JP5545721B2 - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP5545721B2 JP5545721B2 JP2010044928A JP2010044928A JP5545721B2 JP 5545721 B2 JP5545721 B2 JP 5545721B2 JP 2010044928 A JP2010044928 A JP 2010044928A JP 2010044928 A JP2010044928 A JP 2010044928A JP 5545721 B2 JP5545721 B2 JP 5545721B2
- Authority
- JP
- Japan
- Prior art keywords
- movable conductor
- lead terminal
- spring
- elastic body
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010044928A JP5545721B2 (ja) | 2010-03-02 | 2010-03-02 | 保護素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010044928A JP5545721B2 (ja) | 2010-03-02 | 2010-03-02 | 保護素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011181362A JP2011181362A (ja) | 2011-09-15 |
| JP2011181362A5 JP2011181362A5 (enExample) | 2013-04-04 |
| JP5545721B2 true JP5545721B2 (ja) | 2014-07-09 |
Family
ID=44692668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010044928A Active JP5545721B2 (ja) | 2010-03-02 | 2010-03-02 | 保護素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5545721B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021241629A1 (ja) * | 2020-05-29 | 2021-12-02 | デクセリアルズ株式会社 | 保護素子 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9082737B2 (en) | 2012-11-15 | 2015-07-14 | Infineon Technologies Ag | System and method for an electronic package with a fail-open mechanism |
| TWI841957B (zh) * | 2021-04-28 | 2024-05-11 | 乾坤科技股份有限公司 | 一種電氣元件及其製造方法 |
| US20240404778A1 (en) * | 2021-09-03 | 2024-12-05 | Dexerials Corporation | Protective element |
| JP2023175390A (ja) * | 2022-05-30 | 2023-12-12 | 内橋エステック株式会社 | 保護素子 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001283710A (ja) * | 2000-03-31 | 2001-10-12 | Yazaki Corp | ヒューズ |
| JP4908042B2 (ja) * | 2006-04-06 | 2012-04-04 | 三菱電機株式会社 | 回路遮断装置 |
| JP4630403B2 (ja) * | 2008-01-21 | 2011-02-09 | 内橋エステック株式会社 | 保護素子 |
| JP4943359B2 (ja) * | 2008-03-05 | 2012-05-30 | 内橋エステック株式会社 | 保護素子 |
-
2010
- 2010-03-02 JP JP2010044928A patent/JP5545721B2/ja active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021241629A1 (ja) * | 2020-05-29 | 2021-12-02 | デクセリアルズ株式会社 | 保護素子 |
| JP2021190294A (ja) * | 2020-05-29 | 2021-12-13 | デクセリアルズ株式会社 | 保護素子 |
| JP7523951B2 (ja) | 2020-05-29 | 2024-07-29 | デクセリアルズ株式会社 | 保護素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011181362A (ja) | 2011-09-15 |
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