JP5590187B1 - テーブル装置、搬送装置、及び半導体製造装置 - Google Patents

テーブル装置、搬送装置、及び半導体製造装置 Download PDF

Info

Publication number
JP5590187B1
JP5590187B1 JP2013106544A JP2013106544A JP5590187B1 JP 5590187 B1 JP5590187 B1 JP 5590187B1 JP 2013106544 A JP2013106544 A JP 2013106544A JP 2013106544 A JP2013106544 A JP 2013106544A JP 5590187 B1 JP5590187 B1 JP 5590187B1
Authority
JP
Japan
Prior art keywords
bearing
disposed
axis
axis direction
supply port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013106544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014229669A (ja
Inventor
俊徳 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NSK Ltd
Original Assignee
NSK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NSK Ltd filed Critical NSK Ltd
Priority to JP2013106544A priority Critical patent/JP5590187B1/ja
Priority to CN201380003203.XA priority patent/CN104303282B/zh
Priority to PCT/JP2013/083976 priority patent/WO2014188626A1/ja
Priority to KR1020157031271A priority patent/KR20160009547A/ko
Application granted granted Critical
Publication of JP5590187B1 publication Critical patent/JP5590187B1/ja
Publication of JP2014229669A publication Critical patent/JP2014229669A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Machine Tool Units (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2013106544A 2013-05-20 2013-05-20 テーブル装置、搬送装置、及び半導体製造装置 Active JP5590187B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013106544A JP5590187B1 (ja) 2013-05-20 2013-05-20 テーブル装置、搬送装置、及び半導体製造装置
CN201380003203.XA CN104303282B (zh) 2013-05-20 2013-12-18 工作台装置及输送装置
PCT/JP2013/083976 WO2014188626A1 (ja) 2013-05-20 2013-12-18 テーブル装置、及び搬送装置
KR1020157031271A KR20160009547A (ko) 2013-05-20 2013-12-18 테이블 장치 및 반송 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013106544A JP5590187B1 (ja) 2013-05-20 2013-05-20 テーブル装置、搬送装置、及び半導体製造装置

Publications (2)

Publication Number Publication Date
JP5590187B1 true JP5590187B1 (ja) 2014-09-17
JP2014229669A JP2014229669A (ja) 2014-12-08

Family

ID=51701960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013106544A Active JP5590187B1 (ja) 2013-05-20 2013-05-20 テーブル装置、搬送装置、及び半導体製造装置

Country Status (4)

Country Link
JP (1) JP5590187B1 (ko)
KR (1) KR20160009547A (ko)
CN (1) CN104303282B (ko)
WO (1) WO2014188626A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015152246A1 (ja) * 2014-04-01 2015-10-08 日本精工株式会社 テーブル装置、搬送装置、半導体製造装置、及び検査装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107851599B (zh) * 2015-07-30 2022-02-08 日本精工株式会社 工作台装置、定位装置、平板显示器制造装置以及精密机械
DE102019209601A1 (de) * 2019-07-01 2021-01-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Positioniermodul für ein Fügen oder Montieren von Bauteilen
JP7180895B2 (ja) * 2020-07-22 2022-11-30 ヒーハイスト株式会社 位置決めテーブル
CN113504763B (zh) * 2021-07-12 2022-08-09 武汉武重机床有限公司 工作台负载重量的控制方法、装置、设备及存储介质
CN114248122B (zh) * 2021-12-21 2023-06-27 北京海普瑞森超精密技术有限公司 一种超精密空气静压伺服转台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001235001A (ja) * 2000-02-22 2001-08-31 Sankyo Seiki Mfg Co Ltd ２自由度リンク機構
JP4112919B2 (ja) * 2002-07-15 2008-07-02 住友重機械工業株式会社 Ｚチルトステージ
JP4160824B2 (ja) 2002-12-20 2008-10-08 日本トムソン株式会社 昇降用案内ユニット及びそれを組み込んだステージ装置
KR20070039926A (ko) * 2004-07-23 2007-04-13 가부시키가이샤 니콘 지지 장치, 스테이지 장치, 노광 장치, 및 디바이스의 제조방법
JP2010153644A (ja) * 2008-12-25 2010-07-08 Hiihaisuto Seiko Kk 昇降テーブル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015152246A1 (ja) * 2014-04-01 2015-10-08 日本精工株式会社 テーブル装置、搬送装置、半導体製造装置、及び検査装置
JP2015196222A (ja) * 2014-04-01 2015-11-09 日本精工株式会社 テーブル装置、及び搬送装置

Also Published As

Publication number Publication date
WO2014188626A1 (ja) 2014-11-27
CN104303282B (zh) 2017-02-22
CN104303282A (zh) 2015-01-21
JP2014229669A (ja) 2014-12-08
KR20160009547A (ko) 2016-01-26

Similar Documents

Publication Publication Date Title
JP5776812B1 (ja) テーブル装置、及び搬送装置
JP5594404B1 (ja) テーブル装置、搬送装置、半導体製造装置、及びフラットパネルディスプレイ製造装置
JP5541398B1 (ja) テーブル装置、及び搬送装置
JP5590187B1 (ja) テーブル装置、搬送装置、及び半導体製造装置
JP6442831B2 (ja) テーブル装置、及び搬送装置
JP6634836B2 (ja) テーブル装置、位置決め装置、フラットパネルディスプレイ製造装置、及び精密機械
JP5751279B2 (ja) テーブル装置、搬送装置、及び半導体製造装置
WO2015133436A1 (ja) テーブル装置、測定装置、工作機械、及び半導体製造装置
JP6520073B2 (ja) テーブル装置、位置決め装置、フラットパネルディスプレイ製造装置、及び精密機械
JP6610083B2 (ja) テーブル装置、位置決め装置、フラットパネルディスプレイ製造装置、及び精密機械
KR101800765B1 (ko) 테이블 장치 및 반송 장치
JP2023114174A (ja) テーブル装置
JP6331300B2 (ja) テーブル装置、及び搬送装置
JP6318960B2 (ja) テーブル装置、測定装置、半導体製造装置、フラットパネルディスプレイ製造装置、及び工作機械

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140701

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140714

R150 Certificate of patent (=grant) or registration of utility model

Ref document number: 5590187

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150