JP5539957B2 - 熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置 - Google Patents

熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置 Download PDF

Info

Publication number
JP5539957B2
JP5539957B2 JP2011503153A JP2011503153A JP5539957B2 JP 5539957 B2 JP5539957 B2 JP 5539957B2 JP 2011503153 A JP2011503153 A JP 2011503153A JP 2011503153 A JP2011503153 A JP 2011503153A JP 5539957 B2 JP5539957 B2 JP 5539957B2
Authority
JP
Japan
Prior art keywords
heat
heat transfer
transfer members
led
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011503153A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011517092A5 (enExample
JP2011517092A (ja
Inventor
裕司 佐賀
吉信 内田
成実 宇根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011517092A publication Critical patent/JP2011517092A/ja
Publication of JP2011517092A5 publication Critical patent/JP2011517092A5/ja
Application granted granted Critical
Publication of JP5539957B2 publication Critical patent/JP5539957B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y10T29/49378—Finned tube

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2011503153A 2008-04-03 2009-04-02 熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置 Expired - Fee Related JP5539957B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12305408P 2008-04-03 2008-04-03
US61/123,054 2008-04-03
PCT/US2009/039229 WO2009124158A1 (en) 2008-04-03 2009-04-02 Method for integrating heat transfer members, and an led device

Publications (3)

Publication Number Publication Date
JP2011517092A JP2011517092A (ja) 2011-05-26
JP2011517092A5 JP2011517092A5 (enExample) 2012-05-24
JP5539957B2 true JP5539957B2 (ja) 2014-07-02

Family

ID=40718527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011503153A Expired - Fee Related JP5539957B2 (ja) 2008-04-03 2009-04-02 熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置

Country Status (5)

Country Link
US (1) US8127445B2 (enExample)
EP (1) EP2257978A1 (enExample)
JP (1) JP5539957B2 (enExample)
CN (1) CN102132401A (enExample)
WO (1) WO2009124158A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011050256A1 (en) * 2009-10-22 2011-04-28 Thermal Solution Resources, Llc Overmolded led light assembly and method of manufacture
CN102374509A (zh) * 2011-12-02 2012-03-14 深圳市华星光电技术有限公司 液晶显示装置、背光模块及其散热方法
CN103172984B (zh) * 2011-12-21 2015-08-26 财团法人工业技术研究院 高导热复合材料与利用该复合材料的照明装置
CN103855142B (zh) * 2012-12-04 2017-12-29 东芝照明技术株式会社 发光装置及照明装置
US20150221578A1 (en) 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
CN203707181U (zh) * 2014-02-21 2014-07-09 厦门市三安光电科技有限公司 发光二极管封装体
CN105990278A (zh) * 2015-02-02 2016-10-05 明安国际企业股份有限公司 导热元件及其制作方法
US11315852B2 (en) * 2019-10-11 2022-04-26 Aptiv Technologies Limited Thermal interface layer for electronic device
WO2022149409A1 (ja) * 2021-01-07 2022-07-14 日本製鉄株式会社 複合部材及び機器
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160462A (en) * 1986-02-14 1992-11-03 Canon Kabushiki Kaisha Preparing optical memory medium by laminating a thermoplastic resin layer on a thermosetting resin sheet
FR2620296B1 (fr) * 1987-09-03 1990-01-19 Bendix Electronics Sa Boitier pour circuit electronique
US6211626B1 (en) * 1997-08-26 2001-04-03 Color Kinetics, Incorporated Illumination components
AU2001236043A1 (en) * 2000-03-03 2001-09-12 Toyoda Gosei Co. Ltd. Resin hose for fuel
JP3830726B2 (ja) * 2000-04-26 2006-10-11 松下電器産業株式会社 熱伝導基板とその製造方法およびパワーモジュール
WO2004107461A1 (en) * 2003-05-28 2004-12-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
TWI241042B (en) * 2004-03-11 2005-10-01 Chen-Lun Hsingchen A low thermal resistance LED device
JP2005281467A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 高熱伝導性樹脂、および部材、ならびにそれらを用いた電気機器および半導体装置
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
US7145179B2 (en) * 2004-10-12 2006-12-05 Gelcore Llc Magnetic attachment method for LED light engines
ATE453907T1 (de) 2004-10-25 2010-01-15 Barco Nv OPTISCHE KORREKTUR FÜR LEUCHTPANEELE MIT HOHER GLEICHMÄßIGKEIT
JP2006140367A (ja) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd 半導体製造装置用加熱体およびこれを搭載した加熱装置
KR100631903B1 (ko) * 2005-02-17 2006-10-11 삼성전기주식회사 고출력 ｌｅｄ 하우징 및 그 제조 방법
EP1925026A2 (en) * 2005-08-26 2008-05-28 Cool Options, Inc. Thermally conductive thermoplastics for die-level packaging of microelectronics
JP2007067042A (ja) * 2005-08-30 2007-03-15 Matsushita Electric Ind Co Ltd 基板の製造方法
US8911160B2 (en) * 2005-09-27 2014-12-16 Lg Electronics Inc. Light emitting device package and backlight unit using the same
KR100611922B1 (ko) * 2005-09-27 2006-08-11 엘지전자 주식회사 발광 소자용 렌즈 및 그를 이용한 패키지

Also Published As

Publication number Publication date
EP2257978A1 (en) 2010-12-08
CN102132401A (zh) 2011-07-20
US8127445B2 (en) 2012-03-06
JP2011517092A (ja) 2011-05-26
US20090251864A1 (en) 2009-10-08
WO2009124158A1 (en) 2009-10-08

Similar Documents

Publication Publication Date Title
JP5539957B2 (ja) 熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置
JP5728754B2 (ja) 照明装置
CN106605310B (zh) 汽车用led灯散热器
JP5016548B2 (ja) 発光素子用熱可塑性樹脂組成物及びそれからなる成形品、並びにそれを用いてなる発光素子
CN101601130B (zh) 热传输组件
KR100574289B1 (ko) 방열부재, 그의 제조방법 및 그의 설치방법
TW201214809A (en) Light-emitting diode device
JP2011216437A (ja) Ｌｅｄ照明装置用筐体およびｌｅｄ照明装置
JP2013089718A (ja) 高熱伝導性樹脂を用いたヒートシンク及びｌｅｄ光源
TWI880093B (zh) 熱傳導片材及熱傳導片材之製造方法
KR20180018714A (ko) 기기의 방열 방법
KR101679832B1 (ko) 엘이디 가로등
WO2009043849A1 (en) Backlight module for liquid crystal display
JP2006293182A (ja) バックライトユニットおよび液晶表示装置
JP2009185102A (ja) 樹脂製部材及び金属製部材からなる複合体の製造に用いられる熱可塑性樹脂組成物
KR101679834B1 (ko) 방열형 엘이디 터널등
KR101688278B1 (ko) 비카본계 필러 함유 열전도성 수지 조성물 및 압출성형품의 제조방법
KR101471028B1 (ko) 광원용 플렉시블 패널
KR101268367B1 (ko) 액상가압법을 이용한 복합재 방열기판의 제조방법
US20190186841A1 (en) Thermal management devices and methods of making the same
JP2003218567A (ja) 電子機器用冷却装置
KR101009058B1 (ko) 열전도성 몰드재를 포함한 엘이디용 전기제품
Huang et al. An instruction to high thermal conductive materials
KR20180025479A (ko) 히트싱크 장치
KR20200142913A (ko) 그라파이트 복합 타워형 히트싱크 및 이를 포함한 엘이디 등기구

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120402

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120402

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130508

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130702

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131002

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131119

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140401

R150 Certificate of patent or registration of utility model

Ref document number: 5539957

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140501

LAPS Cancellation because of no payment of annual fees