JP5559288B2 - プリント配線板の製造方法及び表面処理装置 - Google Patents

プリント配線板の製造方法及び表面処理装置 Download PDF

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Publication number
JP5559288B2
JP5559288B2 JP2012249639A JP2012249639A JP5559288B2 JP 5559288 B2 JP5559288 B2 JP 5559288B2 JP 2012249639 A JP2012249639 A JP 2012249639A JP 2012249639 A JP2012249639 A JP 2012249639A JP 5559288 B2 JP5559288 B2 JP 5559288B2
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JP
Japan
Prior art keywords
aqueous solution
surface treatment
treatment step
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012249639A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014099473A (ja
Inventor
康孝 網谷
啓佑 松本
薫 漆畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Priority to JP2012249639A priority Critical patent/JP5559288B2/ja
Priority to KR1020157005770A priority patent/KR20150083988A/ko
Priority to CN201380057630.6A priority patent/CN104770070B/zh
Priority to PCT/JP2013/064705 priority patent/WO2014076989A1/ja
Priority to TW102120290A priority patent/TW201419972A/zh
Publication of JP2014099473A publication Critical patent/JP2014099473A/ja
Application granted granted Critical
Publication of JP5559288B2 publication Critical patent/JP5559288B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
JP2012249639A 2012-11-13 2012-11-13 プリント配線板の製造方法及び表面処理装置 Expired - Fee Related JP5559288B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012249639A JP5559288B2 (ja) 2012-11-13 2012-11-13 プリント配線板の製造方法及び表面処理装置
KR1020157005770A KR20150083988A (ko) 2012-11-13 2013-05-28 프린트 배선판의 제조 방법 및 표면 처리 장치
CN201380057630.6A CN104770070B (zh) 2012-11-13 2013-05-28 印刷配线板的制造方法及表面处理装置
PCT/JP2013/064705 WO2014076989A1 (ja) 2012-11-13 2013-05-28 プリント配線板の製造方法及び表面処理装置
TW102120290A TW201419972A (zh) 2012-11-13 2013-06-07 印刷配線板之製造方法及表面處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012249639A JP5559288B2 (ja) 2012-11-13 2012-11-13 プリント配線板の製造方法及び表面処理装置

Publications (2)

Publication Number Publication Date
JP2014099473A JP2014099473A (ja) 2014-05-29
JP5559288B2 true JP5559288B2 (ja) 2014-07-23

Family

ID=50730916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012249639A Expired - Fee Related JP5559288B2 (ja) 2012-11-13 2012-11-13 プリント配線板の製造方法及び表面処理装置

Country Status (5)

Country Link
JP (1) JP5559288B2 (zh)
KR (1) KR20150083988A (zh)
CN (1) CN104770070B (zh)
TW (1) TW201419972A (zh)
WO (1) WO2014076989A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101827765B1 (ko) 2014-06-24 2018-02-09 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 동계 금속 또는 은계 금속의 흑화 처리용 조성물
JP6232605B2 (ja) * 2016-05-10 2017-11-22 メック株式会社 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法
CN109280919B (zh) * 2017-07-20 2020-11-24 添鸿科技股份有限公司 含铜金属用的蚀刻剂组成物
JP6333455B1 (ja) * 2017-08-23 2018-05-30 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6338232B1 (ja) 2017-09-22 2018-06-06 メック株式会社 銅表面の粗化方法および配線基板の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5163585A (en) * 1991-04-19 1992-11-17 Michael Campbell Puncturing device for aerosol containers
JPH05163585A (ja) * 1991-12-12 1993-06-29 Shikoku Chem Corp 銅及び銅合金の表面処理方法
JPH062176A (ja) * 1992-06-18 1994-01-11 Metsuku Kk 銅および銅合金の表面処理剤
JP3458023B2 (ja) * 1995-08-01 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤
CN1195895C (zh) * 1997-01-29 2005-04-06 美克株式会社 铜和铜合金的微浸蚀剂
JP3205927B2 (ja) * 1997-04-07 2001-09-04 株式会社三和研究所 銅金共存基板の表面保護剤および表面保護膜の形成方法。
US7645393B2 (en) * 2007-04-27 2010-01-12 Kesheng Feng Metal surface treatment composition
EP2272015A4 (en) * 2008-04-01 2011-09-14 Yahoo Inc OPEN FRAMEWORK FOR INTEGRATING AND ASSIGNING CONTENT OBJECTS AND INTERACTION WITH THEM
JP5474316B2 (ja) * 2008-05-30 2014-04-16 三井金属鉱業株式会社 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板
JP5163585B2 (ja) * 2009-04-09 2013-03-13 船井電機株式会社 ディスク装置
CN101906630B (zh) * 2010-08-03 2011-08-10 山东金宝电子股份有限公司 电解铜箔的黑色表面处理工艺

Also Published As

Publication number Publication date
CN104770070A (zh) 2015-07-08
TW201419972A (zh) 2014-05-16
WO2014076989A1 (ja) 2014-05-22
KR20150083988A (ko) 2015-07-21
JP2014099473A (ja) 2014-05-29
CN104770070B (zh) 2017-10-10

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