JP5125503B2 - Manufacturing method of organic EL element - Google Patents

Manufacturing method of organic EL element Download PDF

Info

Publication number
JP5125503B2
JP5125503B2 JP2007509175A JP2007509175A JP5125503B2 JP 5125503 B2 JP5125503 B2 JP 5125503B2 JP 2007509175 A JP2007509175 A JP 2007509175A JP 2007509175 A JP2007509175 A JP 2007509175A JP 5125503 B2 JP5125503 B2 JP 5125503B2
Authority
JP
Japan
Prior art keywords
unit
organic el
layer
coating
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007509175A
Other languages
Japanese (ja)
Other versions
JPWO2006100889A1 (en
Inventor
伸彦 高嶋
洋祐 ▲高▼島
真昭 村山
飛沢  誠一
Original Assignee
コニカミノルタホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005083324 priority Critical
Priority to JP2005083324 priority
Application filed by コニカミノルタホールディングス株式会社 filed Critical コニカミノルタホールディングス株式会社
Priority to JP2007509175A priority patent/JP5125503B2/en
Priority to PCT/JP2006/304063 priority patent/WO2006100889A1/en
Publication of JPWO2006100889A1 publication Critical patent/JPWO2006100889A1/en
Application granted granted Critical
Publication of JP5125503B2 publication Critical patent/JP5125503B2/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0024Processes specially adapted for the manufacture or treatment of devices or of parts thereof for forming devices by joining two substrates together, e.g. lamination technique
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2251/00Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
    • H01L2251/50Organic light emitting devices
    • H01L2251/53Structure
    • H01L2251/5338Flexible OLED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

Description

The present invention relates to a method for manufacturing an organic EL (electroluminescence) element used as a surface light source, a display panel, or the like.

  In recent years, organic EL elements using organic substances have been promising for use as solid light-emitting inexpensive, large-area full-color display elements and writing light source arrays, and active research and development have been promoted. The organic EL element includes a first electrode (anode or cathode) formed on a substrate, an organic EL layer having an organic compound layer including a light emitting layer stacked thereon, and a first layer stacked on the light emitting layer. It is a thin film type element having two electrodes (cathode or anode). When a voltage is applied to such an organic EL element, electrons are injected into the organic EL layer from the cathode and holes are injected from the anode. It is known that light is obtained by releasing energy as light when the electrons and holes recombine in the light emitting layer and the energy level returns from the conduction band to the valence band.

  Thus, since the organic EL element is a thin film type element, when an organic EL panel in which one or a plurality of organic EL elements are formed on a substrate is used as a surface light source such as a backlight, a surface light source. It is possible to easily make a device equipped with In addition, when a display device is configured using an organic EL panel in which a predetermined number of organic EL elements as pixels are formed on a substrate as a display panel, the liquid crystal display device has high visibility and no viewing angle dependency. There are benefits that cannot be obtained.

  On the other hand, when forming the organic EL layer of the organic EL element, as described in JP-A-9-102393 and JP-A-2002-170676, vapor deposition, sputtering, CVD, PVD, solvent Various methods, such as coating methods using a glass, can be used. Among these methods, manufacturing processes are simplified, manufacturing costs are reduced, workability is improved, flexible large-area elements such as backlights and illumination light sources, etc. It is known that a wet film-forming method such as a coating method is advantageous from the viewpoint of application to a film. For example, Japanese Patent Application Laid-Open No. 2002-170676 describes a method of forming an organic compound layer on a single wafer glass substrate by spin coating. Japanese Patent Application Laid-Open No. 2003-142260 describes a method of sequentially forming an organic compound layer on a single wafer substrate by an ink jet method. Each of these methods uses a single substrate as a substrate, so there is a limit to increasing production efficiency. The manufacturing method of the organic EL element which uses the roll-shaped base material with high possibility that production efficiency is mentioned from these situations, forms various layers which comprise an organic EL element on a base material, and makes it a winding roll shape (Roll-to-roll system) is being studied.

  For example, a method is known in which a long film in a roll shape is supplied and a light emitting layer is formed on the film while being conveyed by a wet coating method, and then wound into a winding roll shape (for example, a patent) See reference 1.) As a method of manufacturing an organic EL display in which a plastic film is used as a light-transmitting substrate and a cathode, one or a plurality of light emitting layers made of an organic material, and an anode layer are provided on the plastic film, the material is made of an organic material. A method is known in which patterning of one or a plurality of light-emitting layers and patterning of a cathode are performed by a roll-to-roll method using a vapor deposition method under vacuum (see, for example, Patent Document 2). However, in the method described in Patent Document 1, it is technically difficult to obtain production stability in pattern coating that is necessary for production of a full color panel. Further, in the method described in Patent Document 2, 1) Since the light emitting layer and the like are patterned by vapor deposition while transporting the support, it is difficult to control the stability of the patterning position accuracy, and the position of the light emitting layer is There is a risk of slipping. 2) The use efficiency of an organic compound used to form one or a plurality of light emitting layers made of an organic substance is low, which is one of the causes of high costs. 3) Since one or a plurality of light emitting layers made of an organic material are formed by a vapor deposition method, it takes time to form the light emitting layer and it is difficult to increase productivity.

Under these circumstances, it is desired to develop a method for forming an organic compound layer for forming an organic EL element that has high productivity and is compatible with a full color panel.
Japanese Patent Laid-Open No. 10-77467 International Publication No. 01/5194 Pamphlet

The present invention has been made in view of the above circumstances, and its object is high productivity, it is to provide a method for producing a high-quality organic EL element.

  The above object of the present invention has been achieved by the following constitution.

(Claim 1)
An organic EL element having a first electrode, an organic EL layer having an organic compound layer, and a second electrode in this order on a belt-like flexible support, a supply unit, a pattern coating unit / drying unit, In the method of manufacturing an organic EL element manufactured using a manufacturing apparatus having a recovery unit,
To the supply unit, the strip-shaped flexible support A on which the first electrode is formed is supplied in a roll state,
Next, a coating liquid for forming an organic EL layer is applied and dried in the pattern application unit / drying unit, and the organic EL layer is formed on the first electrode on the flexible support to form a strip-like flexible film. As support B,
In the collection unit, the belt-like flexible support B is wound around a winding core,
A first accumulator unit is provided before the pattern application unit / drying unit, and a second accumulator unit is provided after the pattern application unit / drying unit,
A wet application / drying unit in front of the first accumulator unit or after the second accumulator unit;
In the pattern application unit / drying unit, the organic EL layer forming coating solution is applied in a state where the conveyance of the belt-like flexible support A is stopped, and the organic EL layer is intermittently moved after application. Device manufacturing method.
(Claim 2)
An organic EL element having a first electrode, an organic EL layer having an organic compound layer, and a second electrode in this order on a belt-like flexible support, a supply unit, a pattern coating unit / drying unit, In the method of manufacturing an organic EL element manufactured using a manufacturing apparatus having a recovery unit,
To the supply unit, the strip-shaped flexible support A on which the first electrode is formed is supplied in a roll state,
Next, a coating liquid for forming an organic EL layer is applied and dried in the pattern application unit / drying unit, and the organic EL layer is formed on the first electrode on the flexible support to form a strip-like flexible film. As support B,
In the collection unit, the belt-like flexible support B is wound around a winding core,
A first accumulator unit is provided before the pattern application unit / drying unit, and a second accumulator unit is provided after the pattern application unit / drying unit,
Having a wet application / drying unit before the first accumulator unit and after the second accumulator unit;
In the pattern application unit / drying unit, the organic EL layer forming coating solution is applied in a state where the conveyance of the belt-like flexible support A is stopped, and the organic EL layer is intermittently moved after application. Device manufacturing method.
(Claim 3 )
In the pattern application unit / drying unit, the organic EL layer forming coating solution is applied in a state in which the belt-like flexible support A is adsorbed and fixed to a holding table, and intermittent transport is performed after the application. The manufacturing method of the organic EL element of Claim 1 or Claim 2 .

(Claim 4 )
The pattern coating unit / drying unit includes a pattern coating unit that forms a coating film for forming a light emitting layer under an atmospheric pressure condition by using a wet pattern formation coating apparatus with an organic EL layer forming coating solution; And the organic EL layer drying unit for forming the organic EL layer as one unit,
The said pattern application part and drying part have at least 1 unit of the said pattern application part and drying part, The manufacture of the organic EL element of any one of Claim 1 thru | or 3 characterized by the above-mentioned. Method.

(Claim 5 )
The method for manufacturing an organic EL element according to any one of claims 1 to 4, wherein the belt-like flexible support A is provided with an alignment mark.

(Claim 6 )
The wet pattern formation coating apparatus operates in response to the intermittent conveyance of the strip-shaped flexible support A, and operates when the strip-shaped flexible support A is stopped to perform pattern formation coating. A method for producing an organic EL element according to claim 4 or 5 .

(Claim 7 )
The said pattern application part has the holding | maintenance means of a strip | belt-shaped flexible support body, the detection means of an alignment mark, and the application position correction | amendment control means of a wet pattern formation coating device. The manufacturing method of the organic EL element of any one of 1 thru | or 6th term | claim.

(Claim 8 )
The wet coating / drying unit applies a coating solution for forming an organic compound layer under a atmospheric pressure condition with a wet coating apparatus and a wet coating unit to remove the solvent in the organic compound layer. the method for manufacturing an organic EL device according to any one of claims paragraphs 1 through 7, wherein characterized in that it comprises an organic compound layer drying section for.

(Claim 9 )
The organic EL device manufacturing method according to any one of claims 1 to 8 , further comprising a heat treatment unit after the pattern coating unit / drying unit and the wet coating / drying unit. Method.

(Claim 10 )
The method for manufacturing an organic EL element according to any one of claims 1 to 9 , wherein the manufacturing apparatus includes a charge removal processing unit.

(Claim 11 )
The belt-like flexible support A is cleaned before applying the organic compound layer forming coating solution in the wet coating / drying unit or before applying the organic EL layer forming coating solution in the pattern coating unit / drying unit. The method for producing an organic EL element according to any one of claims 1 to 10 , wherein a cleaning surface modification treatment is performed by a modification treatment means.

(Claim 12 )
12. The method of manufacturing an organic EL element according to claim 11, wherein the cleaning surface modification processing means is oxygen plasma or UV irradiation.

(Claim 13 )
The organic EL layer and the organic compound layer have a dew point temperature of −20 ° C. or lower and a measured cleanliness of class 5 or lower in accordance with JISB 9920, and an organic EL layer drying section, an organic compound layer drying section, and a heating The method for producing an organic EL element according to any one of claims 1 to 12 , wherein the organic EL element is formed in an atmospheric pressure of 10 to 45 ° C excluding the treatment portion.

(Claim 14 )
The band-shaped flexible support B in the recovery section, wound after the winding roll form a core, a range paragraphs 1 through 13 claims, characterized in that stored under a reduced pressure of 10 -5 10 Pa The manufacturing method of the organic EL element of any one of claim | items.

  It is possible to provide a method for forming an organic EL layer with high productivity and high quality for an organic EL element, and a stable organic EL element can be produced.

It is a schematic sectional drawing which shows an example of the laminated constitution of an organic EL element. It is a schematic diagram of the manufacturing apparatus which has a pattern application | coating and drying part which forms even an organic EL layer. FIG. 3 is an enlarged schematic view of a portion indicated by P in FIG. 2. It is a schematic diagram of the manufacturing apparatus which has a wet application | coating / drying part and pattern application | coating / drying part which form even an organic EL layer. It is a schematic diagram of the manufacturing apparatus which has a wet application | coating / drying part before and behind the pattern application | coating / drying part which forms even an organic EL layer. FIG. 3 is an enlarged schematic plan view of a portion indicated by Q in FIG. 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a, 1b Organic EL element 101 Base material 102 1st electrode (anode)
103 hole transport layer 104 light emitting layer 105 electron injection layer (electron transport layer)
106 Second electrode (cathode)
107 Sealing layer 109 Sealing film 2, 3, 4 Manufacturing apparatus 201, 301, 401 Supply part 201a Band-shaped flexible support A
202, 302 Clean surface modification processing unit 203 First neutralization processing unit 204, 306, 407 First accumulator unit 205, 307, 408 Pattern application / drying unit 205b11 Head 206, 308, 405, 409 Heat treatment unit 207 Second neutralization Processing unit 208, 311, 411 Second accumulator unit 209, 312, 415 Recovery unit 301h, 401h Strip-like flexible support B
303 Static elimination processing part A
304 Wet coating / drying unit 305 Static elimination processing unit B
309 Static elimination processing unit C
404 First wet coating / drying unit 403 Static elimination processing unit a
406 Static elimination processing unit b
410 Static elimination processing unit c
412 Second wet coating / drying unit 414 Static elimination processing unit d

  Embodiments according to the present invention will be described with reference to FIGS. 1 to 6, but the present invention is not limited thereto.

  FIG. 1 is a schematic cross-sectional view showing an example of a layer structure of an organic EL element. FIG. 1A is a schematic cross-sectional view showing a constituent layer of an organic EL element on which a sealing film is formed. FIG. 1B is a schematic cross-sectional view showing a constituent layer of an organic EL element formed by attaching a sealing film via an adhesive.

  The layer structure of the organic EL element shown in FIG. In the figure, 1a represents an organic EL element. The organic EL element 1a includes a first electrode (anode) 102, a hole transport layer 103, a light emitting layer 104, an electron injection layer 105, a second electrode (cathode) 106, and a sealing material on a substrate 101. Layer 107 is provided in this order.

  The layer structure of the organic EL element shown in FIG. 1B will be described. In the figure, 1b represents an organic EL element. The organic EL element 1b includes a first electrode (anode) 102, a hole transport layer (hole injection layer) 103, a light emitting layer 104, an electron injection layer 105, and a second electrode (cathode) on a substrate 101. ) 106, an adhesive layer 108, and a sealing film 109 in this order. In the organic EL element shown in this figure, a hole injection layer (not shown) may be provided between the first electrode (anode) 102 and the light emitting layer 104 or the hole transport layer 103. Further, an electron transport layer (not shown) may be provided between the second electrode (cathode) 106 and the light emitting layer 104 or the electron injection layer 105. In the organic EL element 1a and the organic EL element 1b shown in this drawing, it is preferable to provide a gas barrier film (not shown) between the anode (first electrode) 102 and the substrate 101.

  The present invention relates to a method for forming the light emitting layer 104 shown in the figure. The layer configuration of the organic EL element shown in this figure shows an example, but the following configuration can be given as a layer configuration of another typical organic EL element.

(1) Base material / anode / light emitting layer / electron transport layer / cathode / sealing layer (2) Base material / anode / hole transport layer / light emitting layer / hole blocking layer / electron transport layer / cathode / sealing layer (3) substrate / anode / hole transport layer (hole injection layer) / light emitting layer / hole blocking layer / electron transport layer / cathode buffer layer (electron injection layer) / cathode / sealing layer (4) substrate / Anode / anode buffer layer (hole injection layer) / hole transport layer / light emitting layer / hole blocking layer / electron transport layer / cathode buffer layer (electron injection layer) / cathode / sealing layer The EL layer refers to a layer structure sandwiched between an anode and a cathode in the layer structure shown in FIG. Each layer constituting the organic EL element will be described later.

  FIG. 2 is a schematic view of a manufacturing apparatus having a pattern coating / drying unit for forming layers up to the organic EL layer. The following is a method for forming an organic EL layer having a hole transport layer, a light emitting layer, and an electron transport layer on a strip-shaped flexible support having a first electrode that is patterned and formed as an example. I will explain it.

  In the figure, reference numeral 2 denotes a manufacturing apparatus that forms up to an organic EL layer, which is one of the constituent layers of an organic EL element, under atmospheric pressure conditions. The manufacturing apparatus 2 includes: a supply unit 201; a cleaning surface modification processing unit 202 for a belt-like flexible support; a first charge removal processing unit 203; a first accumulator unit 204; a pattern application / drying unit 205; A processing unit 206, a second static elimination processing unit 207, a second accumulator unit 208, and a recovery unit 209 are provided.

  In the supply unit 201, the strip-shaped flexible support A201a in which the gas barrier film and the anode layer including the first electrode are already formed in this order is wound around the winding core and supplied in a roll state. 201b shows the strip | belt-shaped flexible support body A201a of a roll state. The first electrode (see FIGS. 1 and 6) is formed by patterning (see FIG. 6).

The cleaning surface modification processing unit 202 cleans the surface of the anode layer (not shown) including the first electrode of the strip-shaped flexible support A201a sent from the supply unit 201 before being applied by the pattern application / drying unit 205. A cleaning surface modifying means 202a for modifying is provided. Examples of the cleaning surface modification means 202a include a low-pressure mercury lamp, an excimer lamp, a plasma cleaning apparatus, and the like. As conditions for the cleaning surface modification treatment using a low-pressure mercury lamp, for example, a cleaning surface modification treatment is performed by irradiating a low-pressure mercury lamp with a wavelength of 184.2 nm at an irradiation intensity of 5 to 20 mW / cm 2 and a distance of 5 to 15 mm. Conditions are mentioned. For example, atmospheric pressure plasma is preferably used as the condition for the cleaning surface modification treatment by the plasma cleaning apparatus. Examples of the cleaning conditions include conditions in which a gas containing oxygen of 1 to 5% by volume is used for argon gas, and the cleaning surface modification treatment is performed at a frequency of 100 KHz to 150 MHz, a voltage of 10 V to 10 KV, and an irradiation distance of 5 to 20 mm.

  Examples of the charge removal processing means used in the first charge removal processing unit 203 include a light irradiation method, a corona discharge method, and the like, and these can be appropriately selected and used as necessary. The light irradiation type generates weak ions, and the corona discharge type generates air ions by corona discharge. The air ions are attracted to the charged object to compensate for the opposite polarity charge and neutralize static electricity. A static eliminator using corona discharge or a static eliminator using soft X-rays can be used. Since the first charge removal processing section removes the charge of the base material, the adhesion of the dust and the dielectric breakdown are prevented, so that the yield of the elements can be improved.

  The first accumulator unit 204 moves the roll 204a in the vertical direction (in the direction of the arrow in the drawing), the conveyance speed of the strip-shaped flexible support A201a conveyed from the supply unit 201, and the pattern application / drying unit 205. Is provided to adjust the difference from the pattern coating speed of the film, and has a function of accumulating the belt-like flexible support A201a having a predetermined length, and the belt-like flexibility before and after the first accumulator unit 204. The operation of the support A 201a can be changed. Adjustment of the length to accumulate can increase the roll 204a according to the speed difference. The roll 204a is preferably a non-contact roll capable of transporting the layer forming surface in a non-contact manner.

  The pattern coating / drying unit 205 shown in this figure includes a pattern coating unit that forms a light emitting layer under an atmospheric pressure condition by using a wet pattern formation coating apparatus with a coating liquid for forming an organic EL layer, and an organic EL layer layer under an atmospheric pressure condition. The organic EL layer drying part which removes a solvent and forms an organic EL layer is provided as one unit. This figure shows the case of having 3 units (first pattern coating / drying unit 205a, second pattern coating / drying unit 205b, and third pattern coating / drying unit 205c). It has the same configuration. The coating liquid for forming an organic EL layer refers to a coating liquid for forming a hole transport layer, a coating liquid for forming a light emitting layer, and a coating liquid for forming an electron transport layer.

  The first pattern coating / drying unit 205a is configured to form a hole transporting layer forming coating solution for forming a hole transporting layer under a atmospheric pressure condition using a wet patterning coating apparatus, and to transport a hole under atmospheric pressure condition. It has a hole transport layer drying section 205a2 that removes the solvent in the layer and forms a hole transport layer.

  The second pattern coating / drying unit 205b includes a second pattern coating unit 205b1 that forms a coating film for forming a light emitting layer under atmospheric pressure conditions by using a wet pattern forming coating apparatus with a coating solution for forming a light emitting layer, and a light emitting layer under atmospheric pressure conditions. And a light emitting layer drying section 205b2 for forming a light emitting layer by removing the solvent therein. In addition, it is preferable to provide the same static elimination process part as the 1st static elimination process part 203 before the 2nd pattern application | coating / drying part 205b.

  The third pattern coating / drying unit 205b includes a second pattern coating unit 205b1 that forms an electron transport layer under an atmospheric pressure condition by using a wet pattern formation coating apparatus with an electron transport layer forming coating solution; And an electron transport layer drying unit 205c2 for forming an electron transport layer. In addition, it is preferable to provide the same static elimination process part as the 1st static elimination process part 203 before the 3rd pattern application | coating / drying part 205c.

  The first pattern application unit 205a1 includes a wet pattern formation application device 205a11 and a holding table 205a12 that is a holding means for the belt-like flexible support A. The second pattern application unit 205b1 is a holding pattern 205b12 that is a holding unit for the belt-like flexible support on which the hole transport layer sent from the wet pattern formation application device 205b11 and the first pattern application / drying unit 205a is formed. And have. The third pattern application unit 205c1 includes a wet pattern formation application device 205c11 and a holding table 205c12 that is a holding unit for the belt-like flexible support on which the light emitting layer sent from the second pattern application / drying unit 205b is formed. Have.

The first pattern application unit 205a1, the second pattern application unit 205b1, and the third pattern application unit 205c1 include an alignment detection unit (see FIG. 6) and an application position correction control unit of the wet pattern formation application apparatus in addition to the holding unit. (See FIG. 6) The heat treatment unit 206 includes a heat treatment unit 206a provided on the rear side of the hole transport layer drying unit 205a2 and a heating unit provided on the rear side of the light emitting layer drying unit 205b2. It has a processing unit 206b and a heat processing unit 206c provided on the rear side of the hole transport layer drying unit 205c2.

  The holding base 205a12 (205b12, 205c12) is not particularly limited as long as the belt-like flexible support can be fixed while maintaining flatness, and examples thereof include a suction table. Examples of the suction table include a mechanism having a suction hole on the table, a mechanism having a porous surface on which the table is placed, and an electrostatic chuck. The suction table can be appropriately selected and used. Preferably, the table of the mechanism in which the mounting surface is porous is used.

  The first pattern coating / drying unit 205a fixes the strip-shaped flexible support A201a conveyed from the supply unit 201 on the holding base 205a12, and the wet pattern formation coating apparatus 205a11 causes the strip-shaped flexible support A201a to be placed on the strip-shaped flexible support A201a. The hole transport layer forming coating solution is applied to the region excluding the end portion of the first electrode formed on the substrate, the solvent in the hole transport layer is removed by the hole transport layer drying unit 205a2, and the hole transport layer is removed. 201c is formed. The formed hole transport layer 201c is subjected to heat treatment by the heat treatment unit 206a. When coating is performed by the wet pattern formation coating device 205a11 in the first pattern coating / drying unit 205a, the alignment provided on the strip-shaped flexible support A on which the first electrode conveyed from the previous step is formed. The mark 4 (see FIG. 6) is detected by the detector of the alignment detecting means disposed in the first pattern application unit 205a1, the belt-like flexible support A is adsorbed and fixed on the holding table, and wet according to the alignment mark. The pattern forming coating device 205a11 is aligned, and a hole layer forming coating solution is coated on the electrode in the region of the first electrode except for a part of the end portion of the patterned first electrode. Is done.

  The second pattern coating / drying unit 205b fixes the belt-like flexible support on which the hole transport layer 201c conveyed from the first pattern coating / drying unit 205a is formed on the holding table 205b12 to form a wet pattern. The coating liquid for forming the light emitting layer is matched with the pattern of the first electrode by the coating device 205b11 and applied onto the formed hole transport layer 201c, and the solvent in the light emitting layer is removed by the light emitting layer drying unit 205b2. 201d is formed. The formed light emitting layer is subjected to heat treatment by the heat treatment unit 206b. When pattern coating is performed by the wet pattern formation coating apparatus 205b11 in the second pattern coating / drying unit 205b, it is provided on the belt-like flexible support on which the hole transport layer 201c transported from the previous step is formed. The alignment mark 4 (see FIG. 6) is detected by the detector of the alignment detection means disposed in the pattern application unit 205b, the belt-like flexible support is temporarily stopped, and the wet pattern formation coating apparatus 205b11 is in accordance with the alignment mark. The alignment is performed, and a coating solution for forming a light emitting layer is applied on the electrode according to the pattern of the first electrode formed by patterning. Note that pattern formation application by the wet pattern formation application apparatus 205b11 will be described with reference to FIG.

  The third pattern coating / drying unit 205c fixes the belt-like flexible support on which the light emitting layer 201d conveyed from the second pattern coating / drying unit 205b is formed on the holding table 205c12, and forms a wet pattern formation coating device. By 205c11, the electron transport layer forming coating solution is applied onto the light emitting layer 201d, and the solvent in the electron transport layer is removed by the electron transport layer drying unit 205c2 to form the electron transport layer 201e. The formed electron transport layer is subjected to heat treatment by the heat treatment unit 206c. When coating is performed by the wet pattern formation coating device 205c11 in the third pattern coating / drying unit 205c, the alignment mark provided on the strip-shaped flexible support A on which the light emitting layer conveyed from the previous step is formed. 4 (see FIG. 6) is detected by the detector of the alignment detection means disposed in the third pattern application unit 205c1, and the belt-like flexible support A on which the light emitting layer is formed is adsorbed and fixed on the holding table. Then, the wet pattern formation coating device 205c11 is aligned according to the alignment mark, and the electron transport layer forming coating solution is coated on the light emitting layer.

  An organic EL layer having a hole transport layer 201c, a light emitting layer 201d, and an electron transport layer 201e except for an end of the first electrode by the first pattern coating / drying unit 205a to the third pattern coating / drying unit 205c. A belt-like flexible support B formed with is completed.

  The first pattern application unit 205a1 to the third pattern application unit 205c1 are all applied in a state where they are adsorbed and fixed to the holding base, so that the hole transport layer is formed from the first pattern application / drying unit 205a. Movement of the flexible support A to the second pattern coating / drying unit 205b, and the third pattern coating / drying unit 205 of the strip-shaped flexible support A on which the light emitting layer is formed by the second pattern coating / drying unit 205b. Since the movement from the third pattern application / drying unit 205 to the recovery unit 209 is performed after the application of each layer is formed in each part, the movement is intermittent.

  Examples of the wet coater that can be used in the wet pattern formation coating apparatus 205a11 (205b11, 205b11) include, for example, an inkjet method, a flexographic printing method, an offset printing method, a gravure printing method, a screen printing method, and a spray coating method using a mask. Various coating apparatuses used for the above are mentioned. Use of these wet pattern formation coating machines can be appropriately selected according to the material of the light emitting layer forming coating solution. This figure shows the case of the ink jet system.

  The second static elimination processing unit 207 has a function of performing static elimination on the belt-like flexible support having the electron transport layer 201e formed by the third pattern application / drying unit 205c and preventing a failure due to static electricity in the next process. And can be arranged as necessary. The second charge removal processing unit 207 preferably uses the same charge removal processing unit as the charge removal processing unit used in the first charge removal processing unit 203.

  When the wet accumulator / drying unit (not shown) is disposed after the second accumulator unit 208, the second accumulator unit 208 applies pattern by moving the roll 208a in the vertical direction (arrow direction in the figure). It is provided to adjust the difference in transport speed between the drying unit 205 and the wet coating / drying unit (not shown), and the roll 208a can be added according to the speed difference. Further, the second accumulator unit 208 is intermittently conveyed in a state where the belt-like flexible support is stopped in the pattern application / drying unit 205, so that a certain amount is accumulated in the second accumulator unit 208 and collected in the collection unit 209. It is also possible to use in a method in which the amount is continuously wound up. The second accumulator unit 208 preferably has the same function and the same configuration as the first accumulator unit 204.

  In the recovery unit 209, the strip-shaped flexible support B201f processed by the second static elimination processing unit 207 and formed with the organic EL layer is wound around the winding core and recovered as a rolled strip-shaped flexible support B201g. It is stored until it is sent to the next process for forming the injection layer, the second electrode, the sealing layer and the like.

  FIG. 3 is an enlarged schematic view of a portion indicated by P in FIG. In the recovery unit 209, it is preferable that the strip-shaped flexible support B on which the organic EL layer is formed is cooled to room temperature with a cooling device (not shown) and then wound up.

  The light emitting layer drying unit 205b2 includes a dry air supply header 205b23 having a discharge port 205b21 for discharging dry air, a supply port 205b22 for dry air, an exhaust port 205b24, and a transport roll 205b25.

  The heat treatment unit 206b is configured to remove the light emitting layer 201d from the back side of the belt-like flexible support having the heat treatment apparatus main body 206b1 and the light emitting layer 201d formed on the hole transport layer 201d in accordance with the pattern of the first electrode. And a plurality of heating rollers 206b2 for heating by the back surface heat transfer method. By heat-processing in the heat processing part 206b, it has the function to stabilize a positive hole transport layer further. The hole transport layer drying unit 205a2 and the heat treatment unit 206a and the electron transport layer drying unit 205c2 and the heat treatment unit 206c shown in FIG. 2 have the same structure as the light emitting layer drying unit 205b2 and the heat treatment unit 206b shown in FIG. It has a function.

  FIG. 4 is a schematic view of a manufacturing apparatus having a wet coating / drying unit and a pattern coating / drying unit that form up to an organic EL layer. The following is a method for forming an organic EL layer having a hole transport layer, a light emitting layer, and an electron transport layer on a strip-shaped flexible support having a first electrode that is patterned and formed as an example. I will explain it.

  In the figure, reference numeral 3 denotes a manufacturing apparatus for forming up to an organic EL layer, which is one of the constituent layers of the organic EL element, under atmospheric pressure conditions. The manufacturing apparatus 3 includes a supply unit 301, a cleaning surface modification processing unit 302 for a strip-shaped flexible support, a static elimination processing unit A303, a wet coating / drying unit 304, a static elimination processing unit B305, and a first accumulator unit 306. A pattern application / drying unit 307, a heat processing unit 308, a charge removal processing unit C 309, a second accumulator unit 311, and a recovery unit 312.

  In the supply unit 301, the strip-shaped flexible support A301a in which the gas barrier film and the anode layer including the first electrode are already formed in this order is wound around the winding core and supplied in a roll state. 301b shows the strip | belt-shaped flexible support body A301a of a roll state. The first electrode (see FIGS. 1 and 6) is formed by patterning (see FIGS. 1 and 6).

  The cleaning surface modification processing unit 302 cleans the surface of the anode layer (not shown) including the first electrode of the strip-shaped flexible support A301a sent from the supply unit 301 before being applied by the wet application / drying unit 304. Cleaning surface modification processing means 302a for modifying. The cleaning surface modification processing unit 302a is the same as the cleaning surface modification processing unit 202a shown in FIG. 2, has the same function, and can perform the cleaning surface modification processing under the same conditions.

  The static elimination processing unit A303 has a function of performing static elimination on the belt-like flexible support A301a processed by the cleaning surface modification processing unit 302 and preventing a failure caused by static electricity in the next process, and is disposed as necessary. It is possible to do. The charge removal processing unit A303 has the same charge removal processing means as the first charge removal processing unit 203 shown in FIG. 2, and has the same function.

  The wet application / drying unit 304 includes a backup roll 304a for holding the strip-shaped flexible support A301a, and a first electrode formed by patterning on the strip-shaped flexible support A301a held by the backup roll 304a. Wet coater 304b for applying a coating liquid for forming a hole transport layer under atmospheric pressure conditions and a large amount of solvent in the hole transport layer 301c formed on the first electrode on the strip-shaped flexible support A301a. And a hole transport layer drying section 304c that is removed under atmospheric pressure conditions.

  Examples of the wet coater that can be used for the wet coater 304b include a die coating method, a screen printing method, a flexographic printing method, a Mayer bar method, a cap coating method, a spray coating method, a casting method, a roll coating method, a bar coating method, A coating machine such as a gravure coating method can be used. Use of these wet coating machines can be appropriately selected according to the material of the organic compound layer forming coating liquid organic compound layer.

  The heat treatment unit 308 is provided after the heat treatment unit 308a disposed after the hole transport layer drying unit 304c, the heat treatment unit 308b disposed after the light emitting layer drying unit 307a2, and the electron transport layer drying unit 307b2. It is comprised from the heat processing part 308c arrange | positioned, and all have the same structure.

  The heat treatment unit 308a has a function of performing heat treatment from the back surface side of the belt-like flexible support having the hole transport layer 301d formed by the hole transport layer drying unit 304c by a back surface heat transfer method, and further stabilizing. It is preferable that it is provided if necessary.

  The heat treatment unit 308b has a function of performing heat treatment from the back side of the belt-like flexible support having the light emitting layer 201e formed by the light emitting layer drying unit 307a1 by a back surface heat transfer method, and further forming a stable light emitting layer 201e. However, it is preferable to dispose as necessary.

  The heat treatment unit 308c heat-treats from the back side of the belt-like flexible support having the electron transport layer 201f formed by the electron transport layer drying unit 307b1 by a back surface heat transfer method, thereby obtaining a more stable electron transport layer 201f. It has a function, and it is preferable to arrange as needed.

  The first accumulator unit 306 is arranged to adjust the difference in transport speed between the wet coating / drying unit 304 and the pattern coating / drying unit 307 by moving the roll 306a in the vertical direction (the arrow direction in the figure). The roll 306a can be added according to the speed difference. The roll 306a is preferably a non-contact roll that can transport the hole transport layer surface in a non-contact manner.

  The pattern application / drying unit 307 includes a pattern application unit that forms a light emitting layer under a atmospheric pressure condition using a wet pattern formation application device, and a drying unit that removes a solvent in the light emitting layer under atmospheric pressure conditions. A first pattern coating / drying unit 307a with one unit as a unit, a pattern coating unit for forming an electron transport layer under an atmospheric pressure condition using a wet pattern formation coating apparatus with an electron transport layer forming coating solution, and an electron transport under an atmospheric pressure condition And a second pattern application / drying unit 307b having one unit of an electron transport layer drying unit for removing the solvent in the layer. The first pattern application / drying unit 307a and the second pattern application / drying unit 307b have the same configuration.

  The first pattern coating / drying unit 307a removes the solvent in the light emitting layer under the atmospheric pressure condition, and the first pattern coating unit 307a1 that forms the light emitting layer under the atmospheric pressure condition by using the wet pattern forming coating apparatus with the coating solution for forming the light emitting layer. And a light emitting layer drying unit 307a2.

  The second pattern coating / drying unit 307b includes a first pattern coating unit 307b1 that forms an electron transport layer under an atmospheric pressure condition by using a wet pattern formation coating apparatus with an electron transport layer forming coating solution, and an electron transport layer under an atmospheric pressure condition. And an electron transport layer drying unit 307b2 for removing the solvent therein.

  The static elimination processing part B has a function of performing static elimination of the belt-like flexible support having the hole transport layer 301d formed by the wet coating / drying part 304 and preventing a failure due to static electricity in the next process, It can be arranged as required.

  The first pattern application unit 307a1 includes a wet pattern formation application device 307a11 and a holding table 307a12 that is a holding means for the strip-shaped flexible support A on which the hole transport layer is formed. The second pattern application unit 307b1 includes a wet pattern formation application device 307b11, a holding table 307b12 which is a holding unit for the belt-like flexible support A on which the light emitting layer sent from the first pattern application / drying unit 307a is formed. have.

  In addition to the holding means, the first pattern application unit 307a1 and the second pattern application unit 307b1 include an alignment detection unit (see FIG. 6), and an application position correction control unit (see FIG. 6) of the wet pattern formation coating apparatus. have. The holding table 307a12 (307b12) is the same as the holding table shown in FIG.

  The first pattern coating / drying unit 307a fixes the belt-shaped flexible support A on which the hole transport layer conveyed from the wet coating / drying unit 304 is formed on the holding table 307a12, and forms a wet pattern forming coating device. By 307a11, the light emitting layer forming coating solution is applied onto the hole transport layer formed on the belt-like flexible support A, the solvent in the light emitting layer is removed by the light emitting layer drying unit 307a2, and the light emitting layer 301e is removed. Form. The formed light emitting layer 301e is subjected to heat treatment by the heat treatment portion 308b. When coating is performed by the wet pattern formation coating apparatus 307a11 in the first pattern coating / drying unit 307a, the first pattern coating / drying unit 307a is provided on the belt-like flexible support A on which the hole transport layer transported from the previous step is formed. The alignment mark 4 (see FIG. 6) is detected by the detector of the alignment detecting means disposed in the first pattern application unit 307a1, and the belt-like flexible support A is sucked and fixed on the holding table, and according to the alignment mark The wet pattern forming coating apparatus 307a11 is aligned, and the light emitting layer forming coating solution is applied on the electrode in accordance with the pattern of the first electrode except for a part of the end portion of the patterned first electrode. To be applied.

  The second pattern coating / drying unit 307b fixes the belt-like flexible support on which the light emitting layer 301e conveyed from the first pattern coating / drying unit 307a is formed on the holding table 307b12, and a wet pattern formation coating device By 307b11, the electron transport layer forming coating solution is applied onto the light emitting layer 201d, and the solvent in the electron transport layer is removed by the electron transport layer drying unit 307b2 to form the electron transport layer 301f. The formed electron transport layer is subjected to heat treatment by the heat treatment unit 308c. When coating is performed by the wet pattern formation coating apparatus 307b11 in the second pattern coating / drying unit 307b, an alignment mark provided on the strip-shaped flexible support A on which the light emitting layer conveyed from the previous step is formed. 4 (see FIG. 6) is detected by the detector of the alignment detecting means disposed in the third pattern application unit 307b1, and the belt-like flexible support A on which the light emitting layer is formed is adsorbed and fixed on the holding table. Then, the wet pattern formation coating device 307b11 is aligned according to the alignment mark, and the electron transport layer forming coating solution is coated on the light emitting layer.

  An organic EL layer having a hole transport layer 301d, a light emitting layer 301e, and an electron transport layer 301f is formed by the wet coating / drying unit 304 to the second pattern coating / drying unit 307b except for the end of the first electrode. The resulting strip-shaped flexible support B is completed.

  The first pattern application unit 307a1 and the second pattern application unit 307b1 are all applied in a state where they are adsorbed and fixed to the holding base, and therefore, a belt-like flexible film in which a light emitting layer is formed from the first pattern application / drying unit 307a. Since the movement of the conductive support A to the second pattern coating / drying unit 307b and the movement from the second pattern coating / drying unit 307b to the collection unit 312 are performed after the coating of each layer is formed in each unit, Become. The wet pattern formation coating device 307a11 (307b11) is the same as the wet pattern formation coating device shown in FIG. This figure shows a case where an ink jet coating apparatus is used.

  The static elimination processing unit C309 has a function of performing static elimination on the belt-like flexible support having the electron transport layer 301f formed by the second pattern application / drying unit 307b and preventing a failure due to static electricity in the next process. It can be arranged as necessary. In addition, it is preferable to use the same static elimination process means as the static elimination process means used for the static elimination process part A as the static elimination process means used for the static elimination process part B305 and the static elimination process part C309.

  When a wet application / drying unit (not shown) is arranged after the second accumulator unit 308, the second accumulator unit 309 moves the roll 208a in the vertical direction (arrow direction in the figure), thereby applying the pattern application. It is provided to adjust the difference in transport speed between the drying unit 307 and the wet coating / drying unit (not shown), and the roll 311a can be added according to the speed difference. In addition, the second accumulator unit 311 is intermittently conveyed in the pattern application / drying unit 207 while the belt-like flexible support is stopped, so that a certain amount is accumulated in the second accumulator unit 311 and collected in the collection unit 312. It is also possible to use in a method in which the amount is continuously wound up. The second accumulator unit 311 preferably has the same function as the first accumulator unit 306 and has the same configuration.

  In the collection unit 312, the strip-shaped flexible support B 301 g processed by the static elimination processing unit C and having the organic EL layer formed thereon is wound around the winding core and collected as a rolled strip-shaped flexible support B 301 h, and the electron injection layer The second electrode, the sealing layer, etc. are stored until they are sent to the next step. In the collection unit 312, it is preferable that the strip-shaped flexible support B on which the organic EL layer is formed is cooled to room temperature with a cooling device (not shown) and then wound up.

  FIG. 5 is a schematic view of a manufacturing apparatus having a wet coating / drying unit before and after a pattern coating / drying unit for forming an organic EL layer. The following is a method for forming an organic EL layer having a hole transport layer, a light emitting layer, and an electron transport layer on a strip-shaped flexible support having a first electrode that is patterned and formed as an example. I will explain it.

  In the figure, reference numeral 4 denotes a manufacturing apparatus for forming up to an organic EL layer, which is one of the constituent layers of an organic EL element, under atmospheric pressure conditions. The manufacturing apparatus 4 includes a supply unit 401, a belt-shaped flexible support cleaning surface modification processing unit 402, a charge removal processing unit a403, a first wet coating / drying unit 404, a heat processing unit 405, and a charge removal processing unit. b406, the 1st accumulator part 407, the pattern application | coating / drying part 408, the heat processing part 409, the static elimination process part c410, the 2nd accumulator part 411, the 2nd wet application | coating / drying part 412, and the static elimination process part d414 and a recovery unit 415.

  The manufacturing apparatus 4 shown in the figure includes a first wet application / drying unit 404 and a heat treatment unit 406 before the first accumulator unit 407, and a second wet application / drying unit 412 and a heat treatment after the second accumulator unit 411. The portion 413 is provided.

  In the supply unit 401, the strip-shaped flexible support A401a in which the gas barrier film and the anode layer including the first electrode are already formed in this order is wound around the winding core and supplied in a roll state. 401b shows the strip | belt-shaped flexible support body A401a of a roll state. The first electrode (see FIGS. 1 and 6) is formed by patterning (see FIGS. 1 and 6).

  The cleaning surface modification processing unit 402 is a surface of an anode layer (not shown) including the first electrode of the strip-shaped flexible support A 401 a sent from the supply unit 401 before being applied by the first wet coating / drying unit 404. Cleaning surface modification processing means 402a for cleaning and reforming.

  The static elimination processing unit a403 has a function of performing static elimination on the belt-like flexible support A401a processed by the cleaning surface modification processing unit 402 and preventing a failure due to static electricity in the next process, and is disposed as necessary. It is possible to do. The charge removal processing unit a403 has the same charge removal processing means as the first charge removal processing unit 203 shown in FIG. 2, and has the same function.

  The first wet coating / drying unit 404 has a backup roll 404a holding the strip-shaped flexible support A401a and a large amount of hole transport layer forming coating liquid on the strip-shaped flexible support A401a held by the backup roll 404a. A wet coater 404b that coats under atmospheric pressure conditions, and a hole transport layer drying unit 405c that removes the solvent of the hole transport layer formed on the first electrode on the strip-shaped flexible support A401a under atmospheric pressure conditions. And have.

  The wet coater 404b is the same as the wet coater 304b shown in FIG. The heat treatment unit 405 performs heat treatment from the back side of the belt-like flexible support A having the hole transport layer 401c formed by the hole transport layer drying unit 405c by a back surface heat transfer method, and further stabilizes hole transport. The layer 401d has a function and is preferably provided as necessary.

  The static elimination process part b406 performs the static elimination of the strip | belt-shaped flexible support body A in which the positive hole transport layer 401d formed in the 1st wet application and drying part was formed, and the function which prevents the failure accompanying the static electricity in the next process And can be arranged as required. The neutralization processing unit b406 preferably uses the same neutralization processing unit as the neutralization processing unit used in the first neutralization processing unit 203 shown in FIG.

  The first accumulator unit 407 is arranged to adjust the difference in transport speed between the wet coating / drying unit 404 and the pattern coating / drying unit 408 by moving the roll 407a in the vertical direction (arrow direction in the figure). The roll 407a can be added according to the speed difference. The roll 406a is preferably a non-contact roll that can transport the hole transport layer surface in a non-contact manner.

  The first pattern application / drying unit 408 includes a pattern application unit 408a and a light emitting layer drying unit 408b. The pattern coating unit 408a includes a holding base 408a2 for a belt-like flexible support on which a hole transport layer 401d is formed, and a coating solution for forming a light emitting layer on the hole transport layer 401d in accordance with the pattern of the first electrode under atmospheric pressure conditions. And a wet pattern formation coating apparatus 408a2 for pattern coating below. The light emitting layer drying unit 408b has a function of removing the solvent in the light emitting layer under atmospheric pressure conditions, and has the same configuration as the light emitting layer drying unit 205b2 shown in FIG. The holding base 408a2 is not particularly limited as long as the belt-like flexible support can be fixed while maintaining flatness, and it is preferable to use a holding base having the same structure as the holding base shown in FIG.

  When the pattern coating / drying unit 408 performs coating by the wet pattern forming coating apparatus 408a1, the alignment mark provided on the belt-like flexible support A on which the hole transport layer transported from the previous step is formed. 4 (see FIG. 6) is detected by the detector of the alignment detection means disposed in the pattern application unit 408a, and the belt-like flexible support A on which the hole transport layer is formed is adsorbed and fixed on the holding table. In accordance with the alignment mark, the wet pattern formation coating apparatus 408a1 is aligned, and the light emitting layer forming coating is performed in accordance with the pattern of the first electrode except for a part of the end of the first electrode formed by patterning. A liquid is applied on the electrode.

  The heat treatment unit 409 has a function of heat-treating from the back side of the belt-like flexible support having the light-emitting layer 401e formed by the light-emitting layer drying unit 408b by a back surface heat transfer method to form a stable light-emitting layer. It is preferable to dispose as necessary. The heat treatment unit 409 has the same configuration as the heat treatment unit 206b shown in FIG.

  The charge removal processing unit c410 has a function of removing charges from the belt-like flexible support on which the light emitting layer is formed and preventing a failure caused by static electricity in the next process, and can be disposed as necessary. ing. The static elimination processing unit c410 preferably uses the same static elimination processing unit as the static elimination processing unit used in the first static elimination processing unit 203 shown in FIG.

  The second accumulator unit 411 is arranged to adjust the difference in transport speed between the pattern coating / drying unit 408 and the wet coating / drying unit 412 as the roll 411a moves in the vertical direction (the arrow direction in the figure). The roll 411a can be added according to the speed difference. The second accumulator unit 411 has the same configuration as the first accumulator unit 407.

  The second wet coating / drying unit 412 includes a backup roll 412a that holds the belt-like flexible support on which the light-emitting layer 401e is formed, and a belt-like flexible support on which the light-emitting layer 401e that is held on the backup roll 412a is formed. A wet coater 412b that applies a coating solution for forming an electron transport layer to the body under atmospheric pressure; and an electron transport layer drying unit 412c that removes the solvent of the formed electron transport layer under atmospheric pressure. Yes. The electron transport layer drying unit 412c has the same configuration as the light emitting layer drying unit 205b2 shown in FIG. The wet coater 412b is the same as the wet coater 304b shown in FIG. The heat treatment unit 413 performs heat treatment from the back side of the belt-like flexible support having the electron transport layer 401f formed by the electron transport layer drying unit 412c by a back surface heat transfer method, thereby obtaining a more stable electron transport layer 401f. It has a function, and it is preferable to arrange as needed. The heat treatment unit 413 has the same configuration as the heat treatment unit 206b shown in FIG.

  The static elimination processing unit d414 has a function of performing static elimination on the belt-like flexible support having the electron transport layer 401f formed by the second wet coating / drying unit 412 and preventing a failure due to static electricity in the next process. It can be arranged as necessary. It is preferable that the static elimination processing unit d414 uses the same static elimination processing means as that used in the first static elimination processing unit 203 shown in FIG.

  In the recovery unit 415, the strip-shaped flexible support B401g processed by the static elimination processing unit d414 and formed with the organic EL layer is wound around the winding core and recovered as a rolled strip-shaped flexible support B401h, and the electron injection layer The second electrode, the sealing layer, etc. are stored until they are sent to the next step. In the recovery unit 415, it is preferable that the strip-shaped flexible support B on which the organic EL layer is formed is cooled to room temperature with a cooling device (not shown) and then wound up.

  The coating device 4 shown in this figure is performed in a state where the application of the light emitting layer forming coating solution in the pattern application / drying unit 408 is stopped, and when the light emitting layer application is completed, the next light emitting layer forming application is performed. Intermittent conveyance is performed to apply the liquid. On the other hand, in the first wet coating / drying unit 404, the hole transport layer is continuously coated, and the first difference is that the speed difference between the first wet coating / drying unit 404 and the pattern coating / drying unit 408 is adjusted. The accumulator unit 407 is adjusted so that the required length can be stored. In the second wet coating / drying unit 412, the electron transport layer is continuously coated, and the second difference is that the speed difference between the pattern coating / drying unit 408 and the second wet coating / drying unit 412 is adjusted. The accumulator unit 411 is adjusted so that the required length can be stored.

  When the strip-shaped flexible support having the organic EL layer formed thereon is wound around the winding core using the manufacturing apparatus shown in FIGS. 2 to 5, a space is provided on the surface of the air-permeable slip sheet or the organic EL layer. It is preferable to wind it up via a spacer tape.

  FIG. 6 is an enlarged schematic plan view of a portion indicated by Q in FIG. FIG. 6A is an enlarged schematic plan view of the pattern application portion indicated by Q in FIG. FIG. 6B is an enlarged schematic plan view of the belt-like flexible support in a state in which the hole transport layer is formed on the first electrode conveyed from the wet coating / drying unit.

  In the figure, A shows a wet pattern forming coating apparatus for pattern coating a blue light emitting layer forming coating liquid, B shows a wet pattern forming coating apparatus for pattern coating a green light emitting layer forming coating liquid, and C is a red light emitting layer. A wet pattern forming and coating apparatus for pattern coating a forming coating solution is shown, and in the case of this figure, a wet pattern forming and coating apparatus 205b1 is configured. Each of the wet pattern forming and coating apparatuses A to C shown in this figure shows a case where an ink jet head is used, and is hereinafter simply referred to as a head.

  Reference numeral 205b13 denotes a stage to which the head 205b11 is attached. The head 205b111 is disposed on the stage 205b13 so as to be movable in the width direction (arrow direction in the drawing). Reference numeral 205b14 denotes a stage on which the stage 205b13 is attached so as to be movable in the transport direction (in the direction of the arrow in the figure) of the belt-like flexible support with the hole transport layer 201c formed on the first electrode 102. . The 1st electrode 102 is patterned on the strip | belt-shaped flexible support body 201m, and is provided in the length direction of the strip | belt-shaped flexible support body 201m continuously with a fixed space | interval. Reference numeral 3 denotes a detection device for the alignment mark 4 provided on the strip-shaped flexible support A in which the anode layer including the first electrode 102 is formed on the strip-shaped flexible support 201m. The detection device 3 is arranged on the frame (not shown) of the wet pattern formation coating device 205b1 in accordance with the position of the alignment mark 4. The arrangement method of the head on the stage 205b13 is not particularly limited. For example, the wet pattern formation coating apparatuses A to C may be individually disposed, or the wet pattern formation coating apparatuses A to C may be combined. It is preferable to select appropriately according to need. This figure has shown the case where each wet pattern formation coating device AC is arrange | positioned collectively.

  The alignment mark 4 is provided in at least two places on the lower right end and the upper left end (or the upper right end and the lower left end) of the first electrode 102 with respect to the transport direction of the belt-like flexible support A (the arrow direction in the drawing). From the relationship of determining the position of the head 205b11, it is preferable. Of course, the alignment mark 4 may be provided on the lower right end, upper right end, lower left end, and upper left end of the first electrode 102. The hole transport layer 201c is formed by coating and drying the entire surface in a first pattern coating / drying unit 205b (see FIG. 2), leaving the end 102a of the first electrode 102. An example of the detection device 3 is a CCD camera. The belt-like flexible support having the hole transport layer 201c, the stage 205b13, the stage 205b14, and the head 205b11 are driven by a coating position correction control means (not shown) according to the detection information of the alignment mark 4 by the detection device 3. Control is possible.

  The manufacturing apparatus shown in FIG. 5 shows the process of applying the light emitting layer forming coating solution on the patterned first electrode 102 in accordance with the pattern of the first electrode 102 in the pattern application unit shown in this figure. It is shown below when it is used.

  In S1, a strip-shaped flexible support in which a hole transport layer 401d is formed on the first electrode 102 that is patterned and arranged by the first wet coating / drying unit 404 and the heat treatment unit 405 in the previous step is provided. The pattern application / drying unit 408 is sent to the pattern application unit 408a.

  In S <b> 2, the alignment mark 4 provided on the first electrode 102 is detected by a detection device provided in the pattern application / drying unit 408, thereby holding the belt-like flexible support on which the hole transport layer 401 d is formed. It is fixed by suction on the table 408a2.

  In S3, the stage 205b13 (see FIG. 6) moves based on the information that the belt-like flexible support is sucked and fixed onto the holding table 408a2, and the position of the head is determined.

  In S4, in accordance with the pattern of the first electrode 102, the blue light emitting layer forming coating liquid is emitted from the head A (see FIG. 6) and the green light emitting layer forming coating liquid is emitted from the head B (see FIG. 6). A layer-forming coating solution is applied onto the first electrode 102 from the head C (see FIG. 6). As the stage 205b13 moves in the width direction, the blue light emitting layer forming coating liquid, the green light emitting layer forming coating liquid, and the red light emitting layer forming coating liquid are applied to each of the patterned first electrodes 102. Is done.

  In S5, when the application in the width direction is completed in S4, the stage 205b14 (see FIG. 6) moves in the transport direction by the pitch of the first electrode 102, and the blue light emitting layer forming coating solution, A green light emitting layer forming coating solution and a red light emitting layer forming coating solution are applied to each of the patterned first electrodes 102. Thereafter, S4 and S5 are repeated until the coating solution for forming the blue light emitting layer, the coating solution for forming the green light emitting layer, and the coating solution for forming the red light emitting layer are applied to all the patterned first electrodes 102.

  In S6, when the coating solution for forming the blue light-emitting layer, the coating solution for forming the green light-emitting layer, and the coating solution for forming the red light-emitting layer is completely applied to all the patterned first electrodes 102, the suction fixation is released and the coating is performed. The portion is sent to the light emitting layer drying unit 408b.

  In S7, a new first electrode 102 is sent to the pattern application unit 408a. Thereafter, the steps up to S6 are repeated, and the blue light emitting layer forming coating liquid, the green light emitting layer forming coating liquid, and the red light emitting layer are sequentially formed on the first electrode 102 provided in the transport direction of the belt-like flexible support. A forming coating solution is applied.

  In S1 to S7, the conveyance of the band-shaped flexible support is stopped at the pattern application unit 408a, while the hole application layer is formed while being continuously conveyed by the wet application / drying unit 404 and the heat treatment unit 406. The first accumulator unit 407 is operated to adjust the speed difference among the pattern application unit 408a, the wet application / drying unit 404, and the heat treatment unit 405, and the hole transport layer is formed by the speed difference. A flexible support can be stored.

  As drying conditions in each drying section shown in FIGS. 2 to 6, in consideration of drying unevenness of each formed coating film, blown rough surface of the coating film, etc., the discharge air velocity of the dry air from the discharge port is 0.1 to 0.1. Examples include air flow drying with 5 m / s and a wind speed distribution in the width direction of 0.1 to 10%.

  The heating conditions in the heat treatment unit shown in FIGS. 2 to 6 are considered to improve the smoothness of the hole transport layer, the light emitting layer, the electron transport layer, etc., remove the residual solvent, cure, etc. -30- + 30 ° C. with respect to the glass transition temperature of the layer, electron transport layer, etc., and at a temperature not exceeding the decomposition temperature of the organic compound constituting the hole transport layer, light emitting layer, electron transport layer, etc. It is preferable to perform heat treatment.

  The variation in the transport speed of the belt-like flexible support when the hole transport layer forming coating solution and the electron transport layer forming coating solution are applied with the wet coater shown in FIGS. In consideration of coating thickness unevenness and the like, it is preferably 0.2 to 10% with respect to the average conveyance speed.

  In the production apparatus shown in FIGS. 2, 4, and 5, the formation of the hole transport layer, the light emitting layer, the electron transport layer, etc. is performed for maintaining the performance of the hole transport layer, the light emitting layer, the electron transport layer, etc. Considering prevention of failure defects, etc., the dew point temperature is -20 ° C or lower, and in accordance with JISB 9920, the measured cleanliness is class 5 or lower, and 10 to 45 ° C is large except for the drying section and the heat treatment section. It is preferably formed under atmospheric conditions.

In the present invention, the strip-like flexible support B on which an organic EL layer (hole transport layer, light emitting layer, electron transport layer, etc.) is formed is wound around a winding core and collected as a roll, and the performance of the organic EL layer Considering maintenance, non-light emitting failure, etc., it is preferable to store under reduced pressure conditions of 10 −5 to 10 Pa. The storage period is preferably 1 hour to 200 hours in consideration of removal of oxygen and trace moisture due to deterioration of the organic EL layer. In some cases, it may be stored in a heated environment.

  In the manufacturing apparatus shown in FIG. 2 to FIG. 6, an organic EL layer (a hole transport layer, a light-emitting layer, a light-emitting layer, an anode EL layer including a first electrode) is used on the first electrode. After forming the electron transport layer) to form the belt-like flexible support B, the organic compound layer is formed into a roll-like belt-like flexible support B by winding the belt-like flexible support B around the winding core. Compared to the vapor deposition method, the following effects can be obtained.

  1) By arranging the accumulator part before and after the pattern application / drying part, when applying the light-emitting layer forming coating liquid, it is possible to stop and apply it, and to form an accurate and stable light-emitting layer. It became.

  2) Furthermore, the application position correction control means makes it possible to place the wet pattern forming application device at an accurate position according to the alignment mark, eliminating the misalignment of the light emitting layer and forming an accurate and stable light emitting layer. It became.

  3) By arranging the accumulator section before and after the pattern coating / drying section, it is possible to use a combination of wet coating equipment and pattern coating equipment with different coating speeds, enabling continuous production and improving productivity. .

  4) The use efficiency of the organic compound used to form one or a plurality of light emitting layers made of an organic substance is high, and the cost can be reduced.

  The hole transport layer according to the present invention is made of a hole transport material having a function of transporting holes, and in a broad sense, a hole injection layer and an electron blocking layer are also included in the hole transport layer. The hole transport layer can be provided as a single layer or a plurality of layers. In the case of providing a plurality of hole transport layers, it is necessary to increase the wet coating / drying section in accordance with the number of layers, and it is preferable to increase the heat treatment section at the same time.

  Each film thickness of the light emitting layer (blue light emitting layer, green light emitting layer, red light emitting layer) is preferably selected in the range of 2 to 100 nm, and more preferably in the range of 2 to 20 nm. Although there is no restriction | limiting in particular about the relationship of the film thickness of each blue, green, and red light emitting layer, It is preferable that a blue light emitting layer is the thickest among the light layers of three colors.

  In the light emitting layer according to the present invention, a layer having an emission maximum wavelength of 430 to 480 nm is referred to as a blue light emitting layer, a layer having a wavelength of 510 to 550 nm is referred to as a green light emitting layer, and a layer in the range of 600 to 640 nm is referred to as a red light emitting layer. It includes at least three layers having different emission spectra in the range of these emission maximum wavelengths. If it is three or more layers, there will be no restriction | limiting in particular. When there are more than four layers, there may be a plurality of layers having the same emission spectrum. Moreover, in the range which maintains the said maximum wavelength, you may mix a several luminescent compound in each light emitting layer. For example, the blue light emitting layer may be used by mixing a blue light emitting compound having a maximum wavelength of 430 to 480 nm and a green light emitting compound having the same wavelength of 510 to 550 nm. The material used for the light emitting layer is not particularly limited, and examples thereof include the latest trends of Toray Research Center, Inc. flat panel displays, the current state of EL displays and the latest technological trends, and various materials as described on pages 228-332.

  The light emitting layer formed by applying the coating solution for forming the light emitting layer with a wet pattern forming coating machine and drying it is recombined with electrons and holes injected from the electrode or electron injection layer and hole transport layer. The light emitting portion may be in the light emitting layer or at the interface between the light emitting layer and the adjacent layer.

  A transparent resin film is mentioned as a strip | belt-shaped flexible support body used for the strip | belt-shaped flexible support body A in which the anode layer containing the 1st electrode concerning this invention was already formed. Examples of the resin film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate, cellulose acetate butyrate, cellulose acetate propionate (CAP), Cellulose esters such as cellulose acetate phthalate (TAC) and cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, polymethylpentene, polyether ketone, polyimide , Polyethersulfone (PES), polyphenylene sulfide, polysulfones, Cycloolefin resins such as polyether imide, polyether ketone imide, polyamide, fluororesin, nylon, polymethyl methacrylate, acrylic or polyarylate, Arton (trade name, manufactured by JSR) or Appel (trade name, manufactured by Mitsui Chemicals) Can be mentioned.

As the anode, an electrode material made of a metal, an alloy, an electrically conductive compound or a mixture thereof having a high work function (4 eV or more) is preferably used. Specific examples of such electrode materials include metals such as Au, and conductive transparent materials such as CuI, indium tin oxide (ITO), SnO 2 and ZnO. Alternatively, an amorphous material such as IDIXO (In 2 O 3 .ZnO) capable of forming a transparent conductive film may be used. For the anode, these electrode materials may be formed into a thin film by a method such as vapor deposition or sputtering, and a pattern having a desired shape may be formed by a photolithography method, or when the pattern accuracy is not required (about 100 μm or more) ), A pattern may be formed through a mask having a desired shape when the electrode material is deposited or sputtered. Or when using the substance which can be apply | coated like an organic electroconductive compound, wet film forming methods, such as a printing system and a coating system, can also be used. When light emission is taken out from the anode, it is desirable that the transmittance is greater than 10%, and the sheet resistance as the anode is preferably several hundred Ω / □ or less. Further, although the film thickness depends on the material, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.

  A hole injection layer (anode buffer layer) may be present between the anode and the light emitting layer or the hole transport layer. An injection layer is a layer provided between an electrode and an organic layer in order to reduce drive voltage and improve light emission luminance. “Organic EL element and its forefront of industrialization (issued by NTT Corporation on November 30, 1998) ) ", Chapter 2, Chapter 2," Electrode Materials "(pp. 123-166).

  The details of the anode buffer layer (hole injection layer) are described in JP-A-9-45479, JP-A-9-260062, JP-A-8-288069 and the like. As a specific example, copper phthalocyanine is used. Examples thereof include a phthalocyanine buffer layer represented by an oxide, an oxide buffer layer represented by vanadium oxide, an amorphous carbon buffer layer, and a polymer buffer layer using a conductive polymer such as polyaniline (emeraldine) or polythiophene. The anode buffer layer (hole injection layer) is desirably a very thin film, and the film thickness is preferably in the range of 0.1 nm to 5 μm although it depends on the material.

A gas barrier film may be formed on the surface of the resin film used as the belt-like flexible support, if necessary. Examples of the gas barrier film include an inorganic film, an organic film, or a hybrid film of both. As a characteristic of the gas barrier film, the water vapor permeability is preferably 0.01 g / m 2 · day · atm or less. Furthermore, a high barrier film having an oxygen permeability of 10 −3 g / m 2 / day or less and a water vapor permeability of 10 −5 g / m 2 / day or less is preferable.

  As a material for forming the barrier film, any material may be used as long as it has a function of suppressing intrusion of elements such as moisture and oxygen that cause deterioration of the element. For example, silicon oxide, silicon dioxide, silicon nitride, or the like can be used. Further, in order to improve the brittleness of the film, it is more preferable to have a laminated structure of these inorganic layers and layers made of organic materials. Although there is no restriction | limiting in particular about the lamination | stacking order of an inorganic layer and an organic layer, It is preferable to laminate | stack both alternately several times. The method for forming the barrier film is not particularly limited. For example, the vacuum deposition method, the sputtering method, the reactive sputtering method, the molecular beam epitaxy method, the cluster ion beam method, the ion plating method, the plasma polymerization method, the atmospheric pressure plasma weighting. A combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, and the like can be used, but an atmospheric pressure plasma polymerization method as described in JP-A-2004-68143 is particularly preferable.

  The hole transport material has any one of hole injection or transport and electron barrier properties, and may be either organic or inorganic. For example, triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives and pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, Examples include stilbene derivatives, silazane derivatives, aniline copolymers, and conductive polymer oligomers, particularly thiophene oligomers.

  As materials used for hole transport according to the present invention, it is preferable to use porphyrin compounds, aromatic tertiary amine compounds and styrylamine compounds, particularly aromatic tertiary amine compounds. Representative examples of aromatic tertiary amine compounds and styrylamine compounds include N, N, N ', N'-tetraphenyl-4,4'-diaminophenyl; N, N'-diphenyl-N, N'- Bis (3-methylphenyl)-[1,1′-biphenyl] -4,4′-diamine (TPD); 2,2-bis (4-di-p-tolylaminophenyl) propane; 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane; N, N, N ′, N′-tetra-p-tolyl-4,4′-diaminobiphenyl; 1,1-bis (4-di-p-tolyl) Aminophenyl) -4-phenylcyclohexane; bis (4-dimethylamino-2-methylphenyl) phenylmethane; bis (4-di-p-tolylaminophenyl) phenylmethane; N, N'-diphenyl-N, N ' − (4-methoxyphenyl) -4,4'-diaminobiphenyl; N, N, N ', N'-tetraphenyl-4,4'-diaminodiphenyl ether; 4,4'-bis (diphenylamino) quadriphenyl; N, N, N-tri (p-tolyl) amine; 4- (di-p-tolylamino) -4 '-[4- (di-p-tolylamino) styryl] stilbene; 4-N, N-diphenylamino- (2-diphenylvinyl) benzene; 3-methoxy-4′-N, N-diphenylaminostilbenzene; N-phenylcarbazole, and also two of those described in US Pat. No. 5,061,569. Having a condensed aromatic ring in the molecule, for example, 4,4'-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (NPD), JP-A-4-3086 4,4 ', 4 "-tris [N- (3-methylphenyl) -N-phenylamino] triphenylamine in which three triphenylamine units described in Japanese Patent No. 8 are linked in a starburst type ( MTDATA) and the like.

  Furthermore, a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used. In addition, inorganic compounds such as p-type-Si and p-type-SiC can also be used as the hole injection material and the hole transport material.

  JP-A-11-251067, J. Org. Huang et. al. A so-called p-type hole transport material described in a book (Applied Physics Letters 80 (2002), p. 139) can also be used. In the present invention, it is preferable to use these materials because a light-emitting element with higher efficiency can be obtained.

  Although there is no restriction | limiting in particular about the film thickness of a positive hole transport layer, Usually, 5 nm-about 5 micrometers, Preferably it is 5-200 nm. This hole transport layer may have a single layer structure composed of one or more of the above materials. A hole transport layer having a high p property doped with impurities can also be used. Examples thereof include JP-A-4-297076, JP-A-2000-196140, JP-A-2001-102175, J.A. Appl. Phys. 95, 5773 (2004), and the like. It is preferable to use a hole transport layer having such a high p property because an organic EL element with lower power consumption can be produced.

  Next, other constituent members used for the configuration of the organic EL layer according to the present invention will be described. Examples of the layer provided adjacent to the light emitting layer include a blocking layer. Examples of the blocking layer include a hole blocking layer and an electron blocking layer. The blocking layer is provided as necessary in addition to the basic constituent layer of the organic compound thin film. For example, it is described in JP-A Nos. 11-204258, 11-204359, and “Organic EL elements and their forefront of industrialization” (issued by NTT, Inc. on November 30, 1998). There is a hole blocking (hole blocking) layer. The hole blocking layer has a function of an electron transport layer in a broad sense, and is made of a hole blocking material that has a function of transporting electrons and has a remarkably small ability to transport holes. By blocking this, the recombination probability of electrons and holes can be improved. Moreover, the structure of the electron carrying layer mentioned later can be used as a hole-blocking layer concerning this invention as needed, and it is preferable that the hole-blocking layer is provided adjacent to the light emitting layer.

  When the light emitting layer has a plurality of light emitting layers having different emission colors, the light emitting layer whose light emission maximum wavelength is the shortest is preferably the closest to the anode among all the light emitting layers. It is preferable to provide an additional hole blocking layer between the shortest wave layer and the light emitting layer next to the anode next to the layer. Furthermore, it is preferable that 50% by mass or more of the compound contained in the hole blocking layer provided at the position has an ionization potential of 0.3 eV or more higher than the host compound of the shortest wave emitting layer.

  The ionization potential is defined by the energy required to emit electrons at the HOMO (highest occupied molecular orbital) level of the compound to the vacuum level, and can be obtained by the following method, for example. (1) Keywords using Gaussian 98 (Gaussian 98, Revision A.11.4, MJ Frisch, et al, Gaussian, Inc., Pittsburgh PA, 2002.), which is molecular orbital calculation software manufactured by Gaussian, USA. The ionization potential can be obtained as a value obtained by rounding off the second decimal place of the value (eV unit conversion value) calculated by performing structural optimization using B3LYP / 6-31G *. This calculation value is effective because the correlation between the calculation value obtained by this method and the experimental value is high. (2) The ionization potential can also be obtained by a method of directly measuring by photoelectron spectroscopy. For example, a low energy electron spectrometer “Model AC-1” manufactured by Riken Keiki Co., Ltd. or a method known as ultraviolet photoelectron spectroscopy can be suitably used.

  On the other hand, the electron blocking layer has a function of a hole transport layer in a broad sense, and is made of a material that has a function of transporting holes and has an extremely small ability to transport electrons, and transports electrons while transporting holes. By blocking, the probability of recombination of electrons and holes can be improved. Moreover, the structure of the positive hole transport layer mentioned later can be used as an electron blocking layer as needed. The film thickness of the hole blocking layer and the electron transport layer according to the present invention is preferably 3 nm to 100 nm, and more preferably 5 nm to 30 nm.

  The light emitting layer constituting the organic EL layer of the present invention contains a known host compound and a known phosphorescent compound (also referred to as a phosphorescent compound) in order to increase the luminous efficiency of the light emitting layer. Is preferred. The host compound is a compound contained in the light-emitting layer, the mass ratio in the layer is 20% or more, and the phosphorescence quantum yield of phosphorescence emission is 0.1 at room temperature (25 ° C.). Is defined as less than a compound. The phosphorescence quantum yield is preferably less than 0.01. A plurality of host compounds may be used in combination. By using a plurality of types of host compounds, it is possible to adjust the movement of charges, and the organic EL layer can be made highly efficient. In addition, by using a plurality of phosphorescent compounds, it is possible to mix different light emission, thereby obtaining an arbitrary emission color. White light emission is possible by adjusting the kind of phosphorescent compound and the amount of doping, and can also be applied to illumination and backlight.

  As these host compounds, compounds having a hole transporting ability and an electron transporting ability, preventing emission light from being increased in wavelength, and having a high Tg (glass transition temperature) are preferable. Known host compounds include, for example, JP-A Nos. 2001-257076, 2002-308855, 2001-313179, 2002-319491, 2001-357777, and 2002-334786. Gazette, 2002-8860, 2002-334787, 2002-15871, 2002-334788, 2002-43056, 2002-334789, 2002-75645 2002-338579, 2002-105445, 2002-343568, 2002-141173, 2002-352957, 2002-203683, 2002-363227 2002-231453, 2003-3165, 2002-234888, 2003-27048, 2002-255934, 2002-260861, 2002-280183, Examples thereof include compounds described in 2002-299060, 2002-302516, 2002-305083, 2002-305084, 2002-308837 and the like.

  When the light emitting layer has a plurality of light emitting layers, it is preferable that 50% by mass or more of the host compound in each of these layers is the same compound because it is easy to obtain a uniform film property over the entire light emitting layer. It is more preferable that the phosphorescence energy of the compound is 2.9 eV or more because it is advantageous in efficiently suppressing energy transfer from the dopant and obtaining high luminance. Phosphorescence emission energy means the peak energy of the 0-0 band of phosphorescence emission when the photoluminescence of a deposited film of 100 nm is measured on a substrate with a host compound.

  When the host compound is an organic EL device using the organic EL layer of the present invention, the organic EL device takes into account the deterioration of the organic EL device over time (decrease in luminance and film properties), market needs as a light source, etc. It is preferable that the light emission energy is 2.9 eV or more and Tg is 90 ° C. or more. That is, in order to satisfy both luminance and durability, it is preferable that phosphorescence emission energy is 2.9 eV or more and Tg is 90 ° C. or more. Tg is more preferably 100 ° C. or higher.

  A phosphorescent compound (phosphorescent compound) is a compound in which light emission from an excited triplet is observed, is a compound that emits phosphorescence at room temperature (25 ° C.), and has a phosphorescence quantum yield of 25. The compound is 0.01 or more at ° C. When used in combination with the host compound described above, an organic EL device with higher luminous efficiency can be obtained.

  The phosphorescent compound according to the present invention preferably has a phosphorescence quantum yield of 0.1 or more. The phosphorescent quantum yield can be measured by the method described in Spectroscopic II, page 398 (1992 version, Maruzen) of Experimental Chemistry Course 4 of the 4th edition. Although the phosphorescence quantum yield in a solution can be measured using various solvents, the phosphorescence quantum yield used in the present invention only needs to achieve the phosphorescence quantum yield in any solvent.

  There are two types of light emission of the phosphorescent compound in principle. One is the recombination of the carriers on the host compound to which carriers are transported, and an excited state of the host compound is generated, and this energy is converted into the phosphorescent compound. The energy transfer type is to obtain light emission from the phosphorescent compound by moving to the phosphor, and the other is that the phosphorescent compound becomes a carrier trap, and carrier recombination occurs on the phosphorescent compound and the phosphorescent compound emits light. Although it is a carrier trap type in which light emission can be obtained, in any case, it is a condition that the excited state energy of the phosphorescent compound is lower than the excited state energy of the host compound.

  The phosphorescent compound can be appropriately selected from known compounds used for the light emitting layer of the organic EL layer. The phosphorescent compound is preferably a complex compound containing a group 8-10 metal in the periodic table of elements, more preferably an iridium compound, an osmium compound, or a platinum compound (platinum complex compound), rare earth Of these, iridium compounds are the most preferred.

  In the present invention, the phosphorescence emission maximum wavelength of the phosphorescent compound is not particularly limited, and can be obtained in principle by selecting a central metal, a ligand, a ligand substituent, and the like. The emission wavelength can be changed.

  The light emission color of the organic EL layer of the present invention and the compound of the present invention is shown in FIG. 4 and FIG. 16 on page 108 of “New Color Science Handbook” (edited by the Japan Color Society, University of Tokyo Press, 1985). It is determined by the color when the result measured with a luminance meter CS-1000 (manufactured by Konica Minolta Sensing) is applied to the CIE chromaticity coordinates.

  The external extraction efficiency at room temperature of light emission of the organic EL device using the organic EL layer according to the present invention is preferably 1% or more, more preferably 5% or more. Here, the external extraction quantum efficiency (%) = the number of photons emitted to the outside of the organic EL element / the number of electrons sent to the organic EL element × 100.

  In addition, a hue improvement filter such as a color filter may be used in combination, or a color conversion filter that converts the emission color from the organic EL element into multiple colors using a phosphor may be used in combination. In the case of using a color conversion filter, the λmax of light emission of the organic EL element is preferably 480 nm or less.

  As an electron transport material (also serving as a hole blocking material) used for the electron transport layer, it is sufficient if it has a function of transmitting electrons injected from the cathode to the light-emitting layer. Any one can be selected and used, for example, nitro-substituted fluorene derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, carbodiimides, fluorenylidenemethane derivatives, anthraquinodimethane and anthrone derivatives, oxadiazoles Derivatives and the like. Furthermore, in the above oxadiazole derivatives, thiadiazole derivatives in which the oxygen atom of the oxadiazole ring is substituted with a sulfur atom, and quinoxaline derivatives having a quinoxaline ring known as an electron-withdrawing group can also be used as the electron transport material. Furthermore, a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used.

  Also, metal complexes of 8-quinolinol derivatives such as tris (8-quinolinol) aluminum (Alq), tris (5,7-dichloro-8-quinolinol) aluminum, tris (5,7-dibromo-8-quinolinol) aluminum. Tris (2-methyl-8-quinolinol) aluminum, tris (5-methyl-8-quinolinol) aluminum, bis (8-quinolinol) zinc (Znq), and the like, and the central metals of these metal complexes are In, Mg, Metal complexes replaced with Cu, Ca, Sn, Ga or Pb can also be used as the electron transport material. In addition, metal-free or metal phthalocyanine, or those having terminal ends substituted with an alkyl group or a sulfonic acid group can be preferably used as the electron transporting material. Distyrylpyrazine derivatives can also be used as electron transport materials, and inorganic semiconductors such as n-type-Si and n-type-SiC are also used as electron transport materials in the same manner as the hole injection layer and hole transport layer. I can do it. Although there is no restriction | limiting in particular about the film thickness of an electron carrying layer, Usually, 5 nm-about 5 micrometers, Preferably it is 5-200 nm. The electron transport layer may have a single layer structure composed of one or more of the above materials.

  An electron transport layer having a high n property doped with impurities can also be used. Examples thereof include JP-A-4-297076, JP-A-10-270172, JP-A-2000-196140, JP-A-2001-102175, J. Pat. Appl. Phys. 95, 5773 (2004), and the like. It is preferable to use such an electron transport layer having high n property because an element with lower power consumption can be manufactured.

  Hereinafter, although an example is given and the concrete effect of the present invention is shown, the mode of the present invention is not limited to this.

Example 1
<Preparation of strip-shaped flexible support having gas barrier layer and first electrode layer in this order> Polyethersulfone (Sumitomo Bakelite Co., Ltd., hereinafter abbreviated as PES) having a thickness of 200 μm is shown below. A gas barrier layer and a first electrode layer were formed by the method, and a belt-like flexible support having a gas barrier layer and a first electrode layer in the order of a winding roll on a winding core was prepared.

(Formation of a transparent gas barrier layer)
A transparent gas barrier layer having a thickness of about 90 nm was formed on the prepared PES by an atmospheric pressure plasma discharge treatment method. As a result of measuring the water vapor transmission rate by a method based on JISk-7129B, it was 10 −3 g / m 2 / day or less. As a result of measuring the oxygen transmission rate by a method based on JISk-7126B, it was 10 −3 g / m 2 / day or less.

(Formation of first electrode layer)
On the formed barrier layer, ITO (indium tin oxide) having a thickness of 120 nm was formed by a plasma ion plating apparatus. Thereafter, a pattern having a width of 110 μm and an interval of 34 μm was formed through a photolithography process.

(Preparation of coating solution for hole transport layer formation)
A solution prepared by diluting polyethylene dioxythiophene / polystyrene sulfonate (PEDOT / PSS, Baytron P AI 4083 manufactured by Bayer) with pure water at 65% and methanol at 5% was prepared as a coating solution for forming a hole transport layer.

(Preparation of light emitting layer forming coating solution)
Preparation of a coating solution for forming a blue light emitting layer A coating material for forming an organic compound layer by dissolving 5% by mass of a dopant material Fir (pic) 3 in 1,2-dichloroethane in polyvinyl carbazole (PVK) as a host material. Prepared as.

Preparation of coating solution for green light emitting layer formation Coating material solution for forming organic compound layer by dissolving 5% by mass of dopant material Ir (ppy) 3 in 1,2-dichloroethane in polyvinylcarbazole (PVK) as a host material Prepared as.

Preparation of coating solution for forming red light-emitting layer 5% by mass of dopant material Btc 2 Ir (acac) 3 is dissolved in 1,2-dichloroethane in polyvinyl carbazole (PVK) as a host material to form a 1% solution for forming an organic compound layer Prepared as a coating solution.

Preparation of Electron Transport Layer Forming Coating Solution As the electron transport layer, Alq 3 was dissolved in 1,2-dichloroethane to obtain a 0.5 mass% solution as an electron transport layer forming coating solution.

<Formation of light emitting layer>
Using the manufacturing apparatus shown in FIG. 3, holes are formed on the first electrode layer of the strip-shaped flexible support having the gas barrier layer and the first electrode layer in this order on the prepared winding core in the form of a winding roll. Change the environmental conditions (dew point temperature, cleanliness) until the formation of the transport layer, light emitting layer, and electron transport layer as shown in Table 1 to form an organic EL layer, heat treatment, charge removal, After cooling to the same temperature, a winding roll is formed on the winding core and sample No. 101-107. The cleanliness indicates a value measured according to JISB 9920, and the cleanliness was changed by changing the filter.

  The hole transport layer was formed by applying and drying the following coating liquid for forming a hole transport layer by a wet coating method using an extrusion coating machine, followed by heat treatment. The light emitting layer is aligned with the wet pattern coating apparatus in accordance with the alignment mark, and the light emitting layer forming coating liquid is aligned with the pattern of the first electrode formed as shown in FIG. 6 while being held by the holding means. Was formed by a wet pattern coating apparatus. The electron transport layer was formed by applying and drying the following electron transport layer forming coating solution by a wet coating method using an extrusion coating machine, followed by heat treatment.

Before applying the coating liquid for forming the hole transport layer, the surface of the belt-like flexible support is subjected to a cleaning surface modification treatment using a low-pressure mercury lamp with a wavelength of 184.9 nm at an irradiation intensity of 15 mW / cm 2 and a distance of 10 mm. Carried out. The charge removal treatment was performed using a static eliminator with weak X-rays.

  The coating liquid for forming the hole transport layer was applied so that the thickness after drying was 50 nm. The light emitting layer forming coating solution was applied so that the thickness after drying was 100 nm.

  The coating solution for forming an electron transport layer was applied so that the thickness after drying was 30 nm. The conveyance speed was 2 m / min.

(Application conditions)
The coating temperature of the hole transport layer forming coating solution, the light emitting layer forming coating solution, and the electron transport layer forming coating solution is 25 ° C., and the ambient temperature is 25 ° C. except for the drying device and the heat treatment device. I went there.

(Drying and heat treatment conditions)
After applying the hole transport layer forming coating solution, the drying unit and the heat treatment apparatus having the same structure as the light emitting layer drying unit and the heat treatment unit shown in FIG. 3 are used. After removing the solvent at a height of 100 mm toward the film surface, a discharge wind speed of 1 m / s, a wide wind speed distribution of 5%, and a temperature of 100 ° C., the back surface heat transfer system heat treatment is subsequently performed at a temperature of 200 ° C. in a heat treatment apparatus. A hole transport layer was formed.

  After the light emitting layer forming coating solution is applied, the light emitting layer drying section and the heat treatment section shown in FIG. 3 are used. In the light emitting layer drying section, the height is 100 mm from the slit nozzle type discharge port toward the film forming surface, and the temperature is 60. After removing the solvent at 0 ° C., the light emitting layer was formed by performing heat treatment at a temperature of 220 ° C. in the heat treatment section.

  After the application liquid for forming the electron transport layer is applied, the drying unit and the heat treatment apparatus having the same structure as the light emitting layer drying unit and the heat treatment unit shown in FIG. 3 are used. After removing the solvent at a height of 100 mm toward the surface and a temperature of 60 ° C., an electron transport layer was formed by subsequently performing a heat treatment at a temperature of 200 ° C. in the heat treatment section. The discharge wind speed was measured with a hot air anemometer model 6113 manufactured by Kanomax Co., Ltd., and the wind speed distribution in the width direction was calculated by the following formula.

Wind speed distribution = (maximum wind speed−minimum wind speed) / average wind speed × 100
Evaluation The produced sample No. 101 to 107, a 0.5 nm thick LiF layer (electron injection layer) was vapor-deposited under a vacuum of 5 × 10 −4 Pa, and a width of 350 μm so as to be orthogonal to the first electrode through a mask. After forming an aluminum layer (second electrode) having a thickness of 100 μm with a pattern of 80 μm by vapor deposition, a sealing layer is subsequently formed by vapor deposition, cooled to room temperature, and wound into a winding roll on the winding core. did. Sample No. manufactured in this state. Table 1 shows the results of visually confirming the non-light emitting failure in 101 to 107 and evaluating according to the following evaluation rank.

Method for Confirming Non-Emitting Failure After the prepared sample was stored at a constant temperature of 80 ° C. for one week, when it was driven with a constant current of 2.5 mA / cm 2 , the presence or absence of a portion that did not emit light was visually confirmed. Evaluation rank of non-luminescent failure ○: No non-luminescent failure is confirmed △: Slight non-luminescent failure that does not cause a practical problem is recognized ×: Non-luminescent failure that causes a practical problem is occasionally seen

  Sample No. In the case of No. 101, depending on the amount of water contained in the sample, the sample No. In the case of 104, it is presumed that a non-light emission failure has occurred due to the adhered foreign matter. The effectiveness of the present invention was confirmed.

Example 2
Sample No. 1 prepared in Example 1 was used. The sample No. 104 was stored under the same conditions except that the conditions for storing 104 were changed as shown in Table 2. 201-206. The storage period was 5 days.

Evaluation The produced sample No. The lifetime of the light emitting layer attached to 201 to 206 is the time required for the luminance to be half of the initial luminance when driven at a constant current of 2.5 mA / cm 2 (half time) as an indicator of the lifetime. The evaluation results are shown in Table 2. The lifetime (relative value) is a relative value when the lifetime is 100 when the storage condition is 1 × 10 −5 Pa.

  The effectiveness of the present invention was confirmed.

Claims (14)

  1. An organic EL element having a first electrode, an organic EL layer having an organic compound layer, and a second electrode in this order on a belt-like flexible support, a supply unit, a pattern coating unit / drying unit, In the method of manufacturing an organic EL element manufactured using a manufacturing apparatus having a recovery unit,
    To the supply unit, the strip-shaped flexible support A on which the first electrode is formed is supplied in a roll state,
    Next, a coating liquid for forming an organic EL layer is applied and dried in the pattern application unit / drying unit, and the organic EL layer is formed on the first electrode on the flexible support to form a strip-like flexible film. As support B,
    In the collection unit, the belt-like flexible support B is wound around a winding core,
    A first accumulator unit is provided before the pattern application unit / drying unit, and a second accumulator unit is provided after the pattern application unit / drying unit,
    A wet application / drying unit in front of the first accumulator unit or after the second accumulator unit;
    In the pattern application unit / drying unit, the organic EL layer forming coating solution is applied in a state where the conveyance of the belt-like flexible support A is stopped, and the organic EL layer is intermittently moved after application. Device manufacturing method.
  2. An organic EL element having a first electrode, an organic EL layer having an organic compound layer, and a second electrode in this order on a belt-like flexible support, a supply unit, a pattern coating unit / drying unit, In the method of manufacturing an organic EL element manufactured using a manufacturing apparatus having a recovery unit,
    To the supply unit, the strip-shaped flexible support A on which the first electrode is formed is supplied in a roll state,
    Next, a coating liquid for forming an organic EL layer is applied and dried in the pattern application unit / drying unit, and the organic EL layer is formed on the first electrode on the flexible support to form a strip-like flexible film. As support B,
    In the collection unit, the belt-like flexible support B is wound around a winding core,
    A first accumulator unit is provided before the pattern application unit / drying unit, and a second accumulator unit is provided after the pattern application unit / drying unit,
    Having a wet application / drying unit before the first accumulator unit and after the second accumulator unit;
    In the pattern application unit / drying unit, the organic EL layer forming coating solution is applied in a state where the conveyance of the belt-like flexible support A is stopped, and the organic EL layer is intermittently moved after application. Device manufacturing method.
  3. In the pattern application unit / drying unit, the organic EL layer forming coating solution is applied in a state in which the belt-like flexible support A is adsorbed and fixed to a holding table, and intermittent transport is performed after the application. The manufacturing method of the organic EL element of Claim 1 or Claim 2 .
  4. The pattern coating unit / drying unit includes a pattern coating unit that forms a coating film for forming a light emitting layer under an atmospheric pressure condition by using a wet pattern formation coating apparatus with an organic EL layer forming coating solution; And the organic EL layer drying unit for forming the organic EL layer as one unit,
    The said pattern application part and drying part have at least 1 unit of the said pattern application part and drying part, The manufacture of the organic EL element of any one of Claim 1 thru | or 3 characterized by the above-mentioned. Method.
  5. The method for manufacturing an organic EL element according to any one of claims 1 to 4, wherein the belt-like flexible support A is provided with an alignment mark.
  6. The wet pattern formation coating apparatus operates in response to the intermittent conveyance of the strip-shaped flexible support A, and operates when the strip-shaped flexible support A is stopped to perform pattern formation coating. A method for producing an organic EL element according to claim 4 or 5 .
  7. The said pattern application part has the holding | maintenance means of a strip | belt-shaped flexible support body, the detection means of an alignment mark, and the application position correction | amendment control means of a wet pattern formation coating device. The manufacturing method of the organic EL element of any one of 1 thru | or 6th term | claim.
  8. The wet coating / drying unit applies a coating solution for forming an organic compound layer under a atmospheric pressure condition with a wet coating apparatus and a wet coating unit to remove the solvent in the organic compound layer. the method for manufacturing an organic EL device according to any one of claims paragraphs 1 through 7, wherein characterized in that it comprises an organic compound layer drying section for.
  9. The organic EL device manufacturing method according to any one of claims 1 to 8 , further comprising a heat treatment unit after the pattern coating unit / drying unit and the wet coating / drying unit. Method.
  10. The method for manufacturing an organic EL element according to any one of claims 1 to 9 , wherein the manufacturing apparatus includes a charge removal processing unit.
  11. The belt-like flexible support A is cleaned before applying the organic compound layer forming coating solution in the wet coating / drying unit or before applying the organic EL layer forming coating solution in the pattern coating unit / drying unit. The method for producing an organic EL element according to any one of claims 1 to 10 , wherein a cleaning surface modification treatment is performed by a modification treatment means.
  12. 12. The method of manufacturing an organic EL element according to claim 11, wherein the cleaning surface modification processing means is oxygen plasma or UV irradiation.
  13. The organic EL layer and the organic compound layer have a dew point temperature of −20 ° C. or lower and a measured cleanliness of class 5 or lower in accordance with JISB 9920, and an organic EL layer drying section, an organic compound layer drying section, and a heating The method for producing an organic EL element according to any one of claims 1 to 12 , wherein the organic EL element is formed in an atmospheric pressure of 10 to 45 ° C excluding the treatment portion.
  14. The band-shaped flexible support B in the recovery section, wound after the winding roll form a core, a range paragraphs 1 through 13 claims, characterized in that stored under a reduced pressure of 10 -5 10 Pa The manufacturing method of the organic EL element of any one of claim | items.
JP2007509175A 2005-03-23 2006-03-03 Manufacturing method of organic EL element Active JP5125503B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005083324 2005-03-23
JP2005083324 2005-03-23
JP2007509175A JP5125503B2 (en) 2005-03-23 2006-03-03 Manufacturing method of organic EL element
PCT/JP2006/304063 WO2006100889A1 (en) 2005-03-23 2006-03-03 Method for forming organic el layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007509175A JP5125503B2 (en) 2005-03-23 2006-03-03 Manufacturing method of organic EL element

Publications (2)

Publication Number Publication Date
JPWO2006100889A1 JPWO2006100889A1 (en) 2008-08-28
JP5125503B2 true JP5125503B2 (en) 2013-01-23

Family

ID=37023564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007509175A Active JP5125503B2 (en) 2005-03-23 2006-03-03 Manufacturing method of organic EL element

Country Status (2)

Country Link
JP (1) JP5125503B2 (en)
WO (1) WO2006100889A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3226073A3 (en) 2003-04-09 2017-10-11 Nikon Corporation Exposure method and apparatus, and method for fabricating device
TWI474132B (en) 2003-10-28 2015-02-21 尼康股份有限公司 The illumination optical apparatus, projection exposure apparatus, exposure method and device manufacturing method
TWI385414B (en) 2003-11-20 2013-02-11 尼康股份有限公司 Optical illuminating apparatus, illuminating method, exposure apparatus, exposure method and device fabricating method
TWI412067B (en) 2004-02-06 2013-10-11 尼康股份有限公司 Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
EP2660853B1 (en) 2005-05-12 2017-07-05 Nikon Corporation Projection optical system, exposure apparatus and exposure method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (en) 2007-10-12 2013-08-21 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
WO2009050976A1 (en) 2007-10-16 2009-04-23 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
EP2179329A1 (en) 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP5184938B2 (en) * 2008-03-28 2013-04-17 住友化学株式会社 Organic electroluminescence device and method for manufacturing the same
CN105606344B (en) 2008-05-28 2019-07-30 株式会社尼康 Lamp optical system, means of illumination, exposure device and exposure method
KR20110091648A (en) 2008-10-10 2011-08-12 가부시키가이샤 니콘 Flexible substrate, method for manufacturing display element and apparatus for manufacturing display element
JP5418505B2 (en) * 2009-02-03 2014-02-19 コニカミノルタ株式会社 Organic electronic device and method for manufacturing the same
WO2010092931A1 (en) * 2009-02-16 2010-08-19 凸版印刷株式会社 Organic electroluminescence display and manufacturing method therefor
JP2011009205A (en) 2009-05-29 2011-01-13 Semiconductor Energy Lab Co Ltd Light emitting element, light emitting device, and method of manufacturing the same
CN102449800A (en) * 2009-05-29 2012-05-09 株式会社半导体能源研究所 Light-emitting element, light-emitting device, lighting device, and electronic appliance
JP2011049084A (en) * 2009-08-28 2011-03-10 Konica Minolta Holdings Inc Method of manufacturing organic electroluminescence panel
JP2011139044A (en) 2009-12-01 2011-07-14 Semiconductor Energy Lab Co Ltd Luminous element, luminous device, electronic equipment, and lighting device
WO2011070841A1 (en) 2009-12-11 2011-06-16 コニカミノルタホールディングス株式会社 Method of manufacturing organic electroluminescence element
WO2012026363A1 (en) * 2010-08-26 2012-03-01 コニカミノルタホールディングス株式会社 Method for manufacturing organic electroluminescent element

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05303995A (en) * 1992-04-27 1993-11-16 Nec Kansai Ltd Electroluminescent lamp and its manufacture
JP2001006875A (en) * 1999-06-24 2001-01-12 Dainippon Printing Co Ltd Manufacture of el element
JP2003509817A (en) * 1999-09-03 2003-03-11 スリーエム イノベイティブ プロパティズ カンパニー Large area organic electronic devices and a method of manufacturing a conductive polymer buffer layer
JP2003173870A (en) * 2001-12-04 2003-06-20 Sony Corp Manufacturing device and manufacturing method of organic electroluminescent element
JP2004185951A (en) * 2002-12-03 2004-07-02 Dainippon Printing Co Ltd Production line for flexible polymer organic el display

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1077467A (en) * 1996-09-04 1998-03-24 Sumitomo Chem Co Ltd Production of organic electroluminescence element
EP0986112A3 (en) * 1998-09-11 2004-02-04 Agilent Technologies, Inc. (a Delaware corporation) An efficient method for fabricating organic light emitting diodes
JP2003077669A (en) * 2001-09-03 2003-03-14 Toppan Printing Co Ltd High polymer electroluminescent element and manufacturing method therefor
JP2005327667A (en) * 2004-05-17 2005-11-24 Seiko Epson Corp Method for manufacturing organic el device, system for manufacturing organic el device, and electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05303995A (en) * 1992-04-27 1993-11-16 Nec Kansai Ltd Electroluminescent lamp and its manufacture
JP2001006875A (en) * 1999-06-24 2001-01-12 Dainippon Printing Co Ltd Manufacture of el element
JP2003509817A (en) * 1999-09-03 2003-03-11 スリーエム イノベイティブ プロパティズ カンパニー Large area organic electronic devices and a method of manufacturing a conductive polymer buffer layer
JP2003173870A (en) * 2001-12-04 2003-06-20 Sony Corp Manufacturing device and manufacturing method of organic electroluminescent element
JP2004185951A (en) * 2002-12-03 2004-07-02 Dainippon Printing Co Ltd Production line for flexible polymer organic el display

Also Published As

Publication number Publication date
JPWO2006100889A1 (en) 2008-08-28
WO2006100889A1 (en) 2006-09-28

Similar Documents

Publication Publication Date Title
JP4697142B2 (en) Organic electroluminescence element, display device and lighting device
US9257680B2 (en) Method to make organic electroluminescent element material
WO2010095564A1 (en) Organic electroluminescent element, and illuminating device and display device each comprising the element
JP5549053B2 (en) Organic electroluminescent element material, organic electroluminescent element, method for producing organic electroluminescent element, display device and lighting device
JP5256485B2 (en) Organic electroluminescence element, display device and lighting device
JP5810529B2 (en) Organic electroluminescence element, display device and lighting device
JP5610038B2 (en) Organic electroluminescence element, display device and lighting device
US20120193619A1 (en) Organic electroluminescent element and lighting device using same
US10347850B2 (en) Organic electroluminescent element, lighting device and display device
JP5472121B2 (en) Organic electroluminescent element, display device and lighting device, and method for producing organic electroluminescent element
EP2463930B1 (en) Organic electroluminescent device, display and illuminating device
JPWO2008146838A1 (en) The organic electroluminescent element, a display device and a lighting device
JPWO2008072596A1 (en) The organic electroluminescent element, a display device and a lighting device
JP2010114180A (en) Organic electroluminescent element, white organic electroluminescent element, display device and illuminator
JP5493309B2 (en) Organic electroluminescent element material, organic electroluminescent element, display device and lighting device
JP2007189001A (en) Organic electroluminescence element, material thereof, display device, and luminaire
JP2008084913A (en) Organic electroluminescence element, display device, and lighting device
JPWO2009060742A1 (en) The organic electroluminescent element, a display device and a lighting device
US8574661B2 (en) Process for producing organic electroluminescent element and organic electroluminescent display device
JPWO2009104488A1 (en) White light emitting organic electroluminescent device
WO2009084413A1 (en) Organic electroluminescent device and method for manufacturing organic electroluminescent device
JP4899284B2 (en) Organic electroluminescence element, lighting device and display device
JP2006032883A (en) Light emitting element
JP2009135183A (en) Organic electroluminescence element, display, and lighting device
JP5045100B2 (en) Organic electroluminescence element material and organic electroluminescence element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090227

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20110224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111025

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111025

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111025

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111226

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120703

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120823

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121002

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121015

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151109

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350