JP2011251493A5 - - Google Patents
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- Publication number
- JP2011251493A5 JP2011251493A5 JP2010127831A JP2010127831A JP2011251493A5 JP 2011251493 A5 JP2011251493 A5 JP 2011251493A5 JP 2010127831 A JP2010127831 A JP 2010127831A JP 2010127831 A JP2010127831 A JP 2010127831A JP 2011251493 A5 JP2011251493 A5 JP 2011251493A5
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- packaging
- electronic component
- base resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 claims 9
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000012766 organic filler Substances 0.000 claims 4
- 239000000565 sealant Substances 0.000 claims 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127831A JP5540905B2 (ja) | 2010-06-03 | 2010-06-03 | 電子部品包装用カバーテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127831A JP5540905B2 (ja) | 2010-06-03 | 2010-06-03 | 電子部品包装用カバーテープ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011251493A JP2011251493A (ja) | 2011-12-15 |
| JP2011251493A5 true JP2011251493A5 (enExample) | 2012-11-22 |
| JP5540905B2 JP5540905B2 (ja) | 2014-07-02 |
Family
ID=45415834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010127831A Expired - Fee Related JP5540905B2 (ja) | 2010-06-03 | 2010-06-03 | 電子部品包装用カバーテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5540905B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014094754A (ja) * | 2012-11-08 | 2014-05-22 | Rohm Co Ltd | 電子部品包装体 |
| JP6065569B2 (ja) * | 2012-12-14 | 2017-01-25 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| JP7469914B2 (ja) * | 2020-03-05 | 2024-04-17 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| WO2022075362A1 (ja) | 2020-10-09 | 2022-04-14 | 株式会社村田製作所 | フィルムコンデンサ、フィルム、及び、金属化フィルム |
| DE112021004414T5 (de) | 2020-10-09 | 2023-06-07 | Murata Manufacturing Co., Ltd. | Folienkondensator, folie und metallisierte folie |
| WO2022075357A1 (ja) | 2020-10-09 | 2022-04-14 | 株式会社村田製作所 | フィルムコンデンサ、フィルム、及び、金属化フィルム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3327387B2 (ja) * | 1998-06-29 | 2002-09-24 | 住友ベークライト株式会社 | 電子部品包装体 |
| JP2001071432A (ja) * | 1999-09-07 | 2001-03-21 | Japan Polychem Corp | 多層延伸ポリプロピレン系フィルム |
| JP2004284605A (ja) * | 2003-03-20 | 2004-10-14 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
| JP4438464B2 (ja) * | 2003-09-05 | 2010-03-24 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
| JP4615984B2 (ja) * | 2004-12-16 | 2011-01-19 | 電気化学工業株式会社 | カバーテープ |
| US8828535B2 (en) * | 2008-11-12 | 2014-09-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover tape |
-
2010
- 2010-06-03 JP JP2010127831A patent/JP5540905B2/ja not_active Expired - Fee Related
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