JP5545301B2 - Organic electroluminescent panel manufacturing method, organic electroluminescent panel - Google Patents

Description

  The present invention relates to a method for producing an organic electroluminescence panel (hereinafter also referred to as an organic EL panel) and an organic EL panel produced by this production method. More specifically, an organic EL panel manufacturing method for manufacturing an organic EL panel by sticking a sealing member having a dried adhesive layer to an organic electroluminescence element (hereinafter also referred to as an organic EL element) and the manufacturing method. The present invention relates to the manufactured organic EL panel.

  In recent years, organic EL elements using organic substances have been promising for use as solid light-emitting inexpensive, large-area full-color display elements and writing light source arrays, and active research and development have been promoted. The organic EL element includes a first electrode (anode or cathode) formed on a substrate and an organic functional layer (single layer portion or multilayer portion) containing an organic light emitting material laminated thereon, that is, a light emitting layer. A thin film type device having a second electrode (cathode or anode) laminated on the light emitting layer.

  When a voltage is applied to such an organic EL element, electrons are injected into the organic light emitting layer from the cathode and holes are injected from the anode. It is known that light is obtained by releasing energy as light when the electrons and holes recombine in the light emitting layer and the energy level returns from the conduction band to the valence band.

  Thus, since the organic EL element is a thin film type element, an organic EL panel in which one or a plurality of organic EL elements are formed on a substrate and sealed with a sealing member is used as a surface light source such as a backlight. When used as a device, a device including a surface light source can be easily made thin. In addition, when a predetermined number of organic EL elements as pixels are formed on a base material and a display device is configured using an organic EL panel sealed with a sealing member as a display panel, the visibility is high and depends on the viewing angle. There is an advantage that cannot be obtained with a liquid crystal display device.

  In using the organic EL panel in a display device, stable light emission of the three primary colors of RGB is an indispensable condition. However, in an organic EL panel, a non-light emitting point called a dark spot is generated by long-time driving, and the growth of the dark spot is one of the causes for shortening the lifetime of the organic EL panel. It is known that a dark spot is generally generated in a size that cannot be seen with the naked eye immediately after driving, and grows by continuous driving using this as a core. Further, it is known that dark spots are generated even in a storage state where driving is not performed and grows with time.

  There are various causes of the dark spot, but external factors include crystallization of the organic layer due to the penetration of moisture and oxygen into the organic EL element, peeling of the second electrode, and the like. As internal factors, short spots due to crystal growth of the metal constituting the second electrode, crystallization and deterioration of the organic layer due to heat generation due to light emission, and the like are considered as factors of dark spots.

  As countermeasures for preventing the occurrence of these dark spots, for example, JP-A-5-182759, JP-A-5-36475, and JP-A-2002-43055 disclose a dry nitrogen atmosphere using a metal or glass sealing can. Describes a method of covering and sealing an organic EL element. However, since a glass or metal sealing can is used, there is a limit to reducing the thickness and weight of the organic EL panel. In addition, in the manufacturing process, a step of encapsulating a desiccant inside the airtight case, a step of applying a photocurable resin to the airtight case, a step of bonding the light transmissive substrate and the airtight case, a step of curing the photocurable resin Therefore, there was a problem in terms of productivity and manufacturing cost.

  In addition, as a countermeasure for reducing the thickness and weight by preventing the generation of dark spots, a thin and lightweight organic EL panel with excellent moisture resistance can be obtained by tightly sealing with a film having a high gas barrier property such as a metal foil. Obtaining methods have been studied.

  For example, when manufacturing an organic EL device, the adhesive is used at 80 ° C. to 300 ° C. in order to remove moisture remaining in the adhesive film before using the adhesive film using an olefin polymer as an adhesive. It is known that the film is heat-treated and used with a moisture content of 0.1% or less (for example, see Patent Document 1).

  However, even if it is dried using the technique described in Patent Document 1, it is not suitable for storage, and the pressure-sensitive adhesive absorbs moisture from the outside air and is insufficient to prevent the generation of dark spots. I found out.

JP 2005-298703 A

  This invention is made | formed in view of such a condition, The objective is to seal an organic EL element using the strip | belt-shaped sealing member which consists of a sealing base material / gas barrier layer / adhesive layer, and organic EL panel It is intended to provide a thin and lightweight organic EL panel manufacturing method and an organic EL panel that eliminates the influence of moisture contained in the adhesive layer when manufacturing the organic EL panel, suppresses the generation of dark spots.

  The above object of the present invention has been achieved by the following constitution.

  1. An organic electroluminescent device having a first electrode, a second electrode, and at least one organic functional layer including an organic light emitting layer between the first electrode and the second electrode is sealed on a substrate. In the method for manufacturing an organic electroluminescence panel, which is sealed with a stop member to manufacture an organic electroluminescence panel, the sealing member is formed by laminating an adhesive layer having a glass transition temperature Tg of 40 ° C. or higher on at least a sealing substrate. Before sealing the organic electroluminescence panel element, the sealing member has a belt-like form having the above-described configuration, and has a glass transition temperature Tg or higher of the adhesive layer and a glass transition of the sealing base material. A method for producing an organic electroluminescence panel, wherein the organic electroluminescence panel is heated and dried at a temperature of Tg + 10 ° C. or less, wound up, and rolled.

  2. 2. The method for producing an organic electroluminescence panel according to 1 above, wherein the time for heating the sealing member is 2 hours or more and 24 hours or less.

  3. 3. The method for producing an organic electroluminescence panel according to 1 or 2, wherein the moisture content after drying of the adhesive layer after the heat drying is 200 ppm or less.

  4). 4. The method for producing an organic electroluminescence panel according to any one of 1 to 3, wherein a moisture content after drying of the adhesive layer after the heat drying is 80 ppm or less.

  5. 5. The method for producing an organic electroluminescence panel according to any one of 1 to 4, wherein the sealing member is dried and stored after drying in an environment having a moisture content of 200 ppm or less.

  6). 6. The method of manufacturing an organic electroluminescence panel according to any one of 1 to 5, wherein the sealing of the organic electroluminescence element by the sealing member is performed in an environment having a moisture content of 200 ppm or less.

  7). 7. An organic electroluminescence panel manufactured by the manufacturing method according to any one of 1 to 6 above.

The inventors have a sealing substrate / gas barrier layer / adhesive layer in which the moisture content of the adhesive layer is 0.05% and the water vapor permeability of the sealing substrate is 0.01 g / m ² · day or less. We examined why dark spots occur when using an organic EL panel in which an organic EL element is tightly sealed by using a band-shaped sealing member and sticking the sealing member through an adhesive layer. As a result, the following was found.

Observing the occurrence of dark spots when using the organic EL panel, it was found that there was the following pattern.
1) Dark spots are initially generated around the organic EL panel and spread from the periphery to the inside as time passes, and the dark spots generated on the entire surface further increase as time passes.
2) Generation of dark spots occurs over the entire surface of the organic EL panel, and increases with time.

  As a result of further investigation on why the pattern as in 1) and 2) occurs, in the case of 1), the waterproofness of the adhesive layer used is insufficient, and in the initial stage, moisture from the surroundings inside the organic EL panel Dark spots are generated around it. Along with the passage of time, moisture further penetrates into the center of the inside of the organic EL panel, so that dark spots are generated on the entire surface, and dark spots are generated by the moisture contained in the adhesive layer. In the case of 2), since the adhesive used for the adhesive layer is waterproof, the penetration of moisture from the surroundings to the inside of the organic EL panel is prevented, but dark spots are generated by the moisture contained in the adhesive layer. .

  When a thermoplastic resin is used for the adhesive, the thermoplastic resin has a large molecular structure with a repeating structure of the monomer (monomer). It is known that the resin is dried after the following period.

  1) A material preheating period in which the temperature of water on the surface of the material rises to the wet-bulb temperature of the hot air as soon as the material receives the hot air and the water starts to evaporate.

  2) The temperature of the water on the surface of the material maintains the wet bulb temperature, and all of the heat received from the hot air is used for water evaporation. After evaporation, the same amount of water moves from the inside of the material, and the evaporation rate Is a constant drying period in which the moisture content decreases in proportion to time.

  3) As the drying progresses, the replenishment rate of moisture that diffuses from the inside of the material to the surface cannot catch up with the evaporation rate of the surface, and a dry part is generated on the surface, the temperature of the material rises and finally the equilibrium water content Decrease in the drying period.

  Why was a waterproof adhesive used, and as a result of further investigation on the occurrence of dark spots, a sealing member using an adhesive made of thermoplastic resin in the adhesive layer once heated the thermoplastic resin. However, it was found that the equilibrium moisture content was not achieved because the heating temperature was low or the heating time was short.

  That is, the moisture contained in the adhesive layer is adhered to the adherend in a state where the contained moisture cannot be completely removed (in the middle of the constant rate drying period). It was estimated that dark spots were generated by gradually leaching into the interface with the layer.

  In order to prevent the occurrence of dark spots, it is effective to reduce the water content to the moisture content of the adhesive layer that can withstand use, and the glass transition temperature Tg of the adhesive layer or higher and the glass transition temperature of the sealing substrate It has been found that the object and effect of the present invention can be achieved by heating and drying the sealing member at a temperature of Tg + 10 ° C. or lower, and the present invention has been achieved.

  When manufacturing an organic EL panel by sealing an organic EL element using a band-shaped sealing member having a sealing substrate / gas barrier layer / adhesive layer, the influence of moisture contained in the adhesive layer is affected. Thus, the production of a thin and light organic EL panel and the organic EL panel can be provided by suppressing the generation of dark spots.

It is the schematic which shows an example of the serial type organic electroluminescent panel manufactured by the manufacturing method of the organic electroluminescent panel of this invention. It is a schematic sectional drawing of the series type organic electroluminescent panel of a structure except having shown in FIG.1 (b). FIG. 3 is a schematic sectional view of a series organic EL panel having a configuration other than that shown in FIG. 2. It is a schematic diagram which shows an example of the manufacturing process of the serial type organic EL panel by the roll-to-roll system using a strip | belt-shaped flexible base material. It is the schematic of the sealing member used for this invention. It is an example schematic diagram of an example drying apparatus which dries the roll-shaped sealing member shown in FIG. FIG. 5 is a schematic flow diagram from a base material supplying step to an organic functional layer forming step in the manufacturing process of the serial type organic EL panel shown in FIG. 4. FIG. 5 is a schematic flow diagram from the dry film forming process to the preparation of a dried sealing member in the serial type organic EL panel manufacturing process shown in FIG. 4. FIG. 5 is a schematic flow diagram from a sealing process to a cutting process in the manufacturing process of the series organic EL panel shown in FIG. 4.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 9, but the present invention is not limited thereto.

  FIG. 1 is a schematic view showing an example of a series organic EL panel manufactured by the method for manufacturing an organic EL panel of the present invention. Fig.1 (a) is a schematic perspective view which shows an example of the series type organic electroluminescent panel manufactured by the manufacturing method of the organic electroluminescent panel of this invention. FIG.1 (b) is a general | schematic expanded sectional view along AA 'shown to Fig.1 (a).

  In the figure, 1 indicates a series-type organic EL panel. Reference numeral 101 denotes a substrate having optical transparency. The series organic EL panel 1 includes a base material 101, a first electrode (anode) 102, an organic functional layer 103 including an organic light emitting layer, a second electrode (cathode) 104, a first sealing member 105, The first electrode external connection electrode 102a1 and the second electrode external connection electrode 104c1 are provided.

  This figure shows a state in which the first electrode (anode) 102 is composed of first electrodes (anodes) 102 a to 102 c arranged in three rows on the base material 101. The number of the first electrodes (anodes) to be arranged is not particularly limited and can be appropriately selected as necessary.

  The first electrode (anode) 102a includes a portion for forming the first electrode external connection electrode 102a1, the first electrode (anode) 102b includes a second electrode joint portion 102b1, and the first electrode (anode) 102c A two-electrode joining portion 102c1 is included. A gas barrier film (not shown) may be provided between the first electrode (anode) 102 and the substrate 101.

  When the first electrode (anode) 102 is formed, the second electrode external connection electrode 104c1 includes a lead portion 108 (see FIG. 9) formed on the substrate 101 at a position separated from the first electrode 102, and the second electrode 104c1. It is formed by joining two electrodes (cathode) 104.

  Reference numeral 103 denotes an organic functional layer formed independently on each of the first electrodes (anodes) 102a to 102c arranged in three rows.

  In the organic functional layer 103, the first electrode (anode) 102a excludes the portion for forming the first electrode external connection electrode 102a1, and the first electrode (anode) 102b excludes the portion 102b1 connected to the second electrode 104a. The first electrode (anode) 102c is formed except for the portion 102c1 connected to the second electrode 104b.

  The second electrode (cathode) 104 (104a to 104c) is formed on each first electrode (anode) 102a to 102c so as to be connected to the first electrode (anode) 102b and the first electrode (anode) 102c. The organic functional layers 103a to 103c are formed.

  The second electrode (cathode) 104a on the organic functional layer 103a formed on the first electrode (anode) 102a is formed so as to be joined to the second electrode joint portion 102b1 of the first electrode (anode) 102b. .

  The second electrode (cathode) 104b on the organic functional layer 103b formed on the first electrode (anode) 102b is formed so as to be joined to the second electrode joint portion 102c1 of the first electrode (anode) 102c. .

  The second electrode (cathode) 104c on the organic functional layer 103c formed on the first electrode (anode) 102c is formed so as to be joined to the lead portion 108 (see FIG. 9).

  A second electrode (cathode) 104a on the organic functional layer 103a formed on the first electrode (anode) 102a, and a second electrode (on the organic functional layer 103b formed on the first electrode (anode) 102b) ( Organic functional layer formed on the second electrode (cathode) 104b on the organic functional layer 103b formed on the first electrode (anode) 102b and the first electrode (anode) 102c. The second electrode (cathode) 104c above 103c is spaced from the second electrode (cathode) 104c so that it does not come into contact with the adhesive layer 105c.

  The first sealing member 105 has a configuration in which a gas barrier layer 105b and an adhesive layer 105c are sequentially laminated on a sealing substrate 105a. The gas barrier layer 105b is composed of an inorganic film. The adhesive layer 105c uses a thermoplastic resin having a glass transition temperature Tg of 40 ° C. or higher. By using the adhesive layer 105c having a glass transition temperature Tg of 40 ° C. or higher, the adhesive layer is softened during storage, and it is possible to prevent moisture from penetrating into the adhesive layer. In addition, glass transition temperature Tg shows the value measured with Perkin-Elmer Japan Co., Ltd. differential scanning calorimeter (DSC6000).

  In the present invention, the adhesive layer refers to a layer including an adhesive having an adhesive and an additive (for example, a filler).

  The first sealing member 105 adheres the adhesive layer 105c onto the substrate 101 except for a part of the first electrode external connection electrode 102a1 and a part of the second electrode external connection electrode 104c1. It is provided by doing.

  As a problem of the organic EL panel including the series organic EL panel 1 shown in FIG. 1, generation of dark spots due to moisture in the adhesive layer 105c is cited, and it is required to prevent the generation of the dark spots. Yes.

  The present invention provides a method for producing an organic EL panel in which the generation of dark spots due to moisture contained in the adhesive layer 105c is prevented by using a sealing member in which the amount of moisture contained in the adhesive layer 105c is reduced as much as possible. The present invention relates to an organic EL panel manufactured by this manufacturing method.

  In the present invention, the base material 101 / the first electrode 102 / the organic functional layer 103 including the organic light emitting layer / the second electrode 104 /, the first electrode external connection electrode 102a1, and the second electrode external connection electrode 104c1. The laminated body containing is called an organic EL element. This figure shows a serial type organic EL panel in which an organic EL panel element is sealed with a first sealing member 105.

  Next, the configuration of a series organic EL panel having a configuration other than that shown in FIG.

  FIG. 2 is a schematic cross-sectional view of a series organic EL panel having a configuration other than that shown in FIG. The organic EL panel in this figure is the same as that in FIG.

  This will be described with reference to the series-type organic EL panel shown in FIG.

  The difference from the organic EL panel in FIG. 1B is that the first sealing member 105 is not attached to the organic EL element, but the organic EL element is attached to the first sealing member 105 and the second sealing member. It is sandwiched and sealed by the stop member 106. In the figure, reference numeral 1a denotes a serial type organic EL panel. The second sealing member 106 has a configuration in which a gas barrier layer 106b and an adhesive layer 106c are sequentially laminated on a sealing substrate 106a. The gas barrier layer 106b is composed of an inorganic film. The adhesive layer 106c uses a thermoplastic resin. Other reference numerals are the same as those in FIG.

  This will be described with reference to the series-type organic EL panel shown in FIG.

  The difference from the organic EL panel in FIG. 1B is that the organic EL panel in FIG. 1B is sandwiched and sealed between the second sealing member 106 and the third sealing member 107. In the figure, 1b represents a series organic EL panel. The third sealing member 107 has a configuration in which a gas barrier layer 107b and an adhesive layer 107c are sequentially laminated on a sealing base material 107a. The gas barrier layer 107b is composed of an inorganic film. The adhesive layer 107c uses a thermoplastic resin. Other reference numerals are the same as those in FIGS. 1B and 2A.

  This will be described with reference to the series-type organic EL panel shown in FIG.

  The difference from the organic EL panel of FIG. 2B is that the fourth sealing member 108 is used instead of the first sealing member 105. In the figure, 1c represents a series-type organic EL panel. The fourth sealing member 108 has a configuration in which a gas barrier layer 108b and an adhesive layer 108c are sequentially laminated on a sealing substrate 108a.

  The sealing base material 108 a is the same as the sealing base material 105 a of the first sealing member 105. The gas barrier layer 108b is composed of an inorganic film. As the adhesive for the adhesive layer 108c, an active energy ray-curable thermoplastic resin is used. Other reference numerals are the same as those in FIGS. 1B and 2B. A gas barrier film (not shown) may be provided between the first electrode (anode) 102 and the substrate 106.

  FIG. 3 is a schematic cross-sectional view of a series organic EL panel having a configuration other than that shown in FIG.

  This will be described with reference to the series-type organic EL panel shown in FIG.

  The difference from the organic EL panel in FIG. 2B is that a fifth sealing member 109 is used instead of the first sealing member 105. In the figure, 1d indicates a series organic EL panel. The fifth sealing member 109 has a configuration in which an adhesive layer 109b is laminated on a sealing base material 109a.

  The sealing base material 109 a is the same as the sealing base material 105 a of the first sealing member 105. The adhesive layer 109b uses a thermoplastic resin. Other symbols are the same as those in FIG.

  The serial type organic EL panel shown in FIG.

  The difference from the organic EL panel of FIG. 2B is that the sixth sealing member 110 is used instead of the first sealing member 105. In the figure, 1e indicates a series organic EL panel. The sixth sealing member 110 has a configuration in which an adhesive layer 110b is laminated on a sealing substrate 110a. The sealing substrate 110 a is the same as the sealing substrate 105 a of the first sealing member 105. As the adhesive for the adhesive layer 110b, an active energy ray-curable thermoplastic resin is used. Other symbols are the same as those in FIG. A gas barrier film (not shown) may be provided between the first electrode (anode) 102 and the substrate 106.

  Also in the sealing member used in the series type organic EL panel of FIGS. 2 and 3, it is desirable to use the method of drying the adhesive layer related to the method of manufacturing the organic EL panel of the present invention.

  FIG. 4 is a schematic view showing an example of a production process of a series organic EL panel by a roll-to-roll method using a strip-like flexible base material.

  In the figure, reference numeral 2 denotes a manufacturing process for manufacturing the organic EL panel shown in FIG. The manufacturing process 2 includes a base material supplying process 3, an organic functional layer forming process 4, a dry film forming process 5, a sealing process 6, and a cutting process 8.

  The substrate supply process 3 uses a feeding device 301, a surface treatment device 302, and an accumulator 303.

  From the feeding device 301, the first electrode having a certain length is arranged in three rows and the lead portion is arranged in four rows as one block L (see FIG. 9), and this block L (see FIG. 9) continues in the transport direction. Then, the already formed belt-like flexible base material 301 a is fed out and sent to the organic functional layer forming step 4 through the surface treatment device 302. This one block L (see FIG. 9) is a block forming one organic EL element.

  An alignment mark M (see FIG. 9) indicating the formation position of the first electrode and the lead portion is attached in advance to the strip-shaped flexible base material 301a.

  The surface treatment apparatus 302 includes a cleaning surface modification processing unit 302a that cleans and modifies the surface of the first electrode, and a charge removal processing unit 302b. Examples of the cleaning surface modification processing unit 302a include a low-pressure mercury lamp, an excimer lamp, and a plasma cleaning apparatus. Examples of the charge removal processing unit 302b include a light irradiation method and a corona discharge method.

  The accumulator 303 is disposed for adjustment of the conveyance speed when replacing the strip-shaped flexible base material 301a, for handling a process trouble, and the like. The accumulator 303 has a certain length of the strip-shaped flexible base material 301a. It has a function to save.

  The organic functional layer forming step 4 includes a hole transport layer forming step 401 for forming and forming a hole transport layer by a wet method, a light emitting layer forming step 402 for forming and forming a light emitting layer by a wet method, and an electron transport layer. And an electron transport layer forming step 403 for forming a film by a wet method.

  In the organic functional layer forming step 4, the alignment mark M (see FIG. 9) attached to the strip-shaped flexible base material 301a conveyed from the base material supplying step 3 is read and detected by a detection device (not shown). According to the information of the apparatus (not shown), the hole transport layer, the light emitting layer, and the electron transport layer are arranged in accordance with the position of each of the three rows of first electrodes formed on the strip-shaped flexible substrate 301a. Sequentially formed. Thereafter, the film is transferred to the dry film forming step 5.

  In the hole transport layer forming step 401, a belt-like flexible base material 301a conveyed from the base material supply step 3 is held by a backup roll 401a, and a coating device 401b disposed in a coating chamber (not shown). Thus, while continuously transporting the belt-like flexible substrate 301a, the hole transport layer forming coating solution is applied, and the solvent in the coating film is removed by the drying device 401c to form the hole transport layer. . The accumulator 401d is disposed for dealing with process troubles and the like, and has a function of storing a strip-shaped flexible base material 301a having a predetermined length.

  In the light emitting layer forming step 402, a belt-like flexible base material 301a conveyed from the hole transport layer forming step 401 is held by a backup roll 402a, and a coating device 402b disposed in a coating chamber (not shown). Thus, while continuously feeding the belt-shaped flexible substrate 301a, the light emitting layer forming coating solution is applied, and the solvent in the coating film is removed by the drying device 402c to form the light emitting layer. The accumulator 402d is provided for dealing with process troubles and the like, and has a function of storing a strip-like flexible base material 301a having a predetermined length.

  In the electron transport layer forming step 403, the belt-shaped flexible base material 301a conveyed from the light emitting layer forming step 402 is held by a backup roll 403a and is applied by a coating device 403b disposed in a coating chamber (not shown). While continuously transporting the belt-like flexible substrate 301a, the electron transport layer forming coating solution is applied, and the solvent in the coating film is removed by the drying device 403c to form the light emitting layer. The accumulator 403d is arranged for adjusting a speed difference (for example, continuous / intermittent driving), for handling a process trouble, and the like, and has a function of storing a strip-shaped flexible base material 301a having a certain length. .

  The method for applying the organic functional layer forming coating solution in the organic functional layer forming step 4 is not particularly limited. For example, after coating and drying on the entire surface of the base material, according to the alignment mark M (see FIG. 9) provided on the strip-shaped flexible base material 301a, the first electrode external connection electrode, the second electrode joint portion, The method of wiping using the solvent which melt | dissolves an organic functional layer so that some lead parts (electrode for external connection for 2nd electrodes) may appear is mentioned. Further, according to the alignment mark M (see FIG. 9) provided on the strip-shaped flexible base material 301a, the first electrode external connection electrode, the second electrode joint, and the lead portion (second electrode external connection) The method of apply | coating by stripe application | coating except a part of electrode) is mentioned. Moreover, the method of combining the method of wiping using a solvent and the method of applying by stripe coating may be used.

  The hole transport layer forming step 401, the light emitting layer forming step 402, and the electron transport layer forming step 403 shown in this figure show a case where there is one wet coating device and one drying device. Accordingly, it is possible to increase the number of activation treatment (heat treatment) devices after the drying device.

  This figure shows the case where the hole transport layer forming step 401, the light emitting layer forming step 402, and the electron transport layer forming step 403 are performed in succession, but the hole transport layer forming step 401 and the light emitting layer forming step are performed. If the step 402 and the electron transport layer forming step 403 require an activation processing device after the drying device, and the entire process becomes long, the hole transport layer forming step 401, the light emitting layer forming step 402, and the electron transport It is also possible to arrange the layer forming step 403 independently.

  The dry film forming process 5 includes a second electrode forming process 501. The second electrode forming step 501 uses a vapor deposition apparatus 501a and an accumulator 501b as means for evaporating the pattern forming material. Note that the accumulator 501b is provided for dealing with process troubles and the like, and has a function of storing a strip-shaped flexible base material 301a having a predetermined length.

  In the dry film forming step 5, the alignment mark M (see FIG. 9) attached to the strip-shaped flexible substrate 301a on which the layers from the electron transport layer forming step 403 to the transported electron transport layer are formed is detected by a detection device (see FIG. The second electrode (cathode) is formed on the electron transport layer formed on the strip-shaped flexible substrate 301a using a mask in accordance with information from a detection device (not shown). To do. At this stage, an organic EL element continuous body in which a plurality of organic EL elements are continuously formed on a strip-shaped flexible substrate 301a is manufactured.

  In addition, when the time which forms a 2nd electrode (cathode) is long and the accumulator currently arrange | positioned before and after the dry film-forming process 5 becomes long, it is preferable to arrange | position the dry film-forming process 5 independently.

  The vapor deposition apparatus 501a as a means for evaporating the pattern forming material is not particularly limited. For example, sputtering, reactive sputtering, molecular beam epitaxy, cluster ion beam, ion plating, plasma polymerization, An atmospheric pressure plasma polymerization method, a plasma CVD method, a laser CVD method, a thermal CVD method, or the like can be used.

  The sealing step 6 uses a sealing member supply device 601, a bonding device 602, and an accumulator 603. The accumulator 603 is arranged for adjusting the speed difference from the cutting process 8 (for example, for continuous / intermittent driving) and for handling process troubles.

  The band-shaped sealing member 7 conveyed from the sealing member supply device 601 is bonded to the surface side on which the second electrode (cathode) of the organic EL element of the organic EL element continuous body is formed by the bonding device 602. By sealing the organic EL element, an organic EL panel continuous body in which a plurality of organic EL panels are continuously connected is produced.

  As the bonding apparatus 602, the adhesive of the adhesive layer 703 (see FIG. 5) constituting the strip-shaped sealing member 7 (see FIG. 5) is melted, and the second electrode ( If it can bond on the surface side in which the (cathode) was formed, there will be no limitation in particular. The laminating apparatus 602 shown in the figure shows a case where the laminating apparatus is composed of a heating roll 602a and a pressing roll 602b. Then, it is conveyed to the cutting process 8. Note that the sealing member supply device 601 is supplied with the strip-shaped sealing member 7 fed out from the sealing member that has been dried in a separate process and wound up in a roll shape. The drying process of the band-shaped sealing member 7 will be described with reference to FIG.

  Although this figure shows the case where the sealing member 7 supplied to the sealing member supply device 601 has a strip shape, it may be a single wafer. In the case of a single wafer, the sealing member supply device 601 supplies the sealing members one by one and supplies them in accordance with the position of one block L (see FIG. 9) formed on the strip-shaped flexible substrate 301a. It is necessary to be able to do.

  The cutting process 8 uses a punching and cutting device 801, an accumulator 802, and a winding device 803. A punching and cutting device 801 reads an alignment mark M (see FIG. 9) attached to the organic EL panel continuum with a detection device (not shown), and punches it into a rectangle according to the information of the detection device (not shown). The organic EL panel 9 is cut. The skeleton from which the in-line organic EL panel 9 is punched is wound up and collected by a winding device 803.

  Here, the series organic EL panel continuum is cut by punching into a rectangle with the punching and cutting device 801. However, the series organic EL panel continuum can be cut by cutting with a blade or a laser. is there.

  This figure uses a band-shaped flexible substrate on which the first electrode (anode) is formed, and the hole transport layer, the light-emitting layer, and the electron transport layer are formed into a band-shaped flexible substrate by a wet method. Form the film while continuously transporting the base material, then use the mask on the electron transport layer to form the second electrode in a dry manner, and paste the dried band-shaped sealing member, The case where it cuts and manufactures an individual organic electroluminescent panel is shown.

  As these other manufacturing processes, for example, the film is formed by continuously transporting a belt-like flexible base material up to the electron transport layer by a wet method, and then wound up and stored. Thereafter, the second electrode (cathode) can be formed by a dry method using a mask, and the process can be divided into two processes in which the process up to cutting is continuously performed.

  In addition, the film is formed by film formation while continuously transporting a belt-like flexible base material to the electron transport layer by a wet method, and then wound up and stored. Thereafter, a second electrode (cathode) is formed by a dry method using a mask, and then wound up and stored. Then, it is also possible to divide into 3 processes from a sealing process to cutting.

  The production process of the in-line organic EL panel shown in FIG. 4 includes: base material / first electrode (anode) / hole transport layer (hole injection layer) / light emitting layer / electron transport layer / second electrode (cathode) / adhesion. An example of an organic EL panel having a layer configuration of an agent layer / gas barrier layer / sealing substrate is shown, but other layers formed between the first electrode (anode) and the second electrode (cathode) The following structure is mentioned as a typical layer structure.

(1) Substrate / first electrode (anode) / light emitting layer / second electrode (cathode) / adhesive layer / gas barrier layer / sealing substrate (2) substrate / first electrode (anode) / light emitting layer / Electron transport layer / second electrode (cathode) / adhesive layer / gas barrier layer / sealing substrate (3) substrate / first electrode (anode) / hole transport layer / light emitting layer / hole blocking layer / electron transport Layer / second electrode (cathode) / adhesive layer / gas barrier layer / sealing substrate (4) substrate / first electrode (anode) / hole transport layer (hole injection layer) / light emitting layer / hole blocking Layer / electron transport layer / cathode buffer layer (electron injection layer) / second electrode (cathode) / adhesive layer / gas barrier layer / sealing substrate (5) substrate / first electrode (anode) / anode buffer layer ( Hole injection layer) / hole transport layer / organic layer (light emitting layer) / hole blocking layer / electron transport layer / cathode buffer layer (electron injection layer) / second electrode (cathode) / adhesive layer / gas layer Rear layer / sealing substrate FIG. 5 is a schematic sectional view of a sealing member used in the present invention.

  In the figure, 7 indicates a sealing member. The sealing member 7 has a gas barrier layer 702 formed on the sealing substrate 701 and an adhesive layer 703 formed on the gas barrier layer 702. Here, the case where the gas barrier layer is formed on the sealing substrate is shown, but only the sealing substrate having gas barrier property may be used.

  The present invention relates to a method for producing an organic EL panel using a sealing member obtained by heating and drying a sealing member having the configuration shown in FIG. 5 in a sealing step, and an organic EL panel produced by this production method. .

  The width of the sealing member 7 is preferably a width that does not cover the first electrode external connection electrode 102a1 (see FIG. 1) and the second electrode external connection electrode 104c1 (see FIG. 1).

  The film thickness of the sealing substrate 701 (see FIG. 5) is preferably 10 μm to 1000 μm, more preferably 50 μm to 500 μm, and still more preferably 80 μm to 200 μm.

  The gas barrier layer 702 (see FIG. 5) is made of an inorganic film. The inorganic film is not particularly limited as long as it has gas barrier properties. For example, ceramic films such as silicon oxide, aluminum oxide, silicon oxynitride, aluminum oxynitride, magnesium oxide, zinc oxide, indium oxide, and tin oxide, metal A foil is mentioned.

  The formation of the ceramic film is preferably formed by applying a sputtering method, an ion assist method, a plasma CVD method described later, a plasma CVD method under atmospheric pressure or a pressure near atmospheric pressure described later, In particular, the atmospheric pressure plasma CVD method is preferable because it does not require a decompression chamber or the like, enables high-speed film formation, and has high productivity.

  The thickness of the ceramic film is preferably 1 nm to 2000 nm in consideration of gas barrier properties, flexibility of the ceramic film, and the like.

  As metal foil, there is no limitation in particular in the kind of metal, for example, copper (Cu) foil, aluminum (Al) foil, gold (Au) foil, brass foil, nickel (Ni) foil, titanium (Ti) foil, copper alloy Examples thereof include foil, stainless steel foil, tin (Sn) foil, and high nickel alloy foil. Among these various metal foils, a particularly preferred metal foil is an Al foil. In the case of a metal foil, it can be formed by laminating a substrate and a metal foil.

  The thickness of the metal foil is preferably 6 μm to 50 μm, more preferably 20 μm to 40 μm in consideration of pinholes, gas barrier properties (moisture permeability, oxygen permeability), cost, thickness of the organic EL panel, and the like.

  Examples of the adhesive used for the adhesive layer 703 (see FIG. 5) include thermoplastic resins having a glass transition temperature Tg of 40 ° C. or higher. As the thermoplastic resin, the melt flow rate specified in JIS K 7210 is from 5 g / 10 min to 20 g in consideration of the sealing performance of the gap portion caused by the step of the lead electrode of each electrode, tensile strength, stress cracking resistance, workability, etc. A thermoplastic resin of / 10 min is preferable, and a thermoplastic resin of 6 g / 10 min to 15 g / 10 min is more preferable. Further, the thermoplastic resin includes an active energy ray curable resin. The active energy ray-curable resin is a solid or soft solid at room temperature (25 ° C.), and melts and develops fluidity when heated to 50 ° C. to 100 ° C. (preferably 60 ° C. to 80 ° C.). It is.

  These thermoplastic resins are preferably used by being laminated on a sealing substrate. The laminating method can be made by using various generally known methods such as wet laminating method, dry laminating method, hot melt laminating method, extrusion laminating method, and thermal laminating method.

  The thermoplastic resin is not particularly limited as long as it satisfies the above numerical values. For example, low-density polyethylene (LDPE), HDPE, which is a polymer film described in Toray Research Center, Inc., a new development of functional packaging materials. , Linear low density polyethylene (LLDPE), medium density polyethylene, unstretched polypropylene (CPP), stretched polypropylene (OPP), stretched nylon (ONy), polyethylene terephthalate (PET), cellophane, polyvinyl alcohol (PVA), stretched vinylon ( OV), ethylene-vinyl acetate copolymer (EVOH), ethylene-propylene copolymer, ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA), vinylidene chloride (PVDC), etc. Can be used.

  The active energy ray-curable resin is not particularly limited as long as it satisfies the above numerical values. For example, the main component is a compound having an ethylenic double bond at the terminal or side chain of the molecule and a photopolymerization initiator. Epoxy (meth) acrylate or the like can be used.

  The sealing substrate 701 (see FIG. 5) is not particularly limited as long as it is a film formed of an organic material that can hold an inorganic film having gas barrier properties. Specifically, homopolymers such as ethylene, propylene and butene, or polyolefin resins such as copolymers or copolymers, amorphous polyolefin resins such as cyclic polyolefin, polyethylene terephthalate resins, polyethylene-2,6- Polyester resins such as naphthalate, polyamide resins such as nylon 6, nylon 12, copolymer nylon, polyvinyl alcohol resins such as polyvinyl alcohol resin and ethylene-vinyl alcohol copolymer, polyimide resins, polyetherimide resins, polysulfone resins Polyether sulfone resin, polyether ether ketone resin, polycarbonate resin, polyvinyl butyrate resin, polyarylate resin, fluorine-based resin, and the like can be used. Among them, polyethylene naphthalate resin such as polyethylene-2,6-naphthalate resin has good gas barrier properties, and particularly oxygen permeability and water vapor permeability are low. Therefore, in the present invention, a polyethylene naphthalate film is used as a substrate. It is preferable to use it.

  When the sealing base material and adhesive layer of the sealing member used in the present invention are adjusted to the temperature at which the sealing member is heated and dried to a level usable for the organic EL panel, the sealing base material is used. It is possible to select a sealing base material that is not deformed and to determine and use a combination of the sealing base material and the adhesive layer as appropriate. The sealing member 105 shown in FIG. 1 and the sealing member 7 shown in FIG. 5 have the same configuration and use the same material.

  As a method for heating and drying the sealing member 7 shown in FIG. 5, a method for drying while continuously feeding out the band-shaped sealing member can be mentioned. Next, a method for drying the adhesive layer of the sealing member will be described.

  FIG. 6 is a schematic view of an example of a drying apparatus for drying the roll-shaped sealing member shown in FIG. Fig.6 (a) is a schematic perspective view of an example drying apparatus which dries a roll-shaped sealing member. FIG. 6B is a schematic cross-sectional view along CC ′ shown in FIG.

  In the figure, 10 indicates a drying apparatus. The drying device 10 includes a supply device 10a, a heating device 10b, a cooling device 10c, and a recovery device 10d.

  The band-shaped sealing member 7 supplied from the supply device 10a is conveyed in a tensioned state, and is heated by the heating device 10b to remove moisture in the adhesive layer 703 (see FIG. 5) (equilibrium). After being dried for a certain period of time with a water content), it is cooled with the cooling device 10c and stored in the form of a take-up roll with the recovery device 10d. The tension is preferably 0.5 N / cm width to 10 N / cm width in consideration of deformation of the sealing substrate. The environment of the heating device 10b, the cooling device 10c, and the recovery device 10d is an environment that is equal to or lower than the moisture content of the adhesive layer of the sealing member after drying in order to efficiently remove moisture and maintain a dry state. preferable. Specifically, an environment having a water content of 200 ppm or less is preferable.

  Reference numeral 10b1 denotes a heating box of the heating device 10b. A heating air supply box 10b12 having a heating air blowing hole 10b11 is provided in the upper part inside the heating box 10b1. Reference numeral 10b13 denotes a heating air supply pipe that supplies heating air to the heating box 10b1, and is connected to a heating air supply device (not shown). The heated air supplied from the heated air supply device (not shown) to the heated air supply box 10b12 via the heated air supply pipe 10b13 is uniformly supplied into the heating box 10b1 through the heated air blowing hole 10b11, and is sealed in a band shape. The adhesive layer 703 (see FIG. 5) of the member 7 (see FIG. 5) is heated uniformly.

  A heating air exhaust box 10b15 having a heating air exhaust hole 10b14 is provided at the lower part inside the heating box 10b1. Reference numeral 10b16 denotes a heated air exhaust pipe for exhausting heated air from the heating box 10b1, and is connected to a suction pump (not shown).

  A holding belt 10b17 for the belt-shaped sealing member 7 is disposed inside the heating box 10b1, and the belt-shaped sealing member 7 is moved to the base material 701 as the belt-shaped sealing member 7 moves during the heat treatment. In order to prevent the occurrence of scratches, the belt-shaped sealing member 7 moves in accordance with the movement. Here, the belt-shaped sealing member 7 is conveyed by the holding belt, but other conveying means such as a roller conveyor or non-contact conveying means such as air levitation can also be used. In the band-shaped sealing member 7 supplied from the supply device 10a to the heating device 10b, the adhesive layer 703 (see FIG. 5) adheres to the transport roll, the film thickness of the adhesive layer becomes uneven, and the transport becomes defective. In order to prevent this, the heated air supply box 10b12 side is supplied in the state of the adhesive layer side.

  In addition, although this figure showed the case where the adhesive bond layer 703 (refer FIG. 5) is heated with a heating air, the system of heating an infrared heater and the holding belt 10b17 etc. may be sufficient. In the case of a method such as heating the infrared heater or the holding belt 10b17, the heating box 10b1 may be depressurized in order to remove moisture from the adhesive layer 703 (see FIG. 5) more quickly.

  The heating condition of the sealing member 7 in the heating device 10b is that the adhesive layer 703 has a balanced moisture content in the amount of water contained in the adhesive layer 703 (see FIG. 5) by taking a long drying rate reduction period. It is heating at a glass transition temperature Tg (see FIG. 5) or higher and a glass transition temperature Tg of the sealing substrate + 10 ° C. or lower. Drying at a temperature higher than the glass transition temperature Tg + 10 ° C. is not preferable because the sealing ability is reduced due to deformation of the sealing substrate. Tg uses the value measured with the Perkin Elmer Japan Co., Ltd. differential scanning calorimeter (DSC6000). In addition, the glass transition temperature Tg or more of the adhesive layer substantially means the glass transition temperature Tg of the adhesive among the materials constituting the adhesive layer.

  When the heating temperature is equal to or higher than the glass transition temperature Tg of the adhesive and exceeds the glass transition temperature Tg + 10 ° C. of the sealing base material, the adhesive base layer 703 (see FIG. 5) becomes poorly bonded because the sealing base material is deformed by heating. Since the sealing ability is lowered, a dark spot is generated when the organic EL panel is used for a long time due to the penetration of moisture from the adhesive layer 703 (see FIG. 5), which is not preferable. There are also concerns about poor adhesion due to thermal deterioration of the adhesive, generation of dark spots due to outgas, and deterioration of the organic layer. When the belt-shaped sealing member is heated and dried in the wound state, the adhesive melts and the belt-shaped sealing members adhere to each other. Accordingly, when the belt-shaped sealing member is heat-dried, it is not particularly limited. However, it is preferable that the belt-shaped sealing member be heat-dried in a state where the belt-shaped sealing member is tensioned rather than being wound.

  The heating time is such that the heating temperature is not lower than the glass transition temperature Tg of the adhesive and not higher than the glass transition temperature Tg + 10 ° C. of the sealing substrate, the water content contained in the adhesive layer 703 (see FIG. 5), and the organic EL panel Considering generation of dark spots during long-term use, poor adhesion due to thermal deterioration of the adhesive, generation of dark spots due to outgas, deterioration of the organic layer, and the like, it is preferable to be 2 hours or more and 24 hours or less.

  Reference numeral 10c1 denotes a cooling box of the cooling device 10c. A cooling air supply box 10c12 having a cooling air blowing hole 10c11 is provided at an upper portion inside the cooling box 10c1. Reference numeral 10c13 denotes a cooling air supply pipe that supplies cooling air to the cooling air supply box 10c12, and is connected to a cooling air supply device (not shown). A cooling air exhaust box 10c15 having a cooling air exhaust hole 10c14 is provided below the cooling box 10c1. Reference numeral 10c16 denotes a cooling air exhaust pipe that exhausts cooling air from the cooling air exhaust box 10c12, and is connected to a suction pump (not shown).

  A holding belt 10c17 for the belt-shaped sealing member 7 is disposed inside the cooling box 10c1, and the belt-shaped sealing member 7 is moved to the sealing base material 701 of the belt-shaped sealing member 7 as the belt-shaped sealing member 7 is moved. In order to prevent the occurrence of scratches, the belt-like sealing member 7 moves in accordance with the movement.

  The cooling in the cooling device 10c is preferably performed to a temperature at which the adhesive layer 703 (see FIG. 5) is solidified and can be wound (for example, a melting point of −30 ° C. or lower).

  After cooling, in order to prevent reabsorption of humidity until use, it is preferable to store in an environment below the moisture content of the adhesive after drying. Specifically, it is preferable to store in an environment with a water content of 200 ppm or less. More preferably, it is 80 ppm or less. The amount of water indicates a value measured with a capacitance type dew point meter (model: MIS1) manufactured by GE Sensing Japan.

  The band-shaped sealing member 7 after being heat-dried by the method shown in this figure can be used in a roll shape, or cut into a size to be used and used in a single wafer state.

  Next, in the manufacturing process of the serial type organic EL panel shown in FIG. 4 in FIG. 7 to FIG. 9, the serial type organic EL panel is manufactured using the sealing member dried by the heating drying method of the adhesive layer shown in FIG. This will be described with reference to a flow diagram.

  FIG. 7 is a schematic flow diagram from the base material supplying process to the organic functional layer forming process in the manufacturing process of the serial type organic EL panel shown in FIG.

  FIG. 8 is a schematic flow diagram from the dry film forming process to the preparation of the heat-dried sealing member in the serial organic EL panel manufacturing process shown in FIG.

  FIG. 9 is a schematic flow diagram from the sealing process to the cutting process in the manufacturing process of the serial organic EL panel shown in FIG.

  Hereinafter, the flow for manufacturing the series organic EL panel shown in FIG. 1 will be described with reference to the flowcharts shown in FIGS.

  In Step 1, the strip-shaped flexible base material 301a in which the first electrode 102 has already been formed is supplied from the base material supply step 3 (see FIG. 4). The first electrode 102 has a total length of 4 rows, 3 rows of first electrodes 102 (consisting of 102a, 102b, 102c) of a certain length on which one organic EL panel is formed and 1 row of lead portions 108. As a single block (a range indicated by L in the figure), a plurality of the blocks L are continuously formed at regular intervals in the transport direction.

  M represents an alignment mark. The alignment mark M is a mark indicating the position where the first electrode is formed and the position where the lead portion is formed. The alignment mark M is the side where the first electrode is formed on the strip-shaped flexible base material 301a, the back side, You may attach to both the side and back side in which 1 electrode is formed.

  The position for attaching the alignment mark M is not particularly limited as long as one block indicated by L can be identified, and the first electrode (anode) 102 and the lead portion arranged on the strip-shaped flexible base material 301a. It is possible to determine appropriately according to the 108 patterns.

  This figure has shown the case where the alignment mark M is arrange | positioned for every block shown by L arrange | positioned in the conveyance direction of the strip | belt-shaped flexible base material 301a.

  In Step 2, the organic functional layer 103 (103a, 103b, 103c) is formed at the organic layer forming position including the first electrode (anode) 102 (including 102a, 102b, 102c) in the organic functional layer forming step 4 (see FIG. 4). Formed). The organic functional layer 103 includes a portion of the first electrode (anode) 102a where the first electrode external connection electrode 102a1 is formed, a second electrode joint portion 102b1 of the first electrode (anode) 102b, and a first electrode (anode). Except for the second electrode joint portion 102c1 of 102c and the lead portion 108, it is applied and dried in the transport direction of the strip-shaped flexible base material 301a by a stripe coating method to form a strip shape.

In the organic functional layer formation step 4 (see FIG. 4), the method for forming the organic functional layer 103 on the first electrode 102 as shown in Step 2 is not particularly limited, and other methods include the following methods. It is done.
1) After applying the organic functional layer forming coating liquid on the entire surface including the first electrode (anode) 102 of the strip-shaped flexible base material 301a, the organic functional layer in an unnecessary portion is wiped off using a solvent. how to.
2) After applying the organic functional layer forming coating solution on the entire surface including the first electrode (anode) 102 of the strip-shaped flexible substrate 301a, the unnecessary organic functional layer is removed by a dry etching method. Method.
3) A method in which a coating liquid for forming an organic functional layer is applied to a belt-like flexible base material 301a by ink jet or the like.
4) A method of pattern-depositing a material for forming an organic functional layer on a belt-like flexible substrate 301a using a mask or the like.
5) A method in which an organic functional layer forming material is vapor-deposited on the entire surface of the strip-shaped flexible substrate 301a, and then an unnecessary organic functional layer is removed by a dry etching method.

  In Step 3, the organic functional layer formed between the blocks of the organic functional layer formed in a strip shape is applied and dried in the transport direction of the strip-shaped flexible base material 301a. The method for removing the organic functional layer is not particularly limited, and examples thereof include a wiping method using a solvent that dissolves the organic functional layer and a dry etching method using a laser.

  In Step 4, in the dry film forming process 5 (see FIG. 4), the second electrode 104 is patterned by a vapor deposition apparatus (not shown) using a mask. The second electrode 104 is formed in the following state.

  1) The second electrode (cathode) 104a formed on the organic functional layer 103a on the first electrode (anode) 102a leaves the first electrode external connection electrode 102a1 of the first electrode (anode) 102a, The first electrode (anode) 102b is joined to the second electrode joint portion 102b1.

  2) The second electrode (cathode) 104b formed on the organic functional layer 103b on the first electrode (anode) 102b is a second electrode junction of the first electrode (anode) 102c of the first electrode (anode) 102c. It is in a state of being joined to the portion 102c1.

  The second electrode (cathode) 104a joined to the second electrode joint portion 102b1 of the first electrode (anode) 102b and the second electrode (cathode) 104b formed on the first electrode (anode) 102b are masked. Since the second electrode (cathode) 104 is not formed, a short circuit is prevented.

  3) The second electrode (cathode) 104c formed on the organic functional layer 103c on the first electrode (anode) 102c is in a state of being joined to the lead portion 108. The lead portion 108 is joined to the second electrode (cathode) 104 to become the second electrode external connection electrode 104c1.

  The second electrode (cathode) 104b joined to the second electrode joint portion 102c1 of the first electrode (anode) 102c and the second electrode (cathode) 104c formed on the first electrode (anode) 102c are masked. Since the second electrode (cathode) 104 is not formed, a short circuit is prevented. At the stage where Step 4 is completed, an organic EL element continuous body in which a plurality of organic EL elements are continuously connected is obtained.

  In Step 5, the second electrode (cathode) 104 formed between each block of the organic functional layer formed in a strip shape is applied and dried in the transport direction of the strip-shaped flexible base material 301a. The method for removing the second electrode (cathode) 104 is not particularly limited, and examples thereof include a dry etching method using a laser.

  In Step 6, when the steps up to Step 5 are completed, the glass transition temperature of the adhesive layer of the sealing member is aligned with the alignment mark M of the strip-shaped flexible base material 301a of the organic EL element continuous body by the drying apparatus shown in FIG. More than Tg and Tg of the sealing substrate + 10 ° C. or less, the band-shaped sealing member 7 heated and dried for 2 hours or more and 24 hours or less is bonded onto each organic EL element of the organic EL element continuous body, Each organic EL element of the organic EL element continuum is sealed. Here, the band-shaped sealing member 7 is shown, but the shape of the band-shaped sealing member 7 may be a shape cut into a single wafer according to the size of the block L shown in Step 1. At the stage where Step 6 is completed, an organic EL panel continuous body in which organic EL panels sealed with organic EL elements are continuously connected is produced.

  In Step 7, the alignment mark M attached to the strip-shaped flexible base material 301a or the strip-shaped sealing member 7 in the cutting step 8 (see FIG. 4) is read by a detection device (not shown), and organic in accordance with the information. Punching and cutting is performed for each block of the EL panel continuous body, and a series organic EL panel having the same configuration as the series organic EL panel shown in FIG. 1 is manufactured.

  As shown in FIGS. 1 to 9, a sealing member in which a gas barrier layer and an adhesive layer are sequentially formed on a sealing base material is not lower than the glass transition temperature Tg of the adhesive layer, and A glass transition temperature Tg + 10 ° C. or lower is 2 hours or more and 24 hours or less, and the organic EL element is sealed with a dry sealing member to produce an organic EL panel. Manufacture is possible.

  Next, main members constituting the organic EL element will be described below.

(Base material)
A transparent resin film is mentioned as a base material. Examples of the resin film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate, cellulose acetate butyrate, cellulose acetate propionate (CAP), Cellulose esters such as cellulose acetate phthalate (TAC) and cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, polymethylpentene, polyether ketone, polyimide , Polyethersulfone (PES), polyphenylene sulfide, polysulfones, Cycloolefin resins such as polyether imide, polyether ketone imide, polyamide, fluororesin, nylon, polymethyl methacrylate, acrylic or polyarylate, Arton (trade name, manufactured by JSR) or Appel (trade name, manufactured by Mitsui Chemicals) Is mentioned.

(Gas barrier layer)
Examples of the gas barrier layer provided on the surface of the substrate as needed include inorganic and organic coatings, or hybrid coatings of both. As a characteristic of the gas barrier film, the water vapor permeability is preferably 0.01 g / m ² · day or less. Furthermore, a high gas barrier film having an oxygen permeability of 0.1 ml / m ² · day · MPa or less and a water vapor permeability of 10 ⁻⁵ g / m ² · day or less is preferable. In addition, water vapor permeability shows the value measured by the method based on JISK7129-1992. The oxygen permeability is a value measured by a method according to JIS K 7126-1987.

  As a material for forming the gas barrier film, any material may be used as long as it has a function of suppressing intrusion of an element such as moisture or oxygen that causes deterioration of the element. For example, silicon oxide, silicon dioxide, silicon nitride, or the like can be used. Further, in order to improve the brittleness of the film, it is more preferable to have a laminated structure of these inorganic layers and layers made of organic materials. Although there is no restriction | limiting in particular about the lamination | stacking order of an inorganic layer and an organic layer, It is preferable to laminate | stack both alternately several times. The method for forming the gas barrier film is not particularly limited. For example, the vacuum deposition method, the sputtering method, the reactive sputtering method, the molecular beam epitaxy method, the cluster ion beam method, the ion plating method, the plasma polymerization method, the atmospheric pressure plasma polymerization method. A plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, or the like can be used, but an atmospheric pressure plasma polymerization method as described in JP-A-2004-68143 is particularly preferable.

(First electrode)
The first electrode is not particularly limited to a cathode and an anode, and can be selected depending on the element structure, but preferably a transparent electrode is used as the anode. For example, when used as an anode, it is preferably an electrode that transmits light from 380 nm to 800 nm. A material having a work function larger (deep) than 4 eV is suitable as a material, for example, a transparent conductive metal oxide such as indium tin oxide (ITO), SnO ₂ , or ZnO, or a metal such as gold, silver, or platinum. Thin films, metal nanowires, carbon nanotubes, and the like can be used.

(Hole transport layer)
The hole transport layer is made of a hole transport material having a function of transporting holes, and in a broad sense, a hole injection layer and an electron blocking layer are also included in the hole transport layer. The hole transport layer can be provided as a single layer or a plurality of layers. The hole transport material has any one of hole injection or transport and electron barrier properties, and may be either organic or inorganic. For example, triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives and pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, Examples include stilbene derivatives, silazane derivatives, aniline copolymers, and conductive polymer oligomers, particularly thiophene oligomers.

The above-mentioned materials can be used as the hole transport material, but it is preferable to use a porphyrin compound, an aromatic tertiary amine compound and a styrylamine compound, particularly an aromatic tertiary amine compound. Representative examples of aromatic tertiary amine compounds and styrylamine compounds include N, N, N ', N'-tetraphenyl-4,4'-diaminophenyl; N, N'-diphenyl-N, N'- Bis (3-methylphenyl)-[1,1′-biphenyl] -4,4′-diamine (TPD); 2,2-bis (4-di-p-tolylaminophenyl) propane; 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane; N, N, N ′, N′-tetra-p-tolyl-4,4′-diaminobiphenyl; 1,1-bis (4-di-p-tolyl) Aminophenyl) -4-phenylcyclohexane; bis (4-dimethylamino-2-methylphenyl) phenylmethane; bis (4-di-p-tolylaminophenyl) phenylmethane; N, N'-diphenyl-N, N ' − (4-methoxyphenyl) -4,4
'-Diaminobiphenyl; N, N, N', N'-tetraphenyl-4,4'-diaminodiphenyl ether; 4,4'-bis (diphenylamino) quadriphenyl; N, N, N-tri (p- 4- (di-p-tolylamino) -4 '-[4- (di-p-tolylamino) styryl] stilbene; 4-N, N-diphenylamino- (2-diphenylvinyl) benzene; Methoxy-4'-N, N-diphenylaminostilbenzene; N-phenylcarbazole, and further having two condensed aromatic rings described in US Pat. No. 5,061,569 in the molecule For example, 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (NPD), a triferate described in JP-A-4-308688. Le amine units are linked to three starburst 4,4 ', 4 "- tris [N- (3- methylphenyl) -N- phenylamino] triphenylamine (MTDATA) and the like.

  Furthermore, a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used. In addition, inorganic compounds such as p-type-Si and p-type-SiC can also be used as the hole injection material and the hole transport material.

  JP-A-11-251067, J. Org. Huang et. al. A so-called p-type hole transport material described in a book (Applied Physics Letters 80 (2002), p. 139) can also be used. In the present invention, it is preferable to use these materials because a light-emitting element with higher efficiency can be obtained.

(Light emitting layer)
The material used for the light emitting layer is not particularly limited, and examples thereof include various materials as described in Toray Research Center, Inc. “Latest trend of flat panel display, current state of EL display and latest technological trend” on pages 228 to 332. It is done.

  The light emitting layer preferably contains a known host compound and a known phosphorescent compound (also referred to as a phosphorescent compound) in order to increase the light emission efficiency of the light emitting layer.

  The host compound is a compound contained in the light-emitting layer, the mass ratio in the layer is 20% or more, and the phosphorescence quantum yield of phosphorescence emission is 0.1 at room temperature (25 ° C.). Is defined as less than a compound. The phosphorescence quantum yield is preferably less than 0.01. A plurality of host compounds may be used in combination. By using a plurality of types of host compounds, it is possible to adjust the movement of charges, and the organic EL element can be made highly efficient. In addition, by using a plurality of phosphorescent compounds, it is possible to mix different light emission, thereby obtaining an arbitrary emission color. White light emission is possible by adjusting the kind of phosphorescent compound and the amount of doping, and can also be applied to illumination and backlight.

  As these host compounds, compounds having a hole transporting ability and an electron transporting ability, preventing emission light from being increased in wavelength, and having a high Tg (glass transition temperature) are preferable. Known host compounds include, for example, JP-A Nos. 2001-257076, 2002-308855, 2001-313179, 2002-319491, 2001-357777, and 2002-334786. Gazette, 2002-8860, 2002-334787, 2002-15871, 2002-334788, 2002-43056, 2002-334789, 2002-75645 2002-338579, 2002-105445, 2002-343568, 2002-141173, 2002-352957, 2002-203683, 2002-363227 2002-231453, 2003-3165, 2002-234888, 2003-27048, 2002-255934, 2002-260861, 2002-280183, Examples thereof include compounds described in 2002-299060, 2002-302516, 2002-305083, 2002-305084, 2002-308837 and the like.

  In the case of having a plurality of light-emitting layers, it is preferable that 50% by mass or more of the host compound in each layer is the same compound because it is easy to obtain a uniform film property over the entire organic layer. It is more preferable that the light emission energy is 2.9 eV or more because it is advantageous in efficiently suppressing energy transfer from the dopant and obtaining high luminance.

  Phosphorescence emission energy refers to the peak energy of the 0-0 band of phosphorescence emission when the photoluminescence of a deposited film of 100 nm is measured on a substrate with a host compound.

  The host compound has a phosphorescence emission energy of 2.9 eV or more and a Tg of 90 ° C. or more in consideration of deterioration of the organic EL device over time (decrease in luminance and film properties), market needs as a light source, and the like. Preferably there is. That is, in order to satisfy both luminance and durability, it is preferable that phosphorescence emission energy is 2.9 eV or more and Tg is 90 ° C. or more. Tg is more preferably 100 ° C. or higher.

  A phosphorescent compound (phosphorescent compound) is a compound in which light emission from an excited triplet is observed, is a compound that emits phosphorescence at room temperature (25 ° C.), and has a phosphorescence quantum yield of 25. The compound is 0.01 or more at ° C. When used in combination with the host compound described above, an organic EL device with higher luminous efficiency can be obtained.

  The phosphorescent compound preferably has a phosphorescence quantum yield of 0.1 or more. The phosphorescent quantum yield can be measured by the method described in Spectroscopic II, page 398 (1992 version, Maruzen) of Experimental Chemistry Course 4 of the 4th edition. Although the phosphorescence quantum yield in a solution can be measured using various solvents, the phosphorescence quantum yield used in the present invention only needs to achieve the phosphorescence quantum yield in any solvent.

  There are two types of light emission of the phosphorescent compound in principle. One is the recombination of the carrier on the host compound to which the carrier is transported to generate an excited state of the host compound, and this energy is transferred to the phosphorescent compound. The energy transfer type is to obtain light emission from the phosphorescent compound by moving to the other, and the other is that the phosphorescent compound becomes a carrier trap, and carrier recombination occurs on the phosphorescent compound, and the phosphorescent compound emits light. Although it is a carrier trap type in which light emission can be obtained, in any case, it is a condition that the excited state energy of the phosphorescent compound is lower than the excited state energy of the host compound.

  The phosphorescent compound can be appropriately selected from known compounds used for the light emitting layer of the organic EL device. The phosphorescent compound is preferably a complex compound containing a group 8-10 metal in the periodic table of elements, more preferably an iridium compound, an osmium compound, or a platinum compound (platinum complex compound), rare earth Of these, iridium compounds are the most preferred.

  The phosphorescent maximum wavelength of the phosphorescent compound is not particularly limited. In principle, the emission wavelength obtained by selecting a central metal, a ligand, a ligand substituent, etc. is changed. I can do it.

  The color emitted by the compound is shown in Fig. 4.16 on page 108 of the "New Color Science Handbook" (edited by the Japan Society of Color Science, The University of Tokyo Press, 1985). It is determined by the color when the measurement result is applied to the CIE chromaticity coordinates.

(Electron transport layer)
In addition, as an electron transport material (also serving as a hole blocking material) used for the electron transport layer adjacent to the light emitting layer side, it is sufficient if it has a function of transmitting electrons injected from the cathode to the light emitting layer. As a material, any one of conventionally known compounds can be selected and used. For example, nitro-substituted fluorene derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, carbodiimides, fluorenylidenemethane derivatives, anthraquinodisides. Examples include methane and anthrone derivatives, oxadiazole derivatives and the like. Furthermore, in the above oxadiazole derivatives, thiadiazole derivatives in which the oxygen atom of the oxadiazole ring is substituted with a sulfur atom, and quinoxaline derivatives having a quinoxaline ring known as an electron-withdrawing group can also be used as the electron transport material. Furthermore, a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used.

  Also, metal complexes of 8-quinolinol derivatives such as tris (8-quinolinol) aluminum (Alq), tris (5,7-dichloro-8-quinolinol) aluminum, tris (5,7-dibromo-8-quinolinol) aluminum Tris (2-methyl-8-quinolinol) aluminum, tris (5-methyl-8-quinolinol) aluminum, bis (8-quinolinol) zinc (Znq), and the like, and the central metals of these metal complexes are In, Mg, Metal complexes replaced with Cu, Ca, Sn, Ga or Pb can also be used as the electron transport material. In addition, metal-free or metal phthalocyanine, or those having terminal ends substituted with an alkyl group or a sulfonic acid group can be preferably used as the electron transport material. Distyrylpyrazine derivatives can also be used as electron transport materials, and inorganic semiconductors such as n-type-Si and n-type-SiC are also used as electron transport materials in the same manner as the hole injection layer and hole transport layer. I can do it. Although there is no restriction | limiting in particular about the film thickness of an electron carrying layer, Usually, 5 nm-about 5 micrometers, Preferably it is 5 to 200 nm. The electron transport layer may have a single layer structure composed of one or more of the above materials.

  An electron transport layer having a high n property doped with impurities can also be used. Examples thereof include JP-A-4-297076, JP-A-10-270172, JP-A-2000-196140, JP-A-2001-102175, J. Pat. Appl. Phys. 95, 5773 (2004), and the like. It is preferable to use such an electron transport layer having a high n property because an element with lower power consumption can be manufactured. The electron transport layer can be formed by forming the electron transport material into a thin film by a known method such as a wet method or a dry method.

(Second electrode)
The second electrode is not particularly limited to a cathode and an anode, and can be selected depending on the element configuration, but preferably a transparent electrode is used as the anode. For example, when used as a cathode, it is preferable to use a metal, an alloy, an electrically conductive compound having a work function of 4 eV or less (shallow), and a mixture thereof as an electrode material. Specific examples of such electrode materials include sodium, sodium-potassium alloy, magnesium, lithium, magnesium / copper mixture, magnesium / silver mixture, magnesium / aluminum mixture, magnesium / indium mixture, aluminum / aluminum oxide (Al ₂ O ₃ ) Mixtures, indium, lithium / aluminum mixtures, rare earth metals and the like. Among these, from the viewpoint of electrical bonding with the organic functional layer and durability against oxidation, etc., these metals and the second metal, which is a stable metal having a larger (deep) work function value than this, Mixtures such as magnesium / silver mixtures, magnesium / aluminum mixtures, magnesium / indium mixtures, aluminum / aluminum oxide (Al ₂ O ₃ ) mixtures, lithium / aluminum mixtures, aluminum alone and the like are suitable.

  The second electrode can be produced by forming a thin film of these electrode materials by a method such as vapor deposition or sputtering. The film thickness is usually selected in the range of 10 nm to 5 μm, preferably 50 nm to 200 nm.

  If a highly reflective metal material is used as the second electrode, for example, in an organic EL element, a part of the emitted light can be reflected and taken out to the outside, and the organic PV element passes through a photoelectric conversion layer. The effect of increasing the optical path length can be obtained by reflecting the reflected light and returning it to the photoelectric conversion layer again, and in any case, improvement of the external quantum efficiency can be expected. Furthermore, it may be a metal (for example, gold, silver, copper, platinum, rhodium, ruthenium, aluminum, magnesium, indium, etc.) or a nanoparticle, nanowire, or nanostructure made of carbon. A highly dispersible paste is preferable because a transparent and highly conductive counter electrode can be formed by a coating method or a printing method.

  Further, when the counter electrode side is made light transmissive, for example, a conductive material suitable for the counter electrode such as aluminum and aluminum alloy, silver and silver compound is formed with a thin film thickness of about 1 nm to 20 nm, and then the above-mentioned By providing a film of the conductive light-transmitting material mentioned in the description of the transparent electrode, a light-transmitting electrode can be obtained.

  EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

Example 1
(Production of organic EL panel)
According to the manufacturing process shown in FIG. 4, the substrate / gas barrier layer / first electrode (anode) / organic functional layer / second shown in FIG. 1 (a) according to the flow charts (Step 1 to Step 7) shown in FIGS. An organic EL panel having a configuration of two electrodes (cathode) / sealing member was produced. In addition, it was set as the structure of a positive hole transport layer / light emitting layer / electron transport layer as an organic functional layer, and the positive hole transport layer, the light emitting layer, and the electron transport layer were formed with the wet apply | coating method.

(Preparation of organic EL panel continuum)
<Preparation of flexible substrate>
As a flexible substrate, a belt-like polyethylene naphthalate film having a width of 200 mm and a length of 500 m and a thickness of 125 μm (a film made by Teijin-Dyupon Co., Ltd., hereinafter abbreviated as PEN film) was prepared. A position designation mark was attached to the position where the alignment mark, the first electrode external connection electrode, and the lead portion were formed in accordance with the position of the first electrode (anode) formed in advance.

(Formation of gas barrier layer)
Transparent layered three layers of low density layer, medium density layer, high density layer, and medium density layer of silicon oxide with a total thickness of about 90 nm on the prepared PEN film by atmospheric pressure plasma discharge treatment method A gas barrier film was produced. As a result of measuring the water vapor permeability by a method based on JIS K 7129-1992, it was 10 ⁻³ g / (m ² · 24 h) or less. As a result of measuring oxygen permeability by a method based on JIS K 7126-1987, it was 10 ⁻³ ml / (m ² · 24 hr · MPa) or less.

(Formation of the first electrode (anode))
On the prepared PEN film, the first electrode (anode) having a thickness of 120 nm, a width of 70 mm and a length of 100 mm under vacuum environmental conditions and having a first electrode external connection electrode and the lead portion are made of ITO (indium tin oxide). A mask pattern is formed by sputtering, and a lead portion having a size of 15 mm × 100 mm is formed at the right end, and three first electrodes having a size of 50 mm × 100 mm are formed at intervals of 5 mm, and wound around a winding core. It was made into a roll shape (see Step 1 in FIG. 9). Note that both ends were spaced 10 mm in order to attach alignment marks.

<Formation of hole transport layer>
(Preparation of coating solution for hole transport layer formation)
A solution prepared by diluting polyethylene dioxythiophene / polystyrene sulfonate (PEDOT / PSS, Baytron P AI 4083 manufactured by Bayer) with pure water at 65% and methanol at 5% was prepared as a coating solution for forming a hole transport layer.

(Application of coating liquid for hole transport layer formation)
The prepared coating solution for forming the hole transport layer is applied to the entire surface of the PEN film on which the prepared first electrode (anode) and the lead portion in the form of a roll are formed. a portion of the first electrode (anode) forming the first electrode external connection electrode in min, a second electrode joint portion of the first electrode (anode), a second electrode joint portion of the first electrode (anode), After applying the strip in the direction of transport of the PEN film to the organic layer forming position including the first electrode (anode) except for the lead portion by a stripe coating method, the height is 100 mm toward the film forming surface, and the discharge wind speed is 1 m / second. The solvent was removed at a sec. wind width distribution of 5% and a temperature of 100 ° C. to form a hole transport layer having a thickness of 50 nm (see Step 2 in FIG. 7), and wound and stored on a winding core. Before applying the coating solution for forming the hole transport layer, the cleaning surface modification treatment of the PEN film was performed using a low-pressure mercury lamp with a wavelength of 184.9 nm at an irradiation intensity of 15 mW / cm ² and a distance of 10 mm. The charge removal treatment was performed using a static eliminator with weak X-rays.

(Activation process)
Activation treatment (heat treatment) was performed by supplying dry air having a temperature of 120 ° C. for 30 minutes to the roll-shaped PEN film having been dried to form a hole transport layer.

<Formation of light emitting layer>
(Preparation of green luminescent layer forming coating solution)
A dopant material Ir (ppy) ₃ was dissolved in a host material polyvinyl carbazole (PVK) in 5% by mass in 1,2-dichloroethane to prepare a 1% solution, which was prepared as a coating solution for forming a green light emitting layer.

(Application of coating solution for green light emitting layer formation)
On the hole transport layer of the PEN film formed up to the hole transport layer, the prepared coating solution for forming the green light-emitting layer is extruded using an extrusion coater in a dry nitrogen gas atmosphere at a coating speed of 2 m / min. After stripe coating in a strip shape in the film transport direction, the solvent is removed at a height of 100 mm toward the film forming surface, a discharge wind speed of 1 m / sec, a wide wind speed distribution of 5%, and a temperature of 60 ° C. to form a light emitting layer having a thickness of 100 nm It formed (refer FIG. 9 Step2), and it wound up and stored.

(Activation process)
Activation treatment (heat treatment) was performed by supplying dry nitrogen having a temperature of 220 ° C. for 30 minutes to the roll-shaped PEN film formed with a green light emitting layer by drying.

<Formation of electron transport layer>
(Preparation of coating solution for electron transport layer formation)
The electron transport layer was prepared by dissolving Alq ₃ in 1,2-dichloroethane to obtain a 0.5 mass% solution as a coating solution for forming an electron transport layer.

(Application of coating solution for electron transport layer formation)
The prepared coating solution for forming an electron transport layer is extruded on a light emitting layer of the PEN film formed up to the light emitting layer using an extrusion coater in a dry nitrogen gas atmosphere, and the coating speed is 2 m in a belt shape in the transport direction of the PEN film. After applying the stripes at / min, the solvent is removed at a height of 100 mm toward the film forming surface, a discharge wind speed of 1 m / sec, a wide wind speed distribution of 5%, and a temperature of 60 ° C. to form an electron transport layer having a thickness of 30 nm. (See Step 2 in FIG. 9).

(Activation process)
An activation treatment was performed by supplying dry nitrogen having a temperature of 200 ° C. for 30 minutes to a roll-shaped PEN film having been dried to form an electron transport layer.

(Waste treatment of unnecessary area of organic functional layer)
Wipe off unnecessary area (organic functional layer between each block) of organic functional layer (hole transport layer / light emitting layer / electron transport layer) formed in a strip shape in the direction of transport of PEN film using acetone as solvent It was removed and wound up and stored on a winding core.

(Formation of second electrode)
The second electrode is placed on the PEN film on which the external connection electrode for the first electrode, the lead portion, and the electron transport layer are formed, and on the electron transport layer in the transport direction of the PEN film as shown in Step 4 of FIG. Aluminum was used as a second electrode forming material under a vacuum of 5 × 10 ⁻⁴ Pa, a mask pattern was formed in a belt shape with a vapor deposition apparatus (not shown), and a second electrode having a thickness of 100 nm was laminated. . The lead portion becomes the second electrode external connection electrode by being connected to the second electrode.

(Removal of second electrode in unnecessary area)
The second electrode formed between the blocks is irradiated with laser and removed by a dry etching method (see Step 5 in FIG. 10). At this stage, an organic EL element continuous body in which a plurality of organic EL elements are continuously connected in the transport direction of the PEN film is produced.

(Preparation of sealing member)
5 was prepared, and the adhesive layer was dried under the conditions shown in Table 1 to obtain a sealing member No. From a to g.

(Preparation of sealing substrate No. 1)
As a sealing substrate, a belt-like PET film having a width of 200 mm, a length of 600 m, and a thickness of 50 μm was prepared in advance by aligning both ends of the film with the position of the first electrode (anode). . It was set to 1. The glass transition temperature Tg of the PET film is 110 ° C.

(Preparation of sealing substrate No. 2)
As a sealing substrate, a belt-like PEN film having a width of 200 mm, a length of 600 m, and a thickness of 50 μm was prepared in advance by aligning the both ends of the film with the position of the first electrode (anode). . 2. The glass transition temperature Tg of the PEN film is 160 ° C.

(Formation of inorganic film)
The prepared sealing substrate No. 1 and sealing substrate No. 1 An inorganic film was formed by providing an aluminum foil having a thickness of 30 μm as an inorganic film on 2 by a known laminating method.

(Formation of adhesive layer)
Thereafter, as shown in Table 1, the type of the thermoplastic resin of the adhesive is changed, and an adhesive layer having a thickness of 40 μm is formed on the aluminum foil by a known laminating method to prepare a pre-drying sealing member. No. From a to e.

(Preparation of comparative sealing member f)
The prepared sealing substrate No. An aluminum film having a thickness of 30 μm as an inorganic film was formed on 1 by a known laminating method to form an inorganic film, and then, as an adhesive layer, a propylene / 1-butene / 4-methyl-1-pentene copolymer ( PB (4-MP); propylene component 48 mol%, 1-butene component 27 mol%, 4-methyl-1-pentene component 25 mol%, MFR (230 ° C.) = 14 g / 10 min) 70 parts by mass, 12 parts by mass of isoprene / styrene block copolymer (SIS; JSR Co., Ltd. SIS 5229N), ethylene and α-olefin co-oligomer (LEO; Mitsui Chemicals, Inc. Lucant TMHC-20) 8 parts by mass and propylene heavy coalescence (h-PP; density ^{0.91kg / m 3, MFR (230} ℃) = 7g / 10min) 10 parts by weight of the resin composition (MFR (230 ℃) 15 g / 10min) to prepare a sealing member is formed with a thickness 10μm by T- die extrusion molding machine was used to compare the sealing member No. f.

(Preparation of comparative sealing member g)
The prepared sealing substrate No. An aluminum film having a thickness of 30 μm as an inorganic film is formed on 2 by a known laminating method to form an inorganic film, and then, as an adhesive layer, a propylene / ethylene / 1-butene copolymer (PEB; propylene component = 77). Mol%, ethylene component = 17 mol%, 1-butene component = 6 mol%, MFR (230 ° C.) = 11 g / 10 min) 75 parts by mass, styrene / styrene block copolymer (SEBS; JSR Co., Ltd. Dynalon) 8600P) 10 parts by mass, ethylene and α-olefin co-oligomer (LEO; Mitsui Chemicals, Inc. Lucant TMHC-20) 10 parts by mass and propylene polymer (h-PP; density 0.91 kg / m ³ , MFR (230 ° C.) = 7 g / 10 min) 5 parts by mass and an organic filler (PMAA) made of crosslinked PMMA; Chemisnow T manufactured by Soken Chemical Co., Ltd. MX-500, particle size 5 μm) 3 parts by mass of a resin composition (MFR (230 ° C.) = 16 g / 10 min) is formed with a thickness of 10 μm by a T-die extruder, and a sealing member is produced. Comparative sealing member No. g.

  In addition, glass transition temperature Tg shows the value measured with Perkin-Elmer Japan Co., Ltd. differential scanning calorimeter (DSC6000).

(Heat-drying of sealing member)
The prepared pre-heat drying sealing member No. a to g were dried under the conditions shown in Tables 2 and 3 using the drying apparatus shown in FIG. 1-1 to 1-62. The strip-shaped sealing member was heat-dried under tension. The moisture content of the adhesive layer indicates a value measured using a Karl Fischer moisture meter CA-200 and a moisture vaporizer VA-200 manufactured by Mitsubishi Chemical Analytech Co., Ltd.

(Sealing with sealing member)
The prepared sealing member No. 1-1 to 1-62 are stored for 24 hours under conditions of a temperature of 30 ° C. and a water content of 200 ppm, and then the second electrode of each organic EL device of the organic EL device continuum using a roll laminator in an environment with a water content of 150 ppm. The surface was pasted at a pressure of 0.5 MPa and a temperature of 100 ° C., and the organic EL element continuum was sealed to obtain a strip-shaped organic EL panel continuum having a length of 500 m.

(Punching of organic EL panel continuum)
A punching and cutting device equipped with a die and a punch adapted to the shape of the die was prepared, and a continuous organic EL panel having a length of 500 m was punched and cut at a cutting speed of 30 pieces / min. An EL panel was prepared and sample no. 101 to 162.

Evaluation Each sample No. Tables 4 and 5 show the results obtained by measuring the occurrence of dark spots from 101 to 162 in accordance with the measurement method shown below and evaluating according to the evaluation rank shown below.

(Sampling of evaluation sample)
Ten individual organic EL panels were sampled from each position corresponding to 150 m, 350 m, and 450 m out of the total length of 500 m, and used as evaluation samples.

(Dark spot measurement method)
The produced organic EL panel was allowed to stand for 24 hours at a humidity of 90% RH and a temperature of 70 ° C., and then 5 V was applied with a constant voltage power source. The light emission state at that time was observed with a microscope made by Keyence, and the number of dark spots of 100 μm or more was visually counted.

Evaluation rank of dark spots ◎: 0 dark spots ○: 1 to 10 dark spots △: 10 to 20 dark spots ×: 20 or more dark spots

  Before sealing the organic electroluminescence panel structure, the sealing member was heated and dried at a temperature not lower than the glass transition temperature Tg of the adhesive layer of the sealing member and not higher than the glass transition temperature Tg of the sealing substrate + 10 ° C. Sample No. manufactured using the sealing member. From 102 to 111, 118 to 127, 134 to 138, 140 to 149, and 151 to 160, the moisture content of the adhesive layer was 200 ppm or less, and it was confirmed that dark spot resistance was excellent. Among these samples, it was confirmed that a sample prepared under a condition where the heating time was 2 hours or more was further excellent because the moisture content of the adhesive layer was less than 200 ppm. In addition, the sample prepared under the condition where the heating time exceeds 24 hours shows a slightly inferior result although there is no practical problem because the barrier property of the inorganic film formed on the sealing substrate deteriorates due to deformation of the sealing substrate. It was.

  Sample No. produced under conditions deviating from the conditions of the present invention (heat drying temperature is lower than the glass transition temperature Tg of the adhesive layer). Nos. 101, 117, 133, 139, and 150 showed a result of slightly inferior dark spot resistance due to a large amount of residual moisture in the adhesive layer.

  Sample No. 1 produced under conditions deviating from the conditions of the present invention (heat drying temperature exceeded glass transition temperature Tg + 10 ° C. of the sealing substrate). Nos. 112 to 116, 128 to 132, and 134 to 138 showed the result that the dark spot resistance was inferior because the barrier property of the inorganic film formed on the sealing substrate deteriorated due to the deformation of the sealing substrate. Sample No. 2 produced using a sealing member having an adhesive layer having a glass transition temperature Tg of −10 ° C. and −50 ° C. 161 and 162 showed the result that dark spot tolerance is inferior. This is because the adhesive layer was softened during storage after drying and the result was that moisture penetrated into the adhesive again because the adhesive layer was in a molten state during storage for measuring dark spots. Seem. The effectiveness of the present invention was confirmed.

Example 2
(Preparation of organic EL element continuum)
Example 1 The same organic EL element continuous body was produced.

(Preparation of sealing member before drying)
The sealing member No. 1 produced in Example 1 was used. The same sealing member as d was prepared and used as a pre-drying sealing member.

(Preparation of heat-dried sealing member)
The prepared pre-drying sealing member is dried using the drying apparatus shown in FIG. 6 at a heating temperature of 130 ° C. and a heating time of 24 hours, as shown in Table 6, with the moisture content inside the drying apparatus changed and dried by heating. Sealing member No. 2-a to 2-d. The moisture content of the adhesive layer indicates a value measured by the same method as in Example 1. The moisture content inside the drying device is a value measured by a capacitance dew point meter (model: MIS1) manufactured by GE Sensing Japan.

(Storage of heat-dried sealing material)
The prepared heat-dried sealing member No. 2-a to 2-d were put in a storage room, the moisture content in the storage place was changed as shown in Table 7, and the storage member was stored at a temperature of 25 ° C. for 2 hours. 2-1 to 2-12. The amount of water indicates a value measured with a capacitance type dew point meter (model: MIS1) manufactured by GE Sensing Japan.

(Sealing with sealing member)
The prepared sealing member No. 2-1 to 2-12 were bonded to the second electrode surface of each organic EL element of the organic EL element continuous body at a pressure of 0.5 MPa and a temperature of 100 ° C. using a roll laminator in an environment with a water content of 150 ppm, and organic The EL element continuum was sealed to obtain a strip-shaped organic EL panel continuum having a length of 500 m.

(Punching of organic EL panel continuum)
Under the same conditions as in Example 1, the produced continuous organic EL panel having a length of 500 m was punched and cut to produce individual organic EL panels. 201 to 212.

Evaluation Each sample No. Table 8 shows the results of measuring the occurrence of dark spots from 201 to 212 according to the same measurement method as in Example 1 and evaluating according to the same evaluation rank as in Example 1.

  Sample No. produced using a sealing member produced by drying and storing the sealing member in an environment having a moisture content of 200 ppm or less. It was confirmed that 203 to 205, 207, 208, and 210 to 212 have excellent dark spot resistance. Moreover, the moisture content of the environment when drying a sealing member was produced with 300 ppm.

  Sample No. produced using the sealing member. 201 showed no problem in practical use, but showed slightly inferior dark spot resistance. Sample No. produced using a sealing member stored at a water content of 300 ppm in the storage environment. 202, 206 and 209 showed the result that dark spot tolerance was a little inferior.

Example 3
(Preparation of organic EL element continuum)
Example 1 The same organic EL element continuous body was produced.

(Preparation of sealing member before drying)
The sealing member No. 1 produced in Example 1 was used. The same sealing member as d was prepared and used as a pre-drying sealing member.

(Preparation of heat-dried sealing member)
The prepared pre-drying sealing member prepared in Example 2 was dried by heating. It dried on the same conditions as 2-b and produced the dried sealing member.

(Storage of heat-dried sealing material)
The prepared heat-dried sealing member was sealed with the sealing member No. 1 of Example 2. It stored on the same conditions as 2-4, and was set as the sealing member.

(Production of organic EL panel)
Using the prepared sealing member, the amount of moisture in the environment is changed as shown in Table 9, and a pressure of 0.5 MPa is applied to the second electrode surface of each organic EL element of the organic EL element continuous body using a roll laminator. Bonding was performed at a temperature of 100 ° C., the organic EL element continuous body was sealed, and a continuous organic EL panel having a length of 500 m was obtained. Thereafter, under the same conditions as in Example 1, the produced continuous organic EL panel having a length of 500 m was punched and cut to produce individual organic EL panels. 301 to 304.

Evaluation Each sample No. Table 9 shows the results of evaluation of the occurrence of dark spots from 301 to 304 in accordance with the same measurement method as in Example 1 and evaluation according to the same evaluation rank as in Example 1.

  When the organic EL element was sealed using the sealing member dried and stored under the heating and drying conditions of the sealing member of the present invention, Sample No. 302 to 304 confirmed that the dark spot resistance was excellent. In addition, when sealing the organic EL element, the sample No. 1 produced with an environmental water content of 300 ppm was used. 301. It was confirmed that the dark spot resistance was slightly inferior.

1, 1a to 1e, 9 In-line type organic EL panel 101, 106, 301a Base material 105a to 110a, 701 Sealing base material 102, 102a to 102c First electrode (anode)
103 Organic functional layer 104, 104a to 104c Second electrode (cathode)
105 to 110, 7 Sealing member 105b to 108b, 702 Gas barrier layer 105c to 108c, 109b, 110b, 703 Adhesive layer 2 Manufacturing process 3 Substrate supply process 4 Organic functional layer forming process 401c, 402c, 403c, 10, 11 Drying device 5 Dry film forming step 6 Sealing step 8 Cutting step 10a Supply device 10b1, 11a1 Heating box 10b, 11a Heating device 10c, 11b Cooling device 10d Collection device 12 Storage shelf

Claims (7)

An organic electroluminescent device having a first electrode, a second electrode, and at least one organic functional layer including an organic light emitting layer between the first electrode and the second electrode is sealed on a substrate. In the manufacturing method of an organic electroluminescence panel for sealing with a stop member and manufacturing an organic electroluminescence panel,
The sealing member has a belt-like form having a configuration in which a gas barrier layer and an adhesive layer having a glass transition temperature Tg of 40 ° C. or higher are laminated on at least a sealing substrate;
Before sealing the organic electroluminescence panel element, the sealing member is heat-dried at a temperature not lower than the glass transition temperature Tg of the adhesive layer and not higher than the glass transition temperature Tg + 10 ° C. of the sealing substrate, A method for producing an organic electroluminescence panel, wherein the organic electroluminescence panel has a wound roll shape.   The method for producing an organic electroluminescence panel according to claim 1, wherein the time for heating the sealing member is 2 hours or more and 24 hours or less.   The method for producing an organic electroluminescence panel according to claim 1 or 2, wherein the moisture content of the adhesive layer after the heat drying is 200 ppm or less.   4. The method for producing an organic electroluminescence panel according to claim 1, wherein the moisture content of the adhesive layer after the heat drying is 80 ppm or less. 5.   The method for producing an organic electroluminescence panel according to any one of claims 1 to 4, wherein the sealing member is dried and stored after drying in an environment having a water content of 200 ppm or less.   6. The method of manufacturing an organic electroluminescence panel according to claim 1, wherein the organic electroluminescence element is sealed by the sealing member in an environment having a moisture content of 200 ppm or less.   An organic electroluminescence panel manufactured by the manufacturing method according to claim 1.