JP5574723B2 - Substrate divider - Google Patents

Description

The present invention relates to a substrate dividing apparatus for dividing a hard substrate along the dividing line.

  Conventionally, various substrate dividing apparatuses that divide a hard substrate such as ceramics or glass along a dividing line in which a dividing groove or the like is formed have been proposed. For example, in the substrate dividing device (break device) described in Patent Document 1, a substrate (material substrate) is placed on a flat belt arranged on the upper surface of the table, and the substrate dividing line (break line of break) is placed. The substrate is divided by pressing on the dividing line of the substrate by a roller whose axes coincide with each other.

JP-A-11-262915

  In the substrate dividing apparatus described in Patent Document 1, when the substrate dividing line is pressed by the roller, the entire lower surface of the substrate is in contact with the upper surface of the flat belt, so the substrate moves on the placed belt. This makes it difficult to separate the divided substrates. For this reason, the edges along the dividing line of the divided substrates are easily contacted immediately after the division. And there existed a problem that damage, such as a chip | tip, was easy to produce in the edge part of the divided | segmented board | substrate by contact of this edge part.

The present invention has been made to solve the above problem, and provides a substrate dividing apparatus capable of suppressing damage such as chipping generated at the edge of a hard substrate divided along a dividing line. With the goal.

The substrate dividing apparatus according to the present invention is a substrate dividing apparatus that divides a hard substrate having a dividing groove formed along a dividing line on a lower surface along the dividing line, the dividing groove formed on the lower surface of the substrate. Are arranged so as to be positioned in between, a support base having a first support part and a second support part that respectively support the lower surface of the substrate along a direction in which the dividing line extends, and the division of the upper surface of the substrate A pressing member that presses a position shifted from the center of the substrate in a direction in which the dividing line extends, and is disposed between the upper surface of the substrate and the pressing member, and the upper surface of the first support portion and the A pressing member bridged between the upper surface of the second support portion, and the pressing member presses the substrate via the pressing member, and the pressing member is divided. Base Characterized in that it does not contact with.

  Moreover, the said board | substrate division | segmentation apparatus of this invention WHEREIN: The said support stand may have the receiving part which receives the said board | substrate divided | segmented between the said 1st support part and the said 2nd support part.

  The first support portion has a first inclined surface formed along a direction in which the dividing line extends, and the second support portion is formed in a second inclination formed along the direction in which the dividing line extends. The first inclined surface and the second inclined surface are arranged so as to face each other, are inclined so that their lower ends are in contact with each other and their upper ends are separated from each other, and the receiving portion However, it may be formed by the first inclined surface and the second inclined surface.

Further, the first inclined surface and the second inclined surface may be configured to support one edge and the other edge of the substrate extending in a direction in which the dividing line extends.

  Each of the first inclined surface and the second inclined surface may be a flat surface.

  In addition, a separator is provided at the bottom of the receiving portion, and the separator is arranged so as to be positioned between the substrates that are divided along the dividing line and received by the receiving portion. May be.

  The pressing surface of the pressing member may be a curved surface that is convex toward the support base, and the curved surface may be curved along a direction orthogonal to the direction in which the dividing line extends.

  Moreover, the said board | substrate division | segmentation apparatus of this invention has further the pressing member arrange | positioned between the upper surface of the said board | substrate and the said press member, and the said press member presses the said board | substrate via the said press member. It may be configured as follows.

ADVANTAGE OF THE INVENTION According to this invention, the board | substrate division | segmentation apparatus which can suppress damage, such as a chip | tip produced at the edge of the hard board | substrate divided | segmented along the division line, can be provided.

It is a perspective view which shows an example of the board | substrate which the board | substrate division | segmentation apparatus of this invention divides | segments. It is a perspective view showing a schematic structure of one embodiment of a substrate dividing device of the present invention. It is a front view of the board | substrate division | segmentation apparatus of FIG. It is process drawing explaining one Embodiment of the board | substrate division | segmentation method of this invention. It is a perspective view which shows the deformation | transformation state of a board | substrate typically. In the substrate dividing apparatus of FIG. 1, the separated state after dividing the substrate is shown, (a) is a plan view thereof, and (b) is a front view thereof. It is a front view which shows schematic structure of other embodiment of the board | substrate division | segmentation apparatus of this invention. It is a front view which shows schematic structure of other embodiment of the board | substrate division | segmentation apparatus of this invention. The schematic structure of other embodiment of the board | substrate division | segmentation apparatus of this invention is shown, (a) is the top view, (b) is the front view. It is a front view which shows schematic structure of other embodiment of the board | substrate division | segmentation apparatus of this invention, (a)-(c) is process drawing explaining the effect | action of a pressing member.

  The substrate dividing apparatus of the present invention is for dividing a hard substrate such as ceramics or glass along a dividing line. As shown in FIG. 1, as an example of a substrate S to be divided by the substrate dividing apparatus of the present invention, a substrate having a dividing groove P formed along a dividing line DD located at the center in the width direction on the lower surface. It is done. The split groove P is formed by a known method such as laser processing.

  Hereinafter, an embodiment of the substrate dividing apparatus of the present invention will be described with reference to the drawings, taking as an example the case of dividing the substrate S shown in FIG.

  As shown in FIGS. 2 and 3, the substrate dividing apparatus X of this embodiment includes a support base 1 that supports the substrate S and a pressing member 3 that is disposed above the support base 1. 2 and 3 show a state in which the substrate S is placed on and supported by the support base 1. For example, the substrate S may be automatically transferred and placed on the support table 1 by a substrate transfer device (not shown), or may be manually placed using a jig or the like.

  The support base 1 includes a first support portion 11 and a second support portion 12 that are arranged so that the split groove P on the lower surface of the substrate S is located therebetween. The first support portion 11 and the second support portion 12 are arranged so that each extends along a direction in which the division line DD of the substrate S is extended (hereinafter referred to as a division direction). The lower surface of the substrate S is supported along the direction. In the present embodiment, the support base 1 is formed by integrating the first support portion 11 and the second support portion 12. Moreover, the support stand 1 is formed, for example with stainless steel.

  More specifically, the first support portion 11 has a first inclined surface 11a extending along the dividing direction of the substrate S. The second support part 12 has a second inclined surface 12 a extending in the dividing direction of the substrate S. The 1st inclined surface 11a and the 2nd inclined surface 12a are arrange | positioned so that it may mutually oppose, and it inclines so that each lower end may contact | connect and each upper end may space apart. Each of the first inclined surface 11a and the second inclined surface 12a is a flat surface, and as shown in FIGS. 2 and 3, on the lower surface of the substrate S, an edge on one side extending in the dividing direction of the substrate S. R and the other side edge L are each supported. Thereby, when the board | substrate S is pressed by the press member 3 so that it may mention later, the position shift of the board | substrate S does not arise easily. Further, as shown in FIG. 3, the first inclined surface 11a and the second inclined surface 12a are symmetrically inclined so that the inclination angle α with respect to the lower surface of the substrate S is the same angle. By doing so, a uniform force is applied in the width direction of the substrate S when pressing above the dividing groove P (partition line DD) located in the center of the substrate S. Therefore, as described later, when the substrate S is separated, the substrate S can be stably positioned at a predetermined position on the receiving portion 5.

  In the present embodiment, the receiving portion 5 is formed by the first inclined surface 11 a of the first support portion 11 and the second inclined surface 12 a of the second support portion 12. As will be described later, the receiving portion 5 is for receiving the substrate S divided along the dividing line DD. In the present embodiment, since the first inclined surface 11a and the second inclined surface 12a constituting the receiving portion 5 are flat surfaces, the divided substrate S can be received by the surface, and the first inclined surface 11a and the first inclined surface 11a The occurrence of damage to the substrate S due to the contact between the two inclined surfaces 12a and the substrate S is suppressed.

  The pressing member 3 is arrange | positioned above the support stand 1, for example, is comprised by the raising / lowering apparatus which is not illustrated so that an up-down movement is possible. The pressing member 3 is formed on the dividing line DD on the upper surface of the substrate S supported by the first inclined surface 11a of the first support portion 11 and the second inclined surface 12a of the second support portion 12. The position shifted from the center of the substrate S in the dividing direction can be pressed. In addition, the raising / lowering apparatus which is not shown in figure may be automated so that the board | substrate S may be pressed by the press member 3 in connection with conveyance of the board | substrate S by the above-mentioned board | substrate conveyance apparatus, for example. Further, the pressing member 3 may be configured and moved so as to be manually moved up and down.

  Further, as shown in FIG. 1, the pressing member 3 of the present embodiment is configured by covering the outer peripheral surface of a disk-shaped shaft body 3 a with a rubber material 3 b. Thereby, the pressing surface of the pressing member 3 is a curved surface that protrudes toward the support base 1, and the curved surface is curved along a direction orthogonal to the direction in which the dividing line DD of the substrate S extends. Is formed. According to the pressing member 3, when the substrate S is pressed, a slight positional shift of the dividing line DD of the substrate S with respect to the pressing member 3 is allowed, and the pressing member 3 is divided into the dividing line DD of the substrate S. Can be pressed well on top.

  Next, an embodiment of the substrate dividing method of the present invention will be described with reference to FIG. 4 by taking as an example the case where the substrate dividing apparatus X is used.

  As shown in FIG. 4A, first, the substrate S is placed on the support base 1. More specifically, one side of the substrate extending in the direction in which the dividing line DD of the substrate S extends by the first inclined surface 11a of the first support portion 11 and the second inclined surface 12a of the second support portion 12. The edge R and the other side edge L are supported. By doing so, the lower surface of the substrate S is supported along the direction in which the dividing line DD of the substrate S extends at a position sandwiching the split groove P on the lower surface of the substrate S. At this time, as shown in FIG. 2, one end portion of the substrate S in the dividing direction is positioned between the first inclined surface 11 a and the second inclined surface 12 a and the pressing member 3. At this time, the pressing member 3 is located above the substrate S and separated from the upper surface of the substrate S.

  Next, as shown in FIG. 4B, the pressing member 3 is moved downward by a lifting device (not shown) to press the upper surface of the substrate S. More specifically, in this way, one end of the upper surface of the substrate S on the dividing line DD is pressed. At this time, a gap U is formed between the lower surface of the substrate S and the receiving portion 5 formed by the first inclined surface 11a and the second inclined surface 12a. Therefore, as shown in FIG. 4C, the dividing line DD of the substrate S is pushed toward the lower gap U as the pressing member 3 moves downward. As a result, the substrate S is cracked toward the upper surface of the substrate S starting from the split groove P formed on the lower surface of the substrate S along the dividing line DD. When the crack reaches the upper surface of the substrate S, the substrate S is divided as shown in FIG. The divided pieces S1 and S2 of the substrate S divided at this time are separated from each other without being in contact with each other, and are received by the first inclined surface 11a and the second inclined surface 12a which are the receiving portions 5. Hereinafter, the principle will be described in detail.

  FIG. 5 is a perspective view schematically showing a deformed state of the substrate S until one end of the substrate S is pressed and divided. When the substrate S is divided, as described above, one end portion of the substrate S is pressed by the pressing member 3, and the edges R and L of the substrate S are the first inclined surface 11 a and the second inclined surface of the support base 1. Although it is in a state in contact with the surface 12a (see FIG. 4), for convenience of explanation, the pressing member 3 and the support base 1 are not shown in FIG.

  FIG. 5A shows a deformed state of the substrate S in the state described with reference to FIG. In FIG. 5A, the front end F of the substrate S is pressed. At this time, as shown in FIG. 5A, the substrate S has an end F on the near side (hereinafter referred to as the front end F) V more than the end B on the back side (hereinafter referred to as the back end B). The shape is greatly deformed. At this time, the front end F of the substrate S is not separated.

  When the front end F of the substrate S is further pushed in, as shown in FIG. 5B, a crack runs from the front end F of the substrate S toward the back end B, and the front end F is separated. At this time, the front end F of the substrate S is further deformed in a V shape more than the rear end B, and a force (hereinafter referred to as reaction force) is generated on the substrate S to repel the deformation.

  When the front end F of the substrate S is further pushed in, a crack on the substrate S reaches the back end B as shown in FIG. Just before the crack reaches the back end B, a large reaction force is stored in the substrate S. Then, at the moment when the crack reaches the back end B and the back end B is separated, the reaction end causes the back end B of the divided pieces S1 and S2 of the substrate S to move to the arrow shown in FIG. It spreads in the N direction and, as shown in FIG. 6, the divided pieces S <b> 1 and S <b> 2 are received on the receiving portion 5 of the support base 1 in a separated state without contact. FIG. 6 shows a separated state after the substrate S is divided in the plan view of the substrate dividing apparatus X of FIG.

  In the substrate dividing method using the substrate dividing apparatus X of the above-described embodiment, the first support portion 11 and the second support portion 12 are arranged so that the dividing groove P on the lower surface of the substrate S is located therebetween. While the first support portion 11 and the second support portion 12 support the lower surface of the substrate S along the direction in which the dividing line DD extends in a position where the dividing groove P is disposed, the substrate S is supported by the pressing member 3. It is comprised so that the one end part on the division line DD in the upper surface may be pressed. Therefore, as described above, the divided substrates S (divided pieces S1, S2) are received by the receiving portion 5 of the support base 1 in a separated state without contact. Therefore, according to the said embodiment, damage, such as a chip | tip produced at the edge of the hard board | substrate S divided | segmented along the division line DD, can be suppressed.

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning.

  In the above-described embodiment, one end portion on the dividing line DD on the upper surface of the substrate S is pressed by the pressing member 3, but is shifted from the center of the substrate in the extending direction of the dividing line on the dividing line on the upper surface of the substrate. As long as the position is pressed, the present invention is not limited to this. In this way, when the position shifted from the center of the substrate is pressed, the V-shaped deformation of one end on the dividing line of the substrate becomes larger than the other end, and from one end of the substrate to the other end. You can run a crack. Therefore, similarly to the above, the divided substrates can be separated without contacting each other, and damage such as chipping generated at the edge of the divided substrate can be suppressed.

  In the substrate dividing apparatus X of the above embodiment, the edges L and R of the substrate S are supported by the first inclined surface 11 a of the first support portion 11 and the second inclined surface 12 a of the second support portion 12. However, the first support portion 11 and the second support portion 12 respectively support the lower surface of the substrate S along the direction in which the dividing line DD extends in a position where the dividing groove P is disposed in the lower surface of the substrate S. As long as it is, it is not limited to this. For example, as shown in FIG. 7, the substrate S is supported on the upper surfaces of the first support portion 11 and the second support portion 12, and the edges SR and SL of the substrate S along the edges R and L of the substrate S are You may make it support. Further, as shown in FIG. 8, the substrate S is supported by the protrusions 1R and 1L of the first support part 11 and the second support part 12, and the lower surface of the substrate S is linearly formed by the protrusions 1R and 1L. You may make it support in the area | region.

  In the substrate dividing apparatus X shown in FIG. 6, for example, as shown in FIG. 9, a separator 7 that extends along the bottom may be further provided at the bottom of the receiving part 5. The separation body 7 is arranged so as to be positioned between the substrates (separation pieces S1, S2) which are divided along the division line and received by the receiving portion 5. This prevents the separated pieces S1 and S2 from coming into contact with each other after the separated substrate has dropped onto the upper surface (the first inclined surface 11a and the second inclined surface 12a) of the receiving portion 5, The resulting substrate damage can be suppressed. The separator 7 is preferably formed of an elastic material such as rubber. Further, the shape of the separator 7 is not particularly limited, and the cross section shown in FIG. 9 may be a triangle or a semicircular cross section. Further, the separator 7 is not limited to the one formed continuously over the entire length of the bottom of the receiving portion 5, and may be formed intermittently.

Moreover, in the board | substrate division | segmentation apparatus X shown in FIG. 3, you may further provide the pressing member 9 arrange | positioned between the upper surface of the board | substrate S and the press member 3, as shown to Fig.10 (a), for example. . By doing so, the pressing member 3 is configured to press the substrate S via the pressing member 9 as shown in FIG. By pressing the substrate S through the pressing member 3 in this way, the position of the substrate S can be prevented from shifting while the substrate S is pressed by the pressing member 3. The predetermined position on the three dividing lines can be pressed more accurately. As shown in FIG. 10, the pressing member 9 spans a linear body made of an elastic material such as rubber between the upper surface of the first support part 11 and the upper surface of the second support part 12, It can comprise by fixing the both ends of a filament. As shown in FIG. 10C, the pressing member 9 is configured not to contact the substrate S after the substrate S is divided.

DESCRIPTION OF SYMBOLS 1 Support stand 11 1st support part 11a 1st inclined surface 12 2nd support part 12a 2nd inclined surface 3 Pressing member 5 Receiving part 7 Separator 9 Pressing member S Substrate S1, S2 Divided piece L, R Edge of substrate P Dividing groove DD Dividing line X Substrate dividing device

Claims (8)

A substrate dividing apparatus for dividing a hard substrate having a dividing groove formed along a dividing line on a lower surface along the dividing line,
A support base having a first support portion and a second support portion, which are arranged so that the split grooves on the lower surface of the substrate are located therebetween, and respectively support the lower surface of the substrate along a direction in which the dividing line extends; ,
On the dividing line on the upper surface of the substrate, a pressing member that presses a position shifted from the center of the substrate in the extending direction of the dividing line;
A pressing member disposed between the upper surface of the substrate and the pressing member and spanned between the upper surface of the first support portion and the upper surface of the second support portion;
The substrate splitting apparatus , wherein the pressing member presses the substrate through the pressing member and does not contact the substrate into which the pressing member is divided .   2. The substrate dividing apparatus according to claim 1, wherein the pressing member presses one end of the substrate in a direction in which the dividing line extends on the dividing line on the upper surface of the substrate.   3. The substrate dividing apparatus according to claim 1, wherein the support base includes a receiving portion that receives the divided substrate between the first support portion and the second support portion. The first support portion has a first inclined surface formed along the direction in which the dividing line extends, and the second support portion has a second inclined surface formed along the direction in which the dividing line extends. Have
The first inclined surface and the second inclined surface are disposed so as to face each other, and lower ends thereof are in contact with each other,
The substrate dividing apparatus according to claim 3, wherein the receiving portion is formed by the first inclined surface and the second inclined surface.   5. The substrate according to claim 4, wherein the first inclined surface and the second inclined surface respectively support an edge on one side and an edge on the other side of the substrate extending in a direction in which the dividing line extends. Splitting device. 6. The substrate dividing apparatus according to claim 4, wherein each of the first inclined surface and the second inclined surface is a flat surface. A separator for separating the substrate separated along the dividing line into the first support part side and the second support part side is provided at the bottom of the receiving part,
The division according to any one of claims 1 to 6, wherein the separator is arranged so as to be positioned between the substrates divided along the division line and received by the receiving portion. apparatus.   The pressing surface of the pressing member is a curved surface that protrudes toward the support base, and the curved surface is curved along a direction orthogonal to a direction in which the dividing line extends. The dividing device according to any one of 1 to 7.

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