JP5545721B2 - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP5545721B2 JP5545721B2 JP2010044928A JP2010044928A JP5545721B2 JP 5545721 B2 JP5545721 B2 JP 5545721B2 JP 2010044928 A JP2010044928 A JP 2010044928A JP 2010044928 A JP2010044928 A JP 2010044928A JP 5545721 B2 JP5545721 B2 JP 5545721B2
- Authority
- JP
- Japan
- Prior art keywords
- movable conductor
- lead terminal
- spring
- elastic body
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 230000001681 protective effect Effects 0.000 title claims description 30
- 239000004020 conductor Substances 0.000 claims description 51
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 239000004033 plastic Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000009471 action Effects 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 7
- 239000007769 metal material Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 229910000743 fusible alloy Inorganic materials 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000005856 abnormality Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Description
102,302,402,502・・・第2リード端子、
103,203,303,403,503・・・可動導体、
104,304,404,504・・・可溶体、
204・・・動作後の可溶体、
105,305,405,505・・・スプリング装入孔、
106,206,306,406・・・弾性体(スプリング、コイルばね)、
107,307,407・・・絶縁台座、
108,308,408・・・絶縁カバー、
309,409・・・第3リード端子、
110,310・・・リベット、 111,311・・・アライメント突起、
112,312・・・突起部、
113,313・・・つめ部端面、 314,414・・・発熱素子、
315・・・導電板、 316・・・リード取付け溝、
117,317・・・ガイドスカート、 418・・・ラッチ部。
Claims (3)
- 導電性の弾性体で付勢した可動導体と、一対のリード端子と、前記可動導体と前記リード端子とを接合して前記可動導体を固着する可溶体と、前記可動導体に熱結合させた発熱素子と、この発熱素子に通電するために設けた第3のリード端子および前記弾性体と、これらを収納する絶縁ケースとを有し、前記可溶体の溶融温度で前記接合が溶融することで、前記弾性体の付勢力で前記可動導体を動かして回路を遮断する温度ヒューズであって、前記可動導体と前記リード端子の表面が平坦であり、それぞれの平坦面を互いに重ね合わせて接合したことを特徴とする保護素子。
- 前記弾性体は、コイルばね、板ばね、皿ばね、リングスパンからなるSUS製ばね材の群から選ばれる少なくとも1つのスプリングであることを特徴とする請求項1に記載の保護素子。
- 前記発熱素子は、抵抗素子またはPTCサーミスタを使用したことを特徴とする請求項1に記載の保護素子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010044928A JP5545721B2 (ja) | 2010-03-02 | 2010-03-02 | 保護素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010044928A JP5545721B2 (ja) | 2010-03-02 | 2010-03-02 | 保護素子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011181362A JP2011181362A (ja) | 2011-09-15 |
JP2011181362A5 JP2011181362A5 (ja) | 2013-04-04 |
JP5545721B2 true JP5545721B2 (ja) | 2014-07-09 |
Family
ID=44692668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010044928A Active JP5545721B2 (ja) | 2010-03-02 | 2010-03-02 | 保護素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5545721B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021241629A1 (ja) * | 2020-05-29 | 2021-12-02 | デクセリアルズ株式会社 | 保護素子 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9082737B2 (en) | 2012-11-15 | 2015-07-14 | Infineon Technologies Ag | System and method for an electronic package with a fail-open mechanism |
WO2023032965A1 (ja) * | 2021-09-03 | 2023-03-09 | デクセリアルズ株式会社 | 保護素子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001283710A (ja) * | 2000-03-31 | 2001-10-12 | Yazaki Corp | ヒューズ |
JP4908042B2 (ja) * | 2006-04-06 | 2012-04-04 | 三菱電機株式会社 | 回路遮断装置 |
JP4630403B2 (ja) * | 2008-01-21 | 2011-02-09 | 内橋エステック株式会社 | 保護素子 |
JP4943359B2 (ja) * | 2008-03-05 | 2012-05-30 | 内橋エステック株式会社 | 保護素子 |
-
2010
- 2010-03-02 JP JP2010044928A patent/JP5545721B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021241629A1 (ja) * | 2020-05-29 | 2021-12-02 | デクセリアルズ株式会社 | 保護素子 |
Also Published As
Publication number | Publication date |
---|---|
JP2011181362A (ja) | 2011-09-15 |
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