JP5921333B2 - Cooker - Google Patents

Description

  The present invention relates to a cooking device, and more particularly to a cooking device including a switching element that constitutes an inverter circuit.

  Conventionally, as this type of cooking device, “a switching element disposed on a printed circuit board for driving a heating coil, a heat sink for cooling the switching element, and an electrical connection path between the switching element and the heating coil” A plurality of jumper wires, and a cooling fan that allows cooling air to flow through the heat sink, and the plurality of jumper wires are parallel to the ventilation portion of the cooling air on the printed circuit board at equal intervals. The cooking device has been proposed (for example, Patent Document 1). The cooking device is connected so that the direction of the current flowing through the adjacent jumper wires is reversed. reference).

JP 2008-235124 A (Summary, FIG. 1)

  In the heating cooker of Patent Document 1, an expensive cooling fin is required to suppress an increase in the chip temperature due to self-heating of the switching elements constituting the inverter circuit, and the board area is small due to the cooling fin capacity (size). There was a problem of getting bigger.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a small-sized and low-cost cooking device that can simplify the cooling structure of the switching element.

A heating cooker according to the present invention that solves the problems is a top plate on which a cooking container as a heated object can be placed, and is disposed below the top plate, and induction heating of the heated object by flowing a high-frequency current A heating means, a substrate on which an inverter circuit using a switching element that supplies high-frequency current to the heating means is mounted, and a main body that encloses the heating means and the substrate, and the switching element is thermally coupled to the top plate In this way, the switching element is attached to the plane portion having the maximum area through grease or a resin film .

  According to the present invention, the switching element is attached to the top plate so as to be thermally coupled, and the top plate is used as a heat dissipation (cooling) member. The area can be reduced, and the size and cost of the cooking device can be reduced.

It is a perspective view which shows the structure of the heating cooker which concerns on Embodiment 1 of this invention. It is a perspective view of the state which removed the top plate which shows the structure of the heating cooker which concerns on Embodiment 1 of this invention. It is the schematic sectional drawing seen from the front side of the cooking-by-heating machine concerning Embodiment 1 of the present invention. It is a figure which shows the circuit structure of one induction heating port of the heating cooker which concerns on Embodiment 1 of this invention. (A) Schematic which shows an example of the switching element attachment range of the heating cooker which concerns on Embodiment 1 of this invention, (b) Other of the switching element attachment range of the heating cooker which concerns on Embodiment 1 of this invention It is the schematic which shows an example. It is the schematic sectional drawing seen from the front side of the cooking-by-heating machine concerning Embodiment 2 of the present invention. It is a perspective view of the state which removed the reinforcement board from the top plate of the heating cooker which concerns on Embodiment 3 of this invention. It is the schematic sectional drawing seen from the front side of the cooking-by-heating machine concerning Embodiment 3 of the present invention. It is the schematic sectional drawing seen from the front side of the cooking-by-heating machine concerning Embodiment 4 of the present invention. It is the schematic sectional drawing seen from the right side surface showing the air path inside the heating cooker which concerns on Embodiment 4 of this invention.

Embodiment 1
(Constitution)
1 is a perspective view showing a configuration of a heating cooker according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view of a state where a top plate showing the configuration of the heating cooker according to Embodiment 1 of the present invention is removed. FIG. 3 is a schematic cross-sectional view seen from the front of the heating cooker according to Embodiment 1 of the present invention.
Hereinafter, the configuration of the heating cooker according to the first embodiment of the present invention will be described with reference to FIGS. 1, 2, and 3.
Note that in each drawing, the same reference numerals are given to the same portions or corresponding portions, and a part of the description may be omitted.

  As shown in FIG. 1, the heating cooker 100 according to the first embodiment of the present invention is a non-magnetic material, for example, crystallized glass, on which a cooking container 10 containing an object to be cooked can be placed on the top surface of the main body 1. A top plate 2 made of such glass, and a top plate 4 provided with a frame 3 made of a metal, for example, stainless steel, which is fixed to the outer periphery of the top plate 2 by a silicon adhesive (not shown) or the like. Then, the top panel 4 is provided with an upper surface operation unit 5 for performing various operation inputs, and a front operation unit 6 for performing various operation inputs on the front surface of the main body 1 and a power switch 7 for turning on / off the heating cooker. ing.

  Reference numeral 8 denotes a cooking chamber in which an object to be cooked such as fish is placed and grill cooking or oven cooking is performed. As shown in FIG. 3, radiation heating means 15a and 15b are disposed inside.

The cooking chamber 8 has an opening on the front surface, and is composed of an inner shell member 8b provided with the above-described radiation heating means 15a and 15b and an outer shell member 8a provided so as to cover the outside. The inner member 8b and the outer member 8a are formed of a metal material, and the inner member 8b that directly accommodates an object to be cooked is made of, for example, stainless steel or a hollow steel plate that hardly generates rust or corrosion, and the outer member 8a is, for example, plated. It is formed of a metal material such as a steel plate. The inner member 8b and the outer member 8a are configured with a predetermined space therebetween.

A cooking cabinet door 9 is provided at the front opening of the cooking cabinet 8 so that it can be pulled out forward. A tray (not shown) and a grill (not shown) for placing the food to be cooked are pulled out in conjunction with the drawer of the cooking cabinet door 9, and the cooking cabinet door 9 is pushed in most. In this state, the front opening of the cooking chamber 8 is closed and cooking can be performed. An operation input for cooking can be performed from the upper surface operation unit 5 or the front operation unit 6.

  A plurality of heating means are disposed below the top plate 2 as shown in FIG. 2, each of which is an induction heating means comprising an induction heating coil, 11 is a left induction heating means, 12 is a right induction heating means, Reference numeral 13 denotes a central induction heating means.

  Here, the induction heating means means a heating means using the principle of electromagnetic induction. When a high-frequency alternating current is applied to the induction heating coil, a rotating magnetic field line is generated, and a uniform magnetic field is generated inside the induction heating coil. Occur. When the magnetic field penetrates the induction heating coil, a magnetic field that disturbs the magnetic flux change is generated inside the induction heating coil, and an eddy current flows through the object to be heated and continues to flow by applying a high-frequency AC current, for example, an AC current of 20 to 90 kHz. Therefore, it is a heating method in which the heated object generates heat by generating Joule heat due to the electric resistance and eddy current of the heated object.

In addition, although the example provided with the 3 induction heating means was given in the above-mentioned description, in the heating cooker which provided 3 heating means, one of them is a heating means such as a radiant heater which is not the induction heating means. It may be constituted by a radiant heating means composed of such a heating wire, and can be appropriately selected. Further, the number of heating means is not limited to three and may be two, and the combination of the heating means in that case can be appropriately selected from induction heating means and radiant heating means.

Below the left induction heating means 11, the right induction heating means 12, and the central induction heating means 13, in addition to the cooking chamber 8, a control board 16b containing control means composed of electronic components, a switching element 17 and a rectifier circuit In addition, an inverter board 16a including an inverter circuit composed of other electronic components is disposed. The switching element 17 is electrically connected to the inverter board 16a via the lead wire 18.

The left induction heating means 11, the right induction heating means 12, the central induction heating means 13, the cooking chamber 8, the inverter board 16a and the control board 16b are divided by a shielding plate 14 as shown in FIG.

  As described above, the cooking chamber 8, the inverter board 16a, and the control board 16b are disposed below the shielding plate 14. The inverter board 16a is arranged in a space on the side of the cooking cabinet 8, and the switching element 17 electrically connected to the inverter board 16a via the lead wire 18 is a left induction heating means for the top plate 2 of the top plate 4. 11, on the surface facing the right induction heating means 12 and the central induction heating means 13 are attached so as to be thermally coupled, for example, by pressing with a holding component (not shown).

Here, the term “thermally coupled” means that the planar portion having the largest area of the switching element 17 that generates heat and the top plate 2 made of glass having a large surface area and a relatively large specific heat are directly or thermally greased. In other words, it is a coupled state in which the surface of the switching element 17 is brought into contact with the top plate 2 through the thin resin film or the like so as to transfer heat to the top plate 2 to the maximum.

The top plate 2 is made of glass, has a large specific heat, has a large area, and has a large thickness. Moreover, since the surface area is large, there is also a heat dissipation effect.

  The switching element 17 is a semiconductor made of, for example, silicon carbide, a gallium nitride-based material, or diamond. A semiconductor made of silicon carbide, a gallium nitride-based material or diamond has a band gap (forbidden band) of about 3 to 5 times that of a semiconductor made of silicon (Si) compared to about 1.1 eV. It is called a wide band gap semiconductor because of its large.

Since the switching element 17 formed of a wide band gap semiconductor has excellent heat resistance and can operate at a higher temperature than a silicon semiconductor, it does not use a heat radiating member such as a large heat sink as in the prior art, and radiates heat. It is possible to operate by attaching to the top plate 2 with a large surface area that is effective.

In addition, the switching element 17 formed of a wide band gap semiconductor has a high withstand voltage and a high allowable current density. Therefore, the switching element 17 can be made smaller than a switching element formed of a silicon semiconductor and does not use a heat dissipation member. In addition, the area occupied by the switching element 17 of the inverter substrate 16a to which the switching element 17 is connected can be reduced, and the size of the substrate can be reduced.

(Circuit configuration)
FIG. 4 is a diagram showing a circuit configuration of one induction heating port of the heating cooker according to Embodiment 1 of the present invention. The circuit configuration of one induction heating port of the heating cooker will be described with reference to FIG.
In FIG. 4, the same or corresponding parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and a part of the description may be omitted.

  As shown in FIG. 4, the AC voltage supplied from the commercial power supply 34 is converted into a DC voltage by a rectifier circuit (diode bridge) 35, and is supplied to an inverter circuit 30 connected to the output side of the rectifier circuit (diode bridge) 35. It comes to be supplied.

The inverter circuit 30 includes a switching element 17 and a diode 31 connected to the switching element 17 in antiparallel. A load circuit 33 is connected to the output side of the inverter circuit 30.

The load circuit 33 is configured by the left induction heating means 11 and the resonance capacitor 32 which are, for example, one induction heating port of a heating cooker. The load circuit 33 is configured to inductively heat the object to be heated when the high-frequency current converted by the inverter circuit 30 flows to the left induction heating means 11.

In this embodiment, a half-bridge circuit is described as an example of an inverter circuit using a switching element. However, the present invention is not limited to this, and a full-bridge circuit or a monolithic resonance circuit may be used. The circuit configuration can be appropriately selected according to the device on which the circuit is mounted.

(Operation)
In the cooking device configured as described above, the inverter circuit 30 is driven by the control means (not shown) by the operation input of the upper surface operation section 5 or the front operation section 6 shown in FIG. 1, for example, the left induction heating means 11 is heated. Be started.

  When the inverter circuit 30 is driven, the switching element 17 is also energized and generates heat due to the energization. As described above, since the switching element 17 is attached so as to be thermally coupled to the top plate 2 of the top plate 4, the heat generated by the switching element 17 is transmitted to the top plate 2, and the temperature of the top plate 2. The temperature increase of the switching element 17 is suppressed. In addition, the temperature rise of the switching element 17 can be suppressed by releasing heat from the top plate 2.

When the switching element 17 is attached so as to be thermally coupled to the top plate 2 of the top plate 4, as shown in FIG. 5A, the left induction heating means mounting position 2a and the right induction heating means. It is desirable to install in a range excluding a range E1 surrounded by a line connecting the center position of the mounting position 2b for use and the center position of the central induction heating means placement position 2c.

Left induction heating means placement position 2a and left induction heating means 11, right induction heating means placement position 2b and right induction heating means 12, central induction heating means placement position 2c and central induction heating means 13 center position This is because, in a situation where a plurality of heating means are driven at the same time, the temperature within the range of E1 may become high, and the switching element 17 is not attached under the high temperature condition.

Further, as shown in FIG. 5B, the outer diameters of the left induction heating means placement position 2a, the right induction heating means placement position 2b, and the central induction heating means placement position 2c are surrounded by tangent lines. If the mounting is performed in a range excluding the range E2, the switching element 17 can be further away from the range under a high temperature condition.

  As described above, in the heating cooker according to the first embodiment of the present invention, the switching element is formed of a wide band gap semiconductor that can operate at a high temperature and has excellent heat resistance. Therefore, the switching element itself can be downsized. Further, since it is not necessary to use a heat dissipation member such as a large heat sink that occupies a large area of the inverter board, the inverter board can be reduced in size.

In addition, the switching element is made of a wide band gap semiconductor with excellent heat resistance that can operate at high temperatures, and the glass top plate is used as a heat dissipation member, eliminating the need for expensive cooling elements for switching elements. It is possible to reduce the cost by reducing the number of parts.

Embodiment 2
(Constitution)
FIG. 6 is a schematic cross-sectional view seen from the front of the heating cooker according to the second embodiment of the present invention.
The heating cooker according to the second embodiment of the present invention is different only in the configuration of the heating cooker according to the first embodiment of the present invention and the mounting location of the switching element, and therefore different parts will be described.

In addition, the same code | symbol is attached | subjected to the part same as the part demonstrated in FIGS. 1-3 of the heating cooker which concerns on Embodiment 2 of this invention, and the heating cooker which concerns on Embodiment 1 of this invention. However, descriptions of the same reference numerals may be omitted.
Moreover, since the circuit structure of the heating cooker which concerns on Embodiment 2 of this invention is the same as the circuit structure of the heating cooker which concerns on Embodiment 1 of this invention, description regarding a circuit structure is abbreviate | omitted.

  As shown in FIG. 6, the heating cooker 200 according to the second embodiment of the present invention is a non-magnetic material, for example, crystallized glass, on which a cooking container 10 containing an object to be cooked can be placed on the top surface of the main body 1. A top plate 2 made of such glass, and a top plate 4 provided with a frame 3 made of a metal, for example, stainless steel, which is fixed to the outer periphery of the top plate 2 by a silicon adhesive (not shown) or the like. The frame body 3 is provided with a frame body extension portion 3a partially extending into the main body.

The frame extension 3a is attached to a portion accommodated in the main body by a fixing means (not shown) such as screwing so that the switching element 17 formed of a wide band gap semiconductor is thermally coupled. It has been.

(Operation)
In the heating cooker configured as described above, the inverter circuit 30 is driven by control means (not shown) by the operation input of the upper surface operation unit 5 or the front operation unit 6 shown in FIG. Be started.

  When the inverter circuit 30 is driven, the switching element 17 formed of the wide band gap semiconductor is also energized and generates heat by the energization. As described above, since the switching element 17 is attached so as to be thermally coupled to the frame body extension portion 3a of the frame body 3, the heat generated by the switching element 17 is transferred from the frame body extension portion 3a to the frame body 3. Communicated. Since the frame 3 is a metal with a large surface area that has a heat dissipation effect, the heat generated by the switching element 17 is radiated from the frame 3. As shown in FIGS. 1 and 2, the frame 3 is attached so as to surround the outer periphery of the top plate 2 and has a large surface area.

  As described above, in the heating cooker according to the second embodiment of the present invention, the switching element is formed of a wide band gap semiconductor that can operate at a high temperature and has excellent heat resistance. Therefore, the switching element itself can be downsized. Further, since it is not necessary to use a heat dissipation member such as a large heat sink that occupies a large area of the inverter board, the inverter board can be reduced in size.

The switching element is made of a wide band gap semiconductor with excellent heat resistance that can be operated at high temperature. The heat sink is made of a metal frame that has a large heat capacity and a large surface area, so it has a large heat dissipation effect. As a result, it is possible to make a configuration that does not use expensive cooling components dedicated to switching elements, and it is possible to reduce costs by reducing the number of components.

Embodiment 3
7 is a perspective view of a state where the reinforcing plate is removed from the top plate of the heating cooker according to Embodiment 3 of the present invention, and FIG. 8 is viewed from the front side of the heating cooker according to Embodiment 3 of the present invention. It is a schematic sectional drawing.
The heating cooker according to Embodiment 3 of the present invention is only partially different from the configuration of the top plate of the heating cooker according to Embodiment 1 of the present invention.

In addition, the same code | symbol is attached | subjected to the part which is the same as the part demonstrated with each figure of the heating cooker which concerns on Embodiment 1 of this invention, or an equivalent part, and description of what attached the same code | symbol may be abbreviate | omitted.
Moreover, since the circuit structure of the heating cooker which concerns on Embodiment 2 of this invention is the same as the circuit structure of the heating cooker which concerns on Embodiment 1 of this invention, description regarding a circuit structure is abbreviate | omitted.

(Constitution)
As shown in FIGS. 7 and 8, the heating cooker 300 according to the first embodiment of the present invention is configured such that a cooking container 10 (see FIG. 1) that contains an object to be cooked can be placed on the top surface of the main body 1. A top plate 2 made of a magnetic material, for example, glass such as crystallized glass, a frame 3 made of a metal, such as stainless steel, fixed to the outer periphery of the top plate 2 with a silicon adhesive (not shown), and the top plate 2 Below, the top plate 22 provided with the reinforcement board 21 comprised with the metal, for example, a plated steel plate, is provided in the back side of the surface which mounts the cooking container 10. As shown in FIG.

For example, the switching element 17 formed of a wide band gap semiconductor is attached to the reinforcing plate 21 by a fixing means (not shown) such as screwing.

(Operation)
In the heating cooker configured as described above, the inverter circuit 30 is driven by control means (not shown) by the operation input of the upper surface operation unit 5 or the front operation unit 6 shown in FIG. Is done.

  When the inverter circuit 30 is driven, the switching element 17 formed of the wide band gap semiconductor is also energized and generates heat by the energization. Since the switching element 17 is attached so as to be thermally coupled to the reinforcing plate 21 of the top plate 22 as described above, the heat generated by the switching element 17 is transmitted to the reinforcing plate 21 and radiated from the reinforcing plate 21. Become so.

  As described above, in the heating cooker according to the third embodiment of the present invention, the switching element is formed of a wide band gap semiconductor that can operate at a high temperature and has excellent heat resistance. Therefore, the switching element itself can be downsized. Further, since it is not necessary to use a heat dissipation member such as a large heat sink that occupies a large area of the inverter board, the inverter board can be reduced in size.

The switching element is made of a wide band gap semiconductor with excellent heat resistance that can be operated at high temperature, and the reinforcing plate on the back side of the top plate that has a large heat dissipation effect due to its large heat capacity and large surface area is made of a heat dissipation member. As a result, it is possible to make a configuration that does not use expensive cooling components dedicated to switching elements, and it is possible to reduce costs by reducing the number of components.

Embodiment 4
FIG. 9 is a schematic cross-sectional view seen from the front of the heating cooker according to Embodiment 4 of the present invention, and FIG. 10 is seen from the right side representing the air path inside the heating cooker according to Embodiment 4 of the present invention. FIG.
The heating cooker according to Embodiment 4 of the present invention is different from the configuration of the heating cooker according to Embodiment 1 of the present invention in that it includes cooling means, and different parts will be described.

In addition, the same code | symbol is attached | subjected to the same part as the part demonstrated in each figure of the heating cooker which concerns on Embodiment 4 of this invention, and the heating cooker which concerns on Embodiment 1 of this invention, and is the same The description of what is labeled may be omitted.
Moreover, since the circuit structure of the heating cooker which concerns on Embodiment 4 of this invention is the same as the circuit structure of the heating cooker which concerns on Embodiment 1 of this invention, description regarding a circuit structure is abbreviate | omitted.

  As shown in FIGS. 9 and 10, the heating cooker 400 according to the fourth embodiment of the present invention includes a cooling fan 20 that is a cooling means for cooling induction heating means and the like housed in a cooling fan case 19. 1 is arranged behind. The cooling fan 20 is driven by control means (not shown) when energization of any one of the induction heating means 11, induction heating means 12, and induction heating means 13 (see FIG. 2) is started, and sucks outside air from an intake port (not shown). Cooling air is blown into 1.

The cooling air is sent from the lower part of the main body 1 to the upper part of the main body 1 through a ventilation path (not shown), cools the induction heating means 11, the induction heating means 12, the induction heating means 13 and the like and is discharged to the outside through an exhaust port (not shown). It is like that.

9 and 10, the switching element 17 formed of a wide band gap semiconductor includes a left induction heating unit 11, a right induction heating unit 12, and a central induction heating unit 13 on the top plate 2 of the top plate 4. For example, a holding part (not shown) is pressed to the opposite surface side so as to be thermally coupled.

(Operation)
In the heating cooker configured as described above, the inverter circuit 30 is driven by control means (not shown) by the operation input of the upper surface operation unit 5 or the front operation unit 6 shown in FIG. At the same time, the cooling fan 20 is also driven.

  When the inverter circuit 30 is driven, the switching element 17 is also energized and generates heat due to the energization. As described above, since the switching element 17 is attached so as to be thermally coupled to the top plate 2 of the top plate 4, the heat generated by the switching element 17 is transmitted to the top plate 2, and the temperature of the top plate 2. The temperature increase of the switching element 17 is suppressed. In addition, the temperature rise of the switching element 17 can be suppressed by releasing heat from the top plate 2.

Further, as shown in FIG. 10, the cooling air flow A generated by the cooling fan 20 passes along the inverter board 16a, and the top plate is moved upwardly like the wind flow B by an air path (not shown). 4 and is sent along the top plate 4 (top plate 2) as a wind flow C, and the surrounding top plate 2 and the switching device 17 to which the switching element 17 is attached like the wind flow D. Can be cooled directly.

  As described above, in the heating cooker according to the fourth embodiment of the present invention, the switching element is formed of a wide band gap semiconductor excellent in heat resistance that can operate at a high temperature, and thus the switching element itself can be downsized. Further, since it is not necessary to use a heat dissipation member such as a large heat sink that occupies a large area of the inverter board, the inverter board can be reduced in size.

In addition, the switching element is made of a wide band gap semiconductor with excellent heat resistance that can operate at high temperatures, and the glass top plate is used as a heat dissipating member so that no cooling parts dedicated to the switching element are used. It is possible to reduce the cost by reducing the number of parts.

Further, since the cooling air passes through the surface on which the switching element and the switching element of the top plate are attached, the cooling air can improve the cooling effect of the switching element and the heat radiation of the top plate.

In all of the first to fourth embodiments, since the heat-generating switching element is not directly mounted on the inverter board, the temperature rise of the inverter board itself can be suppressed, and safety and quality are improved. Is possible.

  DESCRIPTION OF SYMBOLS 1 Main body, 2 Top plate, 2a Placement position for left induction heating means, 2b Placement position for right induction heating means, 2c Placement position for central induction heating means, Left 3 Frame body, 3a Frame body extension, 4 Top Plate, 5 upper surface operation unit, 6 front operation unit, 7 power switch, 8 cooking chamber, 8a outer member, 8b inner member, 9 cooking chamber door, 10 cooking container, 11 left induction heating unit, 12 right induction heating unit, 13 Central induction heating means, 14 Shield plate, 15a Radiation heating means, 15b Radiation heating means, 16a Inverter board, 16b Control board, 17 Switching element, 18 Lead wire, 19 Cooling fan case, 20 Cooling fan, 21 Reinforcing plate , 22 Top plate, 30 Inverter circuit, 31 Diode, 32 Resonance capacitor, 33 Load circuit, 34 Commercial power supply, 35 Rectifier circuit (Die Doburijji), 100 heating cooker 200 heating cooker 300 heating cooker 400 cooker, A wind flow, B air flow, C air flow, the flow of D wind.

Claims (8)

A top plate on which an object to be heated can be placed;
A heating means that is disposed below the top plate and induction-heats the object to be heated when a high-frequency current flows;
A substrate mounted with an inverter circuit using a switching element for supplying a high-frequency current to the heating means;
A main body containing the heating means and the substrate,
A cooking device according to claim 1, wherein the switching element is attached to a plane portion having the largest area through grease or a resin film so as to thermally couple the switching element to the top plate. A plurality of heating means,
2. The switching element is attached to the top plate, the center position being behind the center position of the heating means located closest to the rear of the main body among the plurality of heating means. Cooking device. Comprising at least three heating means,
The top plate is provided with the object-to-be-heated object placement position indications corresponding to the three heating means, and in a range outside the range surrounded by a line connecting the approximate centers of the three heating means, The cooking device according to claim 1, wherein a switching element is attached to the top plate. Comprising at least three heating means,
The top plate is provided with circular heated object placement position indications corresponding to the three heating means, and is outside the range where the outer diameters of the three heated object placement position indications are connected by tangent lines. The heating cooker according to claim 1, wherein the switching element is attached to the top plate within a range.   The top plate includes a top plate made of a non-magnetic material and a frame body made of a metal material provided so as to cover the periphery of the top plate, so that the switching element is thermally coupled to the frame body. The cooking device according to any one of claims 1 to 4, wherein the cooking device is attached. The top plate includes a top plate made of a non-magnetic material, a frame made of a metal material provided so as to cover the periphery of the top plate, and a reinforcing plate made of a metal material separate from the frame. ,
The cooking device according to any one of claims 1 to 4, wherein the switching element is attached so as to be thermally coupled to the reinforcing plate.   A cooling means for cooling the heating means and the substrate is provided in the main body, and a part of the cooling air generated by the cooling means is located at a position where the switching element is attached to the top plate or the switching element. The cooking device according to any one of claims 1 to 6, wherein the air is blown to the attached position and the periphery thereof.   The heating according to any one of claims 1 to 7, wherein the switching element is a wide band gap semiconductor, and the wide band gap semiconductor is made of silicon carbide, a gallium nitride-based material, or diamond. Cooking device.

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