JP2017162725A - Method for manufacturing organic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic device capable of improving productivity.SOLUTION: A method for manufacturing an organic device includes: an organic device part forming step including a first electrode layer forming step of forming a plurality of first electrode layers 5 on a support substrate 3 extending in one direction at predetermined intervals in one direction, an organic function layer forming step of forming on organic function layer 7 on at least a part of the first electrode layer 5 and a second electrode layer forming step of forming a second electrode layer on at least a part of the organic function layer 7, and forming a plurality of organic device parts 13 at predetermined intervals in one direction; and a sealing base material sticking step of sticking a flexible sealing member 11 extending in one direction over the plurality of organic device parts 13 so that at least a part of each of the first electrode layer 5 and the second electrode layer 9 is exposed.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing an organic device.

  As a conventional method for manufacturing an organic device, for example, a method described in Patent Document 1 is known. In the manufacturing method of the organic device described in Patent Document 1, a sealing member is formed on the organic device portion configured by the first electrode layer, the organic functional layer, and the second electrode layer. In the step of forming the sealing member, the sheet-like sealing member is positioned and attached to the support substrate.

JP 2010-182530 A

  In the conventional method for producing an organic device, it is necessary to position the sealing member with respect to the support substrate when the sheet-like sealing member is stuck on the organic device. In particular, in the conventional method for manufacturing an organic device, the position of the sealing member in the longitudinal direction of the support substrate must be set one by one. Therefore, in the conventional manufacturing method of an organic device, since it takes time to stick the sealing member, there is room for improvement in productivity.

  An object of this invention is to provide the manufacturing method of the organic device which can aim at the improvement of productivity.

  The organic device manufacturing method according to one aspect of the present invention includes a first electrode layer forming step of forming a plurality of first electrode layers on a support substrate extending in one direction at a predetermined interval in one direction; An organic functional layer forming step of forming an organic functional layer on at least a portion of the first electrode layer, and a second electrode layer forming step of forming a second electrode layer on at least a portion of the organic functional layer. An organic device part forming step of forming a plurality of organic device parts at a predetermined interval in one direction, and extending in one direction so that at least a part of each of the first electrode layer and the second electrode layer is exposed A sealing member sticking step of sticking a flexible sealing member that extends along one direction across a plurality of organic device portions.

  In this method of manufacturing an organic device, a flexible sealing member extending in one direction is pasted along one direction across a plurality of organic device portions. Therefore, in the manufacturing method of an organic device, it is not necessary to position the sealing member in one direction of the support substrate, and the sealing member can be continuously attached to the organic device portion. Therefore, in the manufacturing method of an organic device, time is not required for formation of a sealing member. As a result, the productivity of the organic device manufacturing method can be improved.

  In one embodiment, the support substrate is flexible, and the support substrate and the sealing substrate are sealed in at least a part of the region where the support substrate and the sealing member are bonded after the sealing member applying step. A dividing step of dividing the stop member at the same time may be included. Thereby, the organic device with which the sealing member was affixed can be separated into pieces efficiently. Therefore, in the organic device manufacturing method, productivity can be further improved.

  In one embodiment, in the sealing member sticking step, at least one of the end in the width direction of the support substrate, the first alignment mark provided on the support substrate, and the end in the width direction of the sealing member And position information is acquired by detecting at least one of the second alignment marks provided on the sealing member, and at least one of the end in the width direction of the support substrate and the first alignment mark. And at least one of the support substrate and the sealing member based on the detection result and at least one detection result of the end in the width direction of the sealing member and the second alignment mark. The sealing member may be aligned with the support substrate by moving in the direction. Thereby, a sealing member can be quickly and accurately affixed on the support substrate in which the organic device part was formed. Therefore, in the organic device manufacturing method, productivity can be further improved.

  In one embodiment, in the organic device portion forming step, a plurality of rows of organic device portions arranged at a predetermined interval in one direction are formed at a predetermined interval in a direction orthogonal to the one direction. In the sealing member attaching step, a plurality of sealing members may be attached at the same time for each row of the plurality of organic device portions. Thereby, the manufacturing number of the organic device part per unit time can be increased. Moreover, in the manufacturing method of an organic device, since many strips of sealing members are stuck, productivity can be improved further.

  According to the present invention, productivity can be improved.

It is sectional drawing of the organic EL element manufactured by the manufacturing method of the organic device which concerns on one Embodiment. It is a figure which shows typically the manufacturing method of the organic device by a roll-to-roll system. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is a figure which shows the manufacturing method of an organic device. It is sectional drawing of the organic EL element manufactured by the manufacturing method of the organic device which concerns on other embodiment. It is sectional drawing of the organic EL element manufactured by the manufacturing method of the organic device which concerns on other embodiment. It is a figure which shows the manufacturing method of the organic device which concerns on other embodiment. It is a figure which shows the manufacturing method of the organic device which concerns on other embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  As shown in FIG. 1, the organic EL element 1 manufactured by the organic device manufacturing method of the present embodiment includes a support substrate 3, an anode layer (first electrode layer) 5, an organic functional layer 7, and a cathode. A layer (second electrode layer) 9 and a sealing member 11 are provided. The anode layer 5, the organic functional layer 7, and the cathode layer 9 constitute an organic EL part (organic device part) 13.

[Support substrate]
The support substrate 3 is made of a resin that is transparent to visible light (light having a wavelength of 400 nm to 800 nm). The support substrate 3 is a film-like substrate (flexible substrate, flexible substrate). The thickness of the support substrate 3 is, for example, not less than 30 μm and not more than 500 μm. When the support substrate 3 is a resin, it is preferably 45 μm or more from the viewpoint of substrate twist, wrinkle, and elongation when the roll-to-roll system is continuous, and 125 μm or less from the viewpoint of flexibility.

  The support substrate 3 is, for example, a plastic film. The material of the support substrate 3 is, for example, polyethersulfone (PES); polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN); polyolefin resin such as polyethylene (PE), polypropylene (PP), or cyclic polyolefin; Polyamide resin; Polycarbonate resin; Polystyrene resin; Polyvinyl alcohol resin; Saponified ethylene-vinyl acetate copolymer; Polyacrylonitrile resin; Acetal resin; Polyimide resin;

  Among the above resins, the material of the support substrate 3 is preferably a polyester resin or a polyolefin resin because of its high heat resistance, low coefficient of linear expansion, and low production cost, and particularly preferably polyethylene retephthalate or polyethylene naphthalate. . Moreover, these resin may be used individually by 1 type, and may be used in combination of 2 or more type.

  On one main surface 3a of the support substrate 3, a gas barrier layer or a moisture barrier layer (barrier layer) may be disposed. The other main surface 3b of the support substrate 3 is a light emitting surface. The support substrate 3 may be a thin film glass. When the support substrate 3 is thin film glass, the thickness is preferably 30 μm or more from the viewpoint of strength and 100 μm or less from the viewpoint of flexibility.

[Anode layer]
The anode layer 5 is disposed on one main surface 3 a of the support substrate 3. For the anode layer 5, an electrode layer showing optical transparency is used. As the electrode exhibiting light transmittance, a thin film of metal oxide, metal sulfide, metal or the like having high electrical conductivity can be used, and a thin film having high light transmittance is preferably used. For example, a thin film made of indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, copper, or the like is used. Among these, a thin film made of ITO, IZO, or tin oxide is preferably used.

  As the anode layer 5, an organic transparent conductive film such as polyaniline and derivatives thereof, polythiophene and derivatives thereof may be used. Further, as the anode layer 5, an electrode obtained by patterning a metal or a metal alloy or the like into a mesh shape, or an electrode in which nanowires containing silver are formed in a network shape may be used.

  The thickness of the anode layer 5 can be determined in consideration of light transmittance, electrical conductivity, and the like. The thickness of the anode layer 5 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 200 nm.

  Examples of the method for forming the anode layer 5 include a vacuum deposition method, a sputtering method, an ion plating method, a plating method, and a coating method.

[Organic functional layer]
The organic functional layer 7 is disposed on one main surface 3 a of the anode layer 5 and the support substrate 3. The organic functional layer 7 includes a light emitting layer. The organic functional layer 7 usually contains an organic substance that mainly emits fluorescence and / or phosphorescence, or a light emitting layer dopant material that assists the organic substance. The dopant material for the light emitting layer is added, for example, in order to improve the light emission efficiency or change the light emission wavelength. The organic substance may be a low molecular compound or a high molecular compound. Examples of the light emitting material constituting the organic functional layer 7 include the following dye materials, metal complex materials, polymer materials, and light emitting layer dopant materials.

(Dye material)
Examples of the dye material include cyclopentamine and derivatives thereof, tetraphenylbutadiene and derivatives thereof, triphenylamine and derivatives thereof, oxadiazole and derivatives thereof, pyrazoloquinoline and derivatives thereof, distyrylbenzene and derivatives thereof, and distyryl. Arylene and derivatives thereof, pyrrole and derivatives thereof, thiophene compounds, pyridine compounds, perinone and derivatives thereof, perylene and derivatives thereof, oligothiophene and derivatives thereof, oxadiazole dimer, pyrazoline dimer, quinacridone and derivatives thereof, coumarin and derivatives thereof Etc.

(Metal complex materials)
Examples of metal complex materials include rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Pt, Ir, and the like as a central metal, and an oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and quinoline structure. And the like. Examples of metal complexes include metal complexes having light emission from triplet excited states such as iridium complexes and platinum complexes, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc complexes, benzothiazole zinc complexes, azomethyl zinc complexes, A porphyrin zinc complex, a phenanthroline europium complex, etc. can be mentioned.

(Polymer material)
Examples of the polymer material include polyparaphenylene vinylene and derivatives thereof, polythiophene and derivatives thereof, polyparaphenylene and derivatives thereof, polysilane and derivatives thereof, polyacetylene and derivatives thereof, polyfluorene and derivatives thereof, polyvinylcarbazole and derivatives thereof, Examples thereof include materials obtained by polymerizing dye materials and metal complex materials.

(Dopant material for light emitting layer)
Examples of the dopant material for the light emitting layer include perylene and derivatives thereof, coumarin and derivatives thereof, rubrene and derivatives thereof, quinacridone and derivatives thereof, squalium and derivatives thereof, porphyrin and derivatives thereof, styryl dyes, tetracene and derivatives thereof, pyrazolone and derivatives thereof. Derivatives, decacyclene and its derivatives, phenoxazone and its derivatives, and the like.

  The thickness of the organic functional layer 7 is usually about 2 nm to 200 nm. The organic functional layer 7 is formed by, for example, a coating method using a coating liquid (for example, ink) containing the light emitting material as described above. The solvent of the coating solution containing the light emitting material is not limited as long as it dissolves the light emitting material. The light emitting material as described above may be formed by vacuum deposition.

[Cathode layer]
The cathode layer 9 is disposed on one main surface 3 a of the organic functional layer 7 and the support substrate 3. The cathode layer 9 is electrically connected to the extraction electrode 9a. The extraction electrode 9 a is disposed on one main surface 3 a of the support substrate 3. The extraction electrode 9a is arranged at a predetermined interval from the anode layer 5. The thickness of the extraction electrode 9 a is equal to the thickness of the anode layer 5. The material of the extraction electrode 9 a is the same as that of the anode layer 5. In addition, a lead wire or a connector is electrically connected to the extraction electrode 9a, and current is supplied from an external power source.

  As a material of the cathode layer 9, for example, alkali metal, alkaline earth metal, transition metal, periodic table group 13 metal, or the like can be used. Specific examples of the material for the cathode layer 9 include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, yttrium, indium, cerium, samarium, Metals such as europium, terbium, ytterbium, alloys of two or more of the metals, one or more of the metals, gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten, tin An alloy with one or more of them, graphite, a graphite intercalation compound, or the like is used. Examples of alloys include magnesium-silver alloys, magnesium-indium alloys, magnesium-aluminum alloys, indium-silver alloys, lithium-aluminum alloys, lithium-magnesium alloys, lithium-indium alloys, calcium-aluminum alloys, and the like. it can.

  Further, as the cathode layer 9, for example, a transparent conductive electrode made of a conductive metal oxide, a conductive organic substance, or the like can be used. Specific examples of conductive metal oxides include indium oxide, zinc oxide, tin oxide, ITO, and IZO. Examples of conductive organic substances include polyaniline and derivatives thereof, polythiophene and derivatives thereof, and the like. Can do. In addition, the cathode layer 9 may be comprised by the laminated body which laminated | stacked two or more layers. An electron injection layer may be used as the cathode layer 9 in some cases.

  The thickness of the cathode layer 9 is set in consideration of electric conductivity and durability. The thickness of the cathode layer 9 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

  Examples of the method for forming the cathode layer 9 include a vacuum deposition method, a sputtering method, and a laminating method and a coating method in which a metal thin film is thermocompression bonded.

[Sealing member]
The sealing member 11 is disposed at the top of the organic EL element 1. The sealing member 11 has a sealing substrate 15 and an adhesive portion 17. The sealing substrate 15 may be a metal foil, a barrier film in which a barrier functional layer is formed on the front or back surface of a transparent plastic film, or both surfaces thereof, a thin film glass having flexibility, or a metal having barrier properties laminated on a plastic film. It has a gas barrier function, particularly a moisture barrier function. As the metal foil, copper, aluminum, and stainless steel are preferable from the viewpoint of barrier properties. The thickness of the metal foil is preferably as thick as possible from the viewpoint of suppressing pinholes, but is preferably 10 μm to 50 μm in view of flexibility.

  The adhesive portion 17 is used to adhere the sealing substrate 15 to the anode layer 5, the organic functional layer 7, and the cathode layer 9 (organic EL portion 13). The adhesive portion 17 is disposed so as to cover the organic EL portion 13.

  Specifically, the adhesive portion 17 is composed of a photocurable or thermosetting acrylate resin, a photocurable or thermosetting epoxy resin, or a photocurable or thermosetting polyimide resin. Is done. Other commonly used resin films that can be fused with an impulse sealer, such as ethylene vinyl acetate copolymer (EVA), polypropylene (PP) film, polyethylene (PE) film, polybutadiene (PB) film, etc. You can also In addition, thermoplastic resins such as vinyl acetate, polyvinyl alcohol, acrylic, polyethylene, epoxy, cellulose, cyclohexane ring-containing saturated hydrocarbon resin, styrene-isobutylene modified resin, and the like can also be used. A pressure-sensitive adhesive (PSA) that can be easily attached due to adhesiveness can also be used.

  As an adhesive used for the adhesive portion 17, the adhesion between the organic EL portion 13 and the adhesive portion 17 is high, and the organic EL portion 13 is caused by significant heat shrinkage of the adhesive and stress on the organic EL portion 13. Adhesives that are highly effective in peeling off, generation of components that adversely affect the organic EL portion 13 from the adhesive portion 17, and high barrier properties and suppressing generation and growth of dark spots are preferable. Further, hygroscopic fine particles (smaller than the thickness of the adhesive) may be contained in the adhesive used for the adhesive portion 17. Examples of the hygroscopic fine particles include metal oxides that cause a chemical reaction with moisture at room temperature and zeolites that physically adsorb moisture.

  The thickness of the adhesive portion 17 is preferably 1 μm to 100 μm, more preferably 5 μm to 60 μm, and still more preferably 10 μm to 30 μm. When the adhesive portion 17 has such a thickness, the organic EL portion 13 surface unevenness or mixed dust can be sufficiently embedded, which causes mechanical stress on the organic EL material and causes dark spots. Can be suppressed. Further, it is difficult to be affected by the intrusion of moisture from the end face of the adhesive portion 17. The moisture content of the adhesive portion 17 is preferably 300 ppm or less (weight basis).

  Examples of the method for forming the adhesive portion 17 include a hot melt lamination method. The hot melt lamination method is a method in which a hot melt adhesive is melted and an adhesive layer is coated on a support, and the thickness of the adhesive layer can be generally set in a wide range of 1 μm to 50 μm. EVA, ethylene ethyl acrylate copolymer (EEA), polyethylene, butyl rubber, and the like are used as the base resin of the adhesive generally used in the hot melt lamination method. Further, rosin, xylene resin, terpene resin, styrene resin or the like is added as a tackifier, and wax or the like is added as a plasticizer.

  Moreover, as a method of forming the adhesion part 17, the extrusion laminating method is mentioned, for example. The extrusion laminating method is a method in which a resin melted at a high temperature is coated on a support with a die, and the thickness of the adhesive layer can be set in a wide range of 10 μm to 50 μm. Examples of the resin used for the extrusion laminating method include low density polyethylene (LDPE), EVA, PP and the like. In addition, as a method for forming the adhesive portion 17, a varnish obtained by dissolving the material constituting the adhesive portion 17 in an organic solvent or the like is prepared, and the substrate (sheet of metal, plastic film, etc.) is prepared. And a method of applying varnish and drying (hot air spraying method, IR method, etc.).

  In addition, when forming the adhesive bond part 17 in the sealing base material 15, the adhesive bond part 17 may be liquid form and a sheet form may be sufficient as it. When the support substrate 3 and the sealing member 11 are bonded by roll bonding, the adhesive bonding part 17 has a preferable sheet shape. In the case where the adhesive portion 17 is in a liquid state, the adhesive substrate 17 is cured by light irradiation or heating after the support substrate 3 and the sealing base material 15 are bonded together. The sheet-like adhesive portion 17 is sticky at room temperature, and a pressure-sensitive adhesive that adheres to the adherend with light pressure may be used, or a thermosetting or photocurable sheet. May be used. The pressure sensitive adhesive may have a thermoplasticity that softens when heated.

[Method of manufacturing organic EL element]
Then, the manufacturing method of the organic EL element 1 which has the said structure is demonstrated.

  In the form in which the support substrate 3 is flexible and extends in the longitudinal direction (one direction), a roll-to-roll method can be adopted as conceptually shown in FIG. When the organic EL element 1 is manufactured by the roll-to-roll method, the long flexible support substrate 3 stretched between the unwinding roll 30A and the winding roll 30B is continuously transported by the transport roller 31. However, each layer is formed in order from the support substrate 3 side.

  When manufacturing the organic EL element 1, first, the support substrate 3 is heated and dried (substrate drying process S01). Next, as shown in FIG. 3, the anode layer 5 and the extraction electrode 9a are formed on the dried support substrate 3 (one main surface 3a) (anode layer forming step (first electrode layer forming step)). S02). The anode layer 5 (extraction electrode 9a) can be formed by the formation method exemplified in the description of the anode layer 5. The anode layer 5 and the extraction electrode 9a are formed at a predetermined interval in the width direction (X direction) of the support substrate 3. On the support substrate 3, a plurality of sets (patterns) of the anode layer 5 and the extraction electrode 9 a are formed at predetermined intervals in the longitudinal direction (Y direction) of the support substrate 3 and the width of the support substrate 3. A plurality (two in this embodiment) are formed at predetermined intervals in the direction.

  Next, as shown in FIG. 4, the organic functional layer 7 is formed on the anode layer 5 (organic functional layer forming step S03). The organic functional layer 7 can be formed by the formation method exemplified in the description of the organic functional layer 7. Subsequently, as shown in FIG. 5, a cathode layer 9 is formed on the organic functional layer 7 (cathode layer forming step (second electrode layer forming step) S04). The cathode layer 9 can be formed by the formation method exemplified in the description of the cathode layer 9. As a result, a plurality of rows of organic EL portions 13 arranged at predetermined intervals in the longitudinal direction of the support substrate 3 are formed at predetermined intervals in the width direction of the support substrate 3. The organic EL part 13 is formed on the support substrate 3 by the above anode layer formation process S02, organic functional layer formation process S03, and cathode layer formation process S04 (organic device part formation process).

  Subsequently, as shown in FIG. 6, the sealing member 11 is pasted (sealing member pasting step S05). The sealing member 11 has a predetermined width and extends in the longitudinal direction (one direction) of the support substrate 3. Specifically, as shown in FIG. 6, the sealing member 11 has a width and a band shape so that a part of each of the anode layer 5 and the extraction electrode 9a (cathode layer 9) is exposed. Yes. The sealing member 11 has flexibility. The sealing member 11 is provided with an adhesive portion 17 on one surface of the sealing substrate 15. The sealing member 11 may be cut into a strip shape after the adhesive portion 17 is formed on one surface of the sealing substrate 15, or after the sealing substrate 15 is cut into a strip shape, The adhesive portion 17 may be formed on one surface. From the viewpoint of the productivity of the coating process, it is preferable to cut into a strip after the adhesive portion 17 is formed on one surface of the sealing substrate 15.

  The sealing member 11 is affixed on the organic EL part 13 so that a part of the anode layer 5 and a part of the extraction electrode 9a are exposed. Specifically, the sealing member 11 is stuck along one direction across the plurality of organic EL portions 13. In the roll-to-roll method, the organic EL unit 13 and the sealing member 11 formed on the support substrate 3 are bonded together while the support substrate 3 is conveyed. More specifically, when sticking the sealing member 11 on the organic EL portion 13, the end in the width direction (X direction) of the support substrate 3 is detected and the end in the width direction of the sealing member 11 is detected. The position of the sealing member 11 relative to the support substrate 3 is moved by moving at least one of the support substrate 3 and the sealing member 11 in the width direction of the support substrate 3 or the sealing member 11 based on the position information obtained by detecting the end of the sealing substrate 11. Align. An end in the width direction of the support substrate 3 and an end in the width direction of the sealing member 11 are detected based on, for example, an image captured by a camera. The camera is, for example, a CCD camera. Further, the end in the width direction of the support substrate 3 and the end in the width direction of the sealing member 11 are detected by, for example, a position sensor. The support substrate 3 and / or the sealing member 11 is moved in the width direction by moving a movable roll (steering roll, payoff-only roll) or a movable guide. The positioning of the sealing member 11 with respect to the support substrate 3 is performed, for example, so that the distance between the end of the support substrate 3 and the end of the sealing member 11 is a predetermined distance.

  For example, the sealing member 11 is aligned in advance with a width of a member that covers at least the entire light emitting area of the organic EL unit 13 formed on the supporting substrate 3, and the supporting substrate 3 covers the entire light emitting area. And the sealing member 11 are aligned and bonded.

  As shown in FIG. 7, the support substrate 3 and the sealing member 11 pass between the heating rollers 32a and 32b. Thereby, the support substrate 3 and the sealing member 11 are given pressure while being heated by the heating rollers 32a and 32b. Thereby, the adhesive part 17 softens and the adhesive part 17 and the organic EL part 13 adhere. When the organic EL portion 13 and the sealing member 11 are bonded together, it is preferably performed in an environment with a low moisture concentration, and particularly preferably in a nitrogen atmosphere.

  Subsequently, as shown in FIG. 8, the support substrate 3 is divided to divide the organic EL element 1 into pieces (dividing step S <b> 06). Specifically, cutting is performed along a parting line L indicated by a broken line in FIG. Thereby, the organic EL element 1 is separated into pieces. When cutting along the dividing line L in the X direction, the support substrate 3 and the sealing member 11 are cut simultaneously. In this case, the separated organic EL element 1 includes an end face of the support substrate 3 and an end face of the sealing member 11 along the facing direction (the X direction in FIG. 8) of the exposed anode layer 5 and the extraction electrode 9a. Is the same. Thus, the organic EL element 1 shown in FIG. 1 is manufactured.

  As described above, in the method for manufacturing an organic device according to this embodiment, the flexible sealing member 11 extending in the longitudinal direction of the support substrate 3 is unidirectionally straddling the plurality of organic EL portions 13. Paste along. Therefore, in the manufacturing method of the organic device, it is not necessary to position the sealing member 11 in the longitudinal direction of the support substrate 3, and the sealing member 11 can be continuously attached to the organic EL portion 13. Therefore, in the manufacturing method of the organic device, it takes no time to form the sealing member 11. As a result, the productivity of the organic device manufacturing method can be improved.

  In the manufacturing method of the organic device according to the present embodiment, the support substrate 3 and the sealing member 11 are divided at the same time in the region where the support substrate 3 and the sealing member 11 are bonded after the sealing member attaching step S05. The dividing step S06 to be performed is included. Thereby, the organic EL element 1 to which the sealing member 11 is affixed can be divided into pieces efficiently. Therefore, in the organic device manufacturing method, productivity can be further improved.

  In the manufacturing method of the organic device according to the present embodiment, in the sealing member attaching step S05, the end in the width direction of the support substrate 3 is detected, the end in the width direction of the sealing member 11 is detected, and each width direction is detected. The positioning of the sealing member 11 with respect to the supporting substrate 3 is performed by moving at least one of the supporting substrate 3 and the sealing member 11 in the width direction of the supporting substrate 3 or the sealing member 11 based on the position information of the end of the sealing substrate 11. Do. Thereby, the sealing member 11 can be quickly and accurately affixed to the support substrate 3 on which the organic EL portion 13 is formed. Therefore, in the organic device manufacturing method, productivity can be further improved.

  In the organic device manufacturing method according to the present embodiment, in the organic device portion forming step, a set (pattern) of the anode layer 5 and the extraction electrode 9a is formed on the support substrate 3 in the longitudinal direction of the support substrate 3 (Y direction). A plurality of (two in the present embodiment) are formed at predetermined intervals in the width direction (X direction) of the support substrate 3. That is, a plurality of rows of the organic EL portions 13 arranged at predetermined intervals in the longitudinal direction of the support substrate 3 are formed at predetermined intervals in the width direction orthogonal to the longitudinal direction. In the sealing member sticking step S05, a plurality (two in this embodiment) of sealing members 19 extending along the longitudinal direction of the support substrate 3 are stuck at the same time for each row of the plurality of organic EL portions 13. As described above, in the organic device manufacturing method, the plurality of organic EL portions 13 are formed on the support substrate 3 at predetermined intervals in the longitudinal direction and the width direction. Can be increased. Moreover, in the manufacturing method of an organic device, since the sealing member 19 is affixed in multiple lines, productivity can be further improved.

The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, in the said embodiment, the organic EL element 1 with which the organic functional layer 7 containing a light emitting layer was arrange | positioned between the anode layer 5 and the cathode layer 9 was illustrated. However, the structure of the organic functional layer 7 is not limited to this. The organic functional layer 7 may have the following configuration.
(A) (Anode layer) / Light emitting layer / (Cathode layer)
(B) (Anode layer) / Hole injection layer / Light emitting layer / (Cathode layer)
(C) (anode layer) / hole injection layer / light emitting layer / electron injection layer / (cathode layer)
(D) (anode layer) / hole injection layer / light emitting layer / electron transport layer / electron injection layer / (cathode layer)
(E) (Anode layer) / Hole injection layer / Hole transport layer / Light emitting layer / (Cathode layer)
(F) (anode layer) / hole injection layer / hole transport layer / light emitting layer / electron injection layer / (cathode layer)
(G) (anode layer) / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / (cathode layer)
(H) (anode layer) / light emitting layer / electron injection layer / (cathode layer)
(I) (anode layer) / light emitting layer / electron transport layer / electron injection layer / (cathode layer)
Here, the symbol “/” indicates that the layers sandwiching the symbol “/” are adjacently stacked. The configuration shown in (a) above shows the configuration of the organic EL element 1 in the above embodiment.

  As materials for the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer, known materials can be used. Each of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer can be formed by, for example, a coating method in the same manner as the organic functional layer 7.

  Here, the electron injection layer may contain an alkali metal or alkaline earth metal, or an oxide or fluoride of an alkali metal or alkaline earth metal. Examples of the method for forming the electron injection layer include a coating method and a vacuum deposition method. In the case of oxides and fluorides, the thickness of the electron injection layer is preferably 0.5 nm to 20 nm. The electron injection layer is preferably a thin film from the viewpoint of suppressing an increase in driving voltage of the organic EL element 1 when the insulating property is particularly strong, and the thickness thereof is, for example, 0.5 nm to 10 nm. In addition, from the viewpoint of electron injecting property, it is preferably 2 nm to 7 nm. The electron injection layer may be formed between the extraction electrode 9a and the cathode layer 9, for example.

The organic EL element 1 may have a single organic functional layer 7 or may have two or more organic functional layers 7. In any one of the layer configurations (a) to (i) above, when the laminated structure disposed between the anode layer 5 and the cathode layer 9 is “structural unit A”, the organic function of two layers As a structure of the organic EL element which has the layer 7, the layer structure shown to the following (j) can be mentioned, for example. The two (structural unit A) layer configurations may be the same or different.
(J) Anode layer / (structural unit A) / charge generation layer / (structural unit A) / cathode layer

  Here, the charge generation layer is a layer that generates holes and electrons by applying an electric field. Examples of the charge generation layer include a thin film made of vanadium oxide, ITO, molybdenum oxide, or the like.

Further, assuming that “(structural unit A) / charge generation layer” is “structural unit B”, the configuration of an organic EL element having three or more organic functional layers 7 is, for example, the layer configuration shown in the following (k) Can be mentioned.
(K) Anode layer / (structural unit B) x / (structural unit A) / cathode layer

  The symbol “x” represents an integer of 2 or more, and “(structural unit B) x” represents a stacked body in which (structural unit B) is stacked in x stages. A plurality of (structural units B) may have the same or different layer structure.

  The organic EL element may be configured by directly laminating a plurality of organic functional layers 7 without providing the charge generation layer.

  In the embodiment described above, an example in which the end in the width direction of the support substrate 3 and the end in the width direction of the sealing member 11 are detected based on an image captured by the camera has been described as an example. However, the end in the width direction of the support substrate 3 and the end in the width direction of the sealing member 11 may be detected by a sensor, for example. As the sensor, for example, an optical reflection type, an optical transmission type, an ultrasonic transmission type, a capacitance type, or the like can be used.

  In the above-described embodiment, the end in the width direction of the support substrate 3 is detected, and the end in the width direction of the sealing member 11 is detected. Based on each end, the support substrate 3 or the sealing member 11 is connected to the support substrate 3 or A mode in which the sealing member 11 is aligned with the support substrate 3 by moving in the width direction of the sealing member 11 has been described as an example. However, the alignment method of the sealing member 11 with respect to the support substrate 3 is not limited to this. For example, the alignment of the sealing member 11 with respect to the support substrate 3 is performed by detecting an alignment mark (first alignment mark) provided on the support substrate 3 based on an image captured by a camera and at the same time the sealing member 11. An alignment mark (second alignment mark) provided on the substrate is detected based on an image captured by the camera, and at least one of the support substrate 3 and the sealing member 11 is detected based on each alignment mark. You may carry out by moving to the width direction of the sealing member 11. FIG.

  Further, the alignment of the sealing member 11 with respect to the support substrate 3 is performed based on the detection result of detecting the alignment mark provided on the sealing member 11 while detecting the end in the width direction of the support substrate 3. Alternatively, the alignment mark provided on the support substrate 3 may be detected and the end in the width direction of the sealing member 11 may be detected, and the detection may be performed based on the detection result. In addition, after detecting the end of the support substrate 3 in the width direction and adjusting the position of the support substrate 3 based on the end of the support substrate 3 in the width direction, the alignment mark provided on the support substrate 3 is detected. May be. Similarly, after detecting the end of the sealing member 11 in the width direction and adjusting the position of the sealing member 11 based on the end of the sealing member 11 in the width direction, the alignment provided in the sealing member 11 Marks may be detected.

  Further, when the support substrate 3 or the sealing member 11 is fixed by a guide, the width direction end and / or alignment mark of the support substrate 3 or the width direction end and / or alignment mark of the sealing member 11 are provided. What is necessary is just to detect.

  In the said embodiment, the form which the sealing member 11 has the sealing base material 15 and the adhesive bond part 17 was demonstrated to an example. However, the sealing member may be only a sealing substrate. In this case, after forming the adhesive part on the organic EL part 13, a sealing base material is stuck.

  In the said embodiment, the form implemented continuously from board | substrate drying process S01 to dividing process S06 was demonstrated to the example. However, in the manufacturing method of the organic device, the support substrate 3 may be wound up after the sealing member 11 is attached. In addition, winding of the support substrate 3 can be performed at arbitrary timings (in the middle of each process). Further, the wound support substrate 3 can be temporarily stored away from the process. Further, the wound support substrate 3 can be unwound to the next step at an arbitrary timing.

  In the above embodiment, the embodiment for performing the substrate drying step S01 has been described as an example, but the substrate drying step S01 may not be performed. Moreover, in the said embodiment, the anode layer formation process S02 demonstrated as an example the form which forms the group of the anode layer 5 and the extraction electrode 9a at predetermined intervals in the width direction of the support substrate 3 as an example. However, in the anode layer forming step S02, the set of the anode layer 5 and the extraction electrode 9a may be one set in the width direction (X direction) of the support substrate 3.

  In the said embodiment, the form which affixes the sealing member 11 with which the adhesive base 17 was provided in the sealing base material 15 on the organic EL part 13 with the heating rollers 32a and 32b was demonstrated as an example. However, the sticking method of the sealing member 11 is not limited to this. For example, the carrier sheet may be peeled after the sealing member 11 is bonded to the carrier sheet and the sealing member 11 is pasted on the organic EL unit 13.

  In addition to the above embodiment, after sticking the sealing member 11 on the organic EL portion 13 in the sealing member sticking step S05, a light extraction film may be stuck on the other main surface 3a of the support substrate 3, A protective film may be stuck on the sealing member 11. Further, the protective film may be provided in advance on the sealing member 11. In addition, a light extraction film and a protective film may be affixed after division | segmentation process S06.

  In the said embodiment, the form which the sealing member 11 has the sealing base material 15 and the adhesive bond part 17 was demonstrated to an example. However, the sealing member 11 may further have a hygroscopic part (getter material). Moreover, after forming the moisture absorption part in the organic EL part 13, the sealing member 11 may be affixed. That is, the organic EL element 1 may include a hygroscopic part.

  In the embodiment described above, an example in which the sealing member attaching step S05 is performed in a nitrogen atmosphere with a low moisture concentration has been described. However, you may perform sealing member sticking process S05 in a vacuum, inert atmosphere, or dry air.

  In the above-described embodiment, the form including the extraction electrode 9a has been described as an example, but the extraction electrode 9a may not be provided. In this case, as shown in FIG. 9, in the organic EL element 1A, the cathode layer 9 functions as an extraction electrode.

  In the above embodiment, as illustrated in FIG. 1, the form in which a part of the anode layer 5 is exposed has been described as an example. However, the anode layer 5 may be covered with the organic functional layer 7. In this case, an extraction electrode that is electrically connected to the anode layer 5 may be formed.

  In the said embodiment, the structure of the organic EL element 1 shown by FIG. 1 was demonstrated to an example. However, the configuration of the organic device is not limited to this. For example, the organic EL element may have a configuration as shown in FIG. In the case of manufacturing the organic EL element 1B shown in FIG. 10, in the case where the anode layer 5 and the cathode layer 9 are arranged together at one end, as shown in FIG. 11, they are arranged at one end. The sealing member 11 is pasted so that the anode layer 5 and the cathode layer 9 are exposed. In addition, as shown in FIG. 12, when the anode layer 5 and the cathode layer 9 are arranged at both ends, the anode layer 5 and the cathode layer 9 arranged at both ends are exposed. Thus, the sealing member 11 is affixed.

  In the said embodiment, the organic EL element was demonstrated to an example as an organic device. The organic device may be an organic thin film transistor, an organic photodetector, an organic thin film solar cell, or the like.

  DESCRIPTION OF SYMBOLS 1 ... Organic EL element (organic device), 3 ... Support substrate, 5 ... Anode layer (1st electrode layer), 7 ... Organic functional layer, 9 ... Cathode layer (2nd electrode layer), 11 ... Sealing member, 13 ... Organic EL part (organic device part).

Claims (4)

A first electrode layer forming step of forming a plurality of first electrode layers on the support substrate extending in one direction at a predetermined interval in the one direction; and an organic material on at least a part of the first electrode layer An organic functional layer forming step of forming a functional layer; and a second electrode layer forming step of forming a second electrode layer on at least a part of the organic functional layer, with a predetermined interval in the one direction. An organic device part forming step of forming a plurality of organic device parts;
A flexible sealing member extending in one direction is disposed across the plurality of organic device portions so that at least a part of each of the first electrode layer and the second electrode layer is exposed. A method for producing an organic device, comprising: a sealing member affixing step for affixing along the line. The support substrate has flexibility,
The method includes a dividing step of simultaneously dividing the support substrate and the sealing member in at least a part of a region where the support substrate and the sealing member are bonded after the sealing member attaching step. 2. A method for producing an organic device according to 1.   In the sealing member affixing step, at least one of a width direction end of the support substrate and a first alignment mark provided on the support substrate, a width direction end of the sealing member, and The position information is obtained by detecting at least one of the second alignment marks provided on the sealing member, and the end of the support substrate in the width direction and the first alignment mark Based on at least one detection result and at least one detection result of the end in the width direction of the sealing member and the second alignment mark, at least one of the support substrate and the sealing member is The organic material according to claim 1, wherein the sealing member is aligned with the supporting substrate by moving the supporting substrate or the sealing member in the width direction. Method of manufacturing the device. In the organic device part forming step, a plurality of rows of the organic device parts arranged at a predetermined interval in the one direction are formed at a predetermined interval in a direction orthogonal to the one direction,
The method for manufacturing an organic device according to any one of claims 1 to 3, wherein in the sealing member attaching step, a plurality of the sealing members are attached at the same time for each row of the plurality of organic device portions.

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