CN102203652B - 混合集成光学元件 - Google Patents

混合集成光学元件 Download PDF

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Publication number
CN102203652B
CN102203652B CN200980137847.1A CN200980137847A CN102203652B CN 102203652 B CN102203652 B CN 102203652B CN 200980137847 A CN200980137847 A CN 200980137847A CN 102203652 B CN102203652 B CN 102203652B
Authority
CN
China
Prior art keywords
motherboard
optics
side direction
master
reference surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980137847.1A
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English (en)
Chinese (zh)
Other versions
CN102203652A (zh
Inventor
S·拉德诺伊斯
D·罗杰斯
G·麦克斯韦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Centre for Integrated Photonics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd, Centre for Integrated Photonics Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN102203652A publication Critical patent/CN102203652A/zh
Application granted granted Critical
Publication of CN102203652B publication Critical patent/CN102203652B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
CN200980137847.1A 2008-07-28 2009-07-27 混合集成光学元件 Active CN102203652B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0813784.6A GB0813784D0 (en) 2008-07-28 2008-07-28 Optical intergration system
GB0813784.6 2008-07-28
PCT/GB2009/050925 WO2010013036A1 (en) 2008-07-28 2009-07-27 Hybrid integrated optical elements

Publications (2)

Publication Number Publication Date
CN102203652A CN102203652A (zh) 2011-09-28
CN102203652B true CN102203652B (zh) 2015-09-30

Family

ID=39747058

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980137847.1A Active CN102203652B (zh) 2008-07-28 2009-07-27 混合集成光学元件

Country Status (6)

Country Link
US (1) US8548292B2 (enExample)
EP (1) EP2321683B1 (enExample)
JP (1) JP5557198B2 (enExample)
CN (1) CN102203652B (enExample)
GB (1) GB0813784D0 (enExample)
WO (1) WO2010013036A1 (enExample)

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US11320613B2 (en) 2018-03-30 2022-05-03 Nitto Denko Corporation Opto-electric hybrid board, connector kit, and producing method of connector kit

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WO2012145572A1 (en) 2011-04-20 2012-10-26 The Trustees Of The University Of Pennsylvania Regimens and compositions for aav-mediated passive immunization of airborne pathogens
US8830466B2 (en) * 2011-11-10 2014-09-09 Cisco Technology, Inc. Arrangement for placement and alignment of opto-electronic components
CN103246027B (zh) * 2013-05-23 2015-04-22 中航海信光电技术有限公司 可无源耦合的多路并行光组件及封装方法
CN108135994B (zh) 2015-05-13 2022-01-25 宾夕法尼亚州大学信托人 Aav-介导的抗-流感抗体的表达及其使用方法
JP6660820B2 (ja) * 2016-06-13 2020-03-11 日本電信電話株式会社 光デバイス
US9939580B2 (en) * 2016-07-06 2018-04-10 Cisco Technology, Inc. Optical component alignment using inverted carrier member
TWI647501B (zh) * 2016-12-13 2019-01-11 峰川光電股份有限公司 主動光纜之製造方法
US20200278506A1 (en) * 2017-09-08 2020-09-03 Teknologian Tutkimuskeskus Vtt Oy Hybrid integration of photonic chips with single-sided coupling
TWI781162B (zh) * 2018-03-30 2022-10-21 日商日東電工股份有限公司 光電混合基板、連接器組及其製造方法
DE102019210750B4 (de) * 2019-07-19 2023-12-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung einer anordnung mit einem substrat und zwei bauelementen mit lichtwellenleitern
DE102019211002B4 (de) * 2019-07-19 2024-01-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches system und verfahren zum herstellen eines optischen systems
DE102019210747B4 (de) * 2019-07-19 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches system und verfahren zum herstellen eines optischen systems
KR20220130767A (ko) * 2020-02-04 2022-09-27 플럭서스, 인크. 기준 표면을 사용한 광자 시스템 컴포넌트의 정렬
MX2023006444A (es) 2020-12-01 2023-08-10 Univ Pennsylvania Composiciones novedosas con motivos dirigidos a tejido específico y composiciones que los contienen.
US11719903B2 (en) * 2021-03-08 2023-08-08 Mellanox Technologies, Ltd. Systems, methods, and devices for assembling lenses and waveguides
EP4329885A1 (en) 2021-04-27 2024-03-06 Generation Bio Co. Non-viral dna vectors expressing therapeutic antibodies and uses thereof
AU2023235112A1 (en) 2022-03-14 2024-10-17 Generation Bio Co. Heterologous prime boost vaccine compositions and methods of use

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CN1215159A (zh) * 1997-07-31 1999-04-28 三星电子株式会社 使用校准平台的光纤无源校准装置
US20050031291A1 (en) * 2003-03-24 2005-02-10 Renfeng Gao Assembly of device components and sub-systems

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JPH07503328A (ja) 1992-01-28 1995-04-06 ブリテイッシュ・テレコミュニケーションズ・パブリック・リミテッド・カンパニー 集積された光学部品の整列
US5256869A (en) * 1992-06-30 1993-10-26 Texas Instruments Incorporated Free-space optical interconnection using deformable mirror device
FR2724807B1 (fr) 1994-09-21 1997-01-31 Socapex Amphenol Systeme de connexion optique entre cartes-filles
JP3569576B2 (ja) * 1995-09-04 2004-09-22 旭栄研磨加工株式会社 光ファイバー実装モジュールの製造方法
US5966486A (en) * 1996-08-29 1999-10-12 The Whitaker Corporation Tilted notched for passive optical alignment
US6095697A (en) * 1998-03-31 2000-08-01 Honeywell International Inc. Chip-to-interface alignment
JP2003524789A (ja) * 1998-04-30 2003-08-19 インフィネオン テクノロジース アクチエンゲゼルシャフト マルチチャネル用途に対する双方向光モジュール
JP2000098157A (ja) 1998-09-25 2000-04-07 Japan Aviation Electronics Industry Ltd 光分岐装置およびその製造方法
FR2793037B1 (fr) * 1999-04-28 2001-08-10 France Telecom Assemblage d'une puce de circuit integre optique sur une plate-forme de connexion de fibres optiques pour former un composant optique miniature
GB2379995B (en) 2001-09-21 2005-02-02 Kamelian Ltd An optical coupling
US6778718B2 (en) * 2001-11-09 2004-08-17 Corning Incorporated Alignment of active optical components with waveguides
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JP4591122B2 (ja) * 2005-03-08 2010-12-01 富士ゼロックス株式会社 インターポーザ基板の製造方法、基板の位置合わせ方法、および光電子回路基板の製造方法
GB0511300D0 (en) 2005-06-03 2005-07-13 Ct For Integrated Photonics Th Control of vertical axis for passive alignment of optical components with wave guides
JP2008026839A (ja) 2005-08-15 2008-02-07 Rohm & Haas Electronic Materials Llc 結合方法および光学アセンブリ

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Publication number Priority date Publication date Assignee Title
CN1215159A (zh) * 1997-07-31 1999-04-28 三星电子株式会社 使用校准平台的光纤无源校准装置
US20050031291A1 (en) * 2003-03-24 2005-02-10 Renfeng Gao Assembly of device components and sub-systems

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11320613B2 (en) 2018-03-30 2022-05-03 Nitto Denko Corporation Opto-electric hybrid board, connector kit, and producing method of connector kit

Also Published As

Publication number Publication date
JP5557198B2 (ja) 2014-07-23
EP2321683B1 (en) 2014-10-01
GB0813784D0 (en) 2008-09-03
US20110164849A1 (en) 2011-07-07
JP2011529206A (ja) 2011-12-01
WO2010013036A1 (en) 2010-02-04
CN102203652A (zh) 2011-09-28
EP2321683A1 (en) 2011-05-18
US8548292B2 (en) 2013-10-01

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Owner name: HUAWEI TECHNOLOGIES CO., LTD.

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Effective date: 20120803

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Address after: 518129 Bantian HUAWEI headquarters office building, Longgang District, Shenzhen

Applicant after: Huawei Technologies Co., Ltd.

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