JP5584846B1 - 太陽電池およびその製造方法、ならびに太陽電池モジュール - Google Patents
太陽電池およびその製造方法、ならびに太陽電池モジュール Download PDFInfo
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- JP5584846B1 JP5584846B1 JP2014516122A JP2014516122A JP5584846B1 JP 5584846 B1 JP5584846 B1 JP 5584846B1 JP 2014516122 A JP2014516122 A JP 2014516122A JP 2014516122 A JP2014516122 A JP 2014516122A JP 5584846 B1 JP5584846 B1 JP 5584846B1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 193
- 238000000034 method Methods 0.000 claims abstract description 126
- 238000002844 melting Methods 0.000 claims abstract description 114
- 230000008018 melting Effects 0.000 claims abstract description 110
- 238000007747 plating Methods 0.000 claims abstract description 87
- 238000006243 chemical reaction Methods 0.000 claims abstract description 76
- 230000003746 surface roughness Effects 0.000 claims abstract description 28
- 238000000137 annealing Methods 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 69
- 239000010409 thin film Substances 0.000 claims description 69
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 56
- 229910052710 silicon Inorganic materials 0.000 claims description 55
- 239000010703 silicon Substances 0.000 claims description 55
- 230000015572 biosynthetic process Effects 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 19
- 239000010419 fine particle Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 abstract description 18
- 239000010410 layer Substances 0.000 description 617
- 239000010408 film Substances 0.000 description 55
- 239000002245 particle Substances 0.000 description 44
- 229910021417 amorphous silicon Inorganic materials 0.000 description 40
- 230000008569 process Effects 0.000 description 40
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- 239000000243 solution Substances 0.000 description 28
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 20
- 238000007639 printing Methods 0.000 description 20
- 238000005245 sintering Methods 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 15
- 239000004332 silver Substances 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 230000007423 decrease Effects 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 12
- 229910052814 silicon oxide Inorganic materials 0.000 description 11
- 239000007769 metal material Substances 0.000 description 10
- 239000003566 sealing material Substances 0.000 description 10
- 238000001035 drying Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 8
- -1 for example Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000011810 insulating material Substances 0.000 description 8
- 239000005871 repellent Substances 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 230000002940 repellent Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 230000031700 light absorption Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 230000002441 reversible effect Effects 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 229910003437 indium oxide Inorganic materials 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- BJXXCWDIBHXWOH-UHFFFAOYSA-N barium(2+);oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Ba+2].[Ba+2].[Ba+2].[Ba+2].[Ba+2].[Ta+5].[Ta+5].[Ta+5].[Ta+5] BJXXCWDIBHXWOH-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910001954 samarium oxide Inorganic materials 0.000 description 2
- 229940075630 samarium oxide Drugs 0.000 description 2
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000000391 spectroscopic ellipsometry Methods 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0465—PV modules composed of a plurality of thin film solar cells deposited on the same substrate comprising particular structures for the electrical interconnection of adjacent PV cells in the module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
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Abstract
Description
一方で、正孔と電子とを比較した場合、有効質量および散乱断面積の小さい電子の方が、一般的に移動度が大きい。以上の観点から、ヘテロ接合太陽電池に用いられる単結晶シリコン基板1は、n型単結晶シリコン基板であることが好ましい。単結晶シリコン基板1は、光閉じ込めの観点から、表面にテクスチャ構造を有することが好ましい。
低融点材料:高融点材料の重量比は、10:90〜50:50がより好ましく、15:85〜35:65がさらに好ましい。
第一導電層71上には、絶縁層9が形成される。ここで、第一導電層71が所定のパターン(例えば櫛形)に形成された場合、光電変換部50の表面上には、第一導電層が形成されている第一導電層形成領域と、第一導電層が形成されていない第一導電層非形成領域とが存在する。
これに伴って、第一導電層71の低融点材料の熱流動開始温度T1は、250℃未満であることが好ましく、200℃未満がより好ましく、180℃未満がさらに好ましい。
(表面粗さ測定)
キーエンス社製のレーザー顕微鏡VK−8510を用いて、JIS B 0601:2001(ISO 4287:1997に対応)に基づいて、第一導電層および第二導電層のそれぞれの表面の表面粗さRaを測定した。
(粘度測定)
印刷ペーストの粘度は、株式会社ブルックフィールド社製の回転式粘度計により、溶液温度25℃、回転速度10rpmで測定した。
実施例1のヘテロ接合太陽電池を、以下のようにして製造した。
一導電型単結晶シリコン基板として、入射面の面方位が(100)で、厚みが200μmのn型単結晶シリコンウェハを用い、このシリコンウェハを2重量%のHF水溶液に3分間浸漬し、表面の酸化シリコン膜が除去された後、超純水によるリンスが2回行われた。このシリコン基板を、70℃に保持された5/15重量%のKOH/イソプロピルアルコール水溶液に15分間浸漬し、ウェハの表面をエッチングすることでテクスチャが形成された。その後に超純水によるリンスが2回行われた。原子間力顕微鏡(AFM パシフィックナノテクノロジー社製)により、ウェハの表面観察を行ったところ、ウェハの表面はエッチングが進行しており、(111)面が露出したピラミッド型のテクスチャが形成されていた。
第一導電層71形成用印刷ペーストの粘度および低融点材料の粒径が表1に示すように変更された点を除いて、実施例1と同様にしてヘテロ接合太陽電池が作製され、モジュール化が行われた。
粒径DL=0.3〜0.7μmの銀微粒子を低融点材料として含有し、高融点材料を含有しない印刷ペーストが、第一導電層71形成用印刷ペーストとして用いられた。印刷用ペーストの粘度は、表1に示す通りであった。この印刷ペーストが用いられた点を除いて、実施例1と同様にしてヘテロ接合太陽電池が作製され、モジュール化が行われた。
第一導電層形成用の印刷ペーストとして、低融点材料を含まない銀ペースト(すなわち金属材料粉末と銀粉末との比率を0:100としたもの)が用いられ、集電極パターンに対応形状にスクリーン印刷した後に、180℃で乾燥が行われた点を除いて、実施例1と同様にして第一導電層(銀電極)71の形成までが行われた。その後、絶縁層形成工程、アニール処理、第二導電層形成工程のいずれも実施せず、この銀電極を集電極とするヘテロ接合太陽電池が作製され、モジュール化が行われた。
第一導電層71形成用の印刷ペーストの低融点材料の種類及び粒径が表1に示すように変更された点を除いて、実施例1と同様にしてヘテロ接合太陽電池が作製された。その後、絶縁層形成工程およびアニール処理を実施することなく、めっき法により第二導電層が形成された。比較例2,3では、第二導電層を形成することができたものの、めっき処理中に透明電極層が完全にエッチングされる不具合が生じており、太陽電池として機能するものが得られなかった。
比較例4,5,および6では、それぞれ参考例1,実施例1,および参考例2と同様の第一導電層71形成用印刷ペーストを用い、第一導電層の形成、および絶縁層の製膜が行われた。その後、アニール処理を実施することなく、めっき法による第二導電層の形成を試みたが、銅が析出せず、第二導電層が形成されなかった。
比較例7では、比較例1と同様の銀ペーストを用いて第一導電層が形成された後、絶縁層の製膜が行われた。その後、実施例1と同様にアニール処理を行い、めっき法による第二導電層の形成を試みたが、銅が析出せず、第二導電層が形成されなかった。
(太陽電池出力測定)
各実施例、参考例および比較例のヘテロ接合太陽電池の太陽電池特性の測定を行った。
(剥離強度試験)
めっき前後の導電層表面の表面粗さと、めっき膜に樹脂製接着剤を用いて貼り付けた部材の剥離強度との関係を検証した。具体的には、ガラス板上に、ITOからなる膜厚100nmの透明電極層を製膜し、その上に、実施例1〜3、参考例1,2、および比較例1〜3と同様の方法で集電極を形成した。この集電極上に、幅:1mm、長さ:100mm、厚さ:100μmの銅箔を、導電性樹脂製接着剤を用いて接着した。具体的には、導電性樹脂製接着剤として、平均粒子径が2μm〜5μmであるNiフィラーを約8質量%含有するエポキシ系樹脂からなり、幅:1mm、長さ:50mm、厚さ:25μmのフィルム状導電性樹脂接着剤を集電極上に配置し、その上に銅箔を配置して、200℃で、0.25MPaで30分間押圧することにより、集電極上に銅箔を接着した。その後、剥離強度試験器(IMADA社製 MX−2000N)を用いて、ガラス板の法線方向に沿って、40mm/分の速度で銅箔を引張り、銅箔が剥離したときの最大荷重を剥離強度とした。
JIS C 8917に従い、実施例、参考例、比較例の太陽電池モジュールの温度サイクル試験を実施した。各実施例、参考例、比較例の太陽電池モジュールの温度サイクル試験前の出力を各々1とし、温度サイクル試験実施後の出力との比、すなわち、サイクル試験前後での保持率を算出した。
2. 真性シリコン系薄膜
3. 導電型シリコン系薄膜
6. 透明電極層
70. 集電極
71. 第一導電層
711. 低融点材料
72. 第二導電層
8. 裏面金属電極
9. 絶縁層
9h. 開口部
50. 光電変換部
100. 太陽電池
101. ヘテロ接合太陽電池
10. めっき装置
11. めっき槽
12. 基板
13. 陽極
14. 基板ホルダ
15. 電源
16. めっき液
33. 樹脂製接着剤
34. 配線部材
Claims (10)
- 光電変換部と、前記光電変換部の一主面上の集電極とを有する太陽電池であって、
前記集電極は、前記光電変換部側から順に第一導電層と第二導電層とを含み、かつ、前記第一導電層と前記第二導電層の間に、開口部が形成された絶縁層を含み、
前記第一導電層は前記絶縁層により被覆されており、
前記第一導電層は低融点材料を含み、前記低融点材料の熱流動開始温度T1は前記光電変換部の耐熱温度よりも低温であり、
前記第二導電層の一部が、前記絶縁層の開口部を介して前記第一導電層に導通されており、かつ、前記第二導電層の表面粗さRa2が1.0μm以上10.0μm以下である太陽電池。 - 前記第一導電層の表面粗さRa1が、1.0μm以上10.0μm以下である、請求項1に記載の太陽電池。
- 前記光電変換部は、一導電型結晶シリコン基板の一主面上に、シリコン系薄膜および透明電極層をこの順に有し、
前記透明電極層上に前記集電極を有し、
前記低融点材料の熱流動開始温度T1が250℃以下である、請求項1または2に記載の太陽電池。 - 前記絶縁層が、前記光電変換部の第一導電層非形成領域上にも形成されている、請求項1〜3のいずれか1項に記載の太陽電池。
- 請求項1〜4のいずれか1項に記載の太陽電池を備える太陽電池モジュール。
- 請求項1〜4のいずれか1項に記載の太陽電池と配線部材とを備え、前記太陽電池が前記配線部材を介して、他の太陽電池または外部回路と接続されており、
前記太陽電池の前記集電極と前記配線部材とが、導電性微粒子を含有する樹脂製接着剤により接着されている、太陽電池モジュール。 - 請求項1〜4のいずれか1項に記載の太陽電池を製造する方法であって、
前記光電変換部上に低融点材料を含む第一導電層が形成される第一導電層形成工程;
前記第一導電層上に絶縁層が形成される絶縁層形成工程;および
めっき法により第二導電層が形成されるめっき工程、をこの順に有し、
前記絶縁層形成工程において、または前記絶縁層形成工程の後めっき工程前に、前記低融点材料の熱流動開始温度T1よりも高温のアニール温度Taで、前記第一導電層のアニール処理が行われ、前記絶縁層に開口部が形成される、太陽電池の製造方法。 - 前記アニール温度Taが、250℃以下である、請求項7に記載の太陽電池の製造方法。
- 前記第一導電層形成工程において、25℃における粘度が20〜500Pa・sのペースト材料を用いて、前記第一導電層が形成される、請求項7または8に記載の太陽電池の製造方法。
- 前記光電変換部は、一導電型結晶シリコン基板の一主面上に、シリコン系薄膜および透明電極層をこの順に有し、前記透明電極層上に前記集電極が形成される、請求項7〜9のいずれか1項に記載の太陽電池の製造方法。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009231840A (ja) * | 2008-03-24 | 2009-10-08 | Palo Alto Research Center Inc | シリコン太陽電池用の多層電極構造体の製造方法 |
WO2011045287A1 (en) * | 2009-10-13 | 2011-04-21 | Ecole Polytechnique Federale De Lausanne (Epfl) | Device comprising electrical contacts and its production process |
JP2011199045A (ja) * | 2010-03-19 | 2011-10-06 | Sanyo Electric Co Ltd | 太陽電池、その太陽電池を用いた太陽電池モジュール及び太陽電池の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007214372A (ja) * | 2006-02-09 | 2007-08-23 | Sharp Corp | 太陽電池およびその製造方法 |
JP5121181B2 (ja) * | 2006-07-28 | 2013-01-16 | 三洋電機株式会社 | 光起電力素子及びその製造方法 |
JP2009152222A (ja) * | 2006-10-27 | 2009-07-09 | Kyocera Corp | 太陽電池素子の製造方法 |
TW200926210A (en) * | 2007-09-27 | 2009-06-16 | Murata Manufacturing Co | Ag electrode paste, solar battery cell, and process for producing the solar battery cell |
US8294024B2 (en) * | 2008-08-13 | 2012-10-23 | E I Du Pont De Nemours And Company | Processes for forming photovoltaic devices |
US20100101639A1 (en) * | 2008-10-24 | 2010-04-29 | Epistar Corporation | Optoelectronic device having a multi-layer solder and manufacturing method thereof |
WO2011072153A2 (en) * | 2009-12-09 | 2011-06-16 | Solexel, Inc. | High-efficiency photovoltaic back-contact solar cell structures and manufacturing methods using three-dimensional semiconductor absorbers |
JP2011204955A (ja) | 2010-03-26 | 2011-10-13 | Sanyo Electric Co Ltd | 太陽電池、太陽電池モジュール、電子部品及び太陽電池の製造方法 |
JP5377409B2 (ja) * | 2010-05-28 | 2013-12-25 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
US20140360567A1 (en) * | 2011-08-05 | 2014-12-11 | Solexel, Inc. | Back contact solar cells using aluminum-based alloy metallization |
KR101878397B1 (ko) * | 2011-11-18 | 2018-07-16 | 인텔렉츄얼 키스톤 테크놀로지 엘엘씨 | 태양전지 및 그 제조 방법 |
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WO2011045287A1 (en) * | 2009-10-13 | 2011-04-21 | Ecole Polytechnique Federale De Lausanne (Epfl) | Device comprising electrical contacts and its production process |
JP2011199045A (ja) * | 2010-03-19 | 2011-10-06 | Sanyo Electric Co Ltd | 太陽電池、その太陽電池を用いた太陽電池モジュール及び太陽電池の製造方法 |
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