JP5540905B2 - 電子部品包装用カバーテープ - Google Patents
電子部品包装用カバーテープ Download PDFInfo
- Publication number
- JP5540905B2 JP5540905B2 JP2010127831A JP2010127831A JP5540905B2 JP 5540905 B2 JP5540905 B2 JP 5540905B2 JP 2010127831 A JP2010127831 A JP 2010127831A JP 2010127831 A JP2010127831 A JP 2010127831A JP 5540905 B2 JP5540905 B2 JP 5540905B2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- electronic component
- packaging
- heat
- sealant layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 31
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000000565 sealant Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 11
- 239000012766 organic filler Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 239000011324 bead Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 36
- 239000002245 particle Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- -1 silica and alumina Chemical class 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127831A JP5540905B2 (ja) | 2010-06-03 | 2010-06-03 | 電子部品包装用カバーテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127831A JP5540905B2 (ja) | 2010-06-03 | 2010-06-03 | 電子部品包装用カバーテープ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011251493A JP2011251493A (ja) | 2011-12-15 |
| JP2011251493A5 JP2011251493A5 (enExample) | 2012-11-22 |
| JP5540905B2 true JP5540905B2 (ja) | 2014-07-02 |
Family
ID=45415834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010127831A Expired - Fee Related JP5540905B2 (ja) | 2010-06-03 | 2010-06-03 | 電子部品包装用カバーテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5540905B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014094754A (ja) * | 2012-11-08 | 2014-05-22 | Rohm Co Ltd | 電子部品包装体 |
| JP6065569B2 (ja) * | 2012-12-14 | 2017-01-25 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| JP7469914B2 (ja) * | 2020-03-05 | 2024-04-17 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| WO2022075362A1 (ja) | 2020-10-09 | 2022-04-14 | 株式会社村田製作所 | フィルムコンデンサ、フィルム、及び、金属化フィルム |
| DE112021004414T5 (de) | 2020-10-09 | 2023-06-07 | Murata Manufacturing Co., Ltd. | Folienkondensator, folie und metallisierte folie |
| WO2022075357A1 (ja) | 2020-10-09 | 2022-04-14 | 株式会社村田製作所 | フィルムコンデンサ、フィルム、及び、金属化フィルム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3327387B2 (ja) * | 1998-06-29 | 2002-09-24 | 住友ベークライト株式会社 | 電子部品包装体 |
| JP2001071432A (ja) * | 1999-09-07 | 2001-03-21 | Japan Polychem Corp | 多層延伸ポリプロピレン系フィルム |
| JP2004284605A (ja) * | 2003-03-20 | 2004-10-14 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
| JP4438464B2 (ja) * | 2003-09-05 | 2010-03-24 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
| JP4615984B2 (ja) * | 2004-12-16 | 2011-01-19 | 電気化学工業株式会社 | カバーテープ |
| US8828535B2 (en) * | 2008-11-12 | 2014-09-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover tape |
-
2010
- 2010-06-03 JP JP2010127831A patent/JP5540905B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011251493A (ja) | 2011-12-15 |
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