JP2022050218A - Organic electronic device manufacturing method - Google Patents

Abstract

To provide an organic electronic device manufacturing method enabling improved productivity.SOLUTION: The organic electronic device manufacturing method includes the steps of: forming an element body including a first electrode layer, an organic electronic device layer and a second electrode layer, on a ground substrate including a first substrate, a peeling layer provided on the first substrate and a first protective layer provided on the peeling layer to protect the peeling layer, so as to form an intermediate substrate which includes the ground substrate and the element body; after forming the element body, pasting a flexible member to the element body side of the intermediate substrate; after pasting the flexible member, peeling off the first substrate from the peeling layer; and pasting a second substrate to the peeling layer from which the first substrate has been peeled off. When viewed from a thickness direction of the ground substrate, the peeling layer is smaller in size than the first substrate, and the first protective layer coats the peeling layer.SELECTED DRAWING: Figure 3

Description

The present invention relates to a method for manufacturing an organic electronic device.

As an organic electronic device, an organic electronic device having flexibility is known. The technique of Patent Document 1 is known as a method for manufacturing such an organic electronic device. In the technique described in Patent Document 1, a release layer is formed on a transfer source substrate such as quartz glass, and then an organic EL element (electric element) or the like is formed on the release layer. After forming a barrier layer on the organic EL element, a substrate (for example, a plastic substrate) is bonded onto the barrier layer. Then, the transfer source substrate is peeled from the peeling layer. As a result, the organic EL element or the like is transferred to the substrate. As a result, an organic EL device (organic electronic device) in which an organic EL element is provided on a substrate can be obtained.

Japanese Unexamined Patent Publication No. 2005-85705

In the technique described in Patent Document 1, the release layer is formed on the entire surface of the transfer source substrate. In this case, the outer peripheral surface of the release layer is exposed. Therefore, when the process after forming the release layer on the rigid transfer source substrate such as quartz glass is performed, unintended separation may occur from the position of the outer peripheral surface of the exposed release layer. As described above, when unintended peeling occurs, the productivity of the organic electronic device decreases.

Therefore, an object of the present invention is to provide a method for manufacturing an organic electronic device capable of improving productivity.

The method for manufacturing an organic electronic device according to an embodiment includes a first substrate, a release layer provided on the first substrate, and a first protective layer provided on the release layer and protecting the release layer. The process of forming the base substrate and the intermediate substrate having the element body by forming the element body having the first electrode layer, the organic electronic element layer and the second electrode layer on the base substrate having the above element. After forming the main body, a step of laminating the flexible member on the element main body side of the intermediate substrate, and a step of laminating the flexible member and then peeling the first substrate from the peeling layer. The step of attaching the second substrate to the peeling layer from which the first substrate has been peeled off is provided, and the size of the peeling layer is smaller than that of the first substrate when viewed from the thickness direction of the base substrate. The first protective layer covers the release layer, and the second substrate is more flexible than the first substrate.

In the method for manufacturing an organic electronic device, after the element body is formed on the first substrate, the first substrate is replaced with a second substrate which is more flexible than the first substrate. Therefore, a flexible organic electronic device can be manufactured as compared with the case of the first substrate. In the base substrate used in the method for manufacturing an organic electronic device, the size of the release layer is smaller than that of the first substrate when viewed from the thickness direction of the base substrate, and the first protective layer covers the release layer. ing. Therefore, the outer peripheral surface of the release layer is covered with the first protective layer, and the first protective layer and the first substrate are in contact with each other at the peripheral edge of the release layer. Therefore, for example, when the intermediate substrate is formed, the peeling between the first substrate and the peeling layer is unlikely to occur. As described above, since the unintended peeling between the first substrate and the peeling layer is suppressed, the productivity of the organic electronic device can be improved.

In the method for manufacturing an organic electronic device according to an embodiment, the base substrate is formed from the element body side to the release layer after the step of forming the intermediate substrate and before the step of laminating the flexible member. In the step of forming the notch, the base substrate is formed at a position outside the element body and inside the outer peripheral surface of the release layer when viewed from the thickness direction. The above cut may be formed.

As described above, in the step of peeling the portion where the first protective layer and the first substrate are in contact with each other at the peripheral edge of the peeling layer from the portion of the peeling layer where the element main body is arranged by forming the notch. It is in a separated state and is easily peeled off when the first substrate is peeled off from the peeling layer.

The method for manufacturing an organic electronic device according to an embodiment includes a step of peeling the flexible member from the intermediate substrate after the step of bonding the second substrate, and the organic electronic element layer on the element body. The flexible member may be a film that can be peeled off from the intermediate substrate.

The method for manufacturing an organic electronic device according to an embodiment further includes a step of forming a second protective layer for protecting the element body on the element body, and in the step of laminating the flexible member, the above-mentioned The flexible member may be bonded onto the second protective layer. In this case, since the element body is protected by the second protective layer, damage to the element body can be prevented when the flexible member is peeled off.

The flexible member may be a sealing member that seals the organic electronic device layer.

The method for manufacturing an organic electronic device according to an embodiment is performed on the first electrode layer and the second electrode layer after the step of forming the intermediate substrate and before the step of laminating the flexible member. Further, there may be a step of adhering at least two conductive films to the intermediate substrate so as to be electrically connected.

In this case, the conductive film can be used as a terminal for supplying electric power to the first electrode layer and the second electrode layer.

The sealing member may be formed with a plurality of through holes for supplying electric power to the first electrode layer and the second electrode layer of the element body.

In this case, electric power can be supplied to the first electrode layer and the second electrode layer through the plurality of through holes.

Terminals electrically connected to the first electrode layer and the second electrode layer may be formed in the plurality of through holes. Power can be supplied to the first electrode layer and the second electrode layer via this terminal.

In the step of forming the intermediate substrate, the element main body may be formed on the base substrate via a first barrier layer that barriers water vapor. In this case, in the manufactured organic electronic device, the first barrier layer exists between the second substrate and the element main body. Therefore, for example, it is possible to prevent water vapor from the second substrate from reaching the element main body.

The first substrate may be a rigid substrate, and the second substrate may have a flexible film.

The flexible film is a resin film, and the second substrate may have a second barrier layer that barriers water vapor on the resin film. In this case, it is possible to further prevent water vapor from the second substrate from reaching the element body.

The organic electronic device layer may have a light emitting layer that emits light, and the second substrate may have a light extraction layer on the flexible film. Thereby, the light from the light emitting layer can be taken out in a desired state.

The sealing member has an adhesive layer, a sealing layer, and a resin layer, and the adhesive layer, the sealing layer, and the resin layer are the adhesive layer, the sealing layer, and the resin. It may be laminated in the order of layers.

The first substrate may be a glass substrate.

The first substrate is a sheet-shaped substrate, the flexible member is a strip-shaped member, the second substrate is a strip-shaped substrate, and the step of forming the intermediate substrate is a sheet-to-sheet process. The step of laminating the flexible member and the step of peeling off the first substrate are carried out by the method by the sheet-to-roll method, and the step of laminating the second substrate is carried out by the roll-to-roll method. It may be carried out. This makes it possible to efficiently produce organic electronic devices.

According to the present invention, it is possible to provide a method for manufacturing an organic electronic device capable of improving productivity.

FIG. 1 is a schematic diagram of an organic EL device (organic electronic device) manufactured by the method for manufacturing an organic electronic device according to an embodiment. FIG. 2 is a flowchart of an example of the method for manufacturing the organic EL device shown in FIG. FIG. 3 is a drawing illustrating an intermediate substrate forming process. FIG. 4 is a drawing for explaining a step after the step shown in FIG. 3 in the intermediate substrate forming step. FIG. 5 is a plan view of an example of the intermediate substrate. FIG. 6 is a drawing for explaining the second protective layer forming step. FIG. 7 is a drawing for explaining a notch forming step, a transfer film bonding step, and a temporary substrate peeling step. FIG. 8 is a drawing for explaining the flexible film bonding process. FIG. 9 is a drawing for explaining the transfer film peeling process. FIG. 10 is a drawing for explaining the sealing member bonding step S08. FIG. 11 is a schematic diagram of an organic EL device (organic electronic device) manufactured by the method for manufacturing an organic electronic device according to the second embodiment. FIG. 12 is a flowchart of an example of the method for manufacturing the organic EL device shown in FIG. FIG. 13 is a drawing for explaining the conductive film bonding process. FIG. 14 is a plan view of an intermediate substrate to which a conductive film is bonded. FIG. 15 is a drawing for explaining a sealing member bonding step in the second embodiment. FIG. 16 is a plan view of an intermediate substrate to which a sealing member is bonded. FIG. 17 is a drawing for explaining the temporary substrate peeling step in the second embodiment. FIG. 18 is a drawing for explaining the flexible film bonding step in the second embodiment. It is a schematic diagram of the organic EL device manufactured by the manufacturing method of the organic electronic device which concerns on 3rd Embodiment. FIG. 20 is a flowchart of an example of the method for manufacturing the organic EL device shown in FIG. FIG. 21 is a drawing for explaining a sealing member bonding step in the third embodiment. FIG. 22 is a drawing for explaining the temporary substrate peeling step in the third embodiment. FIG. 23 is a drawing for explaining the flexible film bonding step in the third embodiment. FIG. 24 is a drawing for explaining a terminal forming process. FIG. 25 is a schematic view showing a modified example of the second substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same elements are designated by the same reference numerals, and duplicate description will be omitted. The dimensional ratios in the drawings do not always match those described.

(First Embodiment)
FIG. 1 is a schematic diagram of an organic electroluminescence (organic EL) device manufactured by an example of the method for manufacturing an organic electronic device according to the first embodiment. The organic EL device 1A is, for example, an organic EL lighting panel used for lighting. The organic EL device 1A may be a bottom emission type device or a top emission type device. Hereinafter, unless otherwise specified, the bottom emission type organic EL device 1A will be described.

The organic EL device (organic electronic device) 1A shown in FIG. 1 includes a support substrate 10 and an organic EL element 20A.

[Support board]
The support substrate 10 is a member that supports the organic EL element 20A. The plan view shape (shape seen from the thickness direction) of the support substrate 10 is, for example, a rectangle or a square. The support substrate 10 has flexibility.

In the present embodiment, the fact that a member (board, film, etc.) has flexibility means that the member of interest is sheared or broken even when a predetermined force is applied to the member (hereinafter referred to as "member of interest"). It means that it is possible to bend the member of interest without doing so.

The support substrate 10 has a flexible film (second substrate) 11, an adhesive layer 12, a release layer 13, a first protective layer 14, and a barrier layer (first barrier layer) 15.

[Flexible film]
The flexible film 11 has translucency with respect to the light (including visible light having a wavelength of 400 nm to 800 nm) output by the organic EL element 20A. An example of the thickness of the flexible film 11 is 30 μm to 700 μm.

The flexible film 11 is a resin film, for example, a plastic film or a polymer film. Examples of the material of the flexible film 11 include polyether sulfone (PES); polyester resin such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); and polyolefin such as polyethylene (PE), polypropylene (PP) and cyclic polyolefin. Examples thereof include resin; polyamide resin; polycarbonate resin; polystyrene resin; polyvinyl alcohol resin; saponified product of ethylene-vinyl acetate copolymer; polyacrylonitrile resin; acetal resin; polyimide resin; epoxy resin. Alternatively, the flexible film 11 may be a thin film glass having flexibility.

When the flexible film 11 is a resin film, it may have a barrier function of barriering water vapor, for example. Further, the flexible film 11 may be provided with a light extraction function for extracting light from the organic EL element 20A. Examples of the light extraction function include a light diffusing function, a light condensing function, a light parallelizing function, and the like.

[Adhesive layer]
The adhesive layer 12 is a layer for adhering the flexible film 11 to the release layer 13. An example of the thickness of the adhesive layer 12 is preferably 1 μm to 100 μm, more preferably 5 μm to 60 μm, and further preferably 10 μm to 30 μm. As in the case of the flexible film 11, the adhesive layer 12 has transparency to the light output by the organic EL device 1A, and is limited as long as the flexible film 11 and the release layer 13 can be bonded to each other. Not done.

The adhesive layer 12 is formed by an adhesive. As used herein, an adhesive includes the concept of an adhesive. Examples of the adhesive are formed from, for example, a photocurable or thermosetting acrylate resin, a photocurable or thermosetting epoxy resin, or a photocurable or thermosetting polyimide resin. Other commonly used resin films that can be fused with an impulse sealer, such as heat-fusing films such as ethylene vinyl acetate copolymer (EVA), polypropylene (PP) film, polyethylene (PE) film, and polybutadiene (PB) film, are also available. It can be used as the adhesive layer 12. Thermoplastic resins such as vinyl acetate-based, polyvinyl alcohol-based, acrylic-based, polyethylene-based, epoxy-based, cellulose-based, cyclohexane ring-containing saturated hydrocarbon resins, and styrene-isobutylene-modified resins can also be used as adhesive materials for the adhesive layer 12. Can be used.

[Release layer]
The release layer 13 is provided on the adhesive layer 12. The thickness of the release layer 13 is, for example, 10 nm to 1000 nm, preferably 50 nm to 500 nm. When the thickness of the peeling layer 13 is 10 nm or more, it is easy to manufacture the organic EL device 1A in which the peeling layer 13 is uniformly formed and the thickness is uniform, and the peeling strength of the peeling layer 13 is difficult to be locally increased. Therefore, it is possible to prevent the peeling layer 13 from breaking, and it is easy to control the curl after the peeling layer 13 is peeled from the temporary substrate 31, which will be described later. Further, since the thickness of the peeling layer 13 is 1000 nm or less, it is easy to realize the peeling layer 13 having a peeling strength of 1 N / 25 mm or less, and it is easy to secure the flexibility of the peeling layer 13. Examples of the material of the release layer 13 include an organic polymer, such as polyimide, polyvinyl alcohol, polyamic acid, polyamide, polyethylene, polystyrene, polynorbornene, phenylmaleimide copolymer, polyazobenzene, polyphenylene phthalamide, polyester, and polymethylmethacrylate. , Polyamilate, cinnate polymer, coumarin polymer, phthalimidine polymer, chalcone polymer, aromatic acetylene polymer and the like.

The peel strength of the peel layer 13 when peeling from the temporary substrate 31 is preferably 1 N / 25 mm or less, more preferably 0.1 N / 25 mm or less. That is, it is preferable that the release layer 13 is made of a material capable of maintaining the physical force applied when peeling from the temporary substrate 31 within 1 N / 25 mm, particularly within 0.1 N / 25 mm. When the peel strength of the peel layer 13 is 1 N / 25 mm or less, the peel layer 13 can be easily peeled cleanly from the temporary substrate 31. Further, when the peel strength of the peel layer 13 is 0.1 N / 25 mm or less, it is possible to suppress the generation of curl after peeling from the temporary substrate 31. Although curl does not affect the function of the organic EL device 1A itself, it is preferable to minimize the occurrence of curl because it deteriorates the work efficiency of adhesion and cutting after peeling.

The release layer 13 is preferably a layer having a surface tension difference of 10 mN / m or more from the temporary substrate 31. It is preferable that the peeling layer 13 can be easily peeled off so that the structure 3A described later is not damaged (as a result, a defective organic EL device is manufactured) and curl is not generated. When the peeling layer 13 satisfies the surface tension difference of 10 mN / m or more from the temporary substrate 31, the peeling layer 13 can be easily peeled from the temporary substrate 31, and the structure 3A is damaged or cracks occur. Can be prevented.

[First protective layer]
The first protective layer 14 is provided on the peeling layer 13. The thickness of the first protective layer 14 is, for example, 0.1 μm to 10 μm, preferably 0.5 μm to 5 μm. Examples of the first protective layer 14 include an organic insulating film and an inorganic insulating film. Examples of the material of the first protective layer 14 include an acrylic resin, an olefin resin, and a polyimide resin in the case of an organic insulating film. Moreover, in the case of an inorganic insulating film, for example, silicon oxide, silicon nitride and the like can be mentioned.

[First barrier layer]
The barrier layer 15 is provided on the first protective layer 14. The barrier layer 15 is a layer having a function of barriering water vapor. The barrier layer 15 may have a function of further barriering a gas other than water vapor (for example, oxygen). An example of the thickness of the barrier layer 15 is 10 nm to 10 μm. The barrier layer 15 may be, for example, a film formed of silicon, oxygen and carbon, a film formed of silicon, oxygen, carbon and nitrogen, or a film formed of a metal oxide. Specifically, examples of the material of the barrier layer 15 are silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide and the like.

[Organic EL element]
The organic EL element 20A includes an anode (first electrode layer) 21a, an extraction electrode (auxiliary electrode) 21b, a bank 22, an organic EL layer (organic electronic element layer) 23, and a cathode (second electrode layer) 24. , A second protective layer 25 and a sealing member 26. In the organic EL element 20, the anode 21a, the extraction electrode 21b, the bank 22, the organic EL layer 23, and the cathode 24 form the element body 27.

[anode]
The anode 21a is provided on the support substrate 10. An electrode exhibiting light transmission is used for the anode 21a. As the electrode exhibiting light transmission, a thin film containing a metal oxide having high electrical conductivity, a metal sulfide, a metal, or the like can be used. A thin film having a high light transmittance is preferably used for the anode 21a. The anode 21a may have a network structure formed of a conductor (eg, metal). The thickness of the anode 21a can be determined in consideration of light transmission, electrical conductivity and the like. The thickness of the anode 21a is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

Examples of the material of the anode 21a include indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver and copper. And so on. As the material of the anode 21a, ITO, IZO, or tin oxide is preferable. The anode 21a can be formed as a thin film containing the exemplified materials. As the material of the anode 21a, an organic substance such as polyaniline and its derivative, polythiophene and its derivative may be used. In this case, the anode 21a can be formed as a transparent conductive film.

[Drawer electrode]
The extraction electrode 21b is provided on the support substrate 10. The extraction electrode 21b is arranged apart from the anode 21a. The extraction electrode 21b is electrically connected to the cathode 24. The extraction electrode 21b is an electrode for supplying electric power to the cathode 24. In the present embodiment, the material and thickness of the extraction electrode 21b are the same as those of the anode 21a.

[bank]
The bank 22 is an insulating member (insulating member) provided on the anode 21a. The bank 22 is a member for defining the formation region of the organic EL layer 23. Bank 22 is composed of organic or inorganic substances. When the bank 22 is composed of an organic substance, examples of the material of the bank 22 include resins such as acrylic resin, phenol resin, and polyimide resin. When the bank 22 is composed of an inorganic substance, examples of the material of the bank 22 include silicon oxide and silicon nitride. The bank 22 is also arranged between the anode 21a and the extraction electrode 21b, and also has a function of preventing a short circuit between the anode 21a and the extraction electrode 21b.

[Organic EL layer]
The organic EL layer 23 is provided on the anode 21a. The organic EL layer 23 is provided in the region defined by the bank 22. The organic EL layer 23 includes a light emitting layer, and is a functional layer that contributes to light emission of the organic EL element 20 such as charge transfer and charge recombination according to the electric power applied to the anode 21a and the cathode 24.

The light emitting layer is a functional layer that emits light (including visible light). The thickness of the light emitting layer is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, and more preferably 10 nm to 200 nm.

The light emitting layer is usually formed mainly of an organic substance that emits at least one of fluorescence and phosphorescence, or a dopant material that assists the organic substance and the organic substance. Dopant materials are added, for example, to improve luminous efficiency and change emission wavelengths. The organic substance contained in the light emitting layer may be a low molecular weight compound or a high molecular weight compound.

Examples of the organic substance that mainly emits at least one of fluorescence and phosphorescence include the following dye-based materials, metal complex-based materials, and polymer-based materials.

Examples of the dye-based material include cyclopendamine or a derivative thereof, tetraphenylbutadiene or a derivative thereof, triphenylamine or a derivative thereof, oxadiazole or a derivative thereof, pyrazoloquinolin or a derivative thereof, distyrylbenzene or a derivative thereof, and di. Styrylarylene or its derivative, pyrrole or its derivative, thiophene ring compound, pyridine ring compound, perinone or its derivative, perylene or its derivative, oligothiophene or its derivative, oxadiazole dimer or its derivative, pyrazoline dimer or its derivative, Examples thereof include quinacridone or a derivative thereof, coumarin or a derivative thereof.

As the metal complex-based material, for example, rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Pt, Ir, etc. are contained in the central metal, and oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and quinoline are used. Examples thereof include a metal complex having a structure or the like as a ligand. Examples of the metal complex include a metal complex that emits light from a triple-term excited state such as an iridium complex and a platinum complex, an aluminum quinolinol complex, a benzoquinolinol beryllium complex, a benzoxazolyl zinc complex, a benzothiazole zinc complex, and an azomethylzinc complex. Examples thereof include a porphyrin zinc complex and a phenanthroline europium complex.

Examples of the polymer-based material include polyparaphenylene vinylene or a derivative thereof, polythiophene or a derivative thereof, polyparaphenylene or a derivative thereof, polysilane or a derivative thereof, polyacetylene or a derivative thereof, polyfluorene or a derivative thereof, polyvinylcarbazole or a derivative thereof, and the like. Examples thereof include materials obtained by polymerizing at least one of the above dye material and metal complex material.

Examples of the dopant material that assists an organic substance that mainly emits at least one of fluorescence and phosphorescence include perylene or a derivative thereof, coumarin or a derivative thereof, rubrene or a derivative thereof, quinacridone or a derivative thereof, squalium or a derivative thereof, porphyrin or a derivative thereof. , Styryl dye, tetracene or its derivative, pyrazolone or its derivative, decacyclene or its derivative, phenoxazone or its derivative and the like.

The organic EL layer 23 may include various functional layers in addition to the light emitting layer. Examples of functional layers disposed between the anode 21a and the light emitting layer include a hole injecting layer and a hole transporting layer. Examples of functional layers disposed between the light emitting layer and the cathode 24 include an electron transport layer and an electron injection layer.

An example of the layer structure that the organic EL layer 23 can have is shown below. In order to show the arrangement relationship between the anode 21a and the cathode 24 and the various functional layers, the anode and the cathode are also shown in parentheses.
(A) (Anode) / Hole injection layer / Light emitting layer / (Cathode)
(B) (Anode) / Hole injection layer / Light emitting layer / Electron injection layer / (Cathode)
(C) (Anode) / Hole injection layer (or hole transport layer) / Light emitting layer / Electron transport layer / Electron injection / (Cathode)
(D) (Anode) / Hole injection layer / Hole transport layer / Light emitting layer / (Cathode)
(E) (Anode) / Hole injection layer / Hole transport layer / Light emitting layer / Electron injection layer / (Cathode)
(F) (Anode) / Hole injection layer / Hole transport layer / Light emitting layer / Electron transport layer / Electron injection layer / (Cathode) (g) (Anode) / Light emitting layer / Electron transport layer (or electron injection layer) /(cathode)
(I) (Anode) / Light emitting layer / Electron transport layer / Electron injection layer / (Cathode)
The symbol "/" means that the layers on both sides of the symbol "/" are joined together.

The hole injection layer is a functional layer having a function of improving the hole injection efficiency from the anode 21a to the light emitting layer. The hole injection layer may be an inorganic layer or an organic layer. A known material is used as the material of the hole injection layer.

The hole transport layer is a functional layer having a function of receiving holes from the hole injection layer (or the anode 21a when there is no hole injection layer) and transporting the holes to the light emitting layer. The hole transport layer is an organic layer. A known material is used as the material of the hole transport layer.

The electron transport layer is a functional layer having a function of receiving electrons from the electron injection layer (or the cathode 24 in the absence of the electron injection layer) and transporting the electrons to the light emitting layer. The electron transport layer is an organic layer. A known material can be used as the material of the electron transport layer.

The electron injection layer is a functional layer having a function of improving the electron injection efficiency from the cathode 24 to the light emitting layer. The electron injection layer may be an inorganic layer or an organic layer. The material of the electron injection layer may be a known material. The electron injection layer may be a part of the cathode 24.

The thickness of the hole injection layer, the hole transport layer, the electron transport layer and the electron injection layer is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, and more preferably 5 nm to 200 nm.

The number of light emitting layers included in the organic EL layer 23 may be one or two or more. In any one of the layer configurations (a) to (i), the laminated structure arranged between the anode 21a and the cathode 24 is referred to as [structural unit I]. In this case, as the configuration of the organic EL layer 23 having two light emitting layers, the layer configuration shown in (j) below can be mentioned. The layer structure of the two structural units I may be the same as or different from each other.
(J) (Anode layer) / [Structural unit I] / Charge generation layer / [Structural unit I] / (Cathode layer)

The charge generation layer is a layer that generates holes and electrons by applying an electric field. Examples of the charge generation layer include a thin film containing vanadium oxide, ITO, molybdenum oxide, and the like.

When the "[structural unit I] / charge generation layer" is referred to as [structural unit II], the configuration of the organic EL layer 23 having three or more light emitting layers includes the layer configuration shown in (k) below.
(K) (Anode layer) / [Structural unit II] x / [Structural unit I] / (Cathode layer)
The symbol "x" represents an integer of 2 or more, and "[structural unit II] x" represents a laminated structure in which [structural unit II] is laminated in x stages. The layer structure of the plurality of structural units II may be the same or different.

The organic EL layer 23 may be formed by directly laminating a plurality of light emitting layers without providing a charge generation layer.

[cathode]
The cathode 24 is provided on the organic EL layer 23. A part of the cathode 24 is provided on the extraction electrode 21b. As a result, the cathode 24 and the extraction electrode 21b are electrically connected. The optimum value of the thickness of the cathode 24 differs depending on the material used, and is set in consideration of electrical conductivity, durability and the like. The thickness of the cathode 24 is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

The material of the cathode 24 is from the light emitting layer of the organic EL layer 23 so that the light from the organic EL layer 23 (specifically, the light from the light emitting layer) is reflected by the cathode 24 and proceeds to the anode 21a side. A material having a high reflectance with respect to light (particularly visible light) is preferable. Examples of the material of the cathode 24 include alkali metals, alkaline earth metals, transition metals, and metals having a Group 13 element in the periodic table. As the cathode 24, a transparent conductive electrode containing a conductive metal oxide, a conductive organic substance, or the like may be used. The cathode 24 may have a plurality of layers.

[Second protective layer]
The second protective layer 25 is provided on the element main body 27. The second protective layer 25 covers the bank 22, the organic EL layer 23, and the cathode 24. The second protective layer 25 is, for example, a passivation film. The second protective layer 25 may have a function of sealing the organic EL layer 23. The second protective layer 25 is composed of at least one layer including an inorganic film or a multilayer film laminated with an organic film / inorganic film / organic film, an inorganic film / organic film / inorganic film, or the like. An example of a material for an inorganic film is an inorganic material whose main raw material is silicon oxide, silicon nitride, silicon nitride, alumina, magnesium oxide, or the like. The organic film has the effect of relaxing the stress between the element body 27 and the inorganic film, or filling and smoothing the unevenness and particles on the upper surface of the element body 27 with the organic film. Further, the organic film may have a water retention function. Examples of organic film materials are thermosetting and photocurable epoxy resins and acrylate resins.

[Sealing member]
The sealing member 26 is provided on the second protective layer 25. The sealing member 26 is a member for sealing the organic EL layer 23. The sealing member 26 also has a function of protecting the element main body 27 (particularly, the organic EL layer 23 and the cathode 24). The sealing member 26 is a flexible member. In order to supply electric power to the anode 21a and the extraction electrode 21b, a part of the anode 21a and the extraction electrode 21b is exposed from the sealing member 26.

The sealing member 26 in the present embodiment has a sealing layer 26a, an adhesive layer 26b, and a resin layer 26c.

The sealing layer 26a has a function of barriering water vapor. The sealing layer 26a may also have a function of barriering a gas other than water vapor (for example, oxygen). An example of the thickness of the sealing layer 26a is 10 μm to 300 μm. An example of the sealing layer 26a is a metal leaf. As the metal foil, copper foil, aluminum foil or stainless steel foil is preferable from the viewpoint of barrier properties. When the sealing layer 26a is a metal foil, the thickness of the metal foil is preferably 10 μm to 50 μm. The sealing layer 26a may be the same barrier layer as the barrier layer 15.

The adhesive layer 26b is a layer for adhering the sealing layer 26a to the second protective layer 25. The example of the material (adhesive) of the adhesive layer 26b is the same as that of the adhesive layer 12.

The resin layer 26c is provided on the sealing layer 26a. The resin layer 26c is provided on the side opposite to the adhesive layer 26b when viewed from the sealing layer 26a. The resin layer 26c is a layer that protects the sealing layer 26a. The resin layer 26c can also function as a layer that supports the sealing layer 26a. An example of the thickness of the resin layer 26c is 10 μm to 100 μm. As an example of the material of the resin layer 26c, polyether sulfone (PES); polyester resin such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefin resin such as polyethylene (PE), polypropylene (PP) and cyclic polyolefin; Examples thereof include polyamide resin, polycarbonate resin; polystyrene resin; polyvinyl alcohol resin; saponified product of ethylene-vinyl acetate copolymer; polyacrylic nitrile resin; acetal resin; polyimide resin; epoxy resin and the like.

Next, an example of the method for manufacturing the organic EL device 1A (the method for manufacturing the organic electronic device according to the first embodiment) will be described. As shown in FIG. 2, the manufacturing method of the organic EL device 1A includes an intermediate substrate forming step S01, a second protective layer forming step S02, a notch forming step S03, a transfer film bonding step S04, and a temporary substrate peeling step S05. It has a flexible film bonding step S06, a transfer film peeling step S07, a sealing member bonding step S08, and an individualization step S09. Each process will be described.

[Intermediate substrate forming process]
The intermediate substrate forming step S01 will be described with reference to FIGS. 3 to 5. 3 to 5 are drawings for explaining the intermediate substrate forming step S01. In the intermediate substrate forming step S01, the intermediate substrate 2 shown in FIG. 4B and FIG. 5 is formed.

First, the base substrate 30 shown in FIG. 3A is prepared. The base substrate 30 has a temporary substrate (first substrate) 31, a release layer 13, and a first protective layer 14. Hereinafter, for convenience of explanation, the lateral direction in FIG. 3A is also referred to as an X direction. Further, the direction orthogonal to the X direction when viewed from the thickness direction of the temporary substrate 31 (corresponding to the thickness direction of the intermediate substrate 2) is also referred to as the Y direction (see FIG. 5).

The temporary substrate 31 is a rigid substrate. The temporary substrate 31 is a substrate that has better heat resistance than the flexible film 11 (see FIG. 1), can withstand the process temperature of manufacturing an organic EL device, and can maintain flatness without being deformed at a high temperature. An example of the temporary substrate 31 is a glass substrate. The shape of the temporary substrate 31 is a sheet shape (or a single leaf shape). The plan view shape of the temporary substrate 31 is, for example, a rectangle or a square. The thickness of the temporary substrate 31 is, for example, 0.2 mm to 1.0 mm.

The release layer 13 is provided on the temporary substrate 31. The peeling layer 13 is a layer for separating the configuration on the temporary substrate 31 from the temporary substrate 31 in a later process. The plan view shape of the release layer 13 is smaller than that of the temporary substrate 31 when viewed from the thickness direction of the temporary substrate 31. Therefore, when viewed from the thickness direction of the temporary substrate 31, the temporary substrate 31 has a first region in which the release layer 13 is formed and a second region surrounding the temporary substrate 31. The release layer 13 is formed on the temporary substrate 31 by, for example, spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, or the like. It is then cured by heat, UV (ultraviolet), or a combination of both.

The first protective layer 14 is provided on the peeling layer 13. In the present embodiment, when viewed from the thickness direction of the temporary substrate 31, the size of the first protective layer 14 is larger than that of the release layer 13 and is substantially the same as the size of the temporary substrate 31. The first protective layer 14 covers the release layer 13. As shown in FIG. 3A, the surface 13a and the outer peripheral surface (outer edge) 13b of the release layer 13 opposite to the temporary substrate 31 are also covered with the first protective layer 14. In the above configuration, in the temporary substrate 31, the region where the release layer 13 is not formed is covered with the first protective layer 14. When the first protective layer 14 is an organic insulating film, the first protective layer 14 is formed by, for example, spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, or the like. When the first protective layer 14 is an inorganic insulating film, the first protective layer 14 is formed by, for example, a vacuum vapor deposition method, a sputtering method, an ion plating method, or the like.

The base substrate 30 is prepared by forming the release layer 13 and the first protective layer 14 on the temporary substrate 31 in the order of the release layer 13 and the first protective layer 14. Examples of the method for forming the release layer 13 and the first protective layer 14 are as described above.

In the intermediate substrate forming step S01, after the base substrate 30 is prepared, the barrier layer 15 and the electrode layer 21 are sequentially formed on the base substrate 30 as shown in FIG. 3A.

The barrier layer 15 is a thin film obtained by forming, for example, a vacuum vapor deposition method, a sputtering method, an ion plating method, an ALD (atomic layer deposition) method, a plasma chemical vapor deposition method, or a precursor on the surface of an underlying substrate and performing plasma treatment. It can be formed on the first protective layer 14 by the forming method.

The electrode layer 21 is formed by, for example, a dry film forming method. Examples of the dry film forming method include a vacuum vapor deposition method, a sputtering method, and an ion plating method. The electrode layer 21 is a layer to be the anode 21a and the extraction electrode 21b. Therefore, the material and the thickness of the electrode layer 21 are as described with respect to the anode 21a.

After that, as shown in FIG. 3B, the anode 21a and the extraction electrode 21b are formed by patterning the electrode layer 21 by a microfabrication technique such as a photolithography method. FIG. 3B is a drawing for explaining a process after FIG. 3A. In the present embodiment, a pair of the anode 21a and the extraction electrode 21b is formed in each of a plurality of device forming regions virtually set in the base substrate 30.

Subsequently, in the present embodiment, the bank 22 is formed as shown in FIG. 3 (c). FIG. 3 (c) is a drawing for explaining a process after FIG. 3 (b). In the pair of the anode 21a and the extraction electrode 21b provided in the device forming region, the bank 22 is formed so as to define the forming region of the organic EL layer 23 in the anode 21a. At this time, in the set of the anode 21a and the extraction electrode 21b, the bank 22 is also formed between the anode 21a and the extraction electrode 21b.

When the bank 22 is formed of an organic substance, for example, the bank 22 can be formed as follows.
A positive type or negative type photosensitive resin is applied to one surface, and a predetermined part is exposed and developed. Further, by curing the photosensitive resin subjected to the development treatment, it is possible to form the bank 22 in which the opening is formed so as to define the formation region of the organic EL layer 23. A photoresist can be used as the photosensitive resin. In addition, the bank 22 can be formed by a coating method such as an inkjet printing method. In this case, the bank 22 is formed by applying a coating liquid containing an insulating material, which is the material of the bank 22, to the formed portion of the bank 22, drying and firing the bank 22. When the coating liquid is dried, for example, vacuum drying can be used.

When the bank 22 is formed of an inorganic substance, for example, the bank 22 can be formed as follows.
A thin film made of an inorganic substance is formed on one surface by a plasma CVD method, a sputtering method, or the like. Next, the bank 22 can be formed by forming an opening at a predetermined portion. Apertures are formed, for example, by photolithography. By forming this opening, the surface of the anode 21a is exposed.

After forming the anode 21a and the extraction electrode 21b and before forming the bank 22, the surface treatment step, the step of cleaning the anode 21a and the extraction electrode 21b, the quality of the pattern of the anode 21a and the extraction electrode 21b, and the presence or absence of foreign matter and the like. You may carry out the process of inspecting.

After forming the bank 22, the organic EL layer 23 is formed on the anode 21a as shown in FIG. 4A. FIG. 4A is a drawing for explaining a process after FIG. 3C. The organic EL layer 23 is formed by a coating method such as an inkjet printing method, as in the case of the bank 22. When the coating liquid is dried, for example, vacuum drying can be used.

When the organic EL layer 23 has a plurality of functional layers including a light emitting layer, the functional layers may be formed in order from the anode 21a side. The method for forming the plurality of functional layers may be the same or different. For example, depending on the functional layer, the functional layer may be formed by the above-mentioned dry film forming method.

After forming the organic EL layer 23, the cathode 24 is formed on the organic EL layer 23 as shown in FIG. 4B. FIG. 4B is a drawing for explaining the process after FIG. 4A. The cathode 24 is formed so that a part thereof is located on the extraction electrode 21b. The cathode 24 is formed by, for example, a dry film forming method, as in the case of the electrode layer 21. For example, the cathode 24 can be formed by vacuum deposition.

As shown in FIG. 4B, by forming the cathode 24, an intermediate substrate 2 having a base substrate 30, a barrier layer 15 formed on the base substrate 30, and an element main body 27 can be obtained.

FIG. 5 is a plan view of the intermediate substrate 2. In the present embodiment, a plurality of element main bodies 27 are two-dimensionally arranged on the intermediate substrate 2. That is, a plurality of element main bodies 27 are formed in each of the X direction and the Y direction. The formation position of each element body 27 corresponds to the device formation region.

For example, the barrier layer 15 and the electrode layer 21 may be included in the base substrate 30. For example, after preparing the temporary substrate 31, the release layer 13, the first protective layer 14, the barrier layer 15, and the electrode layer 21 may be formed in this order on the temporary substrate 31. For example, the anode 21a and the extraction electrode 21b may be directly formed on the barrier layer 15 without forming the electrode layer 21.

[Second protective layer forming step]
After forming the intermediate substrate 2, the second protective layer forming step S02 is carried out. In the second protective layer forming step S02, as shown in FIG. 6, the second protective layer 25 is formed on the element main body 27. The second protective layer 25 is formed by the dry film forming method described for the electrode layer 21. For example, the second protective layer 25 can be suitably formed by a CVD method or a sputtering method. When the second protective layer 25 has an organic film, the organic film may be formed by a wet film forming method. In the case of the wet film forming method, the second protective layer 25 can be formed by a slit coating method, an inkjet method, or the like.

The second protective layer forming step S02 can be carried out by, for example, a sheet-to-sheet method while transporting the base substrate 30 (or the temporary substrate 31).

[Cut forming process]
After forming the second protective layer 25, first, the notch forming step S03 is carried out. Specifically, in FIG. 7A, in the intermediate substrate 2, the element main body 27 side is cut from the temporary substrate 31. In other words, the peeling layer 13 is half-cut. As a result, as shown in FIG. 7A, a notch 2a is formed in the intermediate substrate 2. In FIG. 7A, the notch 2a is shown by a broken line.

The notch forming position is outside the element main body 27 and inside the release layer 13 when viewed from the thickness direction of the intermediate substrate 2. Since the inside of the release layer 13 is cut, the release layer 13 remains outside the notch forming position. In the notch forming step S03, for example, while transporting the intermediate substrate 2, the intermediate substrate 2 may be half-cut along the transport direction and then half-cut along the direction orthogonal to the transport direction. The notch 2a can be formed, for example, by a rotary cutter.

[Transfer film bonding process]
After the notch forming step S03, the transfer film bonding step S04 is carried out. In this step, as shown in FIG. 7A, the transfer film TF is bonded to the intermediate substrate 2 that has undergone the notch forming step S03 from the second protective layer 25 side. The transfer film TF is a flexible film that can be peeled off from the intermediate substrate 2. The transfer film TF includes a flexible base material and an adhesive layer provided on one side of the flexible base material. The flexible base material is, for example, a resin film, and examples of the material of the resin film are polyether sulfone (PES); polyester resin such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyethylene (PE), polypropylene ( Polyethylene resins such as PP), cyclic polyolefins; polyamide resins, polycarbonate resins; polystyrene resins; polyvinyl alcohol resins; kenides of ethylene-vinyl acetate copolymers; polyacrylic nitrile resins; acetal resins; polyimide resins; epoxy resins, etc. Be done. Examples of the material of the pressure-sensitive adhesive layer are acrylic resin, silicone resin, urethane resin and the like.

In this embodiment, the transfer film TF is a strip-shaped film. In the transfer film bonding step S04, the band-shaped transfer film TF is transferred in the longitudinal direction thereof, and the transfer film TF is bonded to the intermediate substrate 2 while conveying the intermediate substrate 2 (or the temporary substrate 31). In other words, the transfer film TF is bonded to the intermediate substrate 2 by a sheet-to-roll method. In FIG. 7A, the Y direction (see FIG. 5) orthogonal to the X direction is the transport direction of the intermediate substrate 2.

The length in the width direction (X direction in FIG. 7A) orthogonal to the longitudinal direction of the transfer film TF is a length capable of covering all the element main bodies 27 in the X direction and is a notch forming step. It is less than or equal to the length between the pair of notches 2a formed in S03 in the X direction.

[Temporary substrate peeling process]
After the transfer film bonding step S04, the temporary substrate peeling step S05 is performed. In this step, as shown in FIG. 7B, the temporary substrate 31 is peeled from the peeling layer 13. In the notch forming step S03, the notch 2a is formed in a part of the intermediate substrate 2. Therefore, by peeling the temporary substrate 31 from the peeling layer 13, the inside of the notch 2a is taken out from the temporary substrate 31. At the time of peeling, a force of 1 N / 25 mm or less, preferably 0.1 N / 25 mm or less may be applied to the peel layer 13, and the force may be changed according to the peel strength of the peel layer 13. When the peeling force is 1 N / 25 mm or less, the structure 3A including the peeling layer 13, the first protective layer 14, the barrier layer 15, the element main body 27, and the second protective layer 25 at the time of peeling from the temporary substrate 31. It is possible to further prevent damage, and it is possible to further suppress that the structure 3A is deformed due to an excessive force and does not function as a device.

In the present embodiment, the temporary substrate peeling step S05 is carried out by a sheet-to-roll method following the transfer film bonding step S04. That is, in the transfer film bonding step S04, the transfer path of the transfer film TF and the temporary substrate 31 after being bonded to the intermediate substrate 2 is configured in the direction in which the transfer film TF and the temporary substrate 31 are separated from each other. As a result, the transfer film TF and the temporary substrate 31 are separated from each other by the transfer of the transfer film TF and the temporary substrate 31, so that the temporary substrate 31 can be peeled from the release layer 13.

The structure 3A is transferred to the transfer film TF by the notch forming step S03, the transfer film bonding step S04, and the temporary substrate peeling step S05. Therefore, the notch forming step S03, the transfer film bonding step S04, and the temporary substrate peeling step S05 are steps of transferring the structure 3A to the transfer film TF.

[Flexible film bonding process]
After performing the temporary substrate peeling step S05, the flexible film bonding step S06 is carried out. In the flexible film bonding step S06, as shown in FIG. 8, the flexible film 11 is bonded to the release layer 13 via the adhesive layer 12.

In this embodiment, the flexible film 11 is a strip-shaped film. The flexible film bonding step S06 is performed on the strip-shaped transfer film TF that is being conveyed following the temporary substrate peeling step S05. Specifically, the strip-shaped flexible film 11 is bonded to the structure 3A on the transferred transfer film TF while being transported in the longitudinal direction thereof via the adhesive layer 12. In other words, the transfer film TF is bonded to the intermediate substrate 2 by a roll-to-roll method.

In the flexible film bonding step S06, the flexible film 11 on which the adhesive layer 12 is previously formed on the surface may be used. Alternatively, for example, when the adhesive layer 12 is a cured product of a photocurable adhesive, a photocurable adhesive (for example, an ultraviolet curable resin) is applied to the flexible film 11 during transportation of the strip-shaped flexible film 11. After applying and adhering the flexible film 11 to the release layer 13, the adhesive layer 12 may be formed by irradiating the photocurable adhesive with light for curing. When the photo-curing adhesive is a delayed curing type, the photo-curing adhesive is applied to the flexible film 11, the photo-curing adhesive is irradiated with curing light, and then the flexible film 11 is peeled off. It may be bonded to the layer 13. If the adhesive layer 12 is a cured product of the thermosetting adhesive, the thermosetting adhesive may be heated instead of the light for curing.

[Transfer film peeling process]
After the flexible film bonding step S06 is performed, the transfer film peeling step S07 is performed. In this step, as shown in FIG. 9, the transfer film TF is peeled off from the structure 3A transferred to the transfer film TF.

In the present embodiment, the transfer film peeling step S07 is carried out in a roll-to-roll manner following the flexible film bonding step S06. That is, the transport path when the flexible film 11 and the transfer film TF are transported following the flexible film bonding step S06 is configured so that the flexible film 11 and the transfer film TF are separated from each other. As a result, the flexible film 11 and the transfer film TF are separated by the transfer of the flexible film 11 and the transfer film TF, so that the transfer film TF can be peeled off from the structure 3A. In order to realize such peeling, the bonding strength between the flexible film 11 and the peeling layer 13 via the adhesive layer 12 is usually determined by the bonding force between the transfer film TF and the second protective layer 25 and the like. Large enough.

The structure 3A is transferred to the flexible film 11 through the flexible film bonding step S06 and the transfer film peeling step S07. Therefore, the flexible film bonding step S06 and the transfer film peeling step S07 are steps of transferring the structure 3A from the transfer film TF to the flexible film 11.

[Sealing member bonding process]
After the transfer film peeling step S07 is carried out, the sealing member bonding step S08 is carried out. In this step, as shown in FIG. 10, the sealing member 26 is bonded to the element main body 27 (specifically, the second protective layer 25 on the element main body 27) by the adhesive layer 26b. The sealing member 26 is attached to each of the plurality of element bodies 27. As a result, as shown in FIG. 10, the organic EL device 1A is obtained for the pair of the anode 21a and the extraction electrode 21b on the flexible film 11.

In the present embodiment, the sealing member 26 is a strip-shaped flexible member. The sealing member bonding step S0 is carried out by a roll-to-roll method following the transfer film peeling step S07. Specifically, the flexible sealing members 26 corresponding to the plurality of element main bodies 27 on the flexible film 11 are conveyed in the longitudinal direction thereof, and are conveyed subsequently in the transfer film peeling step S07. The sealing member 26 is attached to each element main body 27 arranged on the sex film 11.

[Individualization process]
As described above, the organic EL device 1A can be obtained by carrying out the sealing member bonding step S08. At this stage, as shown in FIG. 10, a plurality of organic EL devices 1A are connected. Therefore, after the sealing member bonding step S08, the individualization step is carried out. In the individualization step, the flexible film 11 that has undergone the sealing member bonding step S08 is divided into each formation region (device formation region) of each organic EL device 1A. The division (individualization) can be carried out using, for example, a cutter or a laser.

In the method for manufacturing an organic EL device (organic electronic device) described in the first embodiment, the release layer 13 is covered with the first protective layer 14. As shown in FIG. 3, the outer peripheral surface 13b of the release layer 13 is covered with the first protective layer 14. Therefore, even if the peeling layer 13 having the property of easily peeling from the temporary substrate 31 is formed on the temporary substrate 31, peeling from the outer peripheral surface 13b is unlikely to occur when the intermediate substrate 2 is formed. .. As described above, the unintended peeling between the peeling layer 13 and the temporary substrate 31 is suppressed, so that the productivity can be improved.

Since the rigid substrate is used as the temporary substrate 31, it is easy to handle the temporary substrate 31 in a process of using the temporary substrate 31 (for example, an intermediate substrate forming step, a notch forming step, etc.).

In the method for manufacturing the organic EL device 1A, the temporary substrate 31 and the release layer 13 are separated, and then the flexible film 11 is attached to the release layer 13. Therefore, as shown in FIG. 1, the organic EL device 1A has a flexible film 11 instead of a temporary substrate 31 which is a rigid substrate. Therefore, the organic EL device 1A has flexibility. That is, in the method for manufacturing the organic EL device 1A, the organic EL device 1A having flexibility can be manufactured.

In the dry film forming method, the coating method, and the like used when forming the element main body 27, the barrier layer 15, and the like, it is necessary to heat the structure being manufactured. For example, when the barrier layer 15, the element main body 27, and the like are formed on the flexible film 11 when the organic EL device 1A is manufactured, the flexible film 11 is easily deformed by the heating. When the flexible film 11 is deformed in the manufacturing process, the thickness of the layer formed on the flexible film 11 becomes non-uniform, and as a result, the manufactured organic EL device is determined to be a defective product.

On the other hand, in the method for manufacturing the organic EL device 1A, as described above, the barrier layer 15, the element main body 27, and the like are formed on the temporary substrate 31, and then the temporary substrate 31 is replaced with the flexible film 11. Since the temporary substrate 31 is a rigid substrate, the influence of heat is smaller than that of the flexible film 11. As a result, the manufacturing method of the organic EL device 1A is aimed at improving the manufacturing yield. From the viewpoint of reducing the influence of heat, the temporary substrate 31 is preferably a substrate having high heat resistance.

In the method for manufacturing the organic EL device 1A, the bank 22 is formed before the organic EL layer 23 is formed. The bank 22 defines the formation region of the organic EL layer 23. Therefore, when at least one layer of the organic EL layer 23 is formed by the coating method, it is possible to prevent the coating liquid from getting wet and spreading.

In the method for manufacturing the organic EL device 1A, the transfer film TF is bonded to the intermediate substrate 2 after the second protective layer 25 is formed on the intermediate substrate 2. Therefore, the transfer film TF is attached to the second protective layer 25 instead of the cathode 24. Therefore, when the transfer film TF is peeled off in the transfer film peeling step S17, the cathode 24 is not damaged.

When the second protective layer 25 has a sealing function, the element main body 27 (more specifically, the organic EL layer 23) is sealed by the second protective layer 25 and the sealing member 26. Therefore, high sealing performance is realized.

In the method for manufacturing the organic EL device 1A, the notch forming step S03 is performed before the temporary substrate peeling step S05. In the notch forming step S03, the notch 2a is formed in the intermediate substrate 2 (or the base substrate 30). Therefore, even if the release layer 13 is covered with the first protective layer 14, the temporary substrate 31 can be easily separated from the release layer 13 in the temporary substrate release step S05. As a result, the surface of the peeling layer 13 from which the temporary substrate 31 has been peeled off tends to maintain flatness.

As described above, in the method for manufacturing the organic EL device 1A, a sheet-to-seat method, a sheet-to-roll method, and a roll-to-roll method can be appropriately adopted. In this case, since the organic EL device 1A can be manufactured while transporting the temporary substrate 31, the transfer film TF, the sealing member 26, the flexible film 11, and the like, the productivity of the organic EL device 1A can be further improved.

(Second Embodiment)
FIG. 11 is a schematic diagram of an organic EL device manufactured by the method for manufacturing an organic electronic device according to a second embodiment. The organic EL device 1B shown in FIG. 12 includes a support substrate 10 and an organic EL element 20B. Since the support substrate 10 is the same as that of the first embodiment, the description thereof will be omitted.

The organic EL element 20B is mainly different from the organic EL element 20A in that it does not have the second protective layer 25 and has terminals 41a and 41b. The organic EL element 20B will be described with a focus on this difference.

Since the organic EL element 20B does not have the second protective layer 25, the sealing member 26 is attached to the element main body 27. Specifically, the sealing member 26 is attached to the element main body 27 so as to cover the bank 22, the organic EL layer 23, and the cathode 24. In order to supplement the sealing function of the second protective layer 25, it is preferable that the adhesive layer 26b of the sealing member 26 has lower moisture permeability than that of the first embodiment. The adhesive layer 26b may contain a substance having a hygroscopic function. Examples of the substance having a hygroscopic function include a metal oxide that chemically reacts with water at room temperature and a zeolite that physically adsorbs water. The water content of the adhesive layer 26b is preferably 200 ppm or less (based on weight).

The terminal 41a is electrically connected to the anode 21a. The terminal 41a functions as a terminal for external connection for supplying electric power to the anode 21a. The terminal 41a is connected to a portion of the anode 21a that is not covered by the sealing member 26. In this embodiment, the terminal 41a is a conductive film.

The terminal 41b is electrically connected to the extraction electrode 21b. The terminal 41b functions as an external connection terminal for supplying electric power to the cathode 24 via the extraction electrode 21b. The terminal 41b is connected to a portion of the drawer electrode 21b that is not covered by the sealing member 26. In this embodiment, the terminal 41b is a conductive film.

Next, an example of a method for manufacturing the organic EL device 1B will be described. As shown in FIG. 12, the manufacturing method of the organic EL device 1B includes an intermediate substrate forming step S11, a notch forming step S12, a conductive film bonding step S13, a sealing member bonding step S14, and temporary substrate peeling. It has a step S15, a flexible film bonding step S16, and an individualization step S17.

[Intermediate substrate forming process]
In the intermediate substrate forming step S11, the intermediate substrate 2 shown in FIG. 4B and FIG. 5 is formed in the same manner as in the intermediate substrate forming step S01 shown in FIG.

[Cut forming process]
After the intermediate substrate forming step S11, the notch forming step S12 is carried out. Since the notch forming step S12 is the same as the notch forming step S03 shown in FIG. 2, the description thereof will be omitted.

[Conductive film bonding process]
After the notch forming step S12, the conductive film bonding step S13 is carried out. In this step, as shown in FIGS. 13 and 14, the conductive film 41 is bonded to the intermediate substrate 2 in which the notch 2a is formed through the notch forming step S12. 13 and 14 are drawings for explaining the conductive film bonding step S13. 13 and 14 illustrate a state in which the four conductive films 41 are bonded to the intermediate substrate 2. In FIG. 13, for convenience of illustration, a state in which the thickness of the conductive film 41 is longer than the width is shown, but in reality, the conductive film 41 exhibits a sheet shape having the same thickness as or smaller than the width.

Examples of the material of the conductive film 41 include aluminum foil and copper foil. The conductive film 41 is attached to the intermediate substrate 2 by, for example, an adhesive mixed with a conductive filler (not shown). The conductive film 41 is attached to the intermediate substrate 2 so as to be in contact with the anode 21a and the extraction electrode 21b. The conductive film 41 is attached to the intermediate substrate 2 so as to have a gap between the anode 21a and the configuration (bank 22, organic EL layer 23, and cathode 24) on the extraction electrode 21b. In other words, the width of the conductive film 41 may be such that there is a gap between the anode 21a and the configuration on the extraction electrode 21b. As for the thickness of the conductive film 41, when the sealing member 26 is bonded to the intermediate substrate 2 as described later, the upper surface of the conductive film 41 (the surface opposite to the temporary substrate 31) is the upper surface of the sealing member 26 (the surface opposite to the temporary substrate 31). The height may be substantially aligned with the surface of the resin layer 26c).

In the present embodiment, the conductive film 41 is a strip-shaped film. In the conductive film bonding step S15, the intermediate substrate 2 is conveyed in the Y direction (see FIG. 14) orthogonal to the X direction. Further, a plurality of conductive films 41 corresponding to the plurality of element main bodies 27 on the temporary substrate 31 are conveyed in the longitudinal direction. In this way, the conductive film 41 is bonded to the intermediate substrate 2 while conveying the intermediate substrate 2 and the conductive film 41. In other words, the conductive film bonding step S15 is carried out by a sheet-to-roll method.

[Sealing member bonding process]
After the conductive film bonding step S13, the sealing member bonding step S14 is performed. In this step, as shown in FIGS. 15 and 16, the sealing member 26 is bonded to the element main body 27 by the adhesive layer 26b.

In the sealing member bonding step S14, the sealing member 26 may be bonded to the intermediate substrate 2 so as to seal the organic EL layer 23 between the adjacent conductive films 41. In this embodiment, the width of the sealing member 26 (the length in the X direction in FIG. 15) can be the width between adjacent conductive films 41. As shown in FIGS. 15 and 16, the sealing member 26 is attached to each of the plurality of element main bodies 27.

In the present embodiment, the sealing member 26 is a strip-shaped flexible member. In the sealing member bonding step S14, the conductive film bonding step S15 is followed by a sheet-to-roll method. Specifically, the conductive film 41 which is continuously conveyed after the conductive film bonding step S15 while conveying the plurality of sealing members 26 corresponding to the plurality of element main bodies 27 on the temporary substrate 31 in the longitudinal direction. It is bonded to the bonded intermediate substrate 2.

[Temporary substrate peeling process]
After the sealing member bonding step S14, the temporary substrate peeling step S15 is carried out. In this step, as shown in FIG. 17, the temporary substrate 31 is peeled from the peeling layer 13. Since the notch 2a is included in a part of the intermediate substrate 2 in the notch forming step S12, the inside of the notch 2a is taken out from the temporary substrate 31 by peeling the temporary substrate 31 from the release layer 13. In other words, the structure 3B including the release layer 13, the first protective layer 14, the barrier layer 15, and the element body 27 is transferred to the sealing member 26.

In the present embodiment, the temporary substrate peeling step S15 is carried out by a sheet-to-roll method following the sealing member bonding step S14. That is, the transport path of the sealing member 26 and the conductive film 41 after being bonded to the intermediate substrate 2 in the sealing member bonding step S14 is configured such that the sealing member 26 and the conductive film 41 are separated from the temporary substrate 31. Has been done. As a result, the sealing member 26 and the conductive film 41 are separated from the temporary substrate 31 by the transfer of the sealing member 26, the conductive film 41, and the temporary substrate 31, so that the temporary substrate 31 can be peeled from the release layer 13.

[Flexible film bonding process]
After performing the temporary substrate peeling step S15, the flexible film bonding step S16 is carried out. In the flexible film bonding step S16, as shown in FIG. 18, the flexible film 11 is bonded to the release layer 13 via the adhesive layer 12.

In this embodiment, the flexible film 11 is a strip-shaped film. The flexible film bonding step S16 is carried out on the sealing member 26 which is being conveyed following the temporary substrate peeling step S15. Specifically, the strip-shaped flexible film 11 is attached to the structure 3B on the conveyed sealing member 26 via the adhesive layer 12 while being conveyed in the longitudinal direction thereof. In other words, the flexible film 11 is attached to the release layer 13 by a roll-to-roll method. In the flexible film bonding step S16, the method of forming the adhesive layer 12 is the same as that of the first embodiment.

[Individualization process]
As described above, the organic EL device 1B can be obtained by carrying out the flexible film bonding step S16. At this stage, as shown in FIG. 18, a plurality of organic EL devices 1B are connected. Therefore, after the flexible film bonding step S16, the individualization step S17 is carried out. In the individualization step S17, the flexible film 11 that has undergone the flexible film bonding step S16 is divided into each formation region (device formation region) of each organic EL device 1B. The division (individualization) can be carried out using, for example, a cutter or a laser. The individualization step S17 can be carried out while transporting the flexible film 11. By individualizing in this way, the conductive film 41 connected to both the anode 21a and the extraction electrode 21b is divided into terminals 41a connected to the anode 21a, and terminals 41b connected to the extraction electrode 21b. It becomes.

The method for producing the organic EL device 1B according to the second embodiment has substantially the same effect as the organic EL device 1A according to the first embodiment.

In the method for manufacturing the organic EL device 1B, the conductive films 41 are used to form the terminals 41a and 41b. The terminals 41a and 41b are electrically connected to the anode 21a and the extraction electrode 21b, but are not covered with the sealing member 26. Therefore, electric power can be easily supplied to the anode 21a and the extraction electrode 21b by using the terminals 41a and 41b, and as a result, electric power can be easily supplied to the anode 21a and the cathode 24.

In the embodiment described above, unlike the first embodiment, the transfer film TF is not used, so that the number of steps can be reduced. Therefore, the organic EL device 1B can be produced more efficiently.

(Third Embodiment)
FIG. 19 is a schematic diagram of an organic EL device manufactured by the method for manufacturing an organic electronic device according to a third embodiment. The organic EL device 1C shown in FIG. 19 includes a support substrate 10 and an organic EL element 20C. Since the support substrate 10 is the same as that of the first embodiment, the description thereof will be omitted.

The organic EL element 20C is mainly different from the organic EL element 20A in that it does not have the second protective layer 25 and has a sealing member 51 instead of the sealing member 26. The organic EL element 20C will be described with a focus on this difference.

Since the organic EL element 20C does not have the second protective layer 25, the sealing member 51 is attached to the element main body 27. Specifically, the sealing member 51 is attached to the element main body 27 so as to cover the bank 22, the organic EL layer 23, and the cathode 24.

Like the sealing member 26, the sealing member 51 has a sealing layer 51a, an adhesive layer 51b, and a resin layer 51c. Since the configurations of the sealing layer 51a, the adhesive layer 51b, and the resin layer 51c are the same as those of the sealing layer 26a, the adhesive layer 26b, and the resin layer 26c of the sealing member 26, the description thereof will be omitted. In the sealing member 51, a through hole 52 corresponding to the anode 21a and the extraction electrode 21b is formed in order to perform electrical wiring to the anode 21a and the extraction electrode 21b. The through hole 52 penetrates the sealing member 51 in the thickness direction. The through hole 52 is formed so that the opening 52a on the support substrate 10 side is in contact with the anode 21a and the extraction electrode 21b.

A terminal 53 and a terminal 54 connected to the anode 21a and the extraction electrode 21b are arranged in the through hole 52 corresponding to the anode 21a and the extraction electrode 21b.

The terminal 53 functions as a terminal for external connection for supplying electric power to the anode 21a. The terminal 53 is connected to a portion of the anode 21a that is not covered by the sealing member 26.

The terminal 54 functions as an external connection terminal for supplying electric power to the cathode 24 via the extraction electrode 21b. The terminal 54 is connected to a portion of the drawer electrode 21b that is not covered by the sealing member 51.

Next, an example of a method for manufacturing the organic EL device 1C will be described. As shown in FIG. 20, the manufacturing method of the organic EL device 1C includes an intermediate substrate forming step S21, a notch forming step S22, a sealing member bonding step S23, a temporary substrate peeling step S24, and a flexible film bonding. It has a step S25, a terminal forming step S26, and an individualization step S27.

[Intermediate substrate forming process]
In the intermediate substrate forming step S21, the intermediate substrate 2 shown in FIG. 4B and FIG. 5 is formed in the same manner as in the intermediate substrate forming step S01 shown in FIG.

[Cut forming process]
After the intermediate substrate forming step S21, the notch forming step S22 is carried out. Since the notch forming step S22 is the same as the notch forming step S03 shown in FIG. 2, the description thereof will be omitted.

[Sealing member bonding process]
After the notch forming step S22, the sealing member bonding step S23 is carried out. In this step, as shown in FIG. 21, the sealing member 51 on which the through hole 52 is formed is bonded to the entire surface of the intermediate substrate 2 that has undergone the notch forming step S23. In this case, the sealing member 51 is attached to the intermediate substrate 2 so that the positions of the plurality of through holes 52 formed in the sealing member 51 coincide with the positions of the corresponding anodes 21a and the extraction electrodes 21b.

In the present embodiment, the sealing member 51 is a strip-shaped flexible member. In the sealing member bonding step S23, the intermediate substrate 2 in which the notch 2a is formed through the notch forming step S12 is conveyed in the Y direction (see FIGS. 5, 14, and 16) orthogonal to the X direction. Further, a plurality of sealing members 51 corresponding to the plurality of element main bodies 27 on the temporary substrate 31 are conveyed in the longitudinal direction thereof. In this way, the sealing member 51 is bonded to the intermediate substrate 2 while conveying the intermediate substrate 2 and the sealing member 51. In other words, the sealing member bonding step S23 is carried out by a sheet-to-roll method.

[Temporary substrate peeling process]
After the sealing member bonding step S23, the temporary substrate peeling step S24 is performed. In this step, as shown in FIG. 22, the temporary substrate 31 is peeled from the peeling layer 13. Since the notch 2a is formed in a part of the intermediate substrate 2 in the notch forming step S22, the inside of the notch 2a is taken out from the temporary substrate 31 by peeling the temporary substrate 31 from the release layer 13. In other words, as in the case of the second embodiment, the structure 3B including the release layer 13, the first protective layer 14, the barrier layer 15, and the element body 27 is transferred to the sealing member 51.

In the present embodiment, the temporary substrate peeling step S24 is carried out by a sheet-to-roll method following the sealing member bonding step S23. That is, the transport path of the sealing member 51 and the temporary substrate 31 after being bonded to the intermediate substrate 2 in the sealing member bonding step S23 is configured so that the sealing member 51 and the temporary substrate 31 are separated from each other. As a result, the sealing member 51 and the temporary substrate 31 are separated from each other by the transportation of the sealing member 51 and the temporary substrate 31, so that the temporary substrate 31 can be peeled from the release layer 13.

[Flexible film bonding process]
After performing the temporary substrate peeling step S24, the flexible film bonding step S25 is carried out. In the flexible film bonding step S25, as shown in FIG. 23, the flexible film 11 is bonded to the release layer 13 via the adhesive layer 12.

In this embodiment, the flexible film 11 is a strip-shaped film. In the present embodiment, the flexible film bonding step S25 is carried out by a roll-to-roll method as in the case of the flexible film bonding step in the sub-second embodiment.

[Terminal forming process]
After the flexible film bonding step S25, the terminal forming step S26 is performed. In this step, as shown in FIG. 24, the terminal 53 and the terminal 52b are formed by filling the through hole 52 of the sealing member 51 with a conductive material. An example of a conductive material is a conductive resin in which a filler such as silver particles or carbon black is dispersed in a binder. The terminal 53 is formed of a conductive material filled in a through hole 52 connected to the anode 21a. The terminal 54 is formed of a conductive material filled in a through hole 52 connected to the drawer electrode 21b.

An example of a method for forming the terminal 53 and the terminal 54 will be described. For example, a through hole 52 is filled with a conductive material inked with a solvent by an inkjet printing method, the conductive material is dried, and then thermosetting or photocuring treatment is performed as necessary. As a result, the conductive material is solidified and the terminal 53 and the terminal 54 are formed. The terminal forming step S26 can be carried out while transporting the flexible film 11.

[Individualization process]
By carrying out the terminal forming step S26 as described above, the organic EL device 1C can be obtained. At this stage, as shown in FIG. 24, a plurality of organic EL devices 1C are connected. Therefore, after the terminal forming step S26, the individualization step S27 is carried out. In the individualization step S28, the flexible film 11 that has undergone the terminal forming step S26 is divided into each forming region (device forming region) of each organic EL device 1B. The division (individualization) can be carried out using, for example, a cutter or a laser. The individualization step S27 can be carried out while transporting the flexible film 11.

The method for producing the organic EL device 1C according to the third embodiment has the same function and effect as the organic EL device 1A according to the first embodiment.

In the method for manufacturing the organic EL device 1C, the terminal 53 and the terminal 54 are formed in the through hole 52 formed in the sealing member 51. Therefore, electric power can be easily supplied to the anode 21a and the extraction electrode 21b by using the terminals 53 and 54, and as a result, electric power can be easily supplied to the anode 21a and the cathode 24.

In the method for manufacturing the organic EL device 1C, since the terminals 53 and 54 are formed on the sealing member 51 as described above, the sealing member 51 can be bonded to the entire surface of the intermediate substrate 2 as shown in FIG. .. Therefore, it is easy to carry out the sealing member bonding step S23.

In the embodiment described above, unlike the first embodiment, the transfer film TF is not used, so that the number of steps can be reduced. Therefore, the organic EL device 1C can be produced more efficiently.

The various embodiments of the present invention have been described above. However, the present invention is not limited to the various embodiments illustrated, but includes the scope indicated by the claims, and all modifications within the meaning and scope equivalent to the claims. Intended to be included.

For example, in the first embodiment, if the second protective layer 25 has sufficient sealing performance, a flexible protective member may be used instead of the sealing member 26. Examples of such a protective member include a member in which the adhesive layer 26b is directly formed on the resin layer 26c.

As the second substrate, the flexible film 11 shown in FIGS. 1, 8 and the like is illustrated. The second substrate may be a substrate that is more flexible than the first substrate. For example, as shown in FIG. 25, the substrate 60 may have a flexible film 11, a barrier layer (second barrier layer) 61, and a light extraction layer 62. In the example shown in FIG. 25, the barrier layer 61 and the light extraction layer 62 are arranged on the flexible film 11 so as to sandwich the flexible film 11. The barrier layer 61 can be the same layer as the barrier layer 15. The barrier layer 61 is arranged between the flexible film 11 and the release layer 13. Since the substrate 60 has the barrier layer 61, for example, the moisture from the flexible film 11 is less likely to reach the organic EL layer. The light extraction layer 62 is a layer having a light extraction function. For example, the light extraction layer 62 is a brightness improving film, a diffusion film, or the like. FIG. 25 shows a form in which the barrier layer 61 and the light extraction layer 62 are bonded to both sides of the flexible film 11. For example, the light extraction layer 62 and the barrier layer are formed on the flexible film 11. 61 may be laminated in this order. In FIG. 25, an example having both the barrier layer 61 and the light extraction layer 62 has been described, but the substrate 60 may be in the form of having one of the barrier layer 61 and the light extraction layer 62.

The notch forming step may be performed before the temporary substrate peeling step.

In the description so far, the organic EL device has a bank for defining the formation region of the organic EL layer. However, the organic EL device does not have to have a bank. In this case, when the organic EL device has an anode and a drawer electrode separated from the anode as shown in FIG. 3, for example, an organic EL layer may be formed between them. This can prevent a short circuit between the anode and the extraction electrode.

Although the method for manufacturing an organic EL device having a drawer electrode has been described, the present invention can also be applied to an organic EL device having no drawer electrode.

The case where the first electrode layer is an anode and the second electrode layer is a cathode has been described. However, the first electrode layer may be a cathode and the second electrode layer may be an anode. The cathode may be arranged on the flexible film (second substrate) side.

In the above description, the case where the organic EL device is manufactured by adopting the sheet-to-seat method, the sheet-to-roll method, and the roll-to-roll method has been described. However, the method for manufacturing an organic EL device is not limited to the case where these methods are adopted.

The present invention is also applicable to organic electronic devices other than organic EL devices, such as organic solar cells, organic photodetectors, and organic transistors.

1A, 1B, 1C ... Organic EL device (organic electronic device), 2 ... Intermediate substrate, 2a ... Notch, 11 ... Flexible film (second substrate), 12 ... Adhesive layer, 13 ... Peeling layer, 13b ... Outer circumference Surface, 14 ... first protective layer, 15 ... barrier layer (first barrier layer), 20A, 20B, 20C ... organic EL element (organic electronic element) 21a ... anode (first electrode layer), 23 ... organic EL layer ( Organic electronic element layer), 24 ... cathode (second electrode layer), 25 ... second protective layer, 26, 51 ... sealing member, 26a ... sealing layer, 26b ... adhesive layer, 26c ... resin layer, 27 ... Element body, 30 ... Underground board, 31 ... Temporary board (first board), 41 ... Conductive film, 41a, 41b, 52b, 53, 54 ... Terminals, 52 ... Through holes, 60 ... Board (second board), 61 ... Barrier layer (second barrier layer), 62 ... Light extraction layer.

Claims (15)

A first electrode layer, organic, is placed on a base substrate having a first substrate, a release layer provided on the first substrate, and a first protective layer provided on the release layer and protecting the release layer. A step of forming the base substrate and an intermediate substrate having the element body by forming the element body having the electronic element layer and the second electrode layer.
After forming the element body, a step of bonding a flexible member to the element body side of the intermediate substrate, and
A step of peeling the first substrate from the peeling layer after the flexible members are bonded together.
The step of adhering the second substrate to the peeled layer from which the first substrate has been peeled off, and
Equipped with
The size of the release layer is smaller than that of the first substrate when viewed from the thickness direction of the base substrate.
The first protective layer covers the peeling layer, and the first protective layer covers the peeling layer.
The second substrate is more flexible than the first substrate.
Manufacturing method for organic electronic devices. A step of forming a notch in the base substrate from the element main body side to the peeling layer is further provided after the step of forming the intermediate substrate and before the step of laminating the flexible member.
In the step of forming the notch, the notch is formed in the base substrate at a position outside the element body and inside the outer peripheral surface of the peeling layer when viewed from the thickness direction.
The method for manufacturing an organic electronic device according to claim 1. After the step of laminating the second substrate, the step of peeling the flexible member from the intermediate substrate and the step of peeling the flexible member from the intermediate substrate.
A step of bonding a sealing member for sealing the organic electronic element layer to the element body, and
Further have
The flexible member is a film that can be peeled off from the intermediate substrate.
The method for manufacturing an organic electronic device according to claim 1 or 2. Further, it has a step of forming a second protective layer for protecting the element body on the element body.
In the step of bonding the flexible member, the flexible member is bonded onto the second protective layer.
The method for manufacturing an organic electronic device according to claim 3. The flexible member is a sealing member that seals the organic electronic device layer.
The method for manufacturing an organic electronic device according to claim 1 or 2. After the step of forming the intermediate substrate and before the step of laminating the flexible member, the intermediate substrate is electrically connected to the first electrode layer and the second electrode layer. Further comprising a step of laminating at least two conductive films.
The method for manufacturing an organic electronic device according to claim 5. The sealing member is formed with a plurality of through holes for supplying electric power to the first electrode layer and the second electrode layer of the element body.
The method for manufacturing an organic electronic device according to claim 5. A terminal electrically connected to the first electrode layer and the second electrode layer is formed in the plurality of through holes.
The method for manufacturing an organic electronic device according to claim 7. In the step of forming the intermediate substrate, the element main body is formed on the base substrate via a first barrier layer that barriers water vapor.
The method for manufacturing an organic electronic device according to any one of claims 1 to 8. The first substrate is a rigid substrate, and the first substrate is a rigid substrate.
The second substrate has a flexible film.
The method for manufacturing an organic electronic device according to any one of claims 1 to 9. The organic electronic device layer has a light emitting layer that emits light.
The second substrate has a light extraction layer on the flexible film.
The method for manufacturing an organic electronic device according to claim 10. The flexible film is a resin film and
The second substrate has a second barrier layer that barriers water vapor on the resin film.
The method for manufacturing an organic electronic device according to claim 10 or 11. The sealing member has an adhesive layer, a sealing layer, and a resin layer.
The adhesive layer, the sealing layer, and the resin layer are laminated in the order of the adhesive layer, the sealing layer, and the resin layer.
The method for manufacturing an organic electronic device according to claim 3 or 5. The first substrate is a glass substrate.
The method for manufacturing an organic electronic device according to any one of claims 1 to 13. The first substrate is a sheet-shaped substrate, and the first substrate is a sheet-like substrate.
The flexible member is a strip-shaped member.
The second substrate is a strip-shaped substrate.
The step of forming the intermediate substrate is carried out by a sheet-to-sheet method, and the process is carried out.
The step of laminating the flexible member and the step of peeling off the first substrate are carried out by a sheet-to-roll method.
The step of laminating the second substrate is carried out by a roll-to-roll method.
The method for manufacturing an organic electronic device according to any one of claims 1 to 14.

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