CN102132401A - 集成热传递构件的方法及led装置 - Google Patents

集成热传递构件的方法及led装置 Download PDF

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Publication number
CN102132401A
CN102132401A CN2009801118332A CN200980111833A CN102132401A CN 102132401 A CN102132401 A CN 102132401A CN 2009801118332 A CN2009801118332 A CN 2009801118332A CN 200980111833 A CN200980111833 A CN 200980111833A CN 102132401 A CN102132401 A CN 102132401A
Authority
CN
China
Prior art keywords
heat transfer
thermally conductive
heat
resin
transfer members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801118332A
Other languages
English (en)
Chinese (zh)
Inventor
Y·萨加
Y·乌基达
N·乌内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN102132401A publication Critical patent/CN102132401A/zh
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y10T29/49378—Finned tube

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
CN2009801118332A 2008-04-03 2009-04-02 集成热传递构件的方法及led装置 Pending CN102132401A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12305408P 2008-04-03 2008-04-03
US61/123054 2008-04-03
PCT/US2009/039229 WO2009124158A1 (en) 2008-04-03 2009-04-02 Method for integrating heat transfer members, and an led device

Publications (1)

Publication Number Publication Date
CN102132401A true CN102132401A (zh) 2011-07-20

Family

ID=40718527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801118332A Pending CN102132401A (zh) 2008-04-03 2009-04-02 集成热传递构件的方法及led装置

Country Status (5)

Country Link
US (1) US8127445B2 (enExample)
EP (1) EP2257978A1 (enExample)
JP (1) JP5539957B2 (enExample)
CN (1) CN102132401A (enExample)
WO (1) WO2009124158A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102374509A (zh) * 2011-12-02 2012-03-14 深圳市华星光电技术有限公司 液晶显示装置、背光模块及其散热方法
CN105990278A (zh) * 2015-02-02 2016-10-05 明安国际企业股份有限公司 导热元件及其制作方法
CN112652592A (zh) * 2019-10-11 2021-04-13 安波福技术有限公司 电子设备的热界面层
TWI793917B (zh) * 2021-01-07 2023-02-21 日商日本製鐵股份有限公司 複合構件及具有伴隨作動而發熱之器件之機器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011050256A1 (en) * 2009-10-22 2011-04-28 Thermal Solution Resources, Llc Overmolded led light assembly and method of manufacture
CN103172984B (zh) * 2011-12-21 2015-08-26 财团法人工业技术研究院 高导热复合材料与利用该复合材料的照明装置
CN103855142B (zh) * 2012-12-04 2017-12-29 东芝照明技术株式会社 发光装置及照明装置
US20150221578A1 (en) 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
CN203707181U (zh) * 2014-02-21 2014-07-09 厦门市三安光电科技有限公司 发光二极管封装体
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材

Citations (7)

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US4879630A (en) * 1987-09-03 1989-11-07 Bendix Electronics S.A. Housing for an electronic circuit
US20010036065A1 (en) * 2000-04-26 2001-11-01 Matsushita Electric Industrial Co., Ltd. Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
US20060043401A1 (en) * 2004-09-01 2006-03-02 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
EP1650730A1 (en) * 2004-10-25 2006-04-26 Barco NV Optical correction for high uniformity panel lights
US20060180824A1 (en) * 2005-02-17 2006-08-17 Samsung Electro-Mechanics Co., Ltd. High power LED housing and fabrication method thereof
US20070063321A1 (en) * 2003-05-28 2007-03-22 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
CN1945868A (zh) * 2005-09-27 2007-04-11 Lg电子株式会社 发光器件组件和使用这种发光器件组件的背光单元

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US5160462A (en) * 1986-02-14 1992-11-03 Canon Kabushiki Kaisha Preparing optical memory medium by laminating a thermoplastic resin layer on a thermosetting resin sheet
US6211626B1 (en) * 1997-08-26 2001-04-03 Color Kinetics, Incorporated Illumination components
AU2001236043A1 (en) * 2000-03-03 2001-09-12 Toyoda Gosei Co. Ltd. Resin hose for fuel
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
TWI241042B (en) * 2004-03-11 2005-10-01 Chen-Lun Hsingchen A low thermal resistance LED device
JP2005281467A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 高熱伝導性樹脂、および部材、ならびにそれらを用いた電気機器および半導体装置
US7145179B2 (en) * 2004-10-12 2006-12-05 Gelcore Llc Magnetic attachment method for LED light engines
JP2006140367A (ja) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd 半導体製造装置用加熱体およびこれを搭載した加熱装置
EP1925026A2 (en) * 2005-08-26 2008-05-28 Cool Options, Inc. Thermally conductive thermoplastics for die-level packaging of microelectronics
JP2007067042A (ja) * 2005-08-30 2007-03-15 Matsushita Electric Ind Co Ltd 基板の製造方法
US8911160B2 (en) * 2005-09-27 2014-12-16 Lg Electronics Inc. Light emitting device package and backlight unit using the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879630A (en) * 1987-09-03 1989-11-07 Bendix Electronics S.A. Housing for an electronic circuit
US20010036065A1 (en) * 2000-04-26 2001-11-01 Matsushita Electric Industrial Co., Ltd. Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
US20070063321A1 (en) * 2003-05-28 2007-03-22 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US20060043401A1 (en) * 2004-09-01 2006-03-02 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
EP1650730A1 (en) * 2004-10-25 2006-04-26 Barco NV Optical correction for high uniformity panel lights
US20060180824A1 (en) * 2005-02-17 2006-08-17 Samsung Electro-Mechanics Co., Ltd. High power LED housing and fabrication method thereof
CN1945868A (zh) * 2005-09-27 2007-04-11 Lg电子株式会社 发光器件组件和使用这种发光器件组件的背光单元

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102374509A (zh) * 2011-12-02 2012-03-14 深圳市华星光电技术有限公司 液晶显示装置、背光模块及其散热方法
CN105990278A (zh) * 2015-02-02 2016-10-05 明安国际企业股份有限公司 导热元件及其制作方法
CN112652592A (zh) * 2019-10-11 2021-04-13 安波福技术有限公司 电子设备的热界面层
TWI793917B (zh) * 2021-01-07 2023-02-21 日商日本製鐵股份有限公司 複合構件及具有伴隨作動而發熱之器件之機器

Also Published As

Publication number Publication date
JP5539957B2 (ja) 2014-07-02
EP2257978A1 (en) 2010-12-08
US8127445B2 (en) 2012-03-06
JP2011517092A (ja) 2011-05-26
US20090251864A1 (en) 2009-10-08
WO2009124158A1 (en) 2009-10-08

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Application publication date: 20110720