JP4019323B2 - Induction heating cooker - Google Patents

Induction heating cooker Download PDF

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JP4019323B2
JP4019323B2 JP2004067290A JP2004067290A JP4019323B2 JP 4019323 B2 JP4019323 B2 JP 4019323B2 JP 2004067290 A JP2004067290 A JP 2004067290A JP 2004067290 A JP2004067290 A JP 2004067290A JP 4019323 B2 JP4019323 B2 JP 4019323B2
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heating coil
induction heating
circuit board
circuit
heating cooker
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JP2005259438A (en
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潤 文屋
敏 永井
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Mitsubishi Electric Corp
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Description

この発明は、被加熱調理容器を加熱して調理を行う誘導加熱調理器に関するものである。   The present invention relates to an induction heating cooker for cooking by heating a heated cooking container.

図12、13は従来の誘導加熱調理器のそれぞれ平面図、側面図を示し、本体1上面に鍋等の被加熱物が載置される絶縁板2が設けられ、本体1の後部には上方へ向けて開口された吸気口3と、該吸気口3の下方には冷却ファン4が配設されている。また前記絶縁板2の下方に被加熱物を誘導加熱する加熱コイル5が設けられ、加熱コイル5の下方には、加熱コイル5の出力を制御するインバータ回路が実装された回路基板6が配置されている。この回路基板6には例えば発熱部品7や該発熱部品7に取付けられる放熱フィン8等の部品が実装され、実装面を上面とした構造となっている(例えば、特許文献1)。   12 and 13 are a plan view and a side view, respectively, of a conventional induction heating cooker. An insulating plate 2 on which an object to be heated such as a pan is placed is provided on the upper surface of the main body 1. A cooling fan 4 is disposed below the intake port 3 and the intake port 3 opened toward the bottom. A heating coil 5 for inductively heating an object to be heated is provided below the insulating plate 2, and a circuit board 6 on which an inverter circuit for controlling the output of the heating coil 5 is mounted is disposed below the heating coil 5. ing. The circuit board 6 has, for example, a heat generating component 7 and components such as heat radiating fins 8 attached to the heat generating component 7 mounted thereon, and has a structure with the mounting surface as the upper surface (for example, Patent Document 1).

特開2003−86338号公報(第3図)JP 2003-86338 A (FIG. 3)

上記のように構成された従来の誘導加熱調理器は、加熱コイル5の下方に加熱コイルの出力を制御する回路基板6が配置され、また前記加熱コイル5と回路基板6との間に前記発熱部品7や該発熱部品7に取付けられる放熱フィン8を配置するだけの距離が必要になることから、誘導加熱調理器本体の薄型化の妨げとなっているという問題点があった。   In the conventional induction heating cooker configured as described above, the circuit board 6 that controls the output of the heating coil is disposed below the heating coil 5, and the heat generation is performed between the heating coil 5 and the circuit board 6. Since a distance required to arrange the component 7 and the heat dissipating fins 8 attached to the heat generating component 7 is necessary, there is a problem that the induction heating cooker main body is prevented from being thinned.

この発明は、上記問題点に鑑みてなされたもので、誘導加熱調理器本体の薄型化を可能にする誘導加熱調理器を得ることを目的とするものである。   The present invention has been made in view of the above-described problems, and an object of the present invention is to obtain an induction heating cooker that enables a thin induction heating cooker body.

この発明に係る誘導加熱調理器は、誘導加熱コイルと、前記誘導加熱コイルに高周波電流を供給する少なくとも駆動回路が実装された回路基板とを備えた誘導加熱調理器であって、前記回路基板の一辺を前記誘導加熱コイルの外周形状に合わせて凹状に形成し、該凹状の一辺と前記誘導加熱コイルの外周部とが重ならないように、回路基板を誘導加熱コイルの水平方向に配置し、前記回路基板は前記駆動回路を含む誘導加熱コイルに高周波電流を供給する回路構成部品が実装された面を下側にして配置し、該回路構成部品の内発熱部品に取り付けられる放熱フィンを前記回路基板の下方から前記加熱コイルの下方に向けて延びるように配置し、前記放熱フィンを、前記加熱コイルの大きさに合わせて誘導加熱調理器本体内で最大限に大きくして前記加熱コイルの下方に配置するようにし、前記加熱コイルの誘導加熱調理器本体への固定を、全て前記放熱フィンを介して行い、前記放熱フィンを前記誘導加熱コイルの支持台と兼ねるようにしたものである。 An induction heating cooker according to the present invention is an induction heating cooker including an induction heating coil and a circuit board on which at least a drive circuit that supplies a high-frequency current to the induction heating coil is mounted. One side is formed in a concave shape in accordance with the outer peripheral shape of the induction heating coil, the circuit board is arranged in the horizontal direction of the induction heating coil so that the one side of the concave shape does not overlap with the outer peripheral portion of the induction heating coil, The circuit board is disposed with a surface on which a circuit component for supplying a high-frequency current is mounted on an induction heating coil including the drive circuit facing down, and a heat dissipating fin attached to an inner heat generating component of the circuit component is provided on the circuit board. of arranged so as to extend toward the lower side below the heating coil, the heat radiation fins, and maximized in the induction heating cooker body in accordance with the size of the heating coil To arrange below the heating coil, the fixation of the induction heating cooking device body of the heating coil, do all through the heat radiating fins, and the heat radiating fins double as a support base of the induction heating coil Is.

この発明の誘導加熱調理器は、誘導加熱コイルと、前記誘導加熱コイルに高周波電流を供給する少なくとも駆動回路が実装された回路基板とを備えた誘導加熱調理器であって、前記回路基板の一辺を前記誘導加熱コイルの外周形状に合わせて凹状に形成し、該凹状の一辺と前記誘導加熱コイルの外周部とが重ならないように、回路基板を誘導加熱コイルの水平方向に配置し、回路基板の下側にインバータ回路を構成する例えばスイッチング素子やダイオード等の発熱部品や該発熱部品に取り付けられる放熱フィン、スイッチング素子を駆動するための駆動回路等のインバータ回路構成部品を実装したので、従来の誘導加熱コイルの下方に回路基板を配置し、回路基板の上面に発熱部品や放熱フィン等を実装したものよりも誘導加熱調理器本体を薄型化することが可能となる。
また、回路構成部品の内発熱部品に取り付けられる放熱フィンを前記回路基板の下方から前記加熱コイルの下方に向けて延びるように配置し、前記放熱フィンを、前記加熱コイルの大きさに合わせて誘導加熱調理器本体内で最大限に大きくして前記加熱コイルの下方に配置するようにし、前記加熱コイルの誘導加熱調理器本体への固定を、全て前記放熱フィンを介して行い、前記放熱フィンを前記誘導加熱コイルの支持台と兼ねるようにしたので、冷却用ファンによるさらなる冷却効果の向上を図ることができる。
The induction heating cooker according to the present invention is an induction heating cooker including an induction heating coil and a circuit board on which at least a drive circuit for supplying a high-frequency current to the induction heating coil is mounted. Is formed in a concave shape in accordance with the outer peripheral shape of the induction heating coil, and the circuit board is disposed in the horizontal direction of the induction heating coil so that one side of the concave shape does not overlap with the outer peripheral portion of the induction heating coil. Inverter circuit components such as switching elements and diodes, heat dissipation fins attached to the heat generating parts, and drive circuit components for driving the switching elements are mounted on the lower side of the inverter circuit. Induction heating cooker body than a circuit board placed below the induction heating coil and mounted on the top surface of the circuit board with heat-generating parts, heat-dissipating fins, etc. It becomes possible to reduce the thickness of.
In addition, a heat dissipating fin attached to an internal heat generating component of the circuit component is disposed so as to extend from below the circuit board toward the lower portion of the heating coil, and the heat dissipating fin is guided in accordance with the size of the heating coil. The heating coil is maximized in the heating cooker body and arranged below the heating coil, and the heating coil is fixed to the induction heating cooker body through the radiation fins. Since it also serves as a support for the induction heating coil, it is possible to further improve the cooling effect by the cooling fan.

実施の形態1.
図1に、この発明の実施の形態における誘導加熱調理器の内部平面図を、図2に側面図を、それぞれ示す。尚、本実施の形態では、加熱コイルが一つの誘導加熱調理器を例に示す。また、図1、図2において、同一または相当部分には同一符号を付す。
図1、2において、11は誘導加熱調理器の本体、12は前記本体11の上面に設けられた被加熱調理容器(図示せず)を載置するトッププレート、13は前記本体11の後方に上方へ向けて開口された吸気口、14は前記吸気口13の下方の対向する位置に設けられた冷却用ファン、15は前記トッププレート12の下方に配設され、前記トッププレート12上の加熱部位(図示せず)に載置される被加熱調理容器を誘導加熱する加熱コイルで、本体11の筐体に取り付けられた支柱21に設けたバネ22により前記トッププレート12に密着されている。
Embodiment 1 FIG.
FIG. 1 shows an internal plan view of the induction heating cooker according to the embodiment of the present invention, and FIG. 2 shows a side view thereof. In the present embodiment, an induction heating cooker having one heating coil is shown as an example. 1 and 2, the same or corresponding parts are denoted by the same reference numerals.
1 and 2, 11 is a main body of the induction heating cooker, 12 is a top plate on which a cooking container (not shown) provided on the upper surface of the main body 11 is placed, and 13 is behind the main body 11. An intake port opened upward, 14 is a cooling fan provided at an opposing position below the intake port 13, and 15 is disposed below the top plate 12 to heat the top plate 12. A heating coil for induction heating a cooking container to be heated placed on a portion (not shown), which is in close contact with the top plate 12 by a spring 22 provided on a support column 21 attached to the casing of the main body 11.

16は前記加熱コイル15に高周波電流を供給するインバータ回路の回路構成部品を実装する基板(以下、回路基板という)で、この回路基板16は、前記加熱コイル15の外周形状に合わせて基板の一辺を凹状の円弧形状とし、この凹状の円弧形状の一辺と前記加熱コイル15の外周部とが重ならないように、例えば加熱コイル15の水平方向に配置される。尚、前記回路基板16の一辺の円弧の曲率は、前記加熱コイル15の外周曲率と必ずしも一致させる必要はないが、本体11の限られた空間内で回路基板16の面積を大きくするためには、なるべく近い方が望ましい。 Reference numeral 16 denotes a board (hereinafter referred to as a circuit board) on which circuit components of an inverter circuit for supplying a high-frequency current to the heating coil 15 are mounted. The circuit board 16 is arranged on one side of the board in accordance with the outer peripheral shape of the heating coil 15. Are arranged in the horizontal direction of the heating coil 15, for example, so that one side of the concave arc shape does not overlap with the outer periphery of the heating coil 15. The curvature of the arc on one side of the circuit board 16 is not necessarily matched with the outer periphery curvature of the heating coil 15, but in order to increase the area of the circuit board 16 in the limited space of the main body 11. It is desirable to be as close as possible.

前記回路基板16には、インバータ回路を構成する例えばスイッチング素子やダイオード等の発熱部品17や該発熱部品17に取り付けられる放熱フィン18からなる大電流部、その他コンデンサ19、コイル20等や前記スイッチング素子を駆動するための駆動回路(図示せず)等のインバータ回路構成部品が実装され、実装面を下側として、前記放熱フィン18の下部側(図の本体底面側)が本体11の筐体に、例えば接着剤、或いはネジ等(図示せず)で固定されることにより、前記加熱コイル15の外周部と重ならないように加熱コイル15の水平方向に支持される。前記放熱フィン18は前記冷却用ファン14の送風動作により冷却されるとともに、前述の下部側を本体11の筐体に固定することにより熱を筐体から放熱することができ、放熱性能が向上する。 The circuit board 16 includes, for example, a heating element 17 such as a switching element and a diode that constitutes an inverter circuit, a large current portion including a radiating fin 18 attached to the heating element 17, a capacitor 19, a coil 20, and the switching element. Inverter circuit components such as a drive circuit (not shown) for driving the battery are mounted, and the lower surface side (the bottom surface side of the main body in the figure) of the heat dissipating fin 18 is the housing of the main body 11 with the mounting surface as the bottom For example, by fixing with an adhesive, a screw or the like (not shown), the heating coil 15 is supported in the horizontal direction so as not to overlap with the outer peripheral portion of the heating coil 15. The heat dissipating fins 18 are cooled by the air blowing operation of the cooling fan 14, and heat can be dissipated from the housing by fixing the lower side to the housing of the main body 11, thereby improving the heat dissipating performance. .

上記のように構成された誘導加熱調理器の動作について、図1、図2を用いて説明する。
被加熱調理容器を前記トッププレート12上の加熱部位に載置し調理を開始すると、被加熱調理容器と対向する位置の前記トッププレート12の下方に配設された前記加熱コイル15へ、前記回路基板16に実装されたインバータ回路から高周波電流が供給される。この高周波電流により加熱コイル15に高周波磁界が発生し、この高周波磁界により前記被加熱調理容器の底部に渦電流を発生させる。渦電流は被加熱調理容器の底部を流れ、この渦電流と容器抵抗成分のジュール熱で発熱し誘導加熱される。
The operation of the induction heating cooker configured as described above will be described with reference to FIGS.
When the cooked container is placed on the heating portion on the top plate 12 and cooking is started, the circuit is transferred to the heating coil 15 disposed below the top plate 12 at a position facing the cooked container. A high frequency current is supplied from an inverter circuit mounted on the substrate 16. This high-frequency current generates a high-frequency magnetic field in the heating coil 15, and this high-frequency magnetic field generates an eddy current at the bottom of the cooked container. The eddy current flows through the bottom of the cooking container to be heated and generates heat by the Joule heat of the eddy current and the container resistance component to be induction-heated.

一方、調理が開始されると同時に、前記冷却用ファン14が駆動され、前記本体11の後方に開口された吸気口13から外気を吸い込み、本体11の前面側に送風される。そして、送風の下流に配置された前記回路基板16に実装された回路構成部品の前記発熱部品17や放熱フィン18、及び前記加熱コイル15等に吹き付けられて、これらを冷却し、その後本体11の排気口(図示せず)から外部に排気される。 On the other hand, simultaneously with the start of cooking, the cooling fan 14 is driven, sucks outside air from the air inlet 13 opened at the rear of the main body 11 and blows it to the front side of the main body 11. And it is sprayed by the said heat-emitting component 17 of the circuit component mounted in the said circuit board 16 arrange | positioned downstream of ventilation, the radiation fin 18, the said heating coil 15, etc., these are cooled, and after that of the main body 11 The air is exhausted from an exhaust port (not shown).

以上のように、本実施の形態においては、加熱コイル15に高周波電流を供給するインバータ回路を実装する回路基板16の一辺を、加熱コイル15の外周形状に合わせて凹状の円弧形状とし、この凹状の円弧状の一辺と加熱コイル15の外周部とが重ならないように、例えば加熱コイル15の水平方向に配置し、前記回路基板16の下側にインバータ回路を構成する例えばスイッチング素子やダイオード等の発熱部品17や該発熱部品17に取り付けられる放熱フィン18、スイッチング素子を駆動するための駆動回路等のインバータ回路構成部品を実装したので、従来の加熱コイルの下方に回路基板を配置し、回路基板の上面に発熱部品や放熱フィン等を実装したものよりも誘導加熱調理器本体11の薄型化が可能となる。また、前記回路基板16の発熱部品17や放熱フィン18等の実装面を下側とすることで、発熱部品17や放熱フィン18、及び加熱コイル15等に前記冷却用ファン14による送風を効果的に吹き付けて冷却を行うことができる。   As described above, in the present embodiment, one side of the circuit board 16 on which the inverter circuit that supplies the high-frequency current to the heating coil 15 is formed into a concave arc shape in accordance with the outer peripheral shape of the heating coil 15. For example, a switching element, a diode, or the like that constitutes an inverter circuit below the circuit board 16 is disposed in the horizontal direction of the heating coil 15 so that the one side of the arc shape does not overlap with the outer peripheral portion of the heating coil 15. Since the inverter circuit components such as the heat generating component 17, the heat dissipating fin 18 attached to the heat generating component 17, and the drive circuit for driving the switching element are mounted, the circuit board is disposed below the conventional heating coil. It is possible to make the induction heating cooker body 11 thinner than those in which heat generating parts, heat radiating fins, and the like are mounted on the upper surface of. In addition, since the mounting surface of the circuit board 16 such as the heat generating components 17 and the heat radiating fins 18 is on the lower side, the cooling fan 14 effectively blows air to the heat generating components 17, the heat radiating fins 18, the heating coil 15, and the like. Cooling can be performed by spraying on.

尚、上記実施の形態1では、加熱コイルが一つの場合の例で説明したが、図3の内部平面図(前記図1と同一または相当部分には同一符号を付し説明を省略し、側面図は図2と同様であるので省略する)に示すように加熱コイルが二つ以上の場合においては、加熱コイル15a、15bに夫々高周波電流を供給するインバータ回路を実装する回路基板16a、16bの一辺を前記加熱コイル15a、15bの外周形状に合わせて凹状の円弧形状とし、該凹状の円弧形状の一辺と夫々前記加熱コイル15a、15bの外周部とが重ならないように、加熱コイル15a、15bの夫々水平方向に配置し、回路基板16a、16bの夫々下側に前述のインバータ回路の前記発熱部品や該発熱部品に取り付けられる放熱フィン等の回路構成部品を実装することで、上記実施の形態1同様に本体の薄型化が可能となる。また、加熱コイルが二つ以上の夫々の加熱コイルで調理が開始された場合の誘導加熱動作、及び調理開始と同時に駆動される夫々の加熱コイルごとに設けられた冷却用ファン14a、14bの送風動作による冷却動作等については上記実施の形態1での説明と同様である。(以下、実施の形態2〜4において同様である。) In the first embodiment, an example in which there is one heating coil has been described. However, an internal plan view of FIG. 3 (the same or corresponding parts as those in FIG. In the case where there are two or more heating coils, the circuit boards 16a and 16b on which inverter circuits for supplying high-frequency currents to the heating coils 15a and 15b are mounted as shown in FIG. One side is formed into a concave arc shape in accordance with the outer peripheral shape of the heating coils 15a, 15b, and the heating coils 15a, 15b are arranged so that one side of the concave arc shape does not overlap with the outer peripheral portion of the heating coils 15a, 15b, respectively. Are arranged in the horizontal direction, and circuit components such as the heat generating parts of the inverter circuit and heat radiating fins attached to the heat generating parts are mounted on the lower sides of the circuit boards 16a and 16b, respectively. In Rukoto, form 1 similarly thinner body of the embodiment is possible. Further, induction heating operation when cooking is started with two or more heating coils, and cooling fans 14a and 14b provided for each heating coil driven simultaneously with the start of cooking. The cooling operation or the like by the operation is the same as that described in the first embodiment. (The same applies to Embodiments 2 to 4 below.)

実施の形態2.
上記実施の形態1では、回路基板の一辺を加熱コイルの外周形状に合わせて凹状の円弧形状とし、この凹状の円弧状の一辺と加熱コイルの外周部とが重ならないように加熱コイルの水平方向に配置し、回路基板の下側にインバータ回路の発熱部品や放熱フィン等の回路構成部品を実装することで、本体の薄型化を可能としたものである。本実施の形態においては、上記実施の形態1で可能とした本体の薄型化とともに、前記回路基板の下側に実装される前記放熱フィンの放熱面積を大きくするための形態について、加熱コイルが一つの誘導加熱調理器を例に示す。
図4に、本実施の形態における誘導加熱調理器の内部平面図を、図5に側面図を、それぞれ示す。尚、図4、図5において、上記実施の形態1の図1、図2と同一または相当部分には同一符号を付し説明を省略する。
Embodiment 2. FIG.
In the first embodiment, one side of the circuit board is formed in a concave arc shape in accordance with the outer peripheral shape of the heating coil, and the horizontal direction of the heating coil is set so that the one side of the concave arc shape and the outer peripheral portion of the heating coil do not overlap. The circuit board is mounted on the lower side of the circuit board and mounted with circuit components such as a heat generating part of the inverter circuit and a heat radiating fin, thereby enabling the body to be thinned. In the present embodiment, a heating coil is provided for a form for increasing the heat radiation area of the heat radiation fin mounted on the lower side of the circuit board as well as making the main body thinner in the first embodiment. An induction heating cooker is shown as an example.
FIG. 4 shows an internal plan view of the induction heating cooker in the present embodiment, and FIG. 5 shows a side view thereof. 4 and 5, the same or corresponding parts as those in FIGS. 1 and 2 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

本実施の形態においては、図4、5に示すように、前記加熱コイル15の水平方向に配置した前記回路基板16の下側に発熱部品17とともに実装される前記放熱フィン18を、前記回路基板16が加熱コイル15の水平方向に配置されることによって加熱コイル15の下方に生まれた空間を利用して、該空間の本体11の水平方向に延ばして放熱面積を大きくし、加熱コイル15の下方に配置するようにしたものである。その他の構造は、上記実施の形態1と同様である。 In the present embodiment, as shown in FIGS. 4 and 5, the radiating fins 18 mounted together with the heat generating components 17 on the lower side of the circuit board 16 arranged in the horizontal direction of the heating coil 15 are provided on the circuit board. 16 is arranged in the horizontal direction of the heating coil 15, and the space created below the heating coil 15 is used to extend in the horizontal direction of the main body 11 in the space to increase the heat radiation area. It is intended to be placed in. Other structures are the same as those in the first embodiment.

上記のように構成された誘導加熱調理器において、被加熱調理容器が前記トッププレート12上の加熱コイル15の部位に載置され、調理が開始された場合の誘導加熱動作、及び調理開始と同時に駆動される冷却用ファン14の送風動作による前記発熱部品17や放熱フィン18、及び加熱コイル15等の冷却動作等については上記実施の形態1での説明と同様であるので省略する。 In the induction heating cooker configured as described above, the heated cooking container is placed on the portion of the heating coil 15 on the top plate 12, and the induction heating operation when cooking is started and simultaneously with the start of cooking. Since the cooling operation of the heat generating component 17, the heat radiating fin 18, and the heating coil 15 by the air blowing operation of the driven cooling fan 14 is the same as that described in the first embodiment, the description thereof will be omitted.

以上のように、本実施の形態においては、前記回路基板16の下側に発熱部品17とともに実装される前記放熱フィン18の放熱面積を大きくするため、前記回路基板16を加熱コイル15の水平方向に配置したことによって加熱コイル15の下方に生まれた空間を利用して、該空間の本体11の水平方向に延ばして放熱面積を大きくして加熱コイル15の下方に配置するようにしたので、上記実施の形態1同様本体の薄型化とともに、加熱コイル15の下方に生まれた空間を利用して放熱フィン18を延ばして放熱面積を大きくしたことで、前記冷却用ファン14の送風動作による放熱フィン18の冷却効果を上げることができる。   As described above, in the present embodiment, the circuit board 16 is disposed in the horizontal direction of the heating coil 15 in order to increase the heat dissipating area of the heat dissipating fins 18 mounted together with the heat generating components 17 on the lower side of the circuit board 16. Since the space born below the heating coil 15 is used to extend in the horizontal direction of the main body 11 of the space to increase the heat radiation area, the space is disposed below the heating coil 15. As with the first embodiment, the heat sink fin 18 is blown by the cooling fan 14 by extending the heat dissipating fin 18 by using the space created below the heating coil 15 and increasing the heat dissipating area. Can increase the cooling effect.

尚、上記実施の形態では、加熱コイルが一つの場合の例で説明したが、図3のように加熱コイルが二つ以上の場合においても、前述した夫々の加熱コイルの外周形状に合わせて一辺が凹状の円弧形状をした回路基板を夫々の加熱コイルの水平方向に配置したことによって、加熱コイルの下方に生まれた空間を利用して放熱フィンを延ばして放熱面積を大きくすることで、上記同様の効果が得られる。 In the above embodiment, an example in which there is one heating coil has been described. However, in the case where there are two or more heating coils as shown in FIG. 3, one side corresponds to the outer peripheral shape of each heating coil described above. By arranging the circuit board having a concave arc shape in the horizontal direction of each heating coil, the heat radiation fins are extended using the space created below the heating coils to increase the heat radiation area. The effect is obtained.

実施の形態3.
上記実施の形態2では、本体の薄型化とともに回路基板に実装される放熱フィンの放熱面積を大きくするため、回路基板を加熱コイルの水平方向に配置したことによって生まれる加熱コイルの下方の空間に延ばして放熱面積を大きくする形態について示した。本実施の形態においては、放熱フィンをさらに大きくして前記加熱コイルの支持台を兼ねるように構成した形態について、加熱コイルが一つの誘導加熱調理器を例に示す。
図6に、本実施の形態における誘導加熱調理器の内部平面図を、図7に側面図を、それぞれ示す。尚、図6、図7において、上記実施の形態1の図1、図2と同一または相当部分には同一符号を付し説明を省略する。
Embodiment 3 FIG.
In the second embodiment, in order to increase the heat radiation area of the heat radiation fin mounted on the circuit board along with the thinning of the main body, the circuit board is extended to the space below the heating coil that is created by arranging the circuit board in the horizontal direction. In this way, the heat radiation area is increased. In the present embodiment, an induction heating cooker having one heating coil will be described as an example of a configuration in which the heat dissipating fins are further enlarged to serve also as a support for the heating coil.
FIG. 6 shows an internal plan view of the induction heating cooker in the present embodiment, and FIG. 7 shows a side view thereof. 6 and 7, the same or corresponding parts as those in FIGS. 1 and 2 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

本実施の形態においては、図6、7に示すように、前記回路基板16の下側に発熱部品17とともに実装される放熱フィン18を、回路基板16が加熱コイル15の水平方向に配置されることによって生まれる加熱コイル15の下方の空間を利用して、該空間の本体11の水平方向に前記加熱コイル15の支持台を兼ねるように、例えば加熱コイル15の大きさに合わせて本体11に収まる範囲内で最大限に大きくして、加熱コイル15の下方に配置するようにしたものである。そして、支持台を兼ねるようにした前記放熱フィン18と前記加熱コイル15とは、図7に示すように、例えば加熱コイル15の下部に設けた支持部材30に放熱フィン18の下部側からネジ40等で固定され、また前記回路基板16は、上記実施の形態1と同様に放熱フィン18の下部側(図の本体底面側)が本体11の筐体に例えば接着剤、或いはネジ等で固定されることで前記加熱コイル15の水平方向に支持されるので、前記加熱コイル15と回路基板16が一体的な構造を成す。その他の構造は、上記実施の形態1と同様である。 In the present embodiment, as shown in FIGS. 6 and 7, the heat dissipating fins 18 mounted together with the heat generating components 17 are arranged below the circuit board 16, and the circuit board 16 is arranged in the horizontal direction of the heating coil 15. By using the space below the heating coil 15 generated by this, the body 11 fits in the body 11 in accordance with the size of the heating coil 15 so as to serve as a support for the heating coil 15 in the horizontal direction of the body 11 in the space. The size is maximized within the range and arranged below the heating coil 15. The heat dissipating fin 18 and the heating coil 15 that also serve as a support base are, as shown in FIG. 7, a screw 40 from the lower side of the heat dissipating fin 18 on a support member 30 provided at the lower portion of the heating coil 15, for example. The circuit board 16 is fixed to the housing of the main body 11 with, for example, an adhesive or screws, as in the first embodiment. Thus, the heating coil 15 is supported in the horizontal direction, so that the heating coil 15 and the circuit board 16 form an integral structure. Other structures are the same as those in the first embodiment.

上記のように構成された誘導加熱調理器において、被加熱調理容器が前記トッププレート12上の加熱コイル15の部位に載置され、調理が開始された場合の誘導加熱動作、及び調理開始と同時に駆動される冷却用ファン14の送風動作による発熱部品17、放熱フィン18、及び加熱コイル15等の冷却動作等については、上記実施の形態1での説明と同様であるので省略する。 In the induction heating cooker configured as described above, the heated cooking container is placed on the portion of the heating coil 15 on the top plate 12, and the induction heating operation when cooking is started and simultaneously with the start of cooking. The cooling operation and the like of the heat generating component 17, the radiating fin 18, the heating coil 15 and the like due to the blowing operation of the driven cooling fan 14 are the same as those described in the first embodiment, and will not be described.

以上のように、本実施の形態においては、回路基板16の下側に発熱部品17とともに実装される放熱フィン18を、回路基板16が加熱コイル15の水平方向に配置されることによって生まれる加熱コイル15の下方の空間を利用して延ばし、前記加熱コイル15の支持台を兼ねるように、例えば加熱コイル15の大きさに合わせて本体11に収まる範囲内で最大限に大きくして加熱コイル15の下方に配置するようにしたので、上記実施の形態1同様本体の薄型化とともに、冷却用ファン14によるさらなる冷却効果の向上を図ることができる。また、前述した前記放熱フィン18と加熱コイル15の固定と、前記放熱フィン18下部側の筐体への固定による回路基板16の前記加熱コイル15の水平方向支持とにより、前記加熱コイル15と回路基板16が一体的な構造を成すことで、誘導加熱調理器を製造する際に組み立て工程を簡素化することが可能となり、組み立て工数、組み立て加工費の削減ができる。   As described above, in the present embodiment, the heat dissipating fins 18 that are mounted together with the heat generating components 17 on the lower side of the circuit board 16 are provided with the heating coil that is generated by arranging the circuit board 16 in the horizontal direction of the heating coil 15. 15 is extended using the space below 15, so that it also serves as a support for the heating coil 15, for example, in accordance with the size of the heating coil 15, it is maximized within a range that can be accommodated in the main body 11. Since it is arranged at the lower side, the cooling effect by the cooling fan 14 can be further improved as the main body is made thinner as in the first embodiment. In addition, the heating coil 15 and the circuit are fixed by fixing the radiating fin 18 and the heating coil 15 and supporting the heating coil 15 in the horizontal direction of the circuit board 16 by fixing the radiating fin 18 to the casing on the lower side. When the substrate 16 has an integral structure, it is possible to simplify the assembly process when manufacturing the induction heating cooker, and the assembly man-hours and the assembly processing costs can be reduced.

尚、上記実施の形態では、加熱コイルが一つの場合の例で説明したが、図3のように加熱コイルが二つ以上の場合においても、夫々の加熱コイルの外周形状に合わせて一辺が凹状の円弧形状をした回路基板を夫々の加熱コイルの水平方向に配置することによって、加熱コイルの下方に生まれた空間を利用して放熱フィンを延ばし、加熱コイルの支持台を兼ねるように、加熱コイルの大きさに合わせて本体に収まる範囲内で最大限に大きくして加熱コイルの下方に配置し、前述した前記放熱フィンと加熱コイルの固定と、前記放熱フィン下部側の筐体への固定による回路基板の前記加熱コイルの水平方向支持とにより、前記加熱コイルと回路基板が一体的な構造を成すことで、上記同様の効果が得られる。 In the above embodiment, an example in which there is one heating coil has been described. However, even when there are two or more heating coils as shown in FIG. 3, one side is concave according to the outer peripheral shape of each heating coil. By arranging the circuit board with the circular arc shape in the horizontal direction of each heating coil, the heat radiation fin is extended using the space created below the heating coil, and the heating coil is also used as a support for the heating coil. In accordance with the size of the heat sink, it is maximized within the range that can be accommodated in the main body, and is arranged below the heating coil. By fixing the radiation fin and the heating coil and fixing to the casing on the lower side of the radiation fin, By the horizontal support of the heating coil of the circuit board, the heating coil and the circuit board form an integral structure, and the same effect as described above can be obtained.

また、上記実施の形態では、放熱フィンを加熱コイルの支持台を兼ねるように加熱コイルの大きさに合わせて本体に収まる範囲内で最大限に大きくしたものとして説明したが、加熱コイルの支持台を兼ねることができれば、この大きさに限定されるものではない。 Further, in the above-described embodiment, the radiating fin has been described as being maximized within a range that fits in the main body in accordance with the size of the heating coil so that it also serves as a support for the heating coil. If it can serve as both, it will not be limited to this size.

実施の形態4.
上記実施の形態1〜3では、誘導加熱調理器に備わるインバータ回路の回路構成部品を実装する回路基板、及び該回路基板に発熱部品とともに実装される放熱フィンの形態について示した。本実施の形態においては、上記実施の形態1〜3で説明した一辺が凹状の円弧形状としたインバータ回路を実装する回路基板を例えば長方形、或いは正方形の回路基板から基板取りしたとき、それに対応する片側の基板を、例えば加熱コイルの加熱状態を表示するための制御回路を実装する回路基板として構成するようにした形態について、加熱コイルが一つの誘導加熱調理器を例に示す。
図8に本実施の形態における誘導加熱調理器の内部平面図を示す。尚、図8において、上記実施の形態1の図1と同一または相当部分には同一符号を付し説明を省略する。
図8において、26は、例えば前記回路基板16に実装されたインバータ回路から高周波電流が供給されて誘導加熱動作する前記加熱コイル15の加熱状態を表示するための制御回路が実装される回路基板(以下、表示制御基板という)である。
Embodiment 4 FIG.
In the said Embodiment 1-3, it showed about the form of the circuit board which mounts the circuit component of the inverter circuit with which an induction heating cooking appliance is equipped, and the radiation fin mounted on this circuit board with a heat-emitting component. In the present embodiment, when the circuit board on which the inverter circuit having the concave arc shape on one side described in the first to third embodiments is mounted, for example, from a rectangular or square circuit board, it corresponds to that. For example, an induction heating cooker having one heating coil is shown as an example in which the one-side substrate is configured as a circuit board on which a control circuit for displaying the heating state of the heating coil is mounted.
FIG. 8 shows an internal plan view of the induction heating cooker in the present embodiment. In FIG. 8, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
In FIG. 8, reference numeral 26 denotes a circuit board on which a control circuit for displaying the heating state of the heating coil 15 that performs induction heating operation when a high frequency current is supplied from an inverter circuit mounted on the circuit board 16, for example. Hereinafter referred to as a display control board).

前記表示制御基板26は、図9に示すように例えば長方形、或いは正方形の回路基板から、一辺が凹状の円弧形状をした前記回路基板16を基板取りしたときに、それに対応する片側の凸状の円弧形状基板で、この凸状の円弧形状基板を例えば前記加熱コイル15の加熱状態を表示するための制御回路が実装される回路基板として利用する。このように長方形、或いは正方形の基板から、前記回路基板16、及び表示制御基板26の基板取りをすることで、基板の余りを減らし、基板の取り数を多くすることが可能となり、ひいては基板コストを削減することができる。 As shown in FIG. 9, when the circuit board 16 having a concave arc shape on one side is removed from a rectangular or square circuit board as shown in FIG. An arc-shaped board is used as a circuit board on which a control circuit for displaying the heating state of the heating coil 15, for example, is mounted. Thus, by removing the circuit board 16 and the display control board 26 from a rectangular or square board, it is possible to reduce the remainder of the board and increase the number of boards to be taken, and thus the board cost. Can be reduced.

そして、前記表示制御基板26は、例えば凸状の円弧形状の一辺を前記加熱コイル15側として、前記加熱コイル15の水平方向の本体11前面側に、加熱状態を表示するための制御回路(図示せず)が実装された面を下側として配設され、例えば本体11の前面側に配設される表示部(図示せず)と配線される。その他の構造は、上記実施の形態1と同様である。 The display control board 26 has, for example, a control circuit for displaying the heating state on the front side of the main body 11 in the horizontal direction of the heating coil 15 with one side of a convex arc shape as the heating coil 15 side. (Not shown) is disposed on the lower side, and is wired with a display unit (not shown) disposed on the front side of the main body 11, for example. Other structures are the same as those in the first embodiment.

上記のように構成された誘導加熱調理器において、被加熱調理容器が前記トッププレート12上の加熱コイル15の部位に載置され、調理が開始された場合の誘導加熱動作、及び調理開始と同時に駆動される前記冷却用ファン14の送風動作による発熱部品17、放熱フィン18、及び加熱コイル15等の冷却動作等については上記実施の形態1での説明と同様であるので省略する。 In the induction heating cooker configured as described above, the heated cooking container is placed on the portion of the heating coil 15 on the top plate 12, and the induction heating operation when cooking is started and simultaneously with the start of cooking. Since the cooling operation of the heat generating component 17, the heat radiating fin 18, and the heating coil 15 by the air blowing operation of the driven cooling fan 14 is the same as that described in the first embodiment, the description thereof is omitted.

以上のように、本実施の形態においては例えば長方形、或いは正方形の回路基板から、一辺が凹状の円弧形状をしたインバータ回路を実装する前記回路基板を基板取りしたときに、それに対応する片側の凸状の円弧形状基板を例えば前記加熱コイルの加熱状態を表示するための制御回路を実装する表示制御基板として利用し、該表示制御基板の凸状の円弧形状をした一辺を、例えば前記加熱コイル側として、加熱コイルの水平方向の本体前面側に配設するように構成したので、上記実施の形態1同様本体の薄型化とともに、前記長方形、或いは正方形の基板から前記回路基板、及び表示制御基板の基板取りをすることで、基板の余りを減らし、基板の取り数を多くすることが可能となり、ひいては基板コストを削減することができる。   As described above, in the present embodiment, for example, when the circuit board for mounting the inverter circuit having a concave arc shape on one side is removed from a rectangular or square circuit board, the corresponding convex on one side is taken. For example, a display control board on which a control circuit for displaying the heating state of the heating coil is mounted, and one side of the display control board having a convex arc shape is, for example, the heating coil side As described above, since the heating coil is arranged on the front side of the main body in the horizontal direction, as with the first embodiment, the circuit board and the display control board are changed from the rectangular or square board together with the thinning of the main body. By removing the substrate, the remainder of the substrate can be reduced, the number of substrates can be increased, and the substrate cost can be reduced.

尚、上記実施の形態2、3においても同様に、長方形、或いは正方形の回路基板から、一辺が凹状の円弧形状をしたインバータ回路を実装する前記回路基板を基板取りしたときに、それに対応する片側の凸状の円弧形状基板を前記加熱コイルの加熱状態を表示するための制御回路を実装する表示制御基板として利用し構成できることは、言うまでもない。 Similarly in the second and third embodiments, when the circuit board on which the inverter circuit having a concave arc shape on one side is mounted is removed from a rectangular or square circuit board, one side corresponding thereto is taken. Needless to say, the convex arc-shaped substrate can be used as a display control substrate on which a control circuit for displaying the heating state of the heating coil is mounted.

また、上記実施の形態では、加熱コイルが一つの場合の例で説明したが、図3のように加熱コイルが二つ以上の場合においても同様に、長方形、或いは正方形の回路基板から夫々の加熱コイルに対応するよう、一辺が凹状の円弧形状をした回路基板を基板取りしたとき、それに対応する片側の凸状の円弧形状基板を加熱状態を表示するための制御回路を実装する表示制御基板として利用し、例えば加熱コイルの水平方向の本体前面側に配設するように構成できることは言うまでもなく、その場合においても上記同様の効果が得られる。 In the above embodiment, an example in which there is one heating coil has been described. However, in the case where there are two or more heating coils as shown in FIG. 3, each heating is similarly performed from a rectangular or square circuit board. As a display control board that mounts a control circuit for displaying the heating state of a convex arc-shaped board on one side corresponding to a concave arc-shaped circuit board that is concave on one side so as to correspond to the coil Needless to say, it can be configured to be disposed, for example, on the front side of the main body in the horizontal direction of the heating coil.

また、上記実施の形態においては、凸状の円弧形状をした表示制御基板26を加熱コイル15の水平方向の本体前面側に配置するよう説明したが、前記回路基板16が加熱コイル15の水平方向に配置されたことによって加熱コイル15の下方に生まれた空間を利用して、図10の内部平面図と図11の側面図に示すように、例えば前記表示制御基板26の凸状の円弧形状部分と前記加熱コイル15の外周部分とが重なるように、表示制御基板を加熱コイルの下方に配置して、前述した表示部と配線するようにしても構わない。 In the above-described embodiment, the display control board 26 having a convex arc shape has been described so as to be disposed on the front side of the main body in the horizontal direction of the heating coil 15, but the circuit board 16 is arranged in the horizontal direction of the heating coil 15. As shown in the internal plan view of FIG. 10 and the side view of FIG. 11, for example, a convex arc-shaped portion of the display control board 26 is utilized using the space created below the heating coil 15. The display control board may be arranged below the heating coil so that the outer peripheral portion of the heating coil 15 overlaps with the display unit described above.

本発明は、例えばキッチン組込み型、或いは据え置き型の誘導加熱調理器などに活用できるものである。   The present invention can be used for, for example, a kitchen built-in type or a stationary type induction heating cooker.

この発明の実施の形態1における誘導加熱調理器の内部平面図である。It is an internal top view of the induction heating cooking appliance in Embodiment 1 of this invention. 実施の形態1に係る上記図1の側面図である。FIG. 2 is a side view of FIG. 1 according to the first embodiment. 実施の形態1に係る他の例における誘導加熱調理器の内部平面図である。It is an internal top view of the induction heating cooking appliance in the other example which concerns on Embodiment 1. FIG. この発明の実施の形態2における誘導加熱調理器の内部平面図である。It is an internal top view of the induction heating cooking appliance in Embodiment 2 of this invention. 実施の形態2に係る上記図4の側面図である。FIG. 5 is a side view of FIG. 4 according to the second embodiment. この発明の実施の形態3における誘導加熱調理器の内部平面図である。It is an internal top view of the induction heating cooking appliance in Embodiment 3 of this invention. 実施の形態3に係る上記図6の側面図である。FIG. 7 is a side view of FIG. 6 according to the third embodiment. この発明の実施の形態4における誘導加熱調理器の内部平面図である。It is an internal top view of the induction heating cooking appliance in Embodiment 4 of this invention. 実施の形態4に係る回路基板と表示制御基板の合体図である。FIG. 10 is a combined diagram of a circuit board and a display control board according to a fourth embodiment. 実施の形態4に係る他の例における誘導加熱調理器の内部平面図である。It is an internal top view of the induction heating cooking appliance in the other example which concerns on Embodiment 4. FIG. 実施の形態4に係る上記図10の側面図である。FIG. 11 is a side view of FIG. 10 according to the fourth embodiment. 従来の誘導加熱調理器の内部平面図である。It is an internal top view of the conventional induction heating cooking appliance. 従来の誘導加熱調理器の側面図である。It is a side view of the conventional induction heating cooking appliance.

符号の説明Explanation of symbols

11 誘導加熱調理器本体、 12 トッププレート、 13、13a、13b 吸気口、 14、14a、14b 冷却用ファン、 15、15a、15b 加熱コイル、 16、16a、16b 回路基板、 17 発熱部品、 18 放熱フィン、 21 支柱、 22 バネ、 26 表示制御基板、 30 支持部材、 40 ネジ。   11 Induction heating cooker body, 12 Top plate, 13, 13a, 13b Air inlet, 14, 14a, 14b Cooling fan, 15, 15a, 15b Heating coil, 16, 16a, 16b Circuit board, 17 Heat generating component, 18 Heat dissipation Fin, 21 strut, 22 spring, 26 display control board, 30 support member, 40 screw.

Claims (3)

誘導加熱コイルと、前記誘導加熱コイルに高周波電流を供給する少なくとも駆動回路が実装された回路基板とを備えた誘導加熱調理器であって、前記回路基板の一辺を前記誘導加熱コイルの外周形状に合わせて凹状に形成し、該凹状の一辺と前記誘導加熱コイルの外周部とが重ならないように、回路基板を誘導加熱コイルの水平方向に配置し、
前記回路基板は前記駆動回路を含む誘導加熱コイルに高周波電流を供給する回路構成部品が実装された面を下側にして配置し、該回路構成部品の内発熱部品に取り付けられる放熱フィンを前記回路基板の下方から前記加熱コイルの下方に向けて延びるように配置し、
前記放熱フィンを、前記加熱コイルの大きさに合わせて誘導加熱調理器本体内で最大限に大きくして前記加熱コイルの下方に配置するようにし、
前記加熱コイルの誘導加熱調理器本体への固定を、全て前記放熱フィンを介して行い、前記放熱フィンを前記誘導加熱コイルの支持台と兼ねるようにしたことを特徴とする誘導加熱調理器。
An induction heating cooker comprising an induction heating coil and a circuit board on which at least a drive circuit for supplying a high-frequency current to the induction heating coil is mounted, wherein one side of the circuit board has an outer peripheral shape of the induction heating coil In addition, the circuit board is arranged in the horizontal direction of the induction heating coil so that one side of the concave shape does not overlap with the outer periphery of the induction heating coil.
The circuit board is disposed with a surface on which a circuit component for supplying a high-frequency current is mounted on an induction heating coil including the drive circuit facing down, and a heat dissipating fin attached to an inner heat generating component of the circuit component Arranged so as to extend from below the substrate toward the bottom of the heating coil,
The heat dissipating fins are maximally enlarged in the induction heating cooker body in accordance with the size of the heating coil and arranged below the heating coil,
The induction heating cooker characterized in that the heating coil is fixed to the induction heating cooker main body through the radiating fins, and the radiating fins also serve as a support for the induction heating coil .
前記放熱フィンは、前記回路基板の下面に接触して前記回路基板を支持していることを特徴とする請求項1記載の誘導加熱調理器。 The induction heating cooker according to claim 1 , wherein the radiating fin is in contact with a lower surface of the circuit board to support the circuit board . 前記一辺が凹状をした回路基板を、長方形、或いは正方形の回路基板から基板取りをしたとき、前記凹状と対応する片側の凸状の基板を前記誘導加熱コイルの加熱状態を表示するための制御回路を実装する表示制御基板としたことを特徴とする請求項1又は請求項2記載の誘導加熱調理器。   A control circuit for displaying a heating state of the induction heating coil on a convex substrate on one side corresponding to the concave shape when the circuit substrate having a concave shape on one side is removed from a rectangular or square circuit substrate The induction heating cooker according to claim 1 or 2, wherein the display control board is mounted.
JP2004067290A 2004-03-10 2004-03-10 Induction heating cooker Expired - Fee Related JP4019323B2 (en)

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