JP5557198B2 - ハイブリッド集積光学素子 - Google Patents

ハイブリッド集積光学素子 Download PDF

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Publication number
JP5557198B2
JP5557198B2 JP2011520594A JP2011520594A JP5557198B2 JP 5557198 B2 JP5557198 B2 JP 5557198B2 JP 2011520594 A JP2011520594 A JP 2011520594A JP 2011520594 A JP2011520594 A JP 2011520594A JP 5557198 B2 JP5557198 B2 JP 5557198B2
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JP
Japan
Prior art keywords
motherboard
daughter board
optical
assembly
alignment
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JP2011520594A
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English (en)
Japanese (ja)
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JP2011529206A (ja
JP2011529206A5 (enExample
Inventor
ロジャーズ、デイヴィッド
マクスウェル、グレイアム
ラルデノワ、セバスティアン
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Centre for Integrated Photonics Ltd
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Centre for Integrated Photonics Ltd
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Publication of JP2011529206A publication Critical patent/JP2011529206A/ja
Publication of JP2011529206A5 publication Critical patent/JP2011529206A5/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2011520594A 2008-07-28 2009-07-27 ハイブリッド集積光学素子 Active JP5557198B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0813784.6A GB0813784D0 (en) 2008-07-28 2008-07-28 Optical intergration system
GB0813784.6 2008-07-28
PCT/GB2009/050925 WO2010013036A1 (en) 2008-07-28 2009-07-27 Hybrid integrated optical elements

Publications (3)

Publication Number Publication Date
JP2011529206A JP2011529206A (ja) 2011-12-01
JP2011529206A5 JP2011529206A5 (enExample) 2012-05-31
JP5557198B2 true JP5557198B2 (ja) 2014-07-23

Family

ID=39747058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011520594A Active JP5557198B2 (ja) 2008-07-28 2009-07-27 ハイブリッド集積光学素子

Country Status (6)

Country Link
US (1) US8548292B2 (enExample)
EP (1) EP2321683B1 (enExample)
JP (1) JP5557198B2 (enExample)
CN (1) CN102203652B (enExample)
GB (1) GB0813784D0 (enExample)
WO (1) WO2010013036A1 (enExample)

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WO2012145572A1 (en) 2011-04-20 2012-10-26 The Trustees Of The University Of Pennsylvania Regimens and compositions for aav-mediated passive immunization of airborne pathogens
US8830466B2 (en) * 2011-11-10 2014-09-09 Cisco Technology, Inc. Arrangement for placement and alignment of opto-electronic components
CN103246027B (zh) * 2013-05-23 2015-04-22 中航海信光电技术有限公司 可无源耦合的多路并行光组件及封装方法
CN108135994B (zh) 2015-05-13 2022-01-25 宾夕法尼亚州大学信托人 Aav-介导的抗-流感抗体的表达及其使用方法
JP6660820B2 (ja) * 2016-06-13 2020-03-11 日本電信電話株式会社 光デバイス
US9939580B2 (en) * 2016-07-06 2018-04-10 Cisco Technology, Inc. Optical component alignment using inverted carrier member
TWI647501B (zh) * 2016-12-13 2019-01-11 峰川光電股份有限公司 主動光纜之製造方法
US20200278506A1 (en) * 2017-09-08 2020-09-03 Teknologian Tutkimuskeskus Vtt Oy Hybrid integration of photonic chips with single-sided coupling
TWI781162B (zh) * 2018-03-30 2022-10-21 日商日東電工股份有限公司 光電混合基板、連接器組及其製造方法
US11320613B2 (en) 2018-03-30 2022-05-03 Nitto Denko Corporation Opto-electric hybrid board, connector kit, and producing method of connector kit
DE102019210750B4 (de) * 2019-07-19 2023-12-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung einer anordnung mit einem substrat und zwei bauelementen mit lichtwellenleitern
DE102019211002B4 (de) * 2019-07-19 2024-01-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches system und verfahren zum herstellen eines optischen systems
DE102019210747B4 (de) * 2019-07-19 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches system und verfahren zum herstellen eines optischen systems
KR20220130767A (ko) * 2020-02-04 2022-09-27 플럭서스, 인크. 기준 표면을 사용한 광자 시스템 컴포넌트의 정렬
MX2023006444A (es) 2020-12-01 2023-08-10 Univ Pennsylvania Composiciones novedosas con motivos dirigidos a tejido específico y composiciones que los contienen.
US11719903B2 (en) * 2021-03-08 2023-08-08 Mellanox Technologies, Ltd. Systems, methods, and devices for assembling lenses and waveguides
EP4329885A1 (en) 2021-04-27 2024-03-06 Generation Bio Co. Non-viral dna vectors expressing therapeutic antibodies and uses thereof
AU2023235112A1 (en) 2022-03-14 2024-10-17 Generation Bio Co. Heterologous prime boost vaccine compositions and methods of use

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JPH07503328A (ja) 1992-01-28 1995-04-06 ブリテイッシュ・テレコミュニケーションズ・パブリック・リミテッド・カンパニー 集積された光学部品の整列
US5256869A (en) * 1992-06-30 1993-10-26 Texas Instruments Incorporated Free-space optical interconnection using deformable mirror device
FR2724807B1 (fr) 1994-09-21 1997-01-31 Socapex Amphenol Systeme de connexion optique entre cartes-filles
JP3569576B2 (ja) * 1995-09-04 2004-09-22 旭栄研磨加工株式会社 光ファイバー実装モジュールの製造方法
US5966486A (en) * 1996-08-29 1999-10-12 The Whitaker Corporation Tilted notched for passive optical alignment
KR100248049B1 (ko) * 1997-07-31 2000-03-15 윤종용 정렬용 플랫폼을 이용한 광섬유의 수동정렬 장치
US6095697A (en) * 1998-03-31 2000-08-01 Honeywell International Inc. Chip-to-interface alignment
JP2003524789A (ja) * 1998-04-30 2003-08-19 インフィネオン テクノロジース アクチエンゲゼルシャフト マルチチャネル用途に対する双方向光モジュール
JP2000098157A (ja) 1998-09-25 2000-04-07 Japan Aviation Electronics Industry Ltd 光分岐装置およびその製造方法
FR2793037B1 (fr) * 1999-04-28 2001-08-10 France Telecom Assemblage d'une puce de circuit integre optique sur une plate-forme de connexion de fibres optiques pour former un composant optique miniature
GB2379995B (en) 2001-09-21 2005-02-02 Kamelian Ltd An optical coupling
US6778718B2 (en) * 2001-11-09 2004-08-17 Corning Incorporated Alignment of active optical components with waveguides
US6485198B1 (en) * 2001-12-12 2002-11-26 Industrial Technology Research Institute Optoelectronic transceiver having integrated optical and electronic components
US6786654B2 (en) * 2002-08-21 2004-09-07 Hymite A/S Encapsulated optical fiber end-coupled device
US20050031291A1 (en) * 2003-03-24 2005-02-10 Renfeng Gao Assembly of device components and sub-systems
CN100529814C (zh) 2004-12-02 2009-08-19 三井化学株式会社 光配线基板及光电混载基板
JP4591122B2 (ja) * 2005-03-08 2010-12-01 富士ゼロックス株式会社 インターポーザ基板の製造方法、基板の位置合わせ方法、および光電子回路基板の製造方法
GB0511300D0 (en) 2005-06-03 2005-07-13 Ct For Integrated Photonics Th Control of vertical axis for passive alignment of optical components with wave guides
JP2008026839A (ja) 2005-08-15 2008-02-07 Rohm & Haas Electronic Materials Llc 結合方法および光学アセンブリ

Also Published As

Publication number Publication date
CN102203652B (zh) 2015-09-30
EP2321683B1 (en) 2014-10-01
GB0813784D0 (en) 2008-09-03
US20110164849A1 (en) 2011-07-07
JP2011529206A (ja) 2011-12-01
WO2010013036A1 (en) 2010-02-04
CN102203652A (zh) 2011-09-28
EP2321683A1 (en) 2011-05-18
US8548292B2 (en) 2013-10-01

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