JP2012191084A - Component mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inject a sufficient amount of sealing resin between the board surface and a component and to fill that space with the sealing resin without generating any void, in a wiring board on the surface of which an electronic component is mounted via terminal pads exposed to the board surface.SOLUTION: The component mounting board comprises a wiring board having a plurality of terminal pads exposed to the board surface, and a plurality of components mounted on the terminal pads. The space between the board surface and the component is filled with resin, and a plurality of pairs of terminal pads on which the component is mounted are provided. A first groove extending in a direction intersecting the first arrangement direction of the terminal pads constituting the pair of terminal pads, and a second groove communicating with the first groove and having a width wider than that of the first groove are formed between the pair of terminal pads on the board surface.

Description

  The present invention relates to a component mounting board.

  In recent years, a semiconductor substrate is manufactured by mounting an IC chip on a wiring board formed by laminating at least one conductor layer and an insulating layer, so-called resin wiring board or ceramic board, and sealing the resin. There is a lot going on.

  The IC chip is electrically connected via a terminal pad forming the substrate surface and a plurality of bumps formed on each of the plurality of terminal pads of the IC chip mounting portion. On the other hand, external terminals are formed on the back side of the wiring board to be electrically connected to the base board or inserted into a socket for electrical connection.

  In the semiconductor package as described above, components such as capacitors and resistors for supplying power to the IC chip are electrically connected to the terminal pads of the wiring board via a plurality of bumps on the same substrate surface as the IC chip. In many cases, it is formed so as to be connected.

  When such a semiconductor package is used, the IC chip or component mounted on the substrate generates heat, so that the IC chip or component is repeatedly heated and cooled by repeated use of the semiconductor package. As a result, bumps that connect IC chips and components to the wiring pattern on the substrate surface expand or partially dissolve. Especially, in bumps of components that are smaller than IC chips, adjacent bumps are combined, There may be a short circuit.

  Therefore, when a structure in which an IC chip or component is mounted on the surface of the substrate is resin-sealed to form a semiconductor package, the upper surface and side surfaces of the IC chip and component are covered with resin and embedded. In particular, it is required to inject a resin also into the lower surface side of the component, and to prevent the bumps holding the component from being joined and short-circuited by the injected resin.

  However, when the resin is supplied using a dispenser or the like and the resin is sealed by this, the resin cannot be sufficiently injected into the lower surface side of the component, and the lower surface side of the component is filled. In some cases, voids are generated in the resin. When this void becomes a certain size, a region where no resin exists between adjacent bumps is formed, and the bumps are partially coupled through the region as described above, resulting in a short circuit. There is. Therefore, when manufacturing a semiconductor package by sealing with resin, it is necessary to sufficiently inject and fill the resin on the lower surface side of the component so as not to generate voids.

  In view of such a problem, in Patent Document 1, a groove having a uniform width is formed in the length direction of the component at a position on the substrate surface facing the component, and a sufficient amount of resin is formed on the lower surface side of the component. Techniques for filling the are disclosed. Patent Documents 2 and 3 also disclose that a groove having a uniform width in the length direction of a component is formed at a position facing the component on the substrate surface, although the purpose is different.

  However, even with these techniques, a sufficient amount of resin cannot be filled on the lower surface side of the component, and generation of voids cannot be sufficiently suppressed.

JP 2006-5112 A JP 2003-46216 A JP 2008-244044 A

  The present invention provides a component mounting substrate in which components are mounted via terminal pads exposed on the substrate surface, and a sufficient amount of sealing resin is injected and filled between the substrate surface and the component without causing voids. It is intended to prevent the bumps holding the components from being combined and short-circuited.

In order to achieve the above object, the present invention provides:
A wiring board having a plurality of terminal pads exposed on the substrate surface;
A plurality of components mounted on the terminal pads;
A component mounting substrate filled with resin between the substrate surface and the component,
A plurality of a pair of terminal pads on which the component is mounted;
A first groove extending between the pair of terminal pads and extending in an intersecting direction intersecting a first arranging direction in which the terminal pads constituting the pair of terminal pads are arranged on the substrate surface;
The present invention relates to a component mounting board characterized in that a second groove portion is formed which communicates with the first groove portion and has a width larger than the width of the first groove portion.

  According to the present invention, when a plurality of terminal pads are provided on the surface of the substrate constituting the wiring board, and a plurality of pairs of terminal pads are selected from the plurality of terminal pads and components are mounted on each pair of terminal pads, The first groove portion is formed between the pair of terminal pads on the surface of the substrate, in the first arrangement direction in which the terminal pads are arranged, that is, in at least a part facing the component, and communicated with the first groove portion. A second groove part having a larger width than the groove part is formed. In this case, when injecting and filling the resin between the substrate surface and the component, for example, using a dispenser, the resin is filled between the substrate surface and the component via the groove. Become.

  The resin will be introduced into the second groove part that is initially enlarged in the width of the groove part. Since the width of the second groove portion is larger than that of the first groove portion that communicates with the first groove portion, the resin introduced into the second groove portion increases in flow rate when introduced into the first groove portion, and the resin flows. It becomes easy. As a result, the resin introduced into the second groove portion flows quickly over the entire groove portion due to the increase in the flow rate described above.

  Therefore, since the resin is introduced quickly and smoothly between the substrate surface and the component through the groove portion, a sufficient amount of resin is injected between these without causing a void. In addition, the bumps holding the components can be bonded to each other and can be prevented from being short-circuited.

  In one example of the present invention, the second groove portion can be formed outward from the projection area of the component. In this case, since the second groove portion is exposed outward from the projection region of the component, the resin can be easily introduced into the groove portion via the second groove portion, and as a result, the above-described result is obtained. The effect can be more remarkably exhibited.

  Furthermore, in an example of the present invention, a plurality of pairs of terminal pads can be arranged in the first arrangement direction, and a plurality of second groove portions formed can be arranged linearly in the first arrangement direction. In this case, a plurality of pairs of terminal pads are provided on the substrate surface, and are arranged in the first arrangement direction on the substrate surface, that is, in the vertical direction or the horizontal direction, and components are mounted on each of the plurality of pairs of terminal pads. In some cases, the first groove portion may be formed on at least a part of the substrate surface facing each of the plurality of components, and the second groove portion communicates with each of the plurality of formed first groove portions. It is formed.

  Therefore, even when a plurality of pairs of terminal pads are formed on the substrate surface and components are mounted on the pair of terminal pads, the first groove portion and the first groove portion communicate with each component and the substrate surface. A second groove having a larger width than the first groove can be formed.

  As a result, as described above, the resin introduced into the second groove portion increases in flow rate when introduced into the first groove portion, and the resin easily flows. Therefore, the resin introduced into the second groove portion flows rapidly over the entire groove portion due to the increase in the flow rate described above. For this reason, the resin can be quickly and smoothly introduced between each component and the substrate surface without generating a void, and the bumps holding the components can be prevented from being joined and short-circuited. . Further, since the plurality of second groove portions are linearly arranged, for example, the resin can be injected into the second groove portion only by moving the dispenser in a straight line, so that workability at the time of resin filling can be improved.

  Furthermore, in an example of the present invention, a plurality of pairs of terminal pads may be arranged in the intersecting direction, and at least two of the plurality of second grooves formed may communicate with each other. In this case, a plurality of pairs of terminal pads are provided on the surface of the substrate, and are arranged in the crossing direction of the substrate surface, that is, in the vertical direction or the horizontal direction, and components are mounted on each of the plurality of pairs of terminal pads The first groove portion can be formed on at least a part of the substrate surface facing each of the plurality of components, and the second groove portion is formed to communicate with each of the plurality of formed first groove portions. Is done.

  Even in this case, a plurality of pairs of terminal pads are formed on the substrate surface, and even when components are mounted on the pair of terminal pads, a plurality of pairs of terminal pads are formed on the substrate surface. Even when a component is mounted on the first groove portion, a first groove portion is formed between each component and the substrate surface, and a second groove portion having a larger width than the first groove portion communicating with the first groove portion can be formed. it can.

  Therefore, as described above, when the resin introduced into the second groove portion is introduced into the first groove portion, the flow rate increases and the resin easily flows. As a result, the resin introduced into the second groove portion flows quickly over the entire groove portion due to the increase in the flow rate described above. For this reason, the resin can be quickly and smoothly introduced between each component and the substrate surface without causing voids, and bumps holding the components can be prevented from being joined and short-circuited.

  In addition, since at least two of the second groove portions communicate with each other, when mounting a component on each of the plurality of pairs of terminal pads and each of the plurality of pairs of terminal pads, the plurality of pairs of pairs When the arrangement of the terminal pad and the component to be mounted is the same as the arrangement (formation) direction of the first groove portion and the second groove portion, each pair of terminal pad and component shares one second groove portion. Can do. Therefore, the groove forming process can be simplified. Further, in the case where at least two of the second groove portions communicate with each other, only the resin is injected into one second groove portion, and the other second groove portion communicated with the second groove portion into which the resin has been injected is added. Since the resin flows, the operation of injecting the resin into all the second groove portions communicating with the first groove portion can be omitted, and the workability at the time of resin injection can be improved.

  In an example of the present invention, a plurality of parts can be arranged in a straight line, and the plurality of second grooves formed can be arranged in a straight line in the direction in which the plurality of parts are arranged. Also in this case, when the plurality of pairs of terminal pads are provided on the substrate surface and arranged in the vertical direction or the horizontal direction, and the components are mounted on each of the plurality of pairs of terminal pads, the first groove portion Can be formed on at least a part of the substrate surface facing each of the plurality of components, and the second groove portion is formed so as to communicate with each of the plurality of formed first groove portions.

  In this case, even when a plurality of pairs of terminal pads are formed on the substrate surface and components are mounted on the pair of terminal pads, a first groove is formed between each component and the substrate surface. A second groove part having a larger width than the first groove part communicating with the groove part can be formed.

  Therefore, as described above, when the resin introduced into the second groove portion is introduced into the first groove portion, the flow rate increases and the resin easily flows. As a result, the resin introduced into the second groove portion flows quickly over the entire groove portion due to the increase in the flow rate described above. For this reason, the resin can be quickly and smoothly introduced between each component and the substrate surface without generating a void, and the bumps holding the components can be prevented from being joined and short-circuited. .

  Also in the above example, at least two of the plurality of second grooves formed can be communicated with each other. In this case, when mounting components on the plurality of pairs of terminal pads and each of the plurality of pairs of terminal pads, the plurality of pairs of terminal pads and the arrangement of components to be mounted are the first groove portion and the second groove portion. In this case, each pair of terminal pads and components can share one second groove portion. Therefore, the groove forming process can be simplified.

In the above description, the case where there are a plurality of parts has been described, but the present invention can also be applied to a case where there is a single part. The component mounting board in this case is
A wiring board having a plurality of terminal pads exposed on the substrate surface;
A component mounted on the terminal pad,
A component mounting substrate filled with resin between the substrate surface and the component,
On the surface of the substrate, a first groove extending between a pair of terminal pads on which the component is mounted and extending in an intersecting direction intersecting a first arrangement direction in which the terminal pads constituting the pair of terminal pads are arranged. When,
A second groove portion communicating with the first groove portion and having a larger width than the first groove portion;
It is characterized by including.

  As described above, according to the present invention, in the component mounting board in which the component is mounted through the terminal pad exposed on the substrate surface of the wiring board, no void is generated between the substrate surface and the component. A sufficient amount of sealing resin can be injected and filled to prevent the bumps holding the components from being joined and short-circuited.

It is a top view of the component mounting board in an embodiment. It is sectional drawing at the time of cutting the component mounting board | substrate shown in FIG. 1 along the II line. It is sectional drawing at the time of cutting the component mounting board | substrate shown in FIG. 1 along the II-II line. It is a figure which expands and shows the part shown by the area | region A of the component mounting board | substrate shown in FIG. It is a figure which expands and shows the part shown by the area | region B of the component mounting board | substrate shown in FIG. It is one process figure in the manufacturing method of the component mounting board | substrate in embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment. Similarly, it is one process figure in the manufacturing method of the component mounting board in an embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Component mounting board)
FIG. 1 is a top plan view of a component mounting board in the present embodiment, FIG. 2 is a cross-sectional view taken along the line II of the component mounting board shown in FIG. 1, and FIG. It is sectional drawing at the time of cutting along the II-II line of the component mounting board | substrate shown in FIG. 4 is an enlarged view of a portion indicated by region A of the component mounting board shown in FIG. 1, and FIG. 5 is an enlarged view of a portion indicated by region B of the component mounting board shown in FIG. is there. 2 and 3, the number of electronic components (components) is reduced from 3 to 2 to clarify the internal structure of the component mounting board in order to clarify the characteristics of the component mounting board of this embodiment. It is described as.

  As shown in FIGS. 2 and 3, the wiring board 10 constituting the component mounting board 1 of the present embodiment includes a heat-resistant resin plate (for example, bismaleimide-triazine resin plate) or a fiber reinforced resin plate (for example, glass fiber reinforced). It has a plate-like core 101 made of an epoxy resin or the like.

  The plate-like core 101 is formed with a through-hole 111 drilled by a drill or the like, and a through-hole conductor 112 is formed on the inner wall surface thereof. Further, the through hole 111 is filled with a resin filling material 114 such as an epoxy resin.

  A core conductor layer M1 is formed on the front surface 101A of the plate-like core 101, and a core conductor layer M11 is formed on the back surface 101B of the plate-like core 101. The core conductor layers M1 and M11 are formed as a plane conductor pattern that covers most of the front surface 101A and the back surface 101B of the plate-like core 101, and are used as a power supply layer or a ground layer, as well as the first via pad 121 and the second via pad. 122 is configured.

  In the present embodiment, as shown in FIG. 2, a part of the first via pad 121 and the second via pad 122 is formed so as to be connected to the through-hole conductor 112.

  A first insulating layer 131 is formed on the surface 101A of the plate-shaped core 101 so as to cover the core conductor layer M1, and on the back surface 101B of the plate-shaped core 101, the core conductor layer M11 is covered. A second insulating layer 132 is formed.

  On the first insulating layer 131 and the second insulating layer 132, first conductor layers M2 and M12 are formed, respectively. The first conductor layers M2 and M12 constitute a wiring layer (wiring pattern) (not shown), and constitute a third via pad 123, a receiving pad 125, and a fourth via pad 124, respectively. The receiving pad 125 is used to prevent the irradiated laser beam from reaching the first insulating layer 131 located below when the grooves 16 and 17 described below are formed by laser irradiation. is there.

  A third insulating layer 133 and a fourth insulating layer 134 are formed on the first insulating layer 131 and the second insulating layer 132 so as to cover the first conductor layers M2 and M12, respectively. Yes.

  Further, second conductor layers M3 and M13 are formed on the third insulating layer 133 and the fourth insulating layer 134, respectively. The second conductor layers M3 and M13 constitute a wiring layer (wiring pattern) (not shown), and constitute a first metal pad (terminal pad) 141 and a second metal pad (terminal pad) 142, respectively.

  In addition, the first resist layer 161 and the second resist layer are formed on the third insulating layer 133 and the fourth insulating layer 134 so as to cover the first metal pad 141 and the second metal pad 142, respectively. 162 is formed. Note that openings 161A and 162A are formed in the first resist layer 161 and the second resist layer 162, respectively, and the first metal pad 141 and the second metal pad are formed through the openings 161A and 162A. 142 is exposed.

  Via holes 131A and 132A are formed in the first insulating layer 131 and the second insulating layer 132, respectively, and a first via conductor 151 and a second via conductor 152 are formed in these via holes, The first via pad 121 and the third via pad 123 and the second via pad 122 and the fourth via pad 124 are electrically connected.

  Via holes 133A and 134A are formed in the third insulating layer 133 and the fourth insulating layer 134, respectively, and a third via conductor 153 and a fourth via conductor 154 are formed in these via holes, The third via pad 123 and the first metal pad 141 and the fourth via pad 124 and the second metal pad 142 are electrically connected.

  As shown in FIG. 2, the electronic component 12 is mounted on the first metal pad 141 via the solder layer 18.

  As shown in FIGS. 1 and 2, the lateral direction of the substrate surface 10 </ b> A formed by the surface of the resist layer 161 of the wiring substrate 10 and the surface of the first metal pad 141 exposed from the opening 161 </ b> A of the resist layer 161 ( A plurality of electronic components 12 are mounted via the solder layer 18 in the first arrangement direction). As shown in FIGS. 1 and 5, a plurality of electronic components 13 are mounted via solder layers 19 in the vertical direction (cross direction) of the substrate surface 10 </ b> A of the wiring substrate 10. Further, a semiconductor chip 11 is mounted at a substantially central portion of the substrate surface 10A. The semiconductor chip 11 and the electronic components 12 and 13 are electrically connected by a wiring pattern 15 constituted by the first metal pads 141.

  The second metal pad 142 formed so as to be exposed from the opening 162A of the second resist layer 162 on the back surface side of the wiring substrate 10 is a back surface land (for connecting the wiring substrate 10 to the mother board). LGA pad).

  The through-hole conductor 112, the core conductors M1 and M11, the first conductor layers M2 and M12, and the second conductor layers M3 and M13 can each be composed of a good electrical conductor such as gold, silver, or copper. Further, the first via conductor 151 to the fourth via conductor 154 can also be composed of good electrical conductors such as gold, silver, and copper. However, in general, it can be easily formed by a plating method and is made of copper because it is inexpensive.

  The first insulating layer 131 to the fourth insulating layer 134 can be made of, for example, a thermosetting resin.

  In the present embodiment, reference numerals “12” and “13” are attached to the electronic components. However, the electronic components 12 and 13 may be of the same type or different types. It may be a thing. As described above, the different reference numerals are given to the electronic components because the arrangement of the groove portions described below is performed for convenience in order to explain in relation to the electronic components.

  Furthermore, the electronic components 12 and 13 can be passive components such as capacitors and resistors, for example.

  As shown in FIGS. 2 and 4, in the wiring board 10 constituting the component mounting board 1 of the present embodiment, three pairs of metal pads 141 are arranged in the lateral direction of the board surface 10A. An electronic component 12 is mounted on each of the metal pads 141, and thereby three electronic components 12 are arranged in the lateral direction of the substrate surface 10A.

  A groove 16 is formed in the lower part of each electronic component 12, that is, on the surface 10 </ b> A of the wiring substrate 10 facing each electronic component 12 so as to penetrate the first resist layer 161.

  The groove portion 16 is provided at a first groove portion 16A having a first width h1 and an end portion of the first groove portion 16A, and communicates with the first groove portion 16A, and is a second larger than the width h1 of the first groove portion 16A. And a second groove portion 16B having a width H1. Further, as shown in FIG. 3, the second groove portion 16 </ b> B is formed outward from the projection area of each electronic component 12 and is exposed to the outside of each electronic component 12.

  Injecting and filling the resin 16c between the surface 10A of the wiring board 10 and each electronic component 12, for example, using a dispenser, the resin is filled via the second groove 16B. .

  Since the second groove portion 16B is enlarged as compared with the width h1 of the first groove portion 16A with which the width H1 communicates, the resin 16c introduced into the second groove portion 16B is introduced into the first groove portion 161. The flow rate increases and the resin easily flows. As a result, the resin introduced into the second groove portion 16B quickly flows over the entire groove portion 16 due to the increase in the flow rate described above.

  Therefore, the resin 16c is introduced quickly and smoothly between each electronic component 12 and the substrate surface 10A through the groove 16, so that sufficient voids are not generated between them. An amount of resin can be injected and filled, and the solder layers (bumps) 18 holding the electronic component 12 can be prevented from being bonded and short-circuited.

  In the present embodiment, the second groove portion 16B is formed outside the projection area of each electronic component 12 in the width direction of each electronic component 12, and is exposed to the outside of each electronic component 12. The resin 16c can be easily introduced into the groove portion 16 via the second groove portion 16B, and as a result, the above-described effects can be more remarkably exhibited.

  In the present embodiment, the width direction of the electronic component means the direction on the short side of the electronic component, and the length direction of the electronic component means the direction on the long side of the electronic component.

  Further, as shown in FIGS. 3 and 5, in the wiring board 10 of the present embodiment, three pairs of metal pads 141 are arranged in the vertical direction of the substrate surface 10A, and each of the three pairs of metal pads 141 is arranged. Are mounted with electronic components 13, whereby three electronic components 13 are arranged in the longitudinal direction of the substrate surface 10 </ b> A.

  Further, a groove portion 17 is formed so as to penetrate the first resist layer 161 on the substrate surface 10A located between the pair of metal pads 141 on which the electronic component 13 is mounted.

  The groove portion 17 is provided at a first groove portion 17A having a first width h2 and an end portion of the first groove portion 17A, communicates with the first groove portion 17A, and is larger than the width h2 of the first groove portion 17A. And a second groove portion 17B having a width H2. Further, the second groove portion 17 </ b> B is formed outside the projection area of each electronic component 13 and is exposed to the outside of each electronic component 13.

  When the resin 17c is injected and filled between the surface 10A of the wiring board 10 and each electronic component 13, for example, a dispenser is used. However, the resin is filled through the second groove portion 17B. .

  Since the second groove portion 17B is enlarged in comparison with the width h2 of the first groove portion 17B with which the width H2 communicates, the resin introduced into the second groove portion 17B flows when introduced into the first groove portion 17A. The speed increases and the resin flows easily. As a result, the resin introduced into the second groove portion 17B quickly flows over the entire groove portion 17 due to the increase in the flow rate described above.

  Therefore, the resin is introduced quickly and smoothly between each electronic component 13 and the substrate surface 10A through the groove portion 17, so that a sufficient amount of the resin does not occur between them. It is possible to inject and fill the resin, and to prevent the solder layers (bumps) 19 holding the electronic component 13 from being bonded and short-circuited.

  In the present embodiment, the second groove portion 17B is formed outside the projection area of each electronic component 13 in the width direction of each electronic component 13, and is exposed to the outside of each electronic component 13. It becomes possible to easily introduce the resin 17c into the groove portion 17 via the second groove portion 17B, and as a result, the above-described effects can be more remarkably exhibited.

  The ratio of the width h1 of the first groove portion 16A and the width H1 of the second groove portion 16B of the groove portion 16 is not particularly limited as long as the above-described effects are achieved. For example, when the width h1 is “1” The width H1 can be in the range of 2-5. The specific width is determined in consideration of the size of the wiring board 10 and the size of the electronic component 12. The depth of the groove 16 is determined depending on the irradiation output and the number of times of irradiation when the groove 16 is formed by laser irradiation.

  Similarly, the ratio of the width h2 of the first groove portion 17A and the width H2 of the second groove portion 17B of the groove portion 17 is not particularly limited as long as the above-described effects are achieved. For example, the width h2 is set to “1”. In this case, the width H2 can be in the range of 2-5. The specific width is determined in consideration of the size of the wiring board 10 and the size of the electronic component 13. In addition, the depth of the groove part 17 is determined depending on irradiation output and the frequency | count of irradiation, when forming the groove part 16 by laser irradiation.

(Manufacturing method of component mounting board)
Next, a method for manufacturing the component mounting board shown in FIGS. 6 to 15 are process diagrams in the manufacturing method of the embodiment. In addition, the process drawing shown below shows the sequential process when it sees in the cross section at the time of cutting along the II line | wire of a wiring board equivalent to FIG.

  First, as shown in FIG. 6, a plate-shaped heat-resistant resin plate (for example, bismaleimide-triazine resin plate) or a fiber reinforced resin plate (for example, glass fiber reinforced epoxy resin) is prepared as a core substrate 101, drilling, etc. The through hole 111 is drilled by this method. Next, as shown in FIG. 7, core conductor layers M <b> 1 and M <b> 11 are formed by pattern plating on the front surface 101 </ b> A and the back surface 101 </ b> B of the core substrate 101, and through-hole conductors 112 are formed in the through-holes 111. Is filled with a resin filling material 114.

  Next, after roughening the core conductor layers M1 and M11, as shown in FIG. 8, resin films are formed on the main surfaces 101A and 101B of the core substrate 101 so as to cover the core conductor layers M1 and M11. Are laminated and cured to obtain the first insulating layer 131 and the second insulating layer 132. The resin film may contain a filler as necessary.

  Next, as shown in FIG. 9, the first insulating layer 131 and the second insulating layer 132 are irradiated with laser from their surfaces to form via holes 131A and 132A in a predetermined pattern. Roughening treatment is performed on the first insulating layer 131 and the second insulating layer 132 including 132A. Note that in the case where the first insulating layer 131 and the second insulating layer 132 include a filler, when the roughening treatment is performed on the first insulating layer 131 and the second insulating layer 132 as described above, Since the filler is liberated and remains on the first insulating layer 131 and the second insulating layer 132, water washing is appropriately performed to remove the liberated filler.

  Next, desmear treatment and outline etching are performed to clean the inside of the via holes 131A and 132A. In addition, in this example, since water washing is implemented, the aggregation of the said filler can be suppressed in the case of water washing in a desmear process.

  Moreover, in this example, an air blow can be performed between the water washing by the high water pressure mentioned above and the said desmear process. Thereby, even when the filler liberated by the water washing described above is not completely removed, the removal of the filler can be supplemented in the air blow.

  Next, as shown in FIG. 10, the first conductor layers M2 and M12 and the via conductors 151 and 152 are formed on the first insulating layer 131 and the second insulating layer 132 by pattern plating. The first conductor layer M2 and the like are formed as follows by a semi-additive method or the like. First, after forming an electroless copper plating film, for example, on the first insulating layer 131 and the second insulating layer 132, a resist is formed on the electroless copper plating film, and an unformed portion of the resist is formed. It forms by performing electrolytic copper plating. The resist can be peeled and removed with KOH or the like to form a patterned first conductor layer M2 or the like.

  Next, after roughening the first conductor layers M2 and M12, the first conductor layers M2 and M12 are formed on the first insulating layer 131 and the second insulating layer 132 as shown in FIG. The third insulating layer 133 and the fourth insulating layer 134 are formed by laminating and curing the resin film so as to cover the film. This resin film may also contain a filler as necessary, as described above.

  Next, as shown in FIG. 12, the third insulating layer 133 and the fourth insulating layer 134 are irradiated with laser from their surfaces to form via holes 133A and 134A in a predetermined pattern, and the via holes 133A and 134A are formed. A roughening process is performed on the third insulating layer 133 and the fourth insulating layer 134 including When the third insulating layer 133 and the fourth insulating layer 134 include a filler, when the roughening treatment is performed on the third insulating layer 133 and the fourth insulating layer 134 as described above, the filler Since it is liberated and remains on the third insulating layer 133 and the fourth insulating layer 134, water washing and air blowing are appropriately performed as described above. Next, the via holes 133A and 134A are subjected to desmear treatment and outer shape etching (outline etching) to clean the via holes 133A and 134A.

  Next, as shown in FIG. 13, the second conductor layers M3 and M13 are formed on the third insulating layer 133 and the fourth insulating layer 134 by pattern plating, and the via conductors 153 and 135 are formed in the via holes 133A and 134A. 154 is formed.

  After that, as shown in FIG. 14, the first metal pad 141 and the second metal pad 142 in the second conductor layers M3 and M13 are exposed on the third insulating layer 133 and the fourth insulating layer 134. First resist layers 161 and 162 having such openings 161A and 162A are formed.

Next, the surface of the third insulating layer 133 is partially irradiated with a CO ₂ laser so as to penetrate the first resist layer 161, so that the grooves 16 and 17 are formed in the third insulating layer 133. Form. When forming the grooves 16 and 17, the irradiation position of the CO ₂ laser spot is appropriately adjusted, and the groove 16 as shown in FIGS. 4 and 5 is provided at the first groove 16 A and its end. The second groove portion 16B provided so as to communicate with each other, and the groove portion 17 includes the first groove portion 17A and the second groove portion 17B provided so as to communicate with the end portion thereof. A wiring substrate 10 shown in FIG.

The receiving pad 125 constituting the first conductor layer M2 prevents the CO ₂ laser from reaching the first insulating layer 131 located below, so that the grooves 16 and 17 are connected to the first resist layer 161. It is formed only on the third insulating layer 133.

  Thereafter, the electronic components 12 and 13 are supported by the solder layers 18 and 19 so as to straddle the grooves 16 and 17, and are electrically connected to the first metal pads 141 through the solder layers 18 and 19. Accordingly, the electronic components 12 and 13 can be mounted so that the groove portions 16 and 17 exist below, and the component mounting board 1 as shown in FIGS. 1 to 3 can be obtained.

  The present invention has been described in detail with specific examples. However, the present invention is not limited to the above contents, and various modifications and changes can be made without departing from the scope of the present invention.

  For example, in the above specific example, the electronic component 12 and the electronic component 13 are arranged three by three in the horizontal direction and the vertical direction of the substrate surface A, respectively, but the number of electronic components can be arbitrarily set as necessary. it can.

  In the above specific example, the case where a plurality of electronic components are mounted has been described, but the same applies to the case where a single electronic component is mounted. That is, even when the single electronic component 12 or 13 is mounted, the same effect can be obtained by forming the first groove portion and the second groove portion as described above on the substrate surface located below these. be able to.

  Further, in the above specific example, the wiring board 10 includes the core conductor layers M1 and M11, the first conductor layers M2 and M12, and the second conductor layers M3 and M13 on both surfaces of the core board 101. Insulating layer 131 to fourth insulating layer 134 are provided, and on one side of core substrate 101, there are three conductor layers and two insulating layers, but the number of conductor layers and insulating layers is also necessary. Depending on the number, it can be any number.

  In the above embodiment, although the shape of the second groove 162 is substantially rectangular, the maximum value of the width along the first arrangement direction of the first groove 161, 171 is the first arrangement direction of the second groove 162, 172. The shape is not particularly limited as long as it is larger than the maximum value of the width along the line, and can be an arbitrary shape such as a polygonal shape or a circular shape.

10 Wiring board,
11 Semiconductor chip 12, 13 Electronic component 15 Wiring pattern 16, 17 Groove

Claims (8)

A wiring board having a plurality of terminal pads exposed on the substrate surface;
A plurality of components mounted on the terminal pads;
A component mounting substrate filled with resin between the substrate surface and the component,
A plurality of a pair of terminal pads on which the component is mounted;
A first groove extending between the pair of terminal pads and extending in an intersecting direction intersecting a first arranging direction in which the terminal pads constituting the pair of terminal pads are arranged on the substrate surface;
A component mounting board, comprising: a second groove portion communicating with the first groove portion and having a width larger than a width of the first groove portion.   The component mounting board according to claim 1, wherein the second groove portion is formed outward from a projection region of the component. A plurality of the pair of terminal pads are arranged in the first arrangement direction;
3. The component mounting board according to claim 1, wherein the plurality of second groove portions formed in a plurality are linearly arranged in the first arrangement direction. 4. A plurality of the pair of terminal pads are arranged in the intersecting direction,
The component mounting board according to claim 1, wherein at least two of the plurality of second groove portions formed in communication with each other. A plurality of the parts are arranged in a straight line,
The component mounting board according to claim 1, wherein the plurality of second groove portions formed in a plurality are linearly arranged in a direction in which the plurality of components are arranged.   6. The component mounting board according to claim 5, wherein at least two of the plurality of second groove portions communicate with each other. A wiring board having a plurality of terminal pads exposed on the substrate surface;
A component mounted on the terminal pad,
A component mounting substrate filled with resin between the substrate surface and the component,
On the surface of the substrate, a first groove extending between a pair of terminal pads on which the component is mounted and extending in an intersecting direction intersecting a first arrangement direction in which the terminal pads constituting the pair of terminal pads are arranged. When,
A second groove portion communicating with the first groove portion and having a larger width than the first groove portion;
A component mounting board comprising:   The component mounting board according to claim 7, wherein the second groove portion is formed outward from a projection region of the component.

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