JP2011517092A5 - - Google Patents

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Publication number
JP2011517092A5
JP2011517092A5 JP2011503153A JP2011503153A JP2011517092A5 JP 2011517092 A5 JP2011517092 A5 JP 2011517092A5 JP 2011503153 A JP2011503153 A JP 2011503153A JP 2011503153 A JP2011503153 A JP 2011503153A JP 2011517092 A5 JP2011517092 A5 JP 2011517092A5
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JP
Japan
Prior art keywords
heat transfer
transfer members
integrated composite
composite member
resin injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011503153A
Other languages
English (en)
Japanese (ja)
Other versions
JP5539957B2 (ja
JP2011517092A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/039229 external-priority patent/WO2009124158A1/en
Publication of JP2011517092A publication Critical patent/JP2011517092A/ja
Publication of JP2011517092A5 publication Critical patent/JP2011517092A5/ja
Application granted granted Critical
Publication of JP5539957B2 publication Critical patent/JP5539957B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011503153A 2008-04-03 2009-04-02 熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置 Expired - Fee Related JP5539957B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12305408P 2008-04-03 2008-04-03
US61/123,054 2008-04-03
PCT/US2009/039229 WO2009124158A1 (en) 2008-04-03 2009-04-02 Method for integrating heat transfer members, and an led device

Publications (3)

Publication Number Publication Date
JP2011517092A JP2011517092A (ja) 2011-05-26
JP2011517092A5 true JP2011517092A5 (enExample) 2012-05-24
JP5539957B2 JP5539957B2 (ja) 2014-07-02

Family

ID=40718527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011503153A Expired - Fee Related JP5539957B2 (ja) 2008-04-03 2009-04-02 熱伝達性部材を集積して集積複合部材を提供する方法及び照明装置

Country Status (5)

Country Link
US (1) US8127445B2 (enExample)
EP (1) EP2257978A1 (enExample)
JP (1) JP5539957B2 (enExample)
CN (1) CN102132401A (enExample)
WO (1) WO2009124158A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011050256A1 (en) * 2009-10-22 2011-04-28 Thermal Solution Resources, Llc Overmolded led light assembly and method of manufacture
CN102374509A (zh) * 2011-12-02 2012-03-14 深圳市华星光电技术有限公司 液晶显示装置、背光模块及其散热方法
CN103172984B (zh) * 2011-12-21 2015-08-26 财团法人工业技术研究院 高导热复合材料与利用该复合材料的照明装置
CN103855142B (zh) * 2012-12-04 2017-12-29 东芝照明技术株式会社 发光装置及照明装置
US20150221578A1 (en) 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
CN203707181U (zh) * 2014-02-21 2014-07-09 厦门市三安光电科技有限公司 发光二极管封装体
CN105990278A (zh) * 2015-02-02 2016-10-05 明安国际企业股份有限公司 导热元件及其制作方法
US11315852B2 (en) * 2019-10-11 2022-04-26 Aptiv Technologies Limited Thermal interface layer for electronic device
WO2022149409A1 (ja) * 2021-01-07 2022-07-14 日本製鉄株式会社 複合部材及び機器
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材

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US5160462A (en) * 1986-02-14 1992-11-03 Canon Kabushiki Kaisha Preparing optical memory medium by laminating a thermoplastic resin layer on a thermosetting resin sheet
FR2620296B1 (fr) * 1987-09-03 1990-01-19 Bendix Electronics Sa Boitier pour circuit electronique
US6211626B1 (en) * 1997-08-26 2001-04-03 Color Kinetics, Incorporated Illumination components
AU2001236043A1 (en) * 2000-03-03 2001-09-12 Toyoda Gosei Co. Ltd. Resin hose for fuel
JP3830726B2 (ja) * 2000-04-26 2006-10-11 松下電器産業株式会社 熱伝導基板とその製造方法およびパワーモジュール
WO2004107461A1 (en) * 2003-05-28 2004-12-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
TWI241042B (en) * 2004-03-11 2005-10-01 Chen-Lun Hsingchen A low thermal resistance LED device
JP2005281467A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 高熱伝導性樹脂、および部材、ならびにそれらを用いた電気機器および半導体装置
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
US7145179B2 (en) * 2004-10-12 2006-12-05 Gelcore Llc Magnetic attachment method for LED light engines
ATE453907T1 (de) 2004-10-25 2010-01-15 Barco Nv OPTISCHE KORREKTUR FÜR LEUCHTPANEELE MIT HOHER GLEICHMÄßIGKEIT
JP2006140367A (ja) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd 半導体製造装置用加熱体およびこれを搭載した加熱装置
KR100631903B1 (ko) * 2005-02-17 2006-10-11 삼성전기주식회사 고출력 ｌｅｄ 하우징 및 그 제조 방법
EP1925026A2 (en) * 2005-08-26 2008-05-28 Cool Options, Inc. Thermally conductive thermoplastics for die-level packaging of microelectronics
JP2007067042A (ja) * 2005-08-30 2007-03-15 Matsushita Electric Ind Co Ltd 基板の製造方法
US8911160B2 (en) * 2005-09-27 2014-12-16 Lg Electronics Inc. Light emitting device package and backlight unit using the same
KR100611922B1 (ko) * 2005-09-27 2006-08-11 엘지전자 주식회사 발광 소자용 렌즈 및 그를 이용한 패키지

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