JP5560518B2 - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物 Download PDF

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Publication number
JP5560518B2
JP5560518B2 JP2006260154A JP2006260154A JP5560518B2 JP 5560518 B2 JP5560518 B2 JP 5560518B2 JP 2006260154 A JP2006260154 A JP 2006260154A JP 2006260154 A JP2006260154 A JP 2006260154A JP 5560518 B2 JP5560518 B2 JP 5560518B2
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Japan
Prior art keywords
resin composition
thermosetting resin
group
film
fluorine
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JP2006260154A
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Japanese (ja)
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JP2007119744A (ja
JP2007119744A5 (https=
Inventor
充史 諏訪
博 細野
宏之 仁王
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP2006260154A priority Critical patent/JP5560518B2/ja
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Publication of JP2007119744A5 publication Critical patent/JP2007119744A5/ja
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2006260154A 2005-09-28 2006-09-26 熱硬化性樹脂組成物 Active JP5560518B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006260154A JP5560518B2 (ja) 2005-09-28 2006-09-26 熱硬化性樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005281321 2005-09-28
JP2005281321 2005-09-28
JP2006260154A JP5560518B2 (ja) 2005-09-28 2006-09-26 熱硬化性樹脂組成物

Publications (3)

Publication Number Publication Date
JP2007119744A JP2007119744A (ja) 2007-05-17
JP2007119744A5 JP2007119744A5 (https=) 2009-10-15
JP5560518B2 true JP5560518B2 (ja) 2014-07-30

Family

ID=38143904

Family Applications (1)

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JP2006260154A Active JP5560518B2 (ja) 2005-09-28 2006-09-26 熱硬化性樹脂組成物

Country Status (1)

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JP (1) JP5560518B2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009096050A1 (ja) 2008-01-28 2009-08-06 Toray Industries, Inc. シロキサン系樹脂組成物
EP2259289A4 (en) * 2008-03-18 2013-09-04 Toray Industries GATE INSULATION MATERIAL, GATE INSULATING FILM AND ORGANIC FIELD EFFECT TRANSISTOR
JP4873001B2 (ja) 2008-12-10 2012-02-08 ソニー株式会社 固体撮像装置とその製造方法、電子機器並びに半導体装置
JP5922013B2 (ja) 2011-12-28 2016-05-24 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子
JP5976523B2 (ja) 2011-12-28 2016-08-23 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子
JP5976575B2 (ja) 2012-08-31 2016-08-23 富士フイルム株式会社 低屈折率膜形成用硬化性組成物、光学部材セットの製造方法及び硬化性組成物の製造方法
JP2018178003A (ja) * 2017-04-17 2018-11-15 株式会社ダイセル フッ素含有エポキシ変性シルセスキオキサン、及びそれを含む硬化性組成物
KR20210052431A (ko) 2018-08-31 2021-05-10 도레이 카부시키가이샤 수지 조성물, 그의 경화막
JP2021070758A (ja) * 2019-10-31 2021-05-06 東レ株式会社 樹脂組成物、およびその硬化膜
WO2022102626A1 (ja) * 2020-11-10 2022-05-19 ダウ・東レ株式会社 紫外線硬化性組成物およびその用途
JP7765297B2 (ja) * 2022-01-31 2025-11-06 サカタインクス株式会社 被膜形成用組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3671560B2 (ja) * 1996-11-20 2005-07-13 Jsr株式会社 熱硬化性樹脂組成物の製造方法
JP2004086011A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 撥水性低屈折率コーティング用組成物およびその組成物を塗布した光学物品
WO2005040245A1 (ja) * 2003-10-24 2005-05-06 Nippon Kayaku Kabushiki Kaisha 感光性樹脂組成物及びその硬化皮膜を有するフィルム
JP2006265530A (ja) * 2005-02-28 2006-10-05 Toray Ind Inc コーティング材料およびそれを用いた光学物品
JP4671338B2 (ja) * 2005-06-27 2011-04-13 日本化薬株式会社 フッ素含有ポリシロキサン、それを用いる感光性樹脂組成物及びその硬化物

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