JP6779061B2 - Manufacturing methods for protective sheets, structures and organic devices - Google Patents

Description

The present invention relates to a method for manufacturing a protective sheet, a structure and an organic device.

As a conventional protective sheet, for example, the sheet described in Patent Document 1 is known. The protective sheet described in Patent Document 1 has a flexible support, a gas barrier layer, and a laminated structure of three or more layers. After the organic functional layer is formed in the manufacturing process of the organic device, this protective sheet is laminated and wound on the organic functional layer.

JP-A-2009-1235332

The conventional protective sheet is laminated and wound on the organic functional layer. Therefore, the conventional protective sheet comes into contact with the organic functional layer. In this case, there is a possibility that the organic functional layer in contact with the protective sheet may be defective. This may reduce the quality of the organic device.

An object of the present invention is to provide a protective sheet, a structure, and a method for manufacturing an organic device, which can suppress deterioration of the quality of the organic device.

The protective sheet according to one aspect of the present invention is a protective sheet that protects an organic device, and includes a flexible base material and spacers provided on at least one surface of the base material.

In this protective sheet, spacers are provided on at least one surface of the base material. As a result, the protective sheet can prevent the organic device, for example, the organic functional layer from coming into contact with the base material. Therefore, it is possible to suppress the occurrence of defects such as damage to the organic device. In addition, the protective sheet can prevent dust, dust, and the like from adhering to the organic device due to the base material. As a result, the protective sheet can suppress the deterioration of the quality of the organic device.

In one embodiment, the spacers are provided on a first adhesive layer provided on one surface of the substrate, a spacer layer provided on the first adhesive layer, and a spacer layer. It has a second adhesive layer, and the first adhesive layer may have a higher adhesive force than the second adhesive layer. In this configuration, the peelability of the second adhesive layer can be ensured while ensuring the adhesiveness between the base material and the spacer. Therefore, the protective film can be easily peeled off from the organic device during use.

In one embodiment, the spacer may have an opening that defines a concave space with the substrate. In this configuration, the organic device can be accommodated in the space defined by the openings. Therefore, contact between the base material and the organic device can be suppressed.

In one embodiment, the substrate extends in one direction and the spacers extend in one direction of the substrate and at predetermined intervals in the other direction orthogonal to one direction of the substrate. They may be arranged to face each other. In this configuration, the spacer can suppress the contact between the base material and the organic device, and more reliably suppress the adhesion of dust, dust, etc. to the organic device.

In one embodiment, the substrate extends in one direction and the spacers extend in the other direction orthogonal to one direction of the substrate and are spaced in one direction at predetermined intervals. May be good. In this configuration, the spacer can suppress the contact between the base material and the organic device.

In one embodiment, the substrate may be coated with a desiccant on one side. In this configuration, it is possible to prevent the organic device protected by the protective sheet from containing water. As a result, deterioration of the quality of the organic device can be suppressed.

The structure according to one aspect of the present invention is provided with any of the above-mentioned protective sheets and an organic device or an intermediate in which a part of the layers constituting the organic device is formed. The spacer is arranged in a region provided with a substrate and in which an organic device or an intermediate is not formed on the support substrate.

In the structure according to one aspect of the present invention, the spacer of the protective sheet is arranged in the region where the organic device or the intermediate is not formed in the support substrate. As a result, in the structure, it is possible to prevent the organic device, for example, the organic functional layer from coming into contact with the base material. Therefore, it is possible to suppress the occurrence of defects such as damage to the organic device. Further, in the structure, the base material can prevent dust, dust, and the like from adhering to the organic device. As a result, in the structure, deterioration of the quality of the organic device can be suppressed.

The method for manufacturing an organic device according to one aspect of the present invention is a method for manufacturing an organic device on a flexible support substrate, wherein the organic device or the organic device is mounted on the support substrate. A group that is flexible and extends in one direction on a forming step of forming an intermediate in which a part of the constituent layers is formed and a support substrate on which an organic device or an intermediate is formed. Including a sticking step of sticking a protective sheet having a spacer provided on at least one surface of the material and the base material, in the sticking step, the spacer is arranged in a region where an organic device or an intermediate is not formed on the support substrate. A protective sheet is attached to the support substrate so as to be used.

In the method for manufacturing an organic device according to one aspect of the present invention, a protective sheet is attached to the support substrate so that the spacer is arranged in a region where the organic device or an intermediate is not formed on the support substrate in the attachment step. As a result, it is possible to prevent the organic device, for example, the organic functional layer from coming into contact with the base material. Therefore, it is possible to suppress the occurrence of defects such as damage to the organic device. In addition, the base material can prevent dust, dust, and the like from adhering to the organic device. As a result, in the method for manufacturing an organic device, deterioration of the quality of the organic device can be suppressed.

In one embodiment, in the sticking step, a protective sheet having spacers extending in the other direction orthogonal to one direction of the base material and arranged at predetermined intervals in one direction is stuck and stuck on the support substrate. After the step, a cutting step of cutting the protective sheet and the support substrate along the other direction at the position where the spacer is arranged may be included. As a result, even when the spacer is cut, the organic device is enclosed in the space defined by the base material, the spacer, and the support substrate, so that dust and the like generated when the spacer is cut can be transferred to the organic device. Adhesion can be suppressed. Therefore, even when the spacer is cut to separate the organic device and stored, the deterioration of the quality of the organic device can be suppressed.

According to one aspect of the present invention, deterioration of the quality of the organic device can be suppressed.

It is a figure which shows the protection sheet which concerns on one Embodiment. It is a figure which shows the cross-sectional structure along the line II-II in FIG. (A) is a diagram showing a state in which the protective sheet is attached to the support sheet on which the organic EL device is formed, and (b) is a diagram showing a cross-sectional configuration along the line bb in (a). It is a figure which shows the protection sheet which concerns on other embodiment. It is a figure which shows the protection sheet which concerns on other embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are designated by the same reference numerals, and duplicate description will be omitted.

As shown in FIG. 1, the protective sheet 1 includes a base material 3 and a spacer 5. FIG. 1 shows a state in which the protective sheet 1 is viewed from the spacer 5 side. The protective sheet 1 is a member for protecting the organic EL element (organic device) 17 (see FIG. 3).

The base material 3 is a plastic film. The base material 3 extends in one direction. The material of the base material 3 is, for example, polyethylene terephthalate (PET). The thickness of the base material 3 is, for example, 30 μm to 50 μm. The base material 3 has one surface 3a.

As shown in FIG. 2, the spacer 5 has a first adhesive layer 7, a spacer layer 9, and a second adhesive layer 11.

The first adhesive layer 7 is provided on one surface 3a of the base material 3. The first adhesive layer 7 is composed of, for example, a photocurable or thermosetting acrylate resin or a photocurable or thermosetting epoxy resin. The first adhesive layer 7 is a resin film that can be fused with another commonly used impulse sealer, for example, ethylene vinyl acetate copolymer (EVA), polypropylene (PP) film, polyethylene (PE) film, polybutadiene (PB) film. It is also possible to use a heat-sealing film such as. Moreover, a thermoplastic resin can also be used. The adhesive strength of the first adhesive layer 7 is 10 to 50 N / 25 mm. The thickness of the first adhesive layer 7 is, for example, about 5 μm.

The spacer layer 9 is arranged on the first adhesive layer 7 (the surface of the first adhesive layer 7 opposite to the surface in contact with one surface 3a of the base material 3). The spacer layer 9 is arranged between the first adhesive layer 7 and the second adhesive layer 11. The material of the spacer layer 9 is, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI) and the like. The thickness of the spacer layer 9 is appropriately set according to the thickness (height) of the organic EL element 17. Specifically, the thickness of the spacer layer 9 is set so that the thickness of the spacer 5 is larger than the thickness of the organic EL element 17.

The second adhesive layer 11 is provided on the spacer layer 9 (the surface of the spacer layer 9 opposite to the surface in contact with the first adhesive layer 7). The second adhesive layer 11 is formed of, for example, the same material as the first adhesive layer 7. The adhesive strength of the second adhesive layer 11 is 0.1 to 1.0 N / 25 mm. That is, the adhesive strength of the second adhesive layer 11 is lower than the adhesive strength of the first adhesive layer 7. In other words, the adhesive strength of the first adhesive layer 7 is higher than the adhesive strength of the second adhesive layer 11. The adhesive strength of the second adhesive layer 11 is set so that it can be peeled off from the object to be adhered. The thickness of the second adhesive layer 11 is, for example, about 5 μm.

As shown in FIG. 1, the spacer 5 is provided with an opening 13. The opening 13 is a portion of the spacer 5 in which the first adhesive layer 7, the spacer layer 9, and the second adhesive layer 11 are hollowed out. In the present embodiment, the opening 13 has a rectangular shape when viewed from the stacking direction of the first adhesive layer 7, the spacer layer 9, and the second adhesive layer 11 in the spacer 5. That is, the spacers 5 extend at least in the other direction (width direction) orthogonal to one direction (extending direction) of the base material 3 and are arranged at predetermined intervals in one direction. A plurality of openings 13 are provided in the spacer 5 in one direction of the base material 3 at predetermined intervals. The opening 13 defines a concave space for accommodating the organic EL element 17 in cooperation with the base material 3. The dimensions (length and width) of the opening 13 may be appropriately set according to the size of the organic EL element 17.

A method of manufacturing the protective sheet 1 having the above configuration will be described. First, the sheet-shaped first adhesive layer 7, the spacer layer 9 and the second adhesive layer 11 are laminated to prepare the spacer 5. Next, a predetermined portion of the spacer 5 is punched to form an opening 13. Subsequently, the spacer 5 is attached to one surface 3a of the base material 3. At this time, the spacer 5 is attached to the base material 3 so that the arrangement direction of the openings 13 is along one direction of the base material 3. As described above, the protective sheet 1 is manufactured. The opening 13 may be formed by half-cutting after the spacer 5 is attached to the base material 3.

As shown in FIGS. 3 (a) and 3 (b), the protective sheet 1 is attached to the support substrate 15 on which the organic EL element 17 is formed. Specifically, the second adhesive layer 11 of the protective sheet 1 is attached to one main surface 15a of the support substrate 15. The organic EL element 17 formed on one main surface 15a of the support substrate 15 is housed in the opening 13 of the spacer 5. As a result, the organic EL element 17 is enclosed in the space defined by the protective sheet 1 (base material 3 and spacer 5) and the support substrate 15.

Subsequently, a method of manufacturing the organic EL element 17 using the protective sheet 1 will be described.

In the form in which the support substrate 15 has flexibility and extends in the longitudinal direction, a roll-to-roll method can be adopted as a method for manufacturing the organic EL element 17. When the organic EL element 17 is manufactured by the roll-to-roll method, the long flexible support substrate 15 stretched between the unwinding roll and the winding roll is continuously conveyed by the conveying roll while being conveyed. Each layer is formed in order from the support substrate 15 side.

First, the support substrate 15 is prepared, heated and dried (drying step). The support substrate 15 is made of a resin having translucency with respect to visible light (light having a wavelength of 400 nm to 800 nm). The support substrate 15 is a film-like substrate. The thickness of the support substrate 15 is, for example, 30 μm or more and 500 μm or less. When the support substrate 15 is made of resin, it is preferably 45 μm or more from the viewpoint of substrate twist, wrinkles, and elongation during continuous roll-to-roll method, and 125 μm or less from the viewpoint of flexibility. A gas barrier layer or a moisture barrier layer may be arranged on one main surface 15a of the support substrate 15. The other main surface 15b of the support substrate 15 is a light emitting surface.

Subsequently, an anode layer is formed on the support substrate 15 (anode layer forming step). As the anode layer, an electrode layer exhibiting light transmission is used. As the electrode exhibiting light transmittance, a thin film containing a metal oxide, a metal sulfide and a metal having high electric conductivity can be used, and a thin film having high light transmittance is preferably used. For example, thin films containing indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, copper and the like are used. Among these, a thin film made of ITO, IZO, or tin oxide is preferably used.

As the anode layer, a transparent conductive film of an organic substance such as polyaniline and its derivative, polythiophene and its derivative may be used. Further, as the anode layer, an electrode in which a metal or a metal alloy or the like is patterned in a mesh shape, or an electrode in which nanowires containing silver are formed in a network shape may be used. Examples of the method for forming the anode layer include a vacuum deposition method, a sputtering method, an ion plating method, a plating method and a coating method.

Subsequently, an organic functional layer is formed on the anode layer (organic functional layer forming step). The organic functional layer includes a light emitting layer. The organic functional layer usually contains a light emitting material that mainly emits fluorescence and / or phosphorescent light, or a light emitting material and a dopant material for a light emitting layer that assists the light emitting material. Dopant materials for light emitting layers are added, for example, to improve luminous efficiency or change the emission wavelength. The light emitting material that emits fluorescence and / or phosphorescent light may be a low molecular weight compound or a high molecular weight compound. Examples of the organic substance constituting the organic functional layer include the following dye materials, metal complex materials, polymer materials and other light emitting materials that emit fluorescence and / or phosphorescent light, and light emitting layer dopant materials.

The thickness of the organic functional layer is usually about 2 nm to 200 nm. The organic functional layer is formed, for example, by a coating method using a coating liquid (for example, ink) containing a light emitting material. The solvent of the coating liquid containing the luminescent material is not limited as long as it dissolves the luminescent material. Further, the light emitting layer may be formed by vacuum vapor deposition.

Subsequently, a cathode layer is formed on the organic functional layer (cathode layer forming step). As the material of the cathode layer, for example, an alkali metal, an alkaline earth metal, a transition metal, a Group 13 metal of the periodic table, or the like can be used. Specific examples of the material of the cathode layer include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, ittium, indium, cerium, samarium, and europium. , Terbium, itterbium and other metals, alloys of two or more of the metals, one or more of the metals and of gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten and tin. An alloy with one or more of the above, graphite, a graphite interlayer compound, or the like is used. Examples of alloys include magnesium-silver alloy, magnesium-indium alloy, magnesium-aluminum alloy, indium-silver alloy, lithium-aluminum alloy, lithium-magnesium alloy, lithium-indium alloy, calcium-aluminum alloy and the like. it can.

Further, as the cathode layer, for example, a transparent conductive electrode made of a conductive metal oxide, a conductive organic substance, or the like can be used. Specific examples of the conductive metal oxide include indium oxide, zinc oxide, tin oxide, ITO, and IZO, and examples of the conductive organic substance include polyaniline and its derivatives, polythiophene and its derivatives, and the like. Can be done. The cathode layer may be composed of a laminated body in which two or more layers are laminated.

The thickness of the cathode layer is set in consideration of electrical conductivity and durability. The thickness of the cathode layer is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

Examples of the method for forming the cathode layer include a vacuum vapor deposition method, a sputtering method, a laminating method in which a metal thin film is thermocompression bonded, and a coating method. As described above, the organic EL element 17 is formed on the support substrate 15 (formation step).

Subsequently, the protective sheet 1 is attached to the support substrate 15 (attachment step). Specifically, as shown in FIGS. 3A and 3B, the second adhesive bonding of the protective sheet 1 is performed so that the organic EL element 17 is housed in the opening 13 of the spacer 5. The layer 11 is attached to the support substrate 15. That is, the protective sheet 1 is attached to the support substrate 15 so that the spacer 5 is located in the region of the support substrate 15 on which the organic EL element 17 is not formed. As a result, the structure 20 including the protective sheet 1 and the support substrate 15 provided with the organic EL element 17 is configured.

Subsequently, the structure 20 composed of the support substrate 15 and the protective sheet 1 is wound into a roll (winding step). The structure 20 is wound around a core (not shown). As a result, a roll is formed. Then, the roll is stored in, for example, a storage (storage process).

Subsequently, the stored roll is prepared, and the protective sheet 1 is peeled from the support substrate 15 (peeling step). After peeling off the protective sheet 1, the organic EL element 17 is sealed with a sealing member (not shown) (sealing step). As described above, the organic EL element 17 is manufactured.

When the structure 20 is stored, it does not have to be wound into a roll. The structure 20 may be stored in a sheet form. Further, as shown in FIGS. 3A and 3B, the structure 20 may be cut along the cutting line L (cutting step), and the structure 20 may be separated and stored. In the examples shown in FIGS. 3A and 3B, the cutting line L is set so as to include one organic EL element 17. The cutting line L is set at the position of the spacer 5. As a result, even when the structure 20 is cut, the organic EL element 17 is enclosed in the space defined by the base material 3, the spacer 5, and the support substrate 15, so that when the structure 20 is cut. It is possible to prevent the dust and the like generated in the above from adhering to the organic EL element 17. When the structure 20 is made into individual pieces, for example, the cutting line L may be set so as to include a plurality of organic EL elements 17 and cut.

As described above, in the protective sheet 1 according to the present embodiment, the spacer 5 is provided on one surface 3a of the base material 3. As a result, in the protective sheet 1, it is possible to prevent the organic EL element 17, for example, the organic functional layer from coming into contact with the base material 3. Therefore, it is possible to prevent the organic EL element 17 from having a problem. As a result, the protective sheet 1 can suppress deterioration in the quality of the organic EL element 17.

In the protective sheet 1 according to the present embodiment, the spacer 5 has a first adhesive layer 7, a spacer layer 9, and a second adhesive layer 11. In this configuration, the protective sheet 1 is adhered to the support substrate 15 by the second adhesive layer 11. As a result, it is possible to prevent the protective sheet 1 from being displaced when the support substrate 15 is wound up. Therefore, since it is not necessary to repair the deviation of the protective sheet 1, the organic EL element 17 can be efficiently manufactured.

In the protective sheet 1 according to the present embodiment, the spacer 5 has an opening 13. The opening 13 defines a space for accommodating the organic EL element 17 together with the base material 3. As a result, in the protective sheet 1, since the organic EL element 17 is accommodated in the space, contact between the base material 3 and the organic EL element 17 can be suppressed. Further, in the protective sheet 1, by changing the shape of the opening 13, it is possible to correspond to the organic EL element 17 having various shapes.

In the protective sheet 1 according to the present embodiment, the thickness of the spacer 5 is set to be larger than the thickness of the organic EL element 17. As a result, contact between the base material 3 and the organic EL element 17 can be more reliably suppressed.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

In the above embodiment, the form in which the opening 13 of the spacer 5 is rectangular has been described as an example, but the shape of the opening is not limited to this. The shape of the opening may be any shape as long as it accommodates the organic EL element 17.

In the above embodiment, the form in which the spacer 5 has the first adhesive layer 7, the spacer layer 9, and the second adhesive layer 11 has been described as an example. However, the structure of the spacer is not limited to this. For example, the spacer may have other layers. Further, the spacer may be formed of two or less layers.

In the above embodiment, in the method of manufacturing the organic EL element 17, a mode in which the protective sheet 1 is attached to the support substrate 15 after forming the cathode layer as the organic EL element 17 has been described as an example. However, the timing of attaching the protective sheet 1 to the support substrate 15 is not limited to this. For example, the protective sheet 1 is attached to the support substrate 15 after forming an intermediate in which a part of the layers constituting the organic EL element 17 such as an organic functional layer is formed on the support substrate 15. You may. The organic functional layer may be formed of a plurality of layers. In this case, the protective sheet 1 may be attached to the support substrate 15 after at least one of the plurality of layers forming the organic functional layer is formed. Further, after forming the anode layer, the protective sheet 1 may be attached to the support substrate 15.

The configuration of the organic EL element 17 is not limited to the above embodiment. The organic EL element 17 may have the following configuration.
(A) Anode layer / light emitting layer / cathode layer (b) anode layer / hole injection layer / light emitting layer / cathode layer (c) anode layer / hole injection layer / light emitting layer / electron injection layer / cathode layer (d) Anopod layer / hole injection layer / light emitting layer / electron transport layer / electron injection layer / cathode layer (e) anode layer / hole injection layer / hole transport layer / light emitting layer / cathode layer (f) anode layer / hole Injection layer / hole transport layer / light emitting layer / electron injection layer / cathode layer (g) anode layer / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / cathode layer (h) ( Anopod layer) / light emitting layer / electron injection layer / cathode layer (i) (electron layer) / light emitting layer / electron transport layer / electron injection layer / cathode layer Here, the symbol "/" is each layer sandwiching the symbol "/". Indicates that are adjacent to each other.

In the above embodiment, an opening 13 is provided in the spacer 5 of the protective sheet 1, and the organic EL element 17 is housed in the space defined by the opening 13 as an example. However, the configuration of the protective sheet is not limited to this.

As shown in FIG. 4, in the protective sheet 1A, the spacer 5 extends in one direction (extending direction) of the base material 3 and is predetermined in the other direction (width direction) orthogonal to one direction of the base material 3. They are arranged facing each other with an interval of. Specifically, the spacers 5 are arranged along one direction of the base material 3 at both ends of the base material 3 in the other direction. In this configuration, when the protective sheet 1 is attached to the support substrate 15 provided with the organic EL element 17, the organic EL element 17 is positioned between a pair of spacers 5 facing each other in the other direction of the base material 3. To do. One organic EL element 17 may be located between the pair of spacers 5, or a plurality of organic EL elements 17 may be located. In the protective sheet 1A, the spacer 5 can suppress the contact between the base material 3 and the organic EL element 17.

As shown in FIG. 5, in the protective sheet 1B, the spacer 5 extends in the other direction (width direction) orthogonal to one direction (extending direction) of the base material 3 and has a predetermined interval in one direction. Are arranged. Specifically, the spacer 5 is located substantially parallel to the other direction of the base material 3. In this configuration, when the protective sheet 1 is attached to the support substrate 15 provided with the organic EL element 17, the organic EL element 17 is positioned between a pair of spacers 5 facing each other in one direction of the base material 3. To do. One organic EL element 17 may be located between the pair of spacers 5, or a plurality of organic EL elements 17 may be located. In the protective sheet 1B, the spacer 5 can suppress the contact between the base material 3 and the organic EL element 17. Further, in this configuration, the structure 20 can be separated and stored by cutting the structure 20 along the other direction at the position where the spacer 5 is arranged. In this configuration, even when the structure 20 is cut, the structure 20 is cut because the organic EL element 17 is enclosed in the space defined by the base material 3, the spacer 5, and the support substrate 15. It is possible to prevent the dust and the like generated at that time from adhering to the organic EL element 17.

In addition to the above embodiment, a desiccant may be applied to one surface 3a of the base material 3. As a result, it is possible to prevent the organic EL element 17 protected by the protective sheets 1, 1A and 1B from containing water.

1 ... protective sheet, 3 ... base material, 3a ... one surface, 5 ... spacer, 7 ... first adhesive layer, 9 ... spacer layer, 11 ... second adhesive layer, 13 ... opening, 15 ... Support substrate, 17 ... Organic EL element (organic device).

Claims (8)

A protective sheet that protects organic devices
With a flexible substrate,
A spacer provided on at least one surface of the base material is provided .
The spacer is
A first adhesive layer provided on the one surface of the base material and
A spacer layer provided on the first adhesive layer and
It has a second adhesive layer provided on the spacer layer, and has
The first adhesive layer is a protective sheet having a higher adhesive strength than the second adhesive layer . The protective sheet according to claim 1, wherein the spacer has an opening that defines a concave space together with the base material. The substrate extends in one direction and
The protection according to claim 1, wherein the spacers extend in one direction of the base material and are arranged so as to face each other at a predetermined interval in another direction orthogonal to the one direction of the base material. Sheet. The substrate extends in one direction and
The protective sheet according to claim 1, wherein the spacers extend in the other direction orthogonal to the one direction of the base material and are arranged at predetermined intervals in the one direction. The protective sheet according to any one of claims 1 to 4 , wherein the base material is coated with a desiccant on one surface thereof. The protective sheet according to any one of claims 1 to 5 and
It comprises an organic device or a support substrate provided with an intermediate in which a part of the layers constituting the organic device is formed.
A structure in which the spacer is arranged in a region where the organic device or the intermediate is not formed in the support substrate. A method for manufacturing an organic device, which is a method for manufacturing an organic device on a flexible support substrate.
A forming step of forming the organic device or an intermediate in which a part of the layers constituting the organic device is formed on the support substrate.
A protective sheet provided with a flexible and unidirectionally extending base material and spacers provided on at least one surface of the base material on the support substrate on which the organic device or the intermediate is formed. Including the pasting process and pasting
In the pasting process,
A first adhesive layer provided on the one surface of the base material, a spacer layer provided on the first adhesive layer, and a second adhesive layer provided on the spacer layer. Using the protective sheet having a layer and having the spacer in which the first adhesive layer has a higher adhesive force than the second adhesive layer.
A method for manufacturing an organic device, wherein the protective sheet is attached to the support substrate so that the spacer is arranged in a region where the organic device or the intermediate is not formed in the support substrate. In the attachment step, the protective sheet having the spacers extending in the other direction orthogonal to the one direction of the base material and arranged at predetermined intervals in the one direction is attached to the support substrate.
The method for manufacturing an organic device according to claim 7 , further comprising a cutting step of cutting the protective sheet and the support substrate along the other direction at a position where the spacer is arranged after the pasting step.

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