JP2021048030A - Induction cooker - Google Patents

Abstract

To provide a more reliable induction cooker that can be suppressed in malfunction due to mixing of electromagnetic noise generated from an inverter substrate.SOLUTION: An induction cooker 10 is provided that comprises a top plate 2 placed on a top surface, and a body 1 placed below the top plate, the body comprises: a coil storage 1a that stores heating coils 3a and 3b, and is composed of a metal box body; a board storage 1b that stores an IH circuit board 7a and a fan device 9, and is composed of a metal box body; and an oven storage 1c that stores a heating chamber 50 comprising electric heaters 51 and 52, and is composed of a metal box body, wherein the board storage and the oven storage are placed below the coil storage.SELECTED DRAWING: Figure 4

Description

The present invention relates to an induction heating cooker that induces and heats a metal pot placed on a top plate.

The induction heating cooker uses Joule heating due to the eddy current generated at the bottom of the pot when the magnetic field lines generated by passing a high-frequency current through the heating coil placed below the top plate pass through the metal pot placed on the top plate. Then, the metal pot itself is heated to heat and cook. During cooking, not only the metal pot but also the heating coil, the inverter board, and the like generate heat, so a fan device is used to blow and cool them.

There are two types of induction heating cookers: a stationary type that is placed on the table of the system kitchen and a built-in type that is incorporated into the system kitchen. In both types, in addition to multiple heating coils, a heat source such as an electric heater is used. Many are equipped with a grill. In order to supply sufficient electric power to all of the plurality of heating coils and electric heaters, many induction heating cookers use a 200V AC power source as a power source.

In such an induction heating cooker, the main components to be cooled by the fan device are a heating coil and an inverter substrate. Due to the structure of the induction heating cooker, the heating coil is arranged below the top plate on the upper surface of the main body, and the substrate such as the inverter substrate is often stored in the surplus space on the side of the oven.

Since the dimensions of many domestic system kitchens are regulated according to standards, the storage space for induction heating cookers is often standardized. Therefore, the maximum external dimension allowed for the induction heating cooker is roughly determined regardless of the type.

In a conventional general induction heating cooker, a metal outer shell is designed according to the size of the storage part of the system kitchen. Under such design conditions, the substrate is installed in a resin box shape or flat plate (board stand) for insulation from the inner wall of the main body, and is arranged in multiple stages in the vertical direction of the main body, and is placed on the substrate. A fan device is installed at the starting point of the air passage.

A plurality of power semiconductors (IGBTs: Insulated Gate Bipolar Transistors) are mounted on the inverter substrate that supplies high-frequency current to the heating coil, and the power semiconductors perform switching operations at high frequencies to generate high-frequency currents of about 20 kHz to 50 kHz. Generate. The switching operation of the power semiconductor is the main source of electromagnetic noise in the induction heating cooker and may affect the output signal of the temperature sensor. Therefore, in order to mitigate the noise effect, the conventional induction heating cooker In the above, metal plates and laminated aluminum foil were placed around the inverter board and in the gaps inside the main body.

Here, the cooker according to claim 1 of Patent Document 1 is "a cooker used by being incorporated in a kitchen, which is a substantially box-shaped upper outer shell and a cooked container to be heated that covers the upper surface of the upper outer shell. On the upper unit having a top plate for placing the kitchen and a heating body housed in the upper outer shell to heat the cooked container to be heated, and a part of the kitchen front opening provided on the front surface of the kitchen. It has a grill facing the front opening of the heating chamber and a lower outer shell for accommodating the grill, and includes a lower unit attached below the upper unit, wherein the upper unit and the lower unit are side walls of the grill. The space distance in the left-right direction between the side wall of the lower outer shell and the side wall of the upper outer shell is larger than the space distance in the left-right direction between the side wall of the lower outer shell. It has a structure in which it is inserted and incorporated through the opening on the upper surface of the kitchen provided on the upper surface of the kitchen, and the heating body (heating coil) and the substrate are housed in one unit.

Japanese Unexamined Patent Publication No. 2014-21244

As described above, in an induction heating cooker, the switching operation of a power semiconductor is the main source of electromagnetic noise, and the higher the output (higher thermal power), the more likely it is that malfunctions or failures due to electromagnetic noise will occur.

In the conventional induction heating cooker in which a plurality of substrates are arranged vertically on the side of the oven, a noise generation source is locally generated in the main body due to the miniaturization and high output of the substrates. That is, by reducing the size of the substrate with respect to the volume of the outer shell of the main body molded according to the system kitchen, the space for propagating electromagnetic noise is relatively wide.

Since electromagnetic noise is transmitted through the resin member, it is necessary to shield it with a metal member. However, depending on the metal member installed in the main body, the propagation path of electromagnetic noise becomes more complicated, and it may be difficult to take measures against electromagnetic noise. There are many.

In the induction heating cooker of Patent Document 1, parts such as a substrate and a heating coil are mounted in a main body at a high density. In such a configuration, the space for propagating electromagnetic noise can be limited, but since the heating coil and the substrate are close to each other, the substrate may malfunction due to the magnetic field from the heating coil, or the substrate temperature may rise due to the heat from the heating coil. Adverse effects such as rising are likely to occur.

Therefore, an object of the present invention is to provide a more reliable induction cooking cooker capable of suppressing malfunction due to mixing of electromagnetic noise generated from an inverter substrate with a simple configuration.

In order to solve the above problems, the induction heating cooker according to the present invention includes a top plate arranged on the upper surface and a main body arranged below the top plate, and the main body is provided. , A coil storage made of a metal box containing a heating coil, a board storage made of a metal box containing an IH circuit board and a fan device, and a heating chamber equipped with an electric heater. The oven storage is provided with a metal box body, and the substrate storage and the oven storage are arranged below the coil storage.

According to the induction heating cooker of the present invention, it is possible to suppress malfunction due to mixing of electromagnetic noise generated from the inverter substrate with a simple configuration.

Perspective view of the induction heating cooker of Example 1 An exploded perspective view of the induction heating cooker shown in FIG. Side sectional view cut along the line AA shown in FIG. Schematic diagram of the front cross section cut along the CC line shown in FIG. 1 when installed in the system kitchen. Schematic diagram of FIG. 3 when installed in a system kitchen Modification example of FIG. Modification example of FIG. An exploded perspective view of the induction cooking device of Example 2. Side sectional view of the induction heating cooker of FIG. Front sectional view of the induction heating cooker of Example 3

Examples of the present invention will be described in detail with reference to the drawings as appropriate. In addition, as shown in FIG. 1 and the like, front and rear, up and down, and left and right are defined with reference to the line of sight of the user facing the induction heating cooker 10 (see FIG. 1).

<Structure of induction heating cooker>
First, the induction heating cooker 10 of the first embodiment will be outlined with reference to FIGS. 1 to 4.

FIG. 1 is a perspective view of the induction heating cooker 10 of this embodiment before incorporating the system kitchen, FIG. 2 is an exploded perspective view of the induction heating cooker 10 of FIG. 1, and FIG. 3 is an induction heating cooker of FIG. 10 is a side sectional view taken along the line AA, and FIG. 4 is a front sectional view taken along the line CC of FIG. 1 for the induction heating cooker 10 after incorporating the system kitchen.

As shown in FIG. 1, in the induction heating cooker 10 of this embodiment, the top plate 2 having the pot mounting portion 21 and the operating portion P0 is arranged on the upper surface, the oven 5 is arranged on the lower left, and the power switch P3 is arranged. This is a built-in type IH (Induction Heating) cooking heater in which the front plate P2 to be held is arranged at the lower right. The induction heating cooker 10 has a specification of using an AC power source of 200 to 220 V as a power source, and has a plurality of heating coils having a maximum thermal power (power consumption) of 2.0 kW or more. Therefore, the maximum heating power (power consumption) is larger than that of a desktop type IH cooking heater with a 100V power supply. On the other hand, there is also a problem that component heat generation (circuit loss) and electromagnetic noise are larger than those of the desktop type for home use.

A high-frequency current of about 20 kHz to 40 kHz is passed through the heating coils 3 (3a, 3b, 3c) shown in FIG. 2 on the bottom of the metal pot placed on the pot mounting portion 21 of the top plate 2, and the magnetic flux is temporal. An eddy current is generated by changing to, which causes the metal pan itself to generate heat.

The induction heating cooker 10 for inductively heating a metal pot in this way is mainly composed of two main parts, a top plate 2 arranged on the upper surface and a main body 1 arranged below the top plate 2. The main body 1 is a housing having an outer shell of the induction heating cooker 10, and mainly contains a coil storage 1a containing the heating coil 3 and a substrate containing the IH circuit board 7 (inverter board 7a, control board 7b). It is composed of a storage 1b and an oven storage 1c containing an oven 5, and a substrate storage 1b and an oven storage 1c are arranged side by side below the coil storage 1a. The substrate storage 1b and the oven storage 1c can be removed from the coil storage 1a even when they are incorporated in the system kitchen.

The coil storage 1a arranged at the upper part of the main body 1 is a metal box body whose upper part is open, and has a generally concave cross section while being provided with wiring, ventilation, an opening for arranging a support portion 32 described later, and the like. ing. A heating coil 3, a display unit P1, and the like are installed in the coil storage 1a, and the top plate 2 is installed so as to cover the heating coil 3 and the display unit P1.

The substrate storage 1b arranged at the lower right of the main body 1 is a metal box body having an open upper portion, and has a generally concave cross section while having openings for wiring, ventilation, and the like. A board case 8 is installed in the board storage 1b. The board case 8 is a resin box-like body that houses the IH circuit board 7 and the fan device 9 and substantially seals the parts other than the ventilation part and the wiring part. Such a substrate case 8 insulates the IH circuit board 7 which is a charging unit and suppresses leakage of cooling air to improve the cooling efficiency of the IH circuit board 7.

The oven storage 1c arranged at the lower left of the main body 1 is a metal box body with an open front, and has a generally concave cross section while having openings for wiring, ventilation, and the like. An oven 5 using a heat source such as an electric heater is installed in the oven storage 1c.

As shown in FIG. 2, inside the board case 8, a fan device 9 having a built-in multi-blade impeller is provided behind the IH circuit board 7. The fan device 9 is configured to suck in outside air from an intake opening H1 provided on the back surface of the substrate storage 1b and blow out cooling air toward the IH circuit board 7. The air that has cooled the inverter board 7a further cools the control board 7b, then goes to the heating coil 3 through the duct D1, cools the heating coil 3, and then is exhausted from the exhaust opening H2 at the rear of the top plate 2. That is, the fan device 9 is arranged on the most upstream side of the cooling path. Since the substrate case 8 has a substantially sealed structure, leakage of air flowing through the substrate case 8 is suppressed, and the cooling efficiency of the IH circuit board 7 is improved.

A plurality of support portions 32 for supporting the coil base 31 are installed below the coil base 31 on which the heating coil 3 is placed. Since the bottom surface of the coil storage 1a is open above the board case 8, the coil base 31 on which the heating coil 3 is placed can be placed on the support portion 32 on the bottom surface of the coil storage 1a or on the board case 8. It is supported by the support portion 32 of. Further, a temperature sensor 34 (thermistor, infrared sensor, etc.) for detecting the temperature of the bottom of the pot via the top plate 2 is installed near the center of the heating coil 3. As described above, since the heating coil 3 is arranged on the downstream side of the fan device 9, the air that has cooled the IH circuit board 7 cools the heating coil 3 and the temperature sensor 34 through the duct D1. It has become like.

FIG. 3 is a side sectional view of the induction heating cooker 10 cut along the line AA shown in FIG. 1, mainly the heating coil 3a on the right side in the coil storage 1a and the IH in the substrate storage 1b. It shows the positional relationship between the circuit board 7 and the fan device 9. As is clear from the figure, the inverter board 7a that supplies high-frequency current is arranged on the bottom side far from the coil storage 1a, and the operation unit P0, the display unit P1, the temperature sensor 34, the inverter board 7a, etc. are wired on the upper side. The connected control board 7b is arranged. These IH circuit boards 7 are fixed to the board base 73 protruding from the inner surface of the resin board case 8 with screws or the like.

The inverter board 7a, which is the main source of electromagnetic noise, mounts a power semiconductor 72 that generates a high-frequency current. Since the power semiconductor 72 is an element that generates a large amount of heat, a heat sink 79 that is in thermal contact with the power semiconductor 72 is arranged, and the cooling air from the fan device 9 is applied to the fins of the heat sink 79, thereby passing through the heat sink 79. The power semiconductor 72 is efficiently cooled.

In the induction heating cooker 10, the maximum electromagnetic noise is generated in the inverter board 7a, but the side surface and the bottom surface of the inverter board 7a are covered with a board storage 1b which is a metal box, and the upper surface of the inverter board 7a is wired to the control board 7b. By enclosing it with a pattern, it is possible to suppress the diffusion of electromagnetic noise generated by the inverter board 7a. If a radio wave shielding plate such as a metal plate is further added between the inverter board 7a and the control board 7b or between the heating coil 3a and the control board 7b, it becomes easier to suppress the propagation of electromagnetic noise.

Further, by making the board storage 1b an individual unit independent of the coil storage 1a, the outer shape of the board storage 1b can be easily miniaturized according to the size of the inverter board 7a. Therefore, it becomes easy to surround the noise source with a small metal housing, and it becomes easy to predict the propagation path of electromagnetic noise.

Since the electromagnetic noise causes malfunction or failure of the signal line controlled by a weak voltage, it is possible to keep the electromagnetic noise generated by the inverter board 7a in the board storage 1b by the configuration of this embodiment. It is possible to suppress adverse effects on parts that use a weak voltage as a signal, such as the display unit P1 in the coil storage 1a and the temperature sensor 34 of the heating coil 3a. For example, it is more accurate from the output signal of the temperature sensor 34. The temperature can be detected.

Further, since the board storage 1b is an individual unit that can be easily removed from the main body 1, the board storage 1b is a board storage even when the induction heating cooker 10 is incorporated in the system kitchen in the event of a failure of the IH circuit board 7. Only 1b can be attached and detached. That is, according to the configuration of this embodiment, it is not necessary to remove the entire induction heating cooker 10 from the system kitchen at the time of maintenance, and maintenance services such as replacement of the substrate storage 1b can be easily performed.

In the control board 7b located downstream of the inverter board 7a, a gap between the inner wall of the board case 8 and the board base 73 constitutes a ventilation path (not shown), and is below the heating coil 3a from the fan device 9. The cooling air is guided to the discharge portion D of the above. Therefore, the board base 73 for fixing the control board 7b functions as a wall that is supplied from the fan device 9 and separates the air passage to the inverter board 7a from the air path of the control board 7b.

FIG. 4 is a front sectional view taken along the line CC shown in FIG. 1 when installed in a system kitchen. The upper heater 51 and the lower heater 52 are arranged in the heating chamber 50 in the oven storage 1c, and the grill 54 and the saucer 53 are arranged above and below the lower heater 52. The heat source of the heating chamber 50 is not limited to the electric heater, and the food may be heated by microwaves, steam, or a combination thereof. Alternatively, a temperature controller may be provided to heat the oven.

Here, the door portion on the front side of the heating chamber 50 has a size that matches the opening on the front side of the system kitchen 100, and the heating chamber 50 also has a size that matches the opening in the front view. In this embodiment, a space 100b is provided between the coil storage 1a and the oven storage 1c, so that heat leakage from the heating chamber 50 is difficult to be transmitted to the coil storage 1a. Here, since the heights of the induction heating cooker 10 and the oven storage 1c are generally determined by the standard of the system kitchen, in order to increase the space 100b between the coil storage 1a and the oven storage 1c, the coil storage 1a It is necessary to reduce the height (volume) of the oven. Then, if the volume of the coil storage 1a is reduced, the propagation path of electromagnetic noise can be restricted. Further, by narrowing the gap between the bottom surface of the coil storage 1a and the heating coil 3b, it is possible to reduce the change in the cross-sectional area of the air passage of the cooling air blown from the duct D1. Therefore, the cooling air can be supplied to the heating coil 3b at a high wind speed, and the parts can be efficiently cooled to improve the reliability.

Further, as shown in FIG. 4, in the induction heating cooker 10 of this embodiment, the bottom surface of the substrate storage 1b is made higher than the bottom surface of the oven storage 1c. As a result, a relatively large space 100a is formed below the substrate storage 1b, and this becomes an air passage having a small ventilation resistance that guides the outside air to the intake opening H1. In the substrate storage 1b of FIG. 3, the intake opening H1 is provided on the rear surface of the fan device 9, but if the intake opening H1 is also provided on the lower surface of the fan device 9, low temperature air is mainly provided. It becomes easier to take in in 1. In this embodiment, since the intake opening H1 of the substrate storage 1b is provided at a position far from the oven 5, the high temperature air around the oven 5 is rarely taken in from the intake opening H1.

FIG. 5 is a schematic view of the case where the induction heating cooker 10 of FIG. 3 is incorporated in the system kitchen, and corresponds to a side sectional view of FIG. As shown here, a space 100a connecting the gap below the front plate P2 and the intake opening H1 is formed below the substrate storage 1b. The front plate P2 is connected to the coil storage 1a via the support portion 1d so as to be arranged side by side with the door portion of the oven 5.

As described above, the intake opening H1 for sucking air by the fan device 9 is provided on the back surface side of the main body 1, and the portion for sucking the low temperature outside air is the outer circumference of the front plate P2. The smaller the ventilation resistance from the front plate P2 to the intake opening H1, the fan device 9 can guide a large amount of cooling air into the substrate case 8 at a low speed rotation. It should be noted that the ventilation resistance can be reduced by providing a wide gap with the opening of the system kitchen around the front plate P2 that sucks the outside air into the main body, or by providing a vent such as a small diameter hole in the front plate itself.

Therefore, since the space 100a having a wide cross-sectional air passage as in this configuration is provided in the intake path, the fan device rotating at a low speed can efficiently take in the cooling air with low noise and efficiently cool the parts, which is more reliable. Can provide a high induction heating cooker.
<Modification example 1>
FIG. 6 is a modification 1 of this embodiment. In this modification, the arrangement of the intake opening H1 of the substrate storage 1b is changed from the back surface to the bottom surface, and the rotation axis direction of the fan device 9 is changed from horizontal to vertical.

In this configuration, the distance from the front plate P2 to the intake opening H1 can be shortened to further reduce the ventilation resistance, so that the load on the fan device 9 can be reduced. Therefore, it is possible to efficiently blow air toward the parts to be cooled of the IH circuit board 7 and improve the cooling efficiency, so that it becomes easy to optimize the air cooling performance such as lowering the air volume and noise of the fan device 9.
<Modification 2>
FIG. 7 is a modification 2 of this embodiment. This modification 2 is a modification of the modification 1, in which the intake duct H3 is projected below the bottom surface of the substrate storage 1b, and the intake duct H3 is provided with the intake opening H1. In this configuration, since the impeller of the fan device 9 and the intake opening H1 can be arranged separately, the disturbance of the wind speed distribution on the intake side of the impeller can be suppressed, the flow separation is less likely to occur when the impeller rotates, and the fan device 9 efficiently determines the flow. Can blow air <heating operation and air flow in the substrate case>
A metal pan (not shown) is placed on the pan mounting portion 21 (corresponding to the heating coil 3a) on the right side of the top plate 2, and the heat treatment is performed by operating the operating portion 22 (see FIG. 1) by the user. Start. The operation unit P0 is a touch key and can be operated by touching the key printed on the top plate 2.

A high-frequency current is supplied from the inverter circuit of the inverter board 7a to the heating coil 3a located below the metal pot in response to a command from a control device (not shown) of the control board 7b to induce and heat the metal pot. When the metal pot is induced and heated by the heating coil 3a, the power semiconductor 72 and other electronic components 71 constituting the inverter circuit also generate heat in addition to the heating coil 3a.

With the start of the heat treatment, the fan device 9 is driven in response to a command from the control device. When the fan device 9 is driven, air is sucked from the intake opening H1. The air discharged from the fan device 9 mainly blows out toward the heat sink 79 of the inverter board 7a, and absorbs heat from the heat sink 79 on the inverter board 7a of the heating coil 3a.

The power semiconductor 72 is cooled by heat dissipation via the heat sink 79, and the other electronic components 71 mounted on the inverter board 7a are also cooled by heat exchange with air. The air that has cooled the inverter board 7a is guided to the discharge portion D above the board case 8 via the control board 7b and flows toward the heating coil 3a. The air that has cooled the heating coil 3a is discharged through the exhaust opening H2.

According to the present embodiment described above, with a simple configuration, malfunction due to mixing of electromagnetic noise generated from the inverter board can be suppressed, and reliability is achieved by the high component temperature reduction effect due to the cooling air passage with reduced ventilation resistance. High induction heating can be realized.

In the second embodiment, the configurations of the substrate storage 1b and the substrate case 8 are different from those in the first embodiment, but the other parts are the same as those in the first embodiment. Therefore, the different parts will be described, and duplicate description will be omitted for the parts common to the first embodiment.

FIG. 8 is a perspective view of the induction cooking device 10 of the second embodiment, and FIG. 9 is a side sectional view of FIG.

The substrate storage 1b of the first embodiment was a metal box body whose upper part was open, but the substrate storage 1b of the present embodiment has a metal surface on the entire surface of the substrate case 8. Therefore, in this embodiment, the intake opening H1 and the duct D1 constituting the cooling air passage are the main openings of the substrate storage 1b. Further, an inverter board 7a provided with a heat sink 79 and a fan device 9 are arranged on the bottom surface side of the board case 8, and a control board 7b is arranged so as to cover the inverter board 7a and the fan device 9. By arranging the IH circuit board 7 above the fan device 9, the area of the control board 7b is increased, and the margin for making the circuit pattern resistant to electromagnetic noise is increased. Further, it is possible to reduce the diffusion of electromagnetic noise propagating from the inverter board 7a through the fan device 9 in the board case 8.

According to this embodiment, the area of the substrate constituting the circuit pattern can be expanded, the circuit resistant to electromagnetic noise can be easily constructed, high cooling performance can be ensured, and induction heating cooking resistant to electromagnetic noise can be realized.

In the third embodiment, the configurations of the coil storage 1a, the substrate storage 1b, and the substrate case 8 are different from those of the first embodiment of FIG. 4, but the other parts are the same as those of the first embodiment. Therefore, the different parts will be described, and the description of the parts overlapping with the first embodiment will be omitted.

FIG. 10 is a front sectional view of the induction cooking device 10 of the third embodiment.

In the first embodiment, the space 100b is provided between the coil storage 1a and the oven storage 1c, but in this embodiment, the space 100b is not provided. Therefore, the control board 7b is arranged on the bottom of the coil storage 1a whose height has been increased. Only the inverter board 7a having a large electromagnetic noise is arranged in the board case 8 of the board storage 1b, and the control board 7b is provided so as to cover the board storage 1b, so that the circuit pattern is configured according to the noise resistance. It will be easier. Further, when the control board 7b approaches the heating coil 3, the wiring distance of the signal line, which is vulnerable to noise, can be shortened and connected, and the adverse effect of electromagnetic noise can be mitigated.

According to this embodiment, the noise resistance of the signal line in the vicinity of the heating coil 3 and the display unit P1 can be improved, and induction heating cooking with few failures and high reliability can be realized.

10 Induction heating cooker 1 Main body 1a Coil storage 1b Board storage 1c Oven storage 2 Top plate 3 (3a, 3b, 3c) Heating coil 5 Oven 50 Heating chamber 51 Upper heater 52 Lower heater 7 IH circuit board 7a Inverter board 7b Control board 71 Electronic components 72 Power semiconductor 73 Board stand 79 Heat sink 8 Board case 9 Fan device D1 Duct H1 Intake opening H2 Exhaust opening

Claims (9)

An induction cooker comprising a top plate arranged on the upper surface and a main body arranged below the top plate.
The main body
A coil storage box consisting of a metal box that houses the heating coil,
A board storage made of a metal box that houses an IH circuit board and a fan device,
An oven storage made of a metal box that houses a heating chamber equipped with an electric heater,
Is equipped with
An induction heating cooker characterized in that the substrate storage and the oven storage are arranged below the coil storage. A plurality of the IH circuit boards are arranged one above the other in the board storage.
The induction heating cooker according to claim 1, wherein the IH circuit board arranged on the bottom surface side is an inverter board on which a power semiconductor is mounted. The board storage is a metal box body with an open upper part.
The induction heating cooker according to claim 2, wherein the IH circuit board arranged on the upper side is a control board for controlling the inverter board. The second or third aspect of the present invention, wherein the coil storage further houses a temperature sensor arranged in the heating coil and a display unit arranged on the front side. Induction heating cooker. The induction heating cooker according to any one of claims 2 to 4, wherein the outlet of the fan device faces the inverter substrate. The intake opening of the board storage is on the back
The induction heating cooker according to claim 5, wherein the fan device has a rotating shaft arranged horizontally. The intake opening of the board storage is on the bottom surface.
The induction heating cooker according to claim 5, wherein the fan device has a rotation axis arranged vertically. By making the bottom surface of the substrate storage higher than the bottom surface of the oven storage,
The induction heating cooker according to any one of claims 1 to 7, wherein a space is provided below the substrate storage and the outside air is supplied to the fan device through the space. The induction heating cooker according to any one of claims 1 to 8, wherein the coil storage and the substrate storage are detachable in a state of being incorporated in the system kitchen.

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