JP5544327B2 - Component mounting board - Google Patents

Description

  The present invention relates to a component mounting board.

  In recent years, a semiconductor substrate is manufactured by mounting an IC chip on a wiring board formed by laminating at least one conductor layer and an insulating layer, so-called resin wiring board or ceramic board, and sealing the resin. There is a lot going on.

  The IC chip is electrically connected via a terminal pad forming the substrate surface and a plurality of bumps formed on each of the plurality of terminal pads of the IC chip mounting portion. On the other hand, external terminals are formed on the back side of the wiring board to be electrically connected to the base board or inserted into a socket for electrical connection.

  In the semiconductor package as described above, components such as capacitors and resistors for supplying power to the IC chip are electrically connected to the terminal pads of the wiring board via a plurality of bumps on the same substrate surface as the IC chip. In many cases, it is formed so as to be connected.

  When such a semiconductor package is used, the IC chip or component mounted on the substrate generates heat, so that the IC chip or component is repeatedly heated and cooled by repeated use of the semiconductor package. As a result, bumps that connect IC chips and components to terminal pads on the surface of the substrate expand or partially dissolve. Especially, in bumps of components that are smaller than IC chips, adjacent bumps are combined, There may be a short circuit.

  Therefore, when a structure in which an IC chip or a component is mounted on the substrate surface is resin-sealed and configured as a semiconductor package, the top surface and side surfaces of the IC chip and component are covered with resin and embedded. In particular, it is required to inject a resin also into the lower surface side of the component, and to prevent the bumps holding the component from being joined and short-circuited by the injected resin.

  However, when the resin is supplied using a dispenser or the like and the resin is sealed by this, the resin cannot be sufficiently injected into the lower surface side of the component, and the lower surface side of the component is filled. In some cases, voids are generated in the resin. When this void becomes a certain size, a region where no resin exists between adjacent bumps is formed, and the bumps are partially coupled through the region as described above, resulting in a short circuit. There is. Therefore, when manufacturing a semiconductor package by sealing with resin, it is necessary to sufficiently inject and fill the resin on the lower surface side of the component so as not to generate voids.

  In view of such a problem, in Patent Document 1, a groove having a uniform width is formed in the length direction of the component at a position on the surface of the substrate facing the component, and sufficient both resins are provided on the lower surface side of the component. Techniques for filling the are disclosed. Patent Documents 2 and 3 also disclose that a groove having a uniform width in the length direction of a component is formed at a position facing the component on the substrate surface, although the purpose is different.

  However, even with these techniques, a sufficient amount of resin cannot be filled on the lower surface side of the component, and generation of voids cannot be sufficiently suppressed.

JP 2006-5112 A JP 2003-46216 A JP 2008-244044 A

  The present invention provides a component mounting substrate in which components are mounted via terminal pads exposed on the substrate surface, and a sufficient amount of sealing resin is injected and filled between the substrate surface and the component without causing voids. It is intended to prevent the bumps holding the components from being combined and short-circuited.

In order to achieve the above object, the present invention provides:
A wiring board having a plurality of terminal pads exposed on the substrate surface;
A plurality of components mounted on the terminal pads;
A component mounting substrate filled with resin between the substrate surface and the component,
A plurality of a pair of terminal pads on which the component is mounted;
The substrate surface extends between the pair of terminal pads in a crossing direction intersecting with a first arrangement direction in which the terminal pads constituting the pair of terminal pads are arranged, and from a center portion toward an end portion. A first groove portion having an enlarged width in the first arrangement direction is formed ,
Both ends of the first groove are formed outward from the projection area of the component,
The component mounting board according to claim 1, wherein a shape of one end side of the first groove portion from the center portion and a shape of the first groove portion on the other end side from the center portion are the same .

  According to the present invention, the surface of the wiring board extends in a direction (crossing direction) intersecting with a direction defined by the pair of terminal pads (first arrangement direction in which the terminal pads constituting the pair of terminal pads are arranged). Thus, the groove portion is formed, and the width in the first arrangement direction of the groove portion is expanded at the end portion compared to the central portion, that is, narrowed from the end portion toward the central portion (along the cross direction), The resin introduced into the end portion of the groove part flows to the center part of the groove part as air in the resin escapes from the end part toward the center part.

  Since the width of the groove portion is larger at the end than the center portion, when the resin is injected and filled between the surface of the wiring board and the component using, for example, a dispenser, the resin is initially It will be introduced into the end portion where the width of the groove portion is enlarged. At this time, since the width of the central portion of the groove portion is narrower than that of the end portion, the resin introduced into the end portion of the groove portion is in a state in which the air in the resin escapes from the end portion toward the central portion. Will be introduced. Therefore, the resin can be injected and filled with a sufficient amount of resin between the substrate surface and the component without any void between the substrate surface and the component by way of the groove.

  In one example of the present invention, the side surface of the groove can be configured as a continuous surface. In this case, the above-described resin flow resistance is further reduced. As a result, the resin can be quickly and smoothly introduced into the groove.

Moreover, in this invention, the both ends of a groove part are formed outside from the projection area | region of components. In this case, since the end portion of the groove portion is exposed to the outside of the component, the resin can be easily introduced into the groove portion through the end portion, and as a result, the above-described effects are obtained. Can be played more remarkably.

Moreover, in this invention, the shape of the one end side from the center part of a groove part and the shape in the other end side from a center part are made the same. In this case, since a uniform amount of resin can be introduced from the end portions located on both sides of the groove portion to the central portion at a uniform speed, voids are generated in the region between the substrate surface and the component center. Can be suppressed.

  Furthermore, in an example of the present invention, the angle formed between the side surface and the bottom surface of the groove portion can be an obtuse angle. In this case, since the resin can be sufficiently introduced at the boundary portion between the bottom surface and the side surface of the groove, generation of voids at the boundary portion can be suppressed.

  In one example of the present invention, the side surface of the groove can be a roughened surface. In this case, since the adhesion between the side surface of the groove and the resin injected into the groove is improved, even when a thermal history is applied to the groove, the solder flows between the groove and the resin. A short circuit between the bumps to be held can be prevented.

  Furthermore, in an example of the present invention, the second groove portion is formed between the pair of terminal pads on the substrate surface and extends in the intersecting direction, and the width in the first arrangement direction is increased from one end side to the other end side. The first groove portion and the second groove portion are arranged in the intersecting direction, and the end portion of the first groove portion and the other end portion of the second groove portion are adjacent to each other between the adjacent first groove portion and second groove portion. Can be made. In this case, since the end portion of the first groove portion and the end portion of the second groove portion are brought close to each other, workability at the time of resin injection is improved.

  The second groove portion can also be configured as a continuous surface on the side surface of the groove portion as in the first groove portion, and both end portions of the groove portion can be formed outward from the projection region of the component. Further, both end portions of the groove portion can be formed outward from the component projection region, and the side surface of the groove portion can be a roughened surface.

  As described above, according to the present invention, in a component mounting board in which a component is mounted via a terminal pad exposed on the substrate surface, a sufficient amount is generated without generating a void between the substrate surface and the component. The sealing resin is injected and filled, and the bumps holding the components are bonded to each other to prevent a short circuit.

It is a top view of the component mounting board in an embodiment. It is sectional drawing at the time of cutting the component mounting board | substrate shown in FIG. 1 along the II line. It is a figure which expands and shows the part shown by the area | region A of the component mounting board | substrate shown in FIG. It is a figure which shows the state of the cross section of the groove part formed in the component mounting board | substrate shown in FIG. It is a figure which expands and shows the part shown by the area | region B of the component mounting board | substrate shown in FIG. It is one process figure in the manufacturing method of the component mounting board | substrate in embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Component mounting board)
FIG. 1 is a top plan view of a component mounting board in the present embodiment, FIG. 2 is a cross-sectional view taken along the line II of the component mounting board shown in FIG. 1, and FIG. It is a figure which expands and shows the part shown by the area | region A of the component mounting board | substrate shown in FIG. 4 is a diagram showing a cross-sectional state of the groove formed in the component mounting board shown in FIG. 1, and FIG. 5 is an enlarged view showing a portion indicated by region B of the component mounting board shown in FIG. It is.

  As shown in FIG. 2, the wiring board 10 constituting the component mounting board 1 of this embodiment includes a heat resistant resin plate (for example, bismaleimide-triazine resin plate) and a fiber reinforced resin plate (for example, glass fiber reinforced epoxy resin). It has the plate-shaped core 101 comprised by these.

  The plate-like core 101 is formed with a through-hole 111 drilled by a drill or the like, and a through-hole conductor 112 is formed on the inner wall surface thereof. Further, the through hole 111 is filled with a resin filling material 114 such as an epoxy resin.

  A core conductor layer M1 is formed on the front surface 101A of the plate-like core 101, and a core conductor layer M11 is formed on the back surface 101B of the plate-like core 101. The core conductor layers M1 and M11 are formed as a plane conductor pattern that covers most of the front surface 101A and the back surface 101B of the plate-like core 101, and are used as a power supply layer or a ground layer, as well as the first via pad 121 and the second via pad. 122 is configured.

  In the present embodiment, as shown in FIG. 2, a part of the first via pad 121 and the second via pad 122 is formed so as to be connected to the through-hole conductor 112.

  A first insulating layer 131 is formed on the surface 101A of the plate-shaped core 101 so as to cover the core conductor layer M1, and on the back surface 101B of the plate-shaped core 101, the core conductor layer M11 is covered. A second insulating layer 132 is formed.

  On the first insulating layer 131 and the second insulating layer 132, first conductor layers M2 and M12 are formed, respectively. The first conductor layers M2 and M12 constitute a wiring layer (wiring pattern) (not shown), and constitute a third via pad 123, a receiving pad 125, and a fourth via pad 124, respectively. The receiving pad 125 is used to prevent the irradiated laser beam from reaching the first insulating layer 131 located below when the grooves 16 and 17 described below are formed by laser irradiation. is there.

  A third insulating layer 133 and a fourth insulating layer 134 are formed on the first insulating layer 131 and the second insulating layer 132 so as to cover the first conductor layers M2 and M12, respectively. Yes.

  Further, second conductor layers M3 and M13 are formed on the third insulating layer 133 and the fourth insulating layer 134, respectively. The second conductor layers M3 and M13 constitute a wiring layer (wiring pattern) (not shown), and constitute a first metal pad (terminal pad) 141 and a second metal pad (terminal pad) 142, respectively.

  In addition, the first resist layer 161 and the second resist layer are formed on the third insulating layer 133 and the fourth insulating layer 134 so as to cover the first metal pad 141 and the second metal pad 142, respectively. 162 is formed. Note that openings 161A and 162A are formed in the first resist layer 161 and the second resist layer 162, respectively, and the first metal pad 141 and the second metal pad are formed through the openings 161A and 162A. 142 is exposed.

  Via holes 131A and 132A are formed in the first insulating layer 131 and the second insulating layer 132, respectively, and a first via conductor 151 and a second via conductor 152 are formed in these via holes, The first via pad 121 and the third via pad 123 and the second via pad 122 and the fourth via pad 124 are electrically connected.

  Via holes 133A and 134A are formed in the third insulating layer 133 and the fourth insulating layer 134, respectively, and a third via conductor 153 and a fourth via conductor 154 are formed in these via holes, The third via pad 123 and the first metal pad 141 and the fourth via pad 124 and the second metal pad 142 are electrically connected.

  Further, the component 12 is mounted on the first metal pad 141 via the solder layer 18, and the component 13 is mounted via a solder layer (not shown).

  As shown in FIGS. 1 and 2, the substrate surface 10 </ b> A composed of the surface of the resist layer 161 of the wiring substrate 10 and the surface of the first metal pad 141 exposed from the opening 161 </ b> A of the resist layer 161 is formed on the substrate surface 10 </ b> A. As described above, a plurality of components 12 and 13 are mounted via the first metal pad 141, and the semiconductor chip 11 is mounted at substantially the center thereof. The semiconductor chip 11 and the parts 12 and 13 are electrically connected by a wiring pattern 15 constituted by the first metal pads 141.

  The second metal pad 142 formed so as to be exposed from the opening 162A of the second resist layer 162 on the back surface side of the wiring substrate 10 is a back surface land (for connecting the wiring substrate 10 to the mother board). LGA pad).

  The through-hole conductor 112, the core conductors M1 and M11, the first conductor layers M2 and M12, and the second conductor layers M3 and M13 can each be composed of a good electrical conductor such as gold, silver, or copper. Further, the first via conductor 151 to the fourth via conductor 154 can also be composed of good electrical conductors such as gold, silver, and copper. However, in general, it can be easily formed by a plating method and is made of copper because it is inexpensive.

  The first insulating layer 131 to the fourth insulating layer 134 can be made of, for example, a thermosetting resin.

  Further, in this embodiment, reference numerals “12” and “13” are given to parts, but the parts 12 and 13 may be of the same type or of different types. There may be. As described above, different reference numerals are given to parts for the sake of convenience in order to explain the characteristics of the groove shape described below in relation to the parts.

  Furthermore, the components 12 and 13 can be passive components such as capacitors and resistors, for example.

  As shown in FIGS. 2 and 3, the direction defined by the pair of terminal pads 141 (the terminals constituting the pair of terminal pads is formed on the lower portion of the component 12, that is, on the surface 10 </ b> A of the wiring substrate 10 facing the component 12. A groove 16 (first groove) extending in a direction (crossing direction) intersecting with the first arrangement direction (pads 141) is formed. The width of the groove 16 in the first arrangement direction is enlarged at the end compared to the center, that is, narrows from the end toward the center (along the crossing direction) and penetrates the first resist layer 161. It is formed with the depth to be.

  The width of the groove portion 16 is increased from the central portion 16A toward the end portion 16B (along the crossing direction). When the resin is injected and filled between the surface 10A of the wiring board 10 and the component 12, for example, a dispenser is used. However, the resin is filled through the groove portion 16.

  The width of the groove portion 16 is enlarged at the end portion 16B as compared with the central portion 16A. That is, the central portion 16A is narrowed compared with the end portion 16B, and thus the groove portion 16 is introduced into the end portion 16B of the groove portion 16. As the resin is moved from the end portion 16B toward the central portion 16A, air in the resin escapes and flows to the central portion 16A of the groove portion 16.

  Therefore, since the resin is introduced between the substrate surface 10A and the component 12 in a state in which the air in the resin has escaped through the groove portion 16, there is no void between them. A sufficient amount of resin can be injected and filled, and the solder layers (bumps) 18 holding the component 12 can be prevented from being bonded and short-circuited.

  Further, in this embodiment, since the side surface 16C of the groove portion 16 is configured as a continuous surface, the above-described resin flow resistance is further reduced, and the resin can be more quickly and quickly transferred to the central portion 16A of the groove portion 16. It can be introduced smoothly. As a result, the substrate surface 10A and the component 12 can be quickly and smoothly introduced without generating voids.

  Furthermore, in the present embodiment, the end 16B of the groove 16 is positioned outward from the projection region of the component 12 on the substrate surface 10A, so that the end 16B is positioned outward of the component 12. become. Therefore, it becomes possible to easily introduce the resin into the groove portion 16 via the end portion 16B, and as a result, the above-described operational effects can be more remarkably exhibited.

  In the present embodiment, the shape of the groove portion 16 on the one end side from the central portion 16A and the shape on the other end side from the central portion 16A are the same, so the end portion 16B located on both sides of the groove portion 16 from the end portion 16B to the central portion 16A. A uniform amount of resin can be introduced at a uniform speed, and the generation of voids in the region between the substrate surface 12 and the center of the component 12 can be suppressed.

  In the present embodiment, as shown in FIG. 4, the angle formed between the side surface 16C and the bottom surface 16D of the groove portion 16 can be an obtuse angle. In this case, since the resin can be sufficiently introduced at the boundary portion between the bottom surface 16D and the side surface 16C of the groove portion 16, generation of voids at the boundary portion can be suppressed.

  In the present embodiment, the side surface 16C of the groove 16 can be a roughened surface. In this case, since the adhesiveness between the side surface 16C of the groove 16 and the resin injected into the groove is improved, solder flows between the groove 16 and the resin even when a thermal history is applied to the groove 16. Therefore, short circuit between the solder layers (bumps) 18 holding the component 12 can be prevented.

  In order to make the side surface 16C of the groove portion 16 rough, a desmear treatment is performed after the groove portion 16 is formed by laser processing.

  The ratio of the width of the central portion 16A to the width of the end portion 16B of the groove portion 16 is not particularly limited as long as the above-described effects are achieved. For example, the width of the narrowest central portion 16A is “1”. In this case, the width of the widest end portion 16B can be in the range of 1.5 to 5.0. The specific width is determined in consideration of the size of the wiring board 10 and the size of the component 12. The depth of the groove 16 is determined depending on the laser irradiation output and the number of times of irradiation and the position where the receiving pad 125 is formed when the groove 16 is formed by laser irradiation.

  Further, in the present embodiment, as shown in FIG. 5, in the direction intersecting the direction (first arrangement direction) defined by the pair of terminal pads 141 on which the component 12 is mounted on the substrate surface 10 </ b> A, The components 13 to be mounted on the terminal pads 141 are arranged, and the end 16B and the end 17A of the groove 16 formed so as to face the component 12 are close to each other so that the end 17B faces the component 13 and the groove 17 (Second groove portion) is formed. In this case, since the end portion 16B of the groove portion 16 and the end portion 17A of the groove portion 17 are close to each other, workability at the time of resin injection is improved.

  Since the groove portion 17 is narrowed in the first arrangement direction from the one end 17A side to the other end 17B side, the resin introduced into the end portion 17A of the groove portion 17 is directed to the opposite end portion 17B. As the air in the resin escapes. Therefore, the resin can be quickly and smoothly introduced between the substrate surface 10A and the component 13 without causing voids, and the solder layers (bumps) holding the component 13 are coupled and short-circuited. The purpose is to prevent.

  In addition, although not shown in particular, the groove part 17 can also be comprised as a continuous surface. In this case, since the flow resistance of the resin described above is further reduced, the resin is introduced more quickly and smoothly between the substrate surface 10A and the component 13 through the groove portion 17 without generating a void. be able to.

  Further, as shown in FIG. 5, both end portions 17 </ b> A and 17 </ b> B of the groove portion 17 can be formed outward from the projection region of the component 13. In this case, since the end portions 17A and 17B of the groove portion 17 are exposed to the outside of the component 13, the resin can be easily introduced into the groove portion 17 through the end portions 17A and 17B. As a result, the above-described operational effects can be exhibited more remarkably.

  Further, although not particularly illustrated, the angle formed between the side surface and the bottom surface of the groove portion 17 can be made an obtuse angle similarly to the groove portion 16. In this case, since the resin can be sufficiently introduced at the boundary portion between the bottom surface and the side surface of the groove portion 17, generation of voids at the boundary portion can be suppressed.

  Further, similarly to the groove portion 16, the side surface of the groove portion 17 can be a roughened surface. In this case, since the adhesion between the side surface of the groove portion 17 and the resin injected into the groove portion 17 is improved, solder flows between the groove portion 17 and the resin even when a thermal history is applied to the groove portion 17. Therefore, it is possible to prevent a short circuit between the bumps holding the component 13.

(Manufacturing method of component mounting board)
Next, a method for manufacturing the component mounting board shown in FIGS. 6-15 is process drawing in the manufacturing method in this example. In addition, the process drawing shown below shows the sequential process when it sees in the cross section at the time of cutting along the II line | wire of a wiring board equivalent to FIG.

  First, as shown in FIG. 6, a plate-shaped heat-resistant resin plate (for example, bismaleimide-triazine resin plate) or a fiber reinforced resin plate (for example, glass fiber reinforced epoxy resin) is prepared as a core substrate 101, drilling, etc. The through hole 111 is drilled by this method. Next, as shown in FIG. 7, core conductor layers M <b> 1 and M <b> 11 are formed by pattern plating on the front surface 101 </ b> A and the back surface 101 </ b> B of the core substrate 101, and through-hole conductors 112 are formed in the through-holes 111. Is filled with a resin filling material 114.

  Next, after roughening the core conductor layers M1 and M11, as shown in FIG. 8, resin films are formed on the main surfaces 101A and 101B of the core substrate 101 so as to cover the core conductor layers M1 and M11. Are laminated and cured to obtain the first insulating layer 131 and the second insulating layer 132. The resin film may contain a filler as necessary.

  Next, as shown in FIG. 9, the first insulating layer 131 and the second insulating layer 132 are irradiated with laser from their surfaces to form via holes 131A and 132A in a predetermined pattern. Roughening treatment is performed on the first insulating layer 131 and the second insulating layer 132 including 132A. Note that in the case where the first insulating layer 131 and the second insulating layer 132 include a filler, when the roughening treatment is performed on the first insulating layer 131 and the second insulating layer 132 as described above, Since the filler is liberated and remains on the first insulating layer 131 and the second insulating layer 132, water washing is appropriately performed to remove the liberated filler.

  Next, desmear treatment and outline etching are performed to clean the inside of the via holes 131A and 132A. In addition, in this example, since water washing is implemented, the aggregation of the said filler can be suppressed in the case of water washing in a desmear process.

  Moreover, in this example, an air blow can be performed between the water washing by the high water pressure mentioned above and the said desmear process. Thereby, even when the filler liberated by the water washing described above is not completely removed, the removal of the filler can be supplemented in the air blow.

  Next, as shown in FIG. 10, the first conductor layers M2 and M12 and the via conductors 151 and 152 are formed on the first insulating layer 131 and the second insulating layer 132 by pattern plating. The first conductor layer M2 and the like are formed as follows by a semi-additive method or the like. First, for example, after forming an electroless copper plating film on the first insulating layer 131 and the second insulating layer 132, a resist film is formed on the electroless copper plating film, and a photoresist is formed on the resist film. A resist non-formation portion is formed by lithography, and electrolytic copper plating is performed on this resist non-formation portion. The resist can be peeled and removed with KOH or the like to form a patterned first conductor layer M2 or the like.

  Next, after roughening the first conductor layers M2 and M12, the first conductor layers M2 and M12 are formed on the first insulating layer 131 and the second insulating layer 132 as shown in FIG. The third insulating layer 133 and the fourth insulating layer 134 are formed by laminating and curing the resin film so as to cover the film. This resin film may also contain a filler as necessary, as described above.

  Next, as shown in FIG. 12, the third insulating layer 133 and the fourth insulating layer 134 are irradiated with laser from their surfaces to form via holes 133A and 134A in a predetermined pattern, and the via holes 133A and 134A are formed. A roughening process is performed on the third insulating layer 133 and the fourth insulating layer 134 including When the third insulating layer 133 and the fourth insulating layer 134 include a filler, when the roughening treatment is performed on the third insulating layer 133 and the fourth insulating layer 134 as described above, the filler Since it is liberated and remains on the third insulating layer 133 and the fourth insulating layer 134, water washing and air blowing are appropriately performed as described above. Next, the via holes 133A and 134A are subjected to desmear treatment and outer shape etching (outline etching) to clean the via holes 133A and 134A.

  Next, as shown in FIG. 13, the second conductor layers M3 and M13 are formed on the third insulating layer 133 and the fourth insulating layer 134 by pattern plating, and the via conductors 153 and 135 are formed in the via holes 133A and 134A. 154 is formed.

  After that, as shown in FIG. 14, the first metal pad 141 and the second metal pad 142 in the second conductor layers M3 and M13 are exposed on the third insulating layer 133 and the fourth insulating layer 134. First resist layers 161 and 162 having such openings 161A and 162A are formed.

Next, as shown in FIG. 15, the surface of the third insulating layer 133 is partially irradiated with CO ₂ laser so as to penetrate the first resist layer 161. On the other hand, the groove 16 and the groove 17 are formed. When forming the grooves 16 and 17, the irradiation position of the CO ₂ laser spot is adjusted as appropriate, and the groove 16 as shown in FIG. The groove portion 17 is formed so that the width is narrowed from the one end 17A side to the other end 17B side.

  As described above, in order to make the side surfaces of the groove 16 and / or the groove 17 roughened, the desmear treatment is performed after the grooves 16 and 17 are formed by laser irradiation as described above.

  Thereafter, the components 12 and 13 are supported by the solder layers 18 and 19 so as to straddle the grooves 16 and 17 and are electrically connected to the first metal pads 141 through the solder layers 18 and 19. Thus, the components 12 and 13 can be mounted so that the grooves 16 and 17 are present below, and the component mounting board 1 as shown in FIGS. 1 to 3 can be obtained.

  The present invention has been described in detail with specific examples. However, the present invention is not limited to the above contents, and various modifications and changes can be made without departing from the scope of the present invention.

  For example, in the above specific example, the wiring board 10 includes the core conductor layers M1 and M11, the first conductor layers M2 and M12, and the second conductor layers M3 and M13 on both surfaces of the core board 101. Insulating layer 131 to fourth insulating layer 134 are provided, and on one side of core substrate 101, there are three conductor layers and two insulating layers, but the number of conductor layers and insulating layers is also necessary. Depending on the number, it can be any number.

1 Component mounting board 10 Wiring board,
11 Semiconductor chip 12, 13 Parts 15 Wiring pattern 16, 17 Groove

Claims (5)

A wiring board having a plurality of terminal pads exposed on the substrate surface;
A plurality of components mounted on the terminal pads;
A component mounting substrate filled with resin between the substrate surface and the component,
A plurality of a pair of terminal pads on which the component is mounted;
The substrate surface extends between the pair of terminal pads in a crossing direction intersecting with a first arrangement direction in which the terminal pads constituting the pair of terminal pads are arranged, and from a center portion toward an end portion. A first groove portion having an enlarged width in the first arrangement direction is formed ,
Both ends of the first groove are formed outward from the projection area of the component,
The component mounting board according to claim 1, wherein a shape of one end side of the first groove portion from the center portion and a shape of the first groove portion on the other end side from the center portion are the same .   The component mounting board according to claim 1, wherein a side surface of the first groove is configured as a continuous surface. Wherein the angle between the side surface and the bottom surface of said first groove is an obtuse angle, the component mounting board according to claim 1 or 2. The first groove side surface is characterized by a roughened surface, component mounting board according to claim 1. On the surface of the substrate, a second groove is formed between the pair of terminal pads, extending in the intersecting direction, and having an enlarged width in the first arrangement direction from one end side to the other end side,
The first groove portion and the second groove portion are arranged in the intersecting direction,
For the first groove adjacent the second groove, and the other end of the first groove end the second groove is characterized by comprising in proximity, according to any of claims 1 to 4 Component mounting board.

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