together with the capacitor 51.

  That is, the air blown out from the fan device 40 flows toward the exhaust port 81 using the gap between the induction heating coil 2 and the circuit board 70 as an air path.

  The induction heating coil 2 is mounted on the coil base 21 and supported by three elastic holding springs 29 using, for example, springs, and is pressed so as to be in close contact with the top plate 9 for stable induction heating. The distance between the cooking pan and the induction heating coil 2 is kept constant so that

  The coil base 21 has a structure in which ferrite is arranged radially from the center to reduce the leakage magnetic flux of the induction heating coil 2. When the coil base 21 is viewed from the fan device 40 side, the back surface of the induction heating coil 2 is ferrite. It is exposed from the gap. Accordingly, when the fan device 40 disposed below the induction heating coil 2 is driven, the cooling air directly collides with the back surface of the induction heating coil 2 to efficiently reduce the surface temperature and perform stable induction heating. it can.

  In the vicinity of the center of the coil base 21, at least one contact-type temperature sensor 2a such as a thermistor for detecting the temperature of the cooking pan indirectly from the temperature of the top plate 9 is disposed. The rotational speeds of the fan devices 40 and 41 may be varied depending on the heating power set by the operation unit 90 on the top plate 9 or the indicated value of the temperature sensor 2a.

  As described above, in the configuration of the present embodiment, the induction heating coil 2, the control board 7, the heat sink 6, and the fan devices 40 and 41 are efficiently and high-density while maintaining a cooling air passage sufficient to ensure cooling performance. In addition, it can be placed in the metal case 8, and the thickness of the main body of the induction heating cooker can be reduced.

  The induction heating cooker of Example 2 is demonstrated using sectional drawing of FIG. In the second embodiment, the fan device 41 shown in the first embodiment is omitted, and the shape of the heat sink 6 is changed to cool the control board 7 by the fan device 40 on the induction heating coil 2 side. It is. The description of the configuration equivalent to that of the first embodiment will be omitted.

  In this embodiment, the fins of the heat sink 6 installed on the high heating element 5 of the control board 7 are extended to the bottom surface of the metal case 8. That is, the heat radiation area of the heat sink 6 is widened. In this configuration, the air supplied to the heat sink 6 is the fan device 40 provided below the induction heating coil 2, and the air blown out from the fan device 40 is blown out toward the induction heating coil 2 and the heat sink 6. Yes. Since the fan device 40 is relatively easy to take a relatively large space as compared to the fan device 41 shown in the first embodiment, by reducing the size of the circuit board 70, the outer shape and thickness of the fan device 40 are increased. It is possible to arrange a fan device having a large air volume characteristic.

  Main air flowing from the fan device 40 to the induction heating coil 2 flows along the coil base 21, cools the induction heating coil 2, and is guided to the exhaust port 81 through the gap between the control board 7 and the top plate 9.

  The main air flowing from the fan device 40 to the heat sink 6 flows along the circuit board 70, cools the high heat generating element 5 through the fins of the heat sink 6, further cools the condenser 51 and the like downstream thereof, and the exhaust port 81 flows out as an exhaust stream 11.

  Thus, according to the induction heating cooker of the present embodiment, the control board 7 can also be cooled using the fan device 40 provided for cooling the induction heating coil 2, so that the configuration of the first embodiment can be improved. The same cooling performance can be realized with a simple configuration, and it is easy to obtain an induction heating cooker that is thinner than the configuration of the first embodiment.

  The induction heating cooker of Example 3 is demonstrated using sectional drawing of FIG. The third embodiment is a modification of the control board 7 of the second embodiment, and the description of the configuration equivalent to that of the second embodiment will be omitted.

  In the present embodiment, the high heat generating element 5 installed on the heat sink 6 is arranged at a height position similar to the board portion of the control board 7. In this configuration, since there is no high heating element 5 that shields a part of the air path in the gap between the control board 7 and the top plate 9, the air after cooling the induction heating coil 2 can be efficiently guided to the exhaust port 81. As shown in the figure, if the control board 7 is provided with an opening or a notch and the high heat generating element 5 is fitted, the mounting density is further improved, and the main body can be downsized as compared with the configuration of the second embodiment. It becomes effective.

  The induction heating cooking appliance of Example 4 is demonstrated using the exploded perspective view of FIG. In the fourth embodiment, the present invention is applied to a single built-in type IH cooking heater, and the description of the same configuration as that of the first embodiment will be omitted.

  FIG. 7 shows the internal structure of the main body showing the arrangement of the components in the metal case 8 constituting the outer body of the main body that houses the control board 7 for removing the top plate 9 and the induction heating coil 2 and supplying the induction heating coil 2 with a high frequency current. FIG.

  As in this embodiment, if the control board 7 uses a space outside the induction heating coil 2 and is formed in a U shape so as to cover the induction heating coil 2 from the outer periphery, a wide mounting area can be obtained. This makes it possible to store the electronic components necessary for induction heating in the metal case 8 in a small space, and to cool all the electronic components efficiently.

2 Induction heating coil 2a Temperature sensor 5 High heating element 6 Heat sink 7 Control board 7a, 70a Substrate base 8 Metal case 9 Top plate 9a, 9b Pan mounting part 10 Intake flow 11 Exhaust flow 20, 24 Ferrite 21 Coil base 29 Holding spring 40, 41 Fan device 50 Electronic component 51 Capacitor 70 Circuit board 81 Exhaust port 82 Inlet port 90 Operation unit

Claims (5)

A built-in induction heating cooker having a height of 80 mm to 100 mm that does not have a heating chamber for performing oven heating or grill heating, and is built in a kitchen,
A metal case that forms the outer shell of the main body to be incorporated into the kitchen;
A top plate provided on the upper surface of the main body;
An induction heating coil provided below the top plate;
A control board for controlling the induction heating coil;
A heat sink having a base surface and a fin portion;
A fan device for cooling the control board;
Provided with an air inlet provided on the bottom surface of the metal case,
The heat sink is arranged substantially parallel to the top plate so that the base surface on which the high heat generating element of the control board is installed is on the top plate side, and the fin portion is on the fan device side,
Further, the induction heating cooker is characterized in that the induction heating coil, the control board, and the base surface of the heat sink are arranged so as to have substantially the same height .   The induction heating cooker according to claim 1, wherein the fan device is located below the heat sink.   The induction heating cooker according to claim 1, wherein the fan device is located below the induction heating coil.   The induction heating cooker according to claim 1, wherein the high heating element is mounted on a control board on the top plate side, and other electronic components such as a capacitor are mounted on the back surface thereof.   The induction heating cooker according to claim 1, wherein the heat sink is disposed across the top and bottom of the control board.