JP5590984B2 - 電子装置及びその製造方法 - Google Patents

電子装置及びその製造方法 Download PDF

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Publication number
JP5590984B2
JP5590984B2 JP2010140939A JP2010140939A JP5590984B2 JP 5590984 B2 JP5590984 B2 JP 5590984B2 JP 2010140939 A JP2010140939 A JP 2010140939A JP 2010140939 A JP2010140939 A JP 2010140939A JP 5590984 B2 JP5590984 B2 JP 5590984B2
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Prior art keywords
wiring layer
insulating layer
layer
forming
wiring
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JP2010140939A
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Japanese (ja)
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JP2012004504A (ja
JP2012004504A5 (OSRAM
Inventor
孝治 山野
秀行 小林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2010140939A priority Critical patent/JP5590984B2/ja
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Publication of JP2012004504A5 publication Critical patent/JP2012004504A5/ja
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    • H10W72/20—

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2010140939A 2010-06-21 2010-06-21 電子装置及びその製造方法 Active JP5590984B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010140939A JP5590984B2 (ja) 2010-06-21 2010-06-21 電子装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010140939A JP5590984B2 (ja) 2010-06-21 2010-06-21 電子装置及びその製造方法

Publications (3)

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JP2012004504A JP2012004504A (ja) 2012-01-05
JP2012004504A5 JP2012004504A5 (OSRAM) 2013-05-16
JP5590984B2 true JP5590984B2 (ja) 2014-09-17

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JP2010140939A Active JP5590984B2 (ja) 2010-06-21 2010-06-21 電子装置及びその製造方法

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JP (1) JP5590984B2 (OSRAM)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2857237B2 (ja) * 1990-08-10 1999-02-17 古河電気工業株式会社 多層回路基板の製造方法
JP3423245B2 (ja) * 1999-04-09 2003-07-07 沖電気工業株式会社 半導体装置及びその実装方法
JP3996521B2 (ja) * 2002-02-22 2007-10-24 株式会社フジクラ 多層配線基板用基材の製造方法
JP2004055628A (ja) * 2002-07-17 2004-02-19 Dainippon Printing Co Ltd ウエハレベルの半導体装置及びその作製方法
JP2006278646A (ja) * 2005-03-29 2006-10-12 Sanyo Electric Co Ltd 半導体装置の製造方法
JP4913563B2 (ja) * 2006-11-22 2012-04-11 株式会社テラミクロス 半導体装置の製造方法
JP4995551B2 (ja) * 2006-12-01 2012-08-08 ローム株式会社 半導体装置及び半導体装置の製造方法
JP4121542B1 (ja) * 2007-06-18 2008-07-23 新光電気工業株式会社 電子装置の製造方法
JP4953132B2 (ja) * 2007-09-13 2012-06-13 日本電気株式会社 半導体装置
JP4787296B2 (ja) * 2008-07-18 2011-10-05 Ｔｄｋ株式会社 半導体内蔵モジュール及びその製造方法

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Publication number Publication date
JP2012004504A (ja) 2012-01-05

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