JP5539238B2 - 放熱基板 - Google Patents
放熱基板 Download PDFInfo
- Publication number
- JP5539238B2 JP5539238B2 JP2011016559A JP2011016559A JP5539238B2 JP 5539238 B2 JP5539238 B2 JP 5539238B2 JP 2011016559 A JP2011016559 A JP 2011016559A JP 2011016559 A JP2011016559 A JP 2011016559A JP 5539238 B2 JP5539238 B2 JP 5539238B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- anodized
- aluminum
- heat dissipation
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
11 アルミニウム原板
12 陽極酸化絶縁層
13 金属層
100 陽極酸化多層金属基板(本発明の放熱基板)
110 銅層
120 アルミニウム層
130 陽極酸化絶縁層
140 シード層
150 金属層
Claims (7)
- 一定厚さの銅層、及び、
その銅層の上下表面に備えた陽極酸化絶縁層、を含み、
前記銅層及び陽極酸化絶縁層の間に備えた第1のアルミニウム(Al)層、
前記陽極酸化絶縁層の上部の一部領域に備えた下地金属層、及び、
その下地金属層上に形成された金属層、をさらに含むとともに、
前記銅層の上部又は下部には第1領域と第2領域が形成され、前記陽極酸化絶縁層の一部である前記陽極酸化絶縁層の第1領域に対応する部分が第2のアルミニウム層であり、前記陽極酸化絶縁層と第2アルミニウム層が同一層であることを特徴とする放熱基板。 - 前記陽極酸化絶縁層は、陽極酸化によってなされることを特徴とする請求項1に記載の放熱基板。
- 前記第1又は第2のアルミニウム層は、0.02mm〜0.2mm以上の厚さに形成されることを特徴とする請求項1に記載の放熱基板。
- 前記銅層と第1又は第2のアルミニウム層は、2:2〜3:1の厚み比率に形成されることを特徴とする請求項1に記載の放熱基板。
- 前記下地金属層は、無電解メッキまたはスパッタリング蒸着によってなされることを特徴とする請求項1に記載の放熱基板。
- 前記金属層は、湿式メッキまたは乾式スパッタリング蒸着によってなされることを特徴とする請求項1に記載の放熱基板。
- 前記下地金属層は陽極酸化絶縁層上に備え、
前記金属層は下地金属層上に備え、
湿式化学エッチング、電解エッチングまたはリフトオフ(Lift−OFF)によって一部除去されることを特徴とする請求項1に記載の放熱基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100108130A KR101204191B1 (ko) | 2010-11-02 | 2010-11-02 | 방열기판 |
KR10-2010-0108130 | 2010-11-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012099782A JP2012099782A (ja) | 2012-05-24 |
JP5539238B2 true JP5539238B2 (ja) | 2014-07-02 |
Family
ID=45995369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011016559A Expired - Fee Related JP5539238B2 (ja) | 2010-11-02 | 2011-01-28 | 放熱基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120103588A1 (ja) |
JP (1) | JP5539238B2 (ja) |
KR (1) | KR101204191B1 (ja) |
CN (1) | CN102469753A (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101237668B1 (ko) | 2011-08-10 | 2013-02-26 | 삼성전기주식회사 | 반도체 패키지 기판 |
KR101380774B1 (ko) * | 2012-11-13 | 2014-04-24 | 한밭대학교 산학협력단 | 고방열성 금속 방열기판을 사용한 메탈기판의 전도층 형성방법 |
KR101487082B1 (ko) * | 2013-05-08 | 2015-01-27 | 에스티에스반도체통신 주식회사 | 휨 방지층을 구비하는 적층형 반도체 패키지 및 그 제조방법 |
KR102087864B1 (ko) * | 2013-06-28 | 2020-03-12 | 엘지이노텍 주식회사 | 발광소자 모듈 |
KR102147937B1 (ko) * | 2013-06-28 | 2020-08-25 | 엘지이노텍 주식회사 | 발광소자용 인쇄회로기판 및 그 제조방법 |
CN103594434B (zh) * | 2013-10-23 | 2017-12-29 | 广东明路电力电子有限公司 | 带复合散热层的功率部件 |
KR102148845B1 (ko) * | 2013-12-12 | 2020-08-27 | 엘지이노텍 주식회사 | 인쇄회로기판 |
US9911715B2 (en) * | 2013-12-20 | 2018-03-06 | Cyntec Co., Ltd. | Three-dimensional package structure and the method to fabricate thereof |
KR20150074421A (ko) * | 2013-12-24 | 2015-07-02 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이를 포함하는 발광 장치 |
JP6384112B2 (ja) * | 2014-04-25 | 2018-09-05 | 三菱マテリアル株式会社 | パワーモジュール用基板及びヒートシンク付パワーモジュール用基板 |
DE102015111667A1 (de) * | 2015-07-17 | 2017-01-19 | Rogers Germany Gmbh | Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates |
KR102492733B1 (ko) | 2017-09-29 | 2023-01-27 | 삼성디스플레이 주식회사 | 구리 플라즈마 식각 방법 및 디스플레이 패널 제조 방법 |
CN110113880A (zh) * | 2018-12-29 | 2019-08-09 | 广东生益科技股份有限公司 | 金属基覆铜箔层压板及其制备方法 |
CN111293102B (zh) * | 2020-02-21 | 2022-07-05 | 上海航天电子通讯设备研究所 | 一种基板混合薄膜多层布线制作方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2700212A (en) * | 1948-10-15 | 1955-01-25 | Gen Electric | Electrical conductor |
JPS5069558A (ja) * | 1973-10-24 | 1975-06-10 | ||
JPS5954037A (ja) | 1982-09-22 | 1984-03-28 | Hitachi Ltd | 磁気デイスク用基板の製造方法 |
JPS59107592A (ja) * | 1982-12-13 | 1984-06-21 | ティーディーケイ株式会社 | プリント配線用基板 |
JPS62214632A (ja) * | 1986-03-14 | 1987-09-21 | Sanyo Electric Co Ltd | 混成集積回路 |
JPS63261733A (ja) * | 1987-04-17 | 1988-10-28 | Hitachi Cable Ltd | メタル基板 |
JPH02148790A (ja) * | 1988-11-29 | 1990-06-07 | Ngk Insulators Ltd | 電気回路用基板およびその製造方法 |
US5091609A (en) * | 1989-02-14 | 1992-02-25 | Sumitomo Electric Industries, Ltd. | Insulated wire |
JPH07240570A (ja) * | 1994-02-28 | 1995-09-12 | Mitsubishi Heavy Ind Ltd | 薄膜構造体 |
JP3031363B1 (ja) * | 1998-10-19 | 2000-04-10 | 住友金属工業株式会社 | 金属ベース基板および半導体装置とその製造方法 |
US7572980B2 (en) * | 2007-01-26 | 2009-08-11 | Ford Global Technologies, Llc | Copper conductor with anodized aluminum dielectric layer |
KR100847985B1 (ko) * | 2007-06-25 | 2008-07-22 | 삼성전자주식회사 | 금속 배선 형성방법 |
US20090139868A1 (en) * | 2007-12-03 | 2009-06-04 | Palo Alto Research Center Incorporated | Method of Forming Conductive Lines and Similar Features |
US7935885B2 (en) * | 2008-07-11 | 2011-05-03 | Ford Global Technologies, Llc | Insulated assembly of insulated electric conductors |
KR101003591B1 (ko) | 2009-05-28 | 2010-12-22 | 삼성전기주식회사 | 메탈 적층판 및 이를 이용한 발광 다이오드 패키지의 제조 방법 |
-
2010
- 2010-11-02 KR KR1020100108130A patent/KR101204191B1/ko active IP Right Grant
-
2011
- 2011-01-28 JP JP2011016559A patent/JP5539238B2/ja not_active Expired - Fee Related
- 2011-02-18 US US13/030,976 patent/US20120103588A1/en not_active Abandoned
- 2011-04-26 CN CN2011101058468A patent/CN102469753A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2012099782A (ja) | 2012-05-24 |
CN102469753A (zh) | 2012-05-23 |
US20120103588A1 (en) | 2012-05-03 |
KR20120046464A (ko) | 2012-05-10 |
KR101204191B1 (ko) | 2012-11-23 |
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