JP5576173B2 - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置 Download PDF

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Publication number
JP5576173B2
JP5576173B2 JP2010099986A JP2010099986A JP5576173B2 JP 5576173 B2 JP5576173 B2 JP 5576173B2 JP 2010099986 A JP2010099986 A JP 2010099986A JP 2010099986 A JP2010099986 A JP 2010099986A JP 5576173 B2 JP5576173 B2 JP 5576173B2
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wafer
unit
adhesive
stage
hand
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JP2010099986A
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Japanese (ja)
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JP2011233571A (ja
JP2011233571A5 (enExample
Inventor
暁 原
真吾 玉井
昭宏 重山
路夫 小川
均 青柳
裕之 田中
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2010099986A priority Critical patent/JP5576173B2/ja
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Publication of JP2011233571A5 publication Critical patent/JP2011233571A5/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010099986A 2010-04-23 2010-04-23 半導体装置の製造装置 Expired - Fee Related JP5576173B2 (ja)

Priority Applications (1)

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JP2010099986A JP5576173B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

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JP2010099986A JP5576173B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

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JP2011233571A JP2011233571A (ja) 2011-11-17
JP2011233571A5 JP2011233571A5 (enExample) 2013-06-13
JP5576173B2 true JP5576173B2 (ja) 2014-08-20

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JP2010099986A Expired - Fee Related JP5576173B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5554133B2 (ja) * 2010-04-23 2014-07-23 芝浦メカトロニクス株式会社 半導体装置の製造装置及び半導体装置の製造方法
JP6009217B2 (ja) * 2012-05-18 2016-10-19 株式会社ディスコ 保護部材の貼着方法
JP6018528B2 (ja) 2013-03-13 2016-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6105985B2 (ja) * 2013-03-14 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス 吐出検査装置および基板処理装置
KR101567195B1 (ko) 2013-03-14 2015-11-06 가부시키가이샤 스크린 홀딩스 토출 검사 장치 및 기판 처리 장치
JP6126505B2 (ja) * 2013-09-26 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102247118B1 (ko) * 2013-09-26 2021-04-30 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 토출 검사 장치
JP6756600B2 (ja) * 2016-12-14 2020-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071792Y2 (ja) * 1990-05-07 1995-01-18 株式会社エンヤシステム ウエーハ貼付装置

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JP2011233571A (ja) 2011-11-17

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