JP2018103513A - Sealing member with protective film, method for manufacturing sealing member with protective film, and method for manufacturing organic electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealing member with a protective film, a method for manufacturing a sealing member with a protective film and a method for manufacturing an organic electronic device, by which deformation of a sealing member with a protective film due to air bubbles in a heating dehydration process can be suppressed.SOLUTION: A sealing member 1 with a protective film 20 comprises a sealing member 10 having a sealing substrate 11 and an adhesive layer 12 deposited on the sealing substrate 11, and a protective film 20 laminated via the adhesive layer 12 on the sealing member 10, in which the protective film 20 has a film substrate 21 stuck to the adhesive layer 12 and a plurality of bubble ejection parts formed in the film substrate 21. A method for manufacturing the sealing member 10 with the protective film 20, and a method for manufacturing an organic electronic device are also provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sealing member with a protective film, a method for producing a sealing member with a protective film, and a method for producing an organic electronic device.

  The organic electronic device has a substrate, a first electrode provided on the substrate, a device function unit including an organic layer, and a second electrode. Since the device function part includes an organic layer, it easily deteriorates due to moisture. In order to prevent this deterioration, the organic electronic device further includes a sealing member that seals the device function unit. For example, Patent Document 1 discloses a sealing member having a sealing base material and an adhesive layer laminated on the sealing base material. This sealing member is bonded to a device base material (corresponding to a member in which an organic EL structure is formed on a substrate in Patent Document 1) of an organic electronic device via an adhesive layer.

Japanese Patent Laying-Open No. 2015-215952

  When the adhesive layer of the sealing member is exposed, there are problems such as dust adhering to the adhesive layer, problems such as adhesion of the adhesive layer to the roller when the sealing member is conveyed by a roller, etc. The handling property of the member is lowered. In order to prevent this, a sealing member with a protective film in which a film substrate as a protective film is bonded to an adhesive layer may be used.

  By the way, in order to prevent more reliably the water | moisture content permeation into the device function part which an organic electronic device has, it is possible to heat-dehydrate the sealing member before sealing a device function part with a sealing member. However, when the sealing member with the protective film having the protective film bonded to the adhesive layer is heated and dehydrated, for example, deformation of the sealing substrate, film base due to bubbles generated due to moisture release from the adhesive layer, Deformation of the sealing member with a protective film such as peeling from the adhesive layer occurs. As a result, for example, the sealing performance of the sealing member is lowered, and the handling property of the sealing member with a protective film is lowered.

  Then, this invention provides the sealing member with a protective film which can suppress the deformation | transformation of the sealing member with a protective film by the bubble at the time of heat | fever dehydration, the manufacturing method of the sealing member with a protective film, and the manufacturing method of an organic electronic device. With the goal.

  A sealing member with a protective film according to one aspect of the present invention is laminated on a sealing substrate and a sealing member having an adhesive layer laminated on the sealing substrate, and the sealing member is laminated via an adhesive layer. The protective film has a film base material bonded to the adhesive layer, and a plurality of bubble discharge portions formed on the film base material.

  As for the said sealing member with a protective film, the bubble discharge part is provided in the protective film bonded by the sealing member. Therefore, when a sealing member with a protective film is heated and dehydrated, even if, for example, bubbles are generated due to moisture release from the adhesive layer, the bubbles are discharged from the bubble discharging portion to the outside of the sealing member with a protective film. Therefore, deformation of the sealing member with the protective film due to the bubbles can be suppressed.

  The adhesive layer may contain a hygroscopic agent. Thereby, in the organic electronic device manufactured using the said sealing member with a protective film, the water permeation to an organic layer can be reduced more.

  The manufacturing method of the sealing member with a protective film which concerns on the other side surface of this invention has the sealing member by which the contact bonding layer was laminated | stacked on the sealing base material, and with a protective film used for manufacture of an organic electronic device A method for producing a sealing member, a processing step of forming a protective film by applying a process for forming a bubble discharge part on a film base, and a film base on the sealing base via the adhesive layer A film base material bonding step to be bonded, and the processing step is performed before or after the film base material bonding step.

  According to the said manufacturing method of the sealing member with a protective film, the sealing member with a protective film by which the protective film which has a bubble discharge part was bonded to the sealing base material through the contact bonding layer is obtained. When the sealing member with a protective film is subjected to heat dehydration treatment, for example, even if bubbles are generated due to moisture release from the adhesive layer, the bubbles are discharged from the bubble discharge portion to the outside of the sealing member with a protective film. Therefore, deformation of the sealing member with the protective film due to the bubbles can be suppressed.

  You may have the process of heat-dehydrating at least one among the said contact bonding layer and the said film base material before the said bonding process. Thereby, in the organic electronic device manufactured using the sealing member with a protective film manufactured by the above manufacturing method, moisture intrusion into the organic layer can be further reduced.

  As an example of the said bubble discharge part in the manufacturing method of the sealing member with a protective film, and the sealing member with a protective film, a slit or a circular hole is mentioned.

  According to still another aspect of the present invention, there is provided a method for manufacturing an organic electronic device, comprising: forming a device base on which a first electrode, a device function unit including an organic layer, and a second electrode are sequentially provided on a substrate; A protective film in which a plurality of bubble discharge portions are formed on a film base material is bonded to the sealing member in which the adhesive layer is laminated on the sealing base material through the adhesive layer. From the manufacturing process of the sealing member with a protective film for manufacturing the sealing member with a protective film, the dehydration process for heat-dehydrating the sealing member with the protective film, and the sealing member with the protective film after the dehydration process In the manufacturing process of the sealing member with a protective film, the protective film is peeled off, and the sealing member is bonded to the device substrate via the adhesive layer. With protective film The production of the protective film with a sealing member in the manufacturing method of the sealing member.

  In the manufacturing process of the sealing member with a protective film which the manufacturing method of the said organic electronic device has, the said sealing member with a protective film is manufactured with the manufacturing method of the sealing member with a protective film mentioned above. Therefore, even if the sealing member with a protective film is heated and dehydrated in the dehydration step, deformation of the sealing member with the protective film due to bubbles generated in the heating and dehydration process can be suppressed. Therefore, for example, a sealing member including a sealing base material that is not deformed by bubbles can be bonded to the device base material, and a decrease in sealing performance can be suppressed.

  In the dehydration step, the heat dehydration process may be performed under vacuum. Moreover, you may heat-dehydrate the said sealing member with a protective film by irradiating infrared rays.

  ADVANTAGE OF THE INVENTION According to this invention, the sealing member with a protective film which can suppress a deformation | transformation of the sealing member with a protective film by the bubble at the time of heat | fever dehydration, the manufacturing method of the sealing member with a protective film, and the manufacturing method of an organic device can be provided. .

FIG. 1 is a side view of a sealing member with a protective film according to an embodiment. FIG. 2 is a plan view of the sealing member with the protective film shown in FIG. FIG. 3 is a flowchart showing a method of manufacturing the sealing member with the protective film shown in FIG. FIG. 4 is a flowchart showing a method for manufacturing an organic EL device (organic electronic device) using the sealing member with a protective film shown in FIG. FIG. 5 is a cross-sectional view showing an example of the configuration of a device substrate included in the organic EL device shown in FIG. FIG. 6 is a drawing for explaining a sealing member bonding step in a method for manufacturing an organic EL device (organic electronic device).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same reference numerals are assigned to the same elements, and duplicate descriptions are omitted. The dimensional ratios in the drawings do not necessarily match those described.

  The protective film-equipped sealing member 1 shown in FIG. 1 includes a sealing member 10 and a protective film 20. The sealing member 1 with a protective film is used for manufacturing an organic EL device which is an example of an organic electronic device. The sealing member 1 with a protective film may be strip-shaped or single-wafer-shaped. Hereinafter, unless otherwise indicated, the sealing member 1 with a protective film exhibits a strip shape.

  The sealing member 10 is a member for preventing deterioration of the organic layer included in the organic EL device. The sealing member 10 includes a sealing substrate 11 and an adhesive layer 12.

The sealing substrate 11 has a moisture barrier function. An example of the moisture permeability of the sealing substrate 11 is 5 × 10 ⁻⁵ g / (m ² · 24 hr) or less in an environment of a temperature of 40 ° C. and a humidity of 90% RH. The sealing substrate 11 may have a gas barrier function. Examples of the sealing substrate 11 include a metal foil, a barrier film having a barrier functional layer formed on one side or both sides of a transparent plastic film, a thin film glass having flexibility, and a metal having a barrier property on the plastic film. Examples include laminated films. An example of the thickness of the sealing substrate 11 is 10 μm to 300 μm. As the metal foil, copper foil, aluminum foil, and stainless steel foil are preferable from the viewpoint of barrier properties. When the sealing substrate 11 is a metal foil, the thickness of the metal foil is preferably as thick as possible from the viewpoint of suppressing pinholes, but is preferably 10 μm to 50 μm in view of flexibility.

  The adhesive layer 12 is laminated on the one surface 11 a of the sealing substrate 11. The adhesive layer 12 should just have the thickness which can embed the part which should be sealed with the sealing member 10 in an organic EL device. An example of the thickness of the adhesive layer 12 is 5 μm to 100 μm.

  Examples of the material of the adhesive layer 12 include a photocurable or thermosetting acrylate resin, a photocurable or thermosetting epoxy resin, and the like. Other commonly used resin films that can be fused with an impulse sealer such as ethylene vinyl acetate copolymer (EVA), polypropylene (PP) film, polyethylene (PE) film, polybutadiene film, and the like as the adhesive layer 12 Can be used. A thermoplastic resin can also be used as the material of the adhesive layer 12, and examples thereof include olefin elastomers, styrene elastomers, and butadiene elastomers.

  The sealing member with a protective film 1 may have a resin film 30 on the other surface (the surface opposite to the surface in contact with the adhesive layer 12) 11b of the sealing substrate 11. Examples of the material of the resin film 30 include polyethylene terephthalate (PET) and polyimide (PI). In FIG. 1, the sealing member 1 with the protective film provided with the resin film 30 is illustrated, but the sealing member 1 with the protective film may not include the resin film 30.

  The protective film 20 is laminated on one surface 12 a of the adhesive layer 12. That is, the protective film 20 is laminated on the sealing substrate 11 via the adhesive layer 12. The protective film 20 is a release film that can be peeled from the adhesive layer 12.

  The protective film 20 has a film substrate 21. Examples of the material of the film substrate 21 include PEN, PET, PP, PE, PI, cycloolefin polymer, cycloolefin copolymer, and the like. Examples of the thickness of the film substrate 21 (corresponding to the thickness of the protective film 20) include 9 μm to 50 μm.

  As shown in FIG. 2, a plurality of bubble discharge portions 22 are formed on the film base 21. The bubble discharge portion 22 is a portion that becomes a passage for discharging bubbles generated due to moisture release from the adhesive layer 12 or the film substrate 21 when the sealing member 1 with the protective film is heated and dehydrated. Yes, it is formed by processing the film substrate 21. The bubble discharge part 22 is between the one surface (surface opposite to the surface in contact with the adhesive layer 12) 21a and the other surface (surface in contact with the adhesive layer 12) 21b (see FIG. 1) of the film substrate 21. Even if it does not penetrate, it may be configured to form a passage (in other words, a bubble escape passage) that can be discharged by opening the bubbles generated during the heat dehydration. Therefore, the bubble discharge part 22 may be formed in the half cut state. The example of the bubble discharge part 22 is a slit or a circular hole.

  In the present specification, the slit has a width (length in a direction perpendicular to the extending direction of the slit) substantially zero in plan view of the protective film 20 (when viewed from the thickness direction of the protective film 20). It also includes the concept of “cutting”. Therefore, the slit may have a certain width, or the width may be substantially zero. In FIG. 2, the case where the bubble discharge part 22 is the notch which is an example of a slit is illustrated.

  When the bubble discharge part 22 is formed in a half cut state, the bubble discharge part 22 is formed from the one surface 21a side of the film substrate 21, for example. In this case, the distance between the end portion of the bubble discharge portion 22 (the end portion on the other surface 21b side of the film base material 21) and the other surface 21b is set to a length that can be broken by bubbles. When the bubble discharge part 22 is formed in a half cut state, the bubble discharge part 22 may be formed from the other surface 21b side.

  The size of the bubble discharge part 22 which the protective film 20 has should just be a magnitude | size which can fully discharge | release a bubble. When the plurality of bubble discharge portions 22 are slits, the slit interval is preferably 0.5 mm or less in the case of slit processing. When the bubble discharge portions 22 are circular holes, the area of the circular holes is that of the protective film. The area is preferably 10% to 50%. In the form in which the bubble discharge portion 22 is a slit or a circular hole and penetrates between the one surface 21a and the other surface 21b, it is preferable that the adhesive layer 12 has a size that does not leak from the one surface 21a. . When the bubble discharge part 22 is a slit, the example of the length of a slit is 0.1 mm-1 mm.

  Next, an example of the manufacturing method of the sealing member 1 with a protective film is demonstrated. As shown in FIG. 3, the manufacturing method of the sealing member 1 with a protective film includes a processing step S11 and a film base material bonding step S12.

[Processing process]
In the processing step S <b> 11, the protective film 20 is formed by applying processing for forming the plurality of bubble discharge portions 22 to the film base material 21. When the bubble discharge unit 22 is a slit, slit processing is performed. In the slit processing, for example, a part of the film substrate 21 may be cut out with a cutter knife or the like to form a slit. When the bubble discharging part 22 is a circular hole, the circular hole may be formed by, for example, a punching press method, a hot needle method, a laser irradiation method, or the like. In addition, when a slit is holes (for example, long holes) other than a circular hole, for example, you may form a slit with the illustrated punching press type, a hot needle type, and a laser irradiation type.

[Film base material bonding process]
In the film base material bonding step S12, the film base material 21 (that is, the protective film 20) in a state in which the bubble discharge portion 22 is formed by passing through the processing step S11 is sealed via the adhesive layer 12. 11 is pasted. Thereby, the sealing member 1 with a protective film obtained by laminating the sealing substrate 11, the adhesive layer 12, and the protective film 20 in this order is obtained. For the adhesive layer 12, a material (adhesive) to be the adhesive layer 12 may be applied in advance to the one surface 11 a of the sealing substrate 11.

As shown in FIG. 1, in the form in which the sealing member 1 with the protective film includes the resin film 30, it adheres to the sealing substrate 11 in which the resin film 30 is previously laminated on the other surface 11 b of the sealing substrate 11. The protective film 20 may be bonded via the layer 12, or after the protective film 20 is bonded to the sealing substrate 11 via the adhesive layer 12 (that is, the film substrate bonding step in FIG. 3). After S12), the resin film 30 may be laminated on the other surface 11b.

  In the manufacturing method shown in FIG. 3, the processing step S11 is performed before the film base material bonding step S12. However, you may implement processing process S11 after film base material bonding process S12. That is, after bonding the film base material 21 to the sealing base material 11 through the adhesive layer 12, the film base material 21 laminated on the adhesive layer 12 is subjected to the processing step S11, so that the bubble discharge part 22 is formed into a film base. A protective film 20 formed on the material 21 may be obtained.

  In the said description, the form which bonds the film base material 21 (or protective film 20) to the contact bonding layer 12 formed in the one surface 11a of the sealing base material 11 was demonstrated. However, even if, for example, one of the double-sided tapes having the film base material bonded to both surfaces of the adhesive layer 12 is peeled off and the exposed adhesive layer 12 is bonded to the sealing base material 11. Good. In this case, the non-peeled film base material of the double-sided tape functions as the film base material 21 of the protective film 20. Even in this case, at the stage of the double-sided tape, the processing step S11 may be applied to one of the film bases formed on both sides of the adhesive layer 12, or after bonding to the sealing base 11, You may give processing process S11 to the film base material currently bonded by the layer 12. FIG.

  Next, an example of the manufacturing method of the organic EL device using the sealing member 1 with a protective film shown in FIG. 1 will be described. As shown in FIG. 4, the manufacturing method of an organic EL device includes a device base material forming step S21, a manufacturing step S22 of a sealing member with a protective film, a dehydrating step S23, and a sealing member bonding step S24. Prepare. Below, the method to manufacture the organic EL device of the form which emits light from the board | substrate side using a roll-to-roll system is demonstrated.

[Device substrate formation process]
In the device base material forming step S21, as shown in FIG. 5, an anode (first electrode) 42, an organic EL part (device function part including an organic layer) 43, and a cathode (second electrode) are formed on the substrate 41. ) 44 in order to form the device substrate 40. The device substrate 40 will be described.

[substrate]
The substrate 41 has translucency with respect to light (including visible light having a wavelength of 400 nm to 800 nm) emitted from the organic EL device to be manufactured. In this embodiment, the board | substrate 41 used for manufacture of an organic EL device exhibits strip | belt shape. The example of the thickness of the board | substrate 41 is 30 micrometers-700 micrometers.

  The substrate 41 has flexibility, and an example of the substrate 41 is a plastic film or a polymer film. The substrate 41 may further include a barrier layer having a moisture barrier function. The barrier layer may have a function of barriering gas (for example, oxygen) in addition to the function of barriering moisture.

[anode]
The anode 42 is provided on the substrate 41. As the anode 42, an electrode having optical transparency is used. As the electrode exhibiting light transmittance, a thin film of metal oxide, metal sulfide, metal or the like having high electrical conductivity can be used, and a thin film having high light transmittance is preferably used. The anode 42 may have a network structure made of a conductor (for example, metal). The thickness of the anode 42 can be determined in consideration of light transmittance, electrical conductivity, and the like. The thickness of the anode 42 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

  Examples of the material of the anode 42 include indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, and copper. Among these, ITO, IZO, or tin oxide is preferable. The anode 42 can be formed as a thin film made of the exemplified materials. As the material of the anode 42, organic substances such as polyaniline and derivatives thereof, polythiophene and derivatives thereof may be used. In this case, the anode 42 can be formed as a transparent conductive film.

  The anode 42 can be formed by a vacuum film forming method, an ion plating method, a plating method, a coating method, or the like. Application methods include inkjet printing, slit coating, micro gravure coating, gravure coating, bar coating, roll coating, wire bar coating, spray coating, screen printing, flexographic printing, and offset printing. And a nozzle printing method. Among these, the inkjet printing method is preferable.

[Organic EL part]
The organic EL unit 43 is a functional unit that contributes to light emission of the organic EL device, such as charge transfer and charge recombination, according to the power (for example, voltage) applied to the anode 42 and the cathode 44. Have.

  The light emitting layer is a functional layer having a function of emitting light (including visible light). The light emitting layer is usually composed of an organic substance that mainly emits at least one of fluorescence and phosphorescence, or an organic substance and a dopant material that assists the organic substance. Therefore, the light emitting layer is an organic layer. The dopant material is added, for example, in order to improve the light emission efficiency or change the light emission wavelength. The organic substance may be a low molecular compound or a high molecular compound. The thickness of the light emitting layer is, for example, about 2 nm to 200 nm.

  Examples of the organic substance that is a light-emitting material that mainly emits at least one of fluorescence and phosphorescence include the following dye materials, metal complex materials, and polymer materials.

(Dye material)
Examples of dye-based materials include cyclopentamine derivatives, tetraphenylbutadiene derivative compounds, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, pyrrole derivatives, thiophene ring compounds. Pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, oxadiazole dimers, pyrazoline dimers, quinacridone derivatives, coumarin derivatives, and the like.

(Metal complex materials)
Examples of the metal complex material include rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Ir, Pt, and the like as a central metal, and oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and quinoline. Examples include metal complexes having a structure as a ligand, such as iridium complexes, metal complexes having a light emission from a triplet excited state such as platinum complexes, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc complexes, Examples include benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, phenanthroline europium complex and the like.

(Polymer material)
As polymer materials, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyfluorene derivatives, polyvinyl carbazole derivatives, the above dye materials and metal complex light emitting materials are polymerized. Things.

(Dopant material)
Examples of the dopant material include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazolone derivatives, decacyclene, phenoxazone, and the like.

  The light emitting layer can be formed by a coating method, a vacuum deposition method, a sputtering method, or the like. An example of the coating method is the same as that of the anode 42.

  The organic EL unit 43 may have various functional layers in addition to the light emitting layer. Examples of the functional layer disposed between the anode 42 and the light emitting layer are a hole injection layer and a hole transport layer. Examples of the functional layer disposed between the cathode 44 and the light emitting layer are an electron injection layer and an electron transport layer.

An example of the layer configuration of the organic EL unit 43 is shown below. In the example of the following layer configuration, the anode and the cathode are also shown in order to show the positional relationship between the anode 42, the cathode 44, and various functional layers.
(A) Anode / light emitting layer / cathode (b) Anode / hole injection layer / light emitting layer / cathode (c) Anode / hole injection layer / light emitting layer / electron injection layer / cathode (d) Anode / hole injection layer / Light emitting layer / electron transport layer / electron injection layer / cathode (e) anode / hole injection layer / hole transport layer / light emitting layer / cathode (f) anode / hole injection layer / hole transport layer / light emitting layer / Electron injection layer / cathode (g) anode / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / cathode (h) anode / light emitting layer / electron injection layer / cathode (i) anode / Light emitting layer / electron transport layer / electron injection layer / cathode The symbol “/” means that the layers on both sides of the symbol “/” are joined together.

  A known material can be used as a material of a functional layer (for example, a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, etc.) other than the light emitting layer included in the organic EL unit 43. The thickness of the functional layer included in the organic EL unit 43 varies depending on the material used, and is set in consideration of electrical conductivity, durability, and the like.

[cathode]
The cathode 44 is provided on the organic EL unit 43. The thickness of the cathode 44 varies depending on the material used, and is set in consideration of electrical conductivity, durability, and the like. The thickness of the cathode 44 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

  The material of the cathode 44 is from the light emitting layer of the organic EL unit 43 so that light from the organic EL unit 43 (specifically, light from the light emitting layer) is reflected by the cathode 44 and travels to the anode 42 side. A material having a high reflectance with respect to light (particularly visible light) is preferable. Examples of the material of the cathode 44 include alkali metals, alkaline earth metals, transition metals, and Group 13 metals of the periodic table. As the cathode 44, a transparent conductive electrode made of a conductive metal oxide, a conductive organic material, or the like may be used.

  In the device base material forming step S21, the anode 42 and the organic EL unit are respectively formed on a plurality of device regions virtually set on the substrate 41 while the belt-like substrate 41 is conveyed in the longitudinal direction by a roll-to-roll method. The device substrate 40 is formed by sequentially stacking 43 and the cathode 44. The anode 42, the organic EL part 43, and the cathode 44 can be formed by the method described above. When the organic EL portion 43 has a multilayer structure, each layer may be formed in order from the anode 42 side.

[Manufacturing process of sealing member with protective film]
In this manufacturing process S22, the sealing member 1 with a protective film is manufactured with the manufacturing method of the sealing member 1 with a protective film demonstrated using FIG. Therefore, detailed description of the method for manufacturing the sealing member 1 with the protective film is omitted.

[Dehydration process]
In the dehydration step S23, the protective film-equipped sealing member 1 manufactured in the manufacturing step S22 is heated and dehydrated under vacuum. Although the method of heat dehydration is not limited, For example, the method of carrying out heat dehydration by irradiating the sealing member 1 with a protective film with infrared rays can be illustrated. Infrared rays applied to the sealing member 1 with the protective film are preferably mid-infrared rays (wavelength 1.8 μm to 3.0 μm) including the absorption wavelength of water for efficient dehydration. In one form, in dehydration process S23, the sealing member 1 with a protective film is heat-dehydrated, for example so that the moisture content of the contact bonding layer 12 may be 2000 ppm or less. The dehydration step S23 can be performed while conveying the sealing member 1 with the protective film in the longitudinal direction. In the present embodiment, an example in which the heat dehydration process is performed in a vacuum has been described. Heat dehydration may be performed by the infrared irradiation in an environment other than a vacuum environment (for example, under atmospheric pressure).

[Sealing member bonding process]
In sealing member bonding process S24, as shown in FIG. 6, the protective film 20 is peeled from the sealing member 1 with a protective film that has undergone the dehydration process S23, and the sealing member 10 is attached to the device base via the adhesive layer 12. By bonding to the material 40, an organic EL device is obtained. Sealing member bonding process S24 may be implemented, conveying the sealing member 1 with a protective film, and the device base material 40 to a longitudinal direction, respectively.

  Specifically, the protective film 20 is continuously peeled from the sealing member 1 with the protective film while the sealing member 1 with the protective film is conveyed in the longitudinal direction, and the protective film 20 is continuously peeled to obtain continuously. The sealing member 10 thus obtained is conveyed in the longitudinal direction. While the sealing member 10 and the device base material 40 are conveyed in the longitudinal direction, the sealing member 10 with the adhesive layer 12 of the sealing member 10 facing the device base material 40 as shown in FIG. And the device substrate 40 are pressed in the thickness direction, and the sealing member 10 is bonded to the device substrate 40 by heating.

  In FIGS. 5 and 6, the device base 40 is schematically illustrated in a simplified manner. However, in the manufacture of the organic EL device, the anode 42 and the cathode 44 can be applied to the anode 42 and the cathode 44. Each of these may be configured such that a part of each of the anode 42 and the cathode 44 is drawn from the sealing member 10. Alternatively, an electrode part that is provided corresponding to each of the anode 42 and the cathode 44 and a part of which is disposed outside the sealing member 10 is formed on the substrate 41, and the anode 42 and the cathode 44 are You may form so that it may electrically connect with a corresponding electrode part.

  The organic EL device is formed for every device area by passing through sealing member bonding process S24. Therefore, the manufacturing method of an organic EL device may include an individualization step for individualizing the substrate 41 that has undergone the sealing member bonding step S24 for each device region. In the singulation process, the substrate 41 is divided for each device region, whereby an organic EL device having a product size is obtained.

  Next, the effect of the sealing member 1 with a protective film, the manufacturing method of the sealing member 1 with a protective film, and the manufacturing method of an organic EL device is demonstrated.

  The sealing member 1 with a protective film has a protective film 20 laminated on the adhesive layer 12 of the sealing member 10. Therefore, it is possible to prevent dust from adhering to the adhesive layer 12 before the sealing member 10 is bonded to the device substrate 40. Therefore, when the organic EL device is manufactured using the sealing member 1 with the protective film, the adhesive force of the adhesive layer 12 can be maintained, so that the organic EL portion 43 can be reliably sealed with the sealing member 10. . Furthermore, since dust can be prevented from being mixed between the sealing member 10 and the device substrate 40, an organic EL device having desired performance can be efficiently manufactured.

  Since the protective film 20 is bonded to the adhesive layer 12, when the strip-shaped sealing film-attached sealing member 1 is transported in the longitudinal direction by a roll-to-roll method, it adheres to a roll or the like constituting a part of the transport means. Layer 12 does not adhere. Therefore, it is easy to handle the sealing member 1 with a protective film, for example, it is easy to convey the sealing member 1 with a protective film. Furthermore, the freedom degree of design of the conveyance path | route of the sealing member 1 with a protective film improves.

  The protective film 20 has a plurality of bubble discharge portions 22. Therefore, as shown in FIG. 4, when the sealing member 1 with the protective film is heated and dehydrated in the dehydration step S23 of the manufacturing method of the organic EL device, bubbles due to moisture release from the adhesive layer 12 or the like are generated. Even if it occurs, the bubbles can be discharged to the outside of the sealing member 1 with the protective film through the bubble discharge portion 22.

  If bubbles remain inside the sealing member 1 with a protective film, deformation of the sealing member with a protective film such as deformation of the sealing substrate 11 and peeling of the protective film 20 occurs. On the other hand, if bubbles can be discharged by providing the bubble discharge portion 22, deformation of the sealing member with the protective film such as deformation of the sealing substrate 11 and peeling of the protective film 20 from the adhesive layer 12 is prevented. it can. Since deformation of the sealing substrate 11 is suppressed, the organic EL part 43 can be reliably sealed when the sealing member 10 is bonded to the device substrate 40. Since peeling of the protective film 20 from the adhesive layer 12 can be prevented, there is no need to stop the conveyance of the sealing member 1 with the protective film, and the ease of handling of the sealing member 1 with the protective film can be maintained as described above. . Therefore, when manufacturing an organic EL device using the sealing member 1 with a protective film, the production efficiency of the organic EL device is improved.

  Since the bubble discharge part 22 is formed by performing processing process S11 to the film base material 21, formation of the bubble discharge part 22 is easy. As a result, the sealing member 1 with a protective film can be manufactured efficiently.

  In the form in which the sealing member 1 with the protective film is provided with the resin film 30, the handling property of the sealing member 1 with the protective film is improved. Furthermore, by providing the resin film 30, even if the sealing member 1 with the protective film is conveyed via a roll or the like before being bonded to the device base material 40, wrinkles and the like are formed on the sealing member 1 with the protective film. Hard to occur.

  Next, the effect of providing a bubble discharge part in the protective film which a sealing member with a protective film has is demonstrated concretely with reference to an Example and a comparative example.

[Example]
In the example, a sealing member with a protective film cut out to a 10 cm square was prepared. The sealing member with a protective film was equipped with the sealing base material, the contact bonding layer, and the protective film. Specifically, an adhesive layer was laminated on the sealing substrate, and a protective film was further laminated on the adhesive layer.

  The sealing substrate was a 35 μm thick copper foil (CF-T8G-STD-35 manufactured by Fukuda Metal Foil Powder Co., Ltd.). The adhesive layer was 30 μm thick. The protective film was obtained by subjecting a 25 μm-thick film substrate (Panac Co., Ltd., PET25TP01) to 0.5 mm long slit processing at 0.5 mm intervals as a bubble discharge part. The slits formed by the slit processing were “notches” whose width perpendicular to the extending direction was substantially zero.

  The sealing member with a protective film of Example formed a plurality of slits (more specifically, notches) as bubble discharge parts on the film base material, and after obtaining a protective film (processing step), the adhesive layer was interposed therebetween. The protective film obtained in the processing step was produced by pasting the protective film on which the adhesive layer was formed via the adhesive layer (film base material pasting step).

In the examples, the sealing member was heated and dehydrated by heating to 100 ° C. under vacuum (1 × 10 ⁻⁵ Pa). As a result, in the sealing member with the protective film, there were no bubbles between the protective film and the adhesive layer.

[Comparative example]
In the comparative example, the sealing member with a protective film cut out to 10 cm square was prepared. The configuration of the sealing member with the protective film is the same configuration except that the bubble discharge portion is not formed on the film base material of the sealing member with the protective film prepared in the examples. That is, the protective film of the comparative example was the film substrate itself. The sealing member with a protective film of the comparative example was manufactured by bonding the protective film, which is the film base material itself, to the sealing base material on which the adhesive layer was formed via the adhesive layer.

In the comparative example, as in the example, the sealing member with a protective film was heated to 100 ° C. under vacuum (1 × 10 ⁻⁵ Pa), thereby dehydrating the sealing member with the protective film. Went. The heating time in the heat dehydration treatment was the same as in the example. As a result, in the comparative example, in the sealing member with the protective film, bubbles existed between the protective film substrate and the adhesive layer.

  From the results of the above Examples and Comparative Examples, by adopting a protective film in which a bubble discharge part is formed on the film substrate, even if the sealing member with the protective film is heated and dehydrated, the protective film and the adhesive layer It was found that air bubbles between them could be eliminated. Therefore, deformation of the sealing member with the protective film due to bubbles can be suppressed.

  The various embodiments and examples of the present invention have been described above. However, the present invention is not limited to the various embodiments and examples described above, and various modifications can be made without departing from the spirit of the present invention.

  At least one of the adhesive layer that the sealing member has and the film substrate that the protective film has may be heat-dehydrated in advance before the film substrate bonding step shown in FIG. The method of the heat dehydration process can be the same as the method described in the dehydration step S23 shown in FIG. In this case, since moisture can be further removed from the adhesive layer of the sealing member bonded to the organic EL device, moisture intrusion into the organic layer of the organic EL device is less likely to occur.

  The adhesive layer that the sealing member has may include a hygroscopic agent. The hygroscopic agent may capture oxygen or the like in addition to moisture. The moisture absorption rate of the hygroscopic agent is preferably 1 wt% / hr or more in an environment of a temperature of 24 ° C. and a humidity of 55% RH.

  The manufacturing method of the sealing member with a protective film may be provided with the dehydration step S23 illustrated in FIG. That is, after the processing step S11 and the film base material bonding step S12 shown in FIG. 3, the laminate (sealing member with a protective film) in which the adhesive layer and the protective film are sequentially laminated on the sealing base material is heated and dehydrated. You may manufacture the sealing member with a protective film which processed and heat-dehydrated.

  Although the case where the sealing member with the protective film has a strip shape has been described as an example, the sealing member with the protective film may have a sheet shape. Similarly, the device base material (or the substrate included in the device base material) may be a single wafer.

  Although the case where the protective film is composed only of a film base material has been described as an example, a silicone resin release agent, a fluorine release agent, an alkyd release agent, an acrylic resin is formed on one surface of the film base material. A coating layer may be formed by coating a release agent or the like. That is, the protective film may have a multilayer structure of a film substrate and at least one coating layer. Even in a protective film having a multilayer structure, it is possible to suppress deformation of the sealing member with the protective film due to air bubbles by providing a bubble discharging portion on the film substrate.

  The organic EL device manufactured by the manufacturing method of the organic EL device is not limited to a form that emits light from the substrate side (the anode 42 side in FIG. 1), and an organic that generates light from the side opposite to the substrate (cathode 44 side). It can also be applied to EL devices. The present invention is also applicable to organic devices other than organic EL devices, such as organic solar cells, organic photodetectors, and organic transistors.

  DESCRIPTION OF SYMBOLS 1 ... Sealing member with a protective film, 10 ... Sealing member, 11 ... Sealing base material, 12 ... Adhesive layer, 20 ... Protective film, 21 ... Film base material, 22 ... Bubble discharge part, 40 ... Device base material, DESCRIPTION OF SYMBOLS 41 ... Board | substrate, 42 ... Anode (1st electrode), 43 ... Organic EL part (device function part containing an organic layer), 44 ... Cathode (2nd electrode).

Claims (10)

A sealing member having a sealing substrate and an adhesive layer laminated on the sealing substrate;
A protective film laminated on the sealing member via an adhesive layer;
With
The protective film is
A film substrate to be bonded to the adhesive layer;
A plurality of bubble discharge portions formed on the film substrate;
Having
Sealing member with protective film. The bubble discharge part is a slit or a circular hole,
The sealing member with a protective film according to claim 1. The adhesive layer includes a hygroscopic agent;
The sealing member with a protective film according to claim 1 or 2. It has a sealing member in which an adhesive layer is laminated on a sealing substrate, and is a method for manufacturing a sealing member with a protective film used for manufacturing an organic electronic device,
A processing step of forming a protective film by performing processing for forming a bubble discharge part on the film base,
A film substrate bonding step of bonding a film substrate to the sealing substrate via the adhesive layer;
With
The processing step is performed before or after the film base material bonding step.
The manufacturing method of the sealing member with a protective film. The bubble discharge part is a slit or a circular hole,
The manufacturing method of the sealing member with a protective film of Claim 4. The adhesive layer includes a hygroscopic agent;
The manufacturing method of the sealing member with a protective film of Claim 4 or 5. At least one of the adhesive layer and the film base material has a step of heat dehydrating before the film base material bonding step,
The manufacturing method of the sealing member with a protective film as described in any one of Claims 4-6. A device base material forming step of forming a device base material in which a first electrode, a device function part including an organic layer, and a second electrode are provided in order on the substrate;
Manufactures a sealing member with a protective film in which a protective film in which a plurality of bubble discharge portions are formed on a film base material is bonded to the sealing member with the adhesive layer laminated on the sealing base material via the adhesive layer Manufacturing process of sealing member with protective film
A dehydration step of heat-dehydrating the sealing member with the protective film;
A sealing member bonding step of peeling the protective film from the sealing member with the protective film that has undergone the dehydration step, and bonding the sealing member to the device substrate via the adhesive layer;
With
In the manufacturing process of the sealing member with a protective film, the said sealing member with a protective film is manufactured with the manufacturing method of the sealing member with a protective film as described in any one of Claims 4-7.
A method for manufacturing an organic electronic device. In the dehydration step, the heat dehydration process is performed under vacuum.
The manufacturing method of the organic electronic device of Claim 8. The heat dehydration treatment is performed by irradiating the sealing member with the protective film with infrared rays.
The manufacturing method of the organic electronic device of Claim 8 or 9.

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