JP5533541B2 - Sensor unit assembly method, manufacturing method, and jig - Google Patents

Description

  The present invention relates to a sensor unit assembling method, a manufacturing method, and a jig for assembling a first substrate on which a first sensor is assembled and a second substrate on which a second sensor is assembled.

  A sensor unit such as an acceleration sensor or a gyro sensor is used in attitude control of a vehicle such as an inverted motorcycle or an automobile. In general, vehicle attitude control (particularly inversion control) requires high sensor accuracy from the standpoint of safety, and the sensor unit mounting accuracy greatly affects its output value.

  On the other hand, it is necessary by assembling a sensor to a bracket or sensor block with high dimensional accuracy to ensure the sensor accuracy (for example, see Patent Document 1), or by performing calibration correction after assembly. Techniques for ensuring high accuracy are known.

JP 2007-040766 A

  However, as described above, when a sensor is assembled to a bracket with high dimensional accuracy, a space for providing the bracket is required, so it is not only difficult to downsize the sensor unit, but also a special bracket is required. This may lead to an increase in cost. Further, when calibration or the like is performed after assembly, the number of work steps may increase, leading to an increase in cost.

  The present invention has been made to solve such problems, and has as its main object to provide a sensor unit assembling method, manufacturing method, and jig capable of realizing cost reduction while achieving miniaturization. .

  To achieve the above object, according to one aspect of the present invention, the positioning jig is fixed to the first substrate so that the first substrate on which the first sensor is assembled and the vertical surface of the positioning jig are in a vertical state. A step of abutting one end of a second substrate on which a second sensor is assembled to a vertical surface of the positioning jig, and positioning the second substrate according to the vertical surface; And a step of joining the other end of the positioned second substrate to each other. According to this aspect, it is possible to reduce the cost while reducing the size of the sensor unit.

  In this aspect, the method further includes a step of inserting the other end of the second substrate into a positioning hole formed in the first substrate, and joining the other end of the second substrate and the positioning hole of the first substrate. May be. Thereby, the second substrate can be easily positioned and fixed to the first substrate.

  In this aspect, the positioning is performed by moving the movable block to the vertical plane side of the positioning jig and sandwiching one end of the second substrate between the vertical plane of the positioning jig and the pressing surface of the movable block. The method may further include a step of positioning the second substrate according to a vertical plane of the jig. Accordingly, the second substrate is positioned in a vertical state with respect to the first substrate according to the vertical surface of the positioning jig.

  In this aspect, the method may further include a step of supporting the second substrate so as to sandwich both side edges thereof at a position below the center of gravity of the second substrate. As a result, the second substrate contacts the vertical surface of the positioning jig by the action of gravity with the supported position as a fulcrum, and is positioned in a vertical state with respect to the first substrate according to the vertical surface.

  In this aspect, the method further includes the step of simultaneously soldering the other end of the second substrate inserted into the positioning hole of the first substrate and a component positioned on the first substrate to the first substrate. May be. As a result, the efficiency of the soldering work can be improved, leading to a reduction in manufacturing cost.

  In this aspect, the method may further include a step of sealing a joint portion between the first substrate and the second substrate with a resin member. Thereby, durability of a junction part improves and the positioning accuracy of the perpendicular state of the 1st substrate and the 2nd substrate is maintained.

  On the other hand, according to one aspect of the present invention for achieving the above object, a step of assembling the first sensor to the first substrate, a step of assembling the second sensor to the second substrate, and a vertical surface of the first substrate and the positioning jig. And fixing the positioning jig to the first substrate so as to form a vertical state, pressing one end of the second substrate against the vertical surface of the positioning jig, and moving the first jig along the vertical surface. The sensor unit manufacturing method may include a step of positioning two substrates and a step of joining the first substrate and the other end of the second substrate.

  One aspect of the present invention for achieving the above object is a jig for positioning the second substrate on which the second sensor is assembled to the first substrate on which the first sensor is assembled, A box-shaped jig main body, a positioning pin provided on an edge of the jig main body for engaging the first substrate to position the jig main body on the first substrate, and protruding into the jig main body. When the jig body is positioned on the first substrate, a positioning convex portion formed with a vertical surface that is perpendicular to the first substrate, and an end of the second substrate are positioned. And a contact means for contacting the vertical surface of the convex portion.

  In this aspect, the abutting means may be a movable block that presses an end portion of the second substrate against a vertical surface of the positioning convex portion.

  In this aspect, the contact means may be a pair of support members that support the both side edges of the second substrate at a position below the center of gravity of the second substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the assembly method of a sensor unit, the manufacturing method, and jig which can implement | achieve cost reduction, aiming at size reduction can be provided.

(A) It is a side view which shows the schematic structure of the sensor unit which concerns on Embodiment 1 of this invention. (B) It is a front view which shows schematic structure of the sensor unit which concerns on Embodiment 1 of this invention. (A) It is a side view which shows schematic structure of the positioning jig fixed to the sensor unit which concerns on Embodiment 1 of this invention. (B) It is a front view which shows schematic structure of the positioning jig fixed to the sensor unit which concerns on Embodiment 1 of this invention. It is a figure which shows an example of the state by which the convex-shaped part of a 2nd board | substrate and the component positioned by the 1st board | substrate are soldered simultaneously. It is a figure for demonstrating the assembly method of a sensor unit. (A) It is a side view which shows the schematic structure of the sensor unit which concerns on Embodiment 2 of this invention. (B) It is a front view which shows schematic structure of the sensor unit which concerns on Embodiment 2 of this invention. (A) It is a side view which shows the schematic structure of the positioning jig fixed to the sensor unit which concerns on Embodiment 3 of this invention. (B) It is a front view which shows schematic structure of the positioning jig fixed to the sensor unit which concerns on Embodiment 3 of this invention.

Embodiment 1 FIG.
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a side view showing a schematic configuration of a sensor unit according to Embodiment 1 of the present invention. FIG.1 (b) is a front view which shows schematic structure of the sensor unit based on Embodiment 1 of this invention.

  The sensor unit 10 according to the first embodiment includes a main board (first board) 1 attached to the attachment surface 100 of the vehicle, and a sub board (second board) 2 joined to the main board 1. ing. The main board 1 is fastened to the mounting surface 100 of the vehicle by a pair of front and rear fixing screws 3 and a pair of left and right fixing screws 3. In addition, the attachment method of the main board | substrate 1 and the attachment surface 100 of a vehicle is not restricted to the said example, Arbitrary attachment methods are applicable.

  A convex portion 21 protruding in a substantially rectangular shape is formed at the lower end of the sub-substrate 2, and this convex portion 21 is inserted into the positioning hole 11 formed in the main substrate 1. The shape of the convex portion 21 of the sub-board 2 is not limited to the example shown in FIG. 1, and any shape can be applied as long as the convex portion 21 and the positioning hole 11 can be appropriately joined.

  The sub-substrate 2 is fixed to the main substrate 1 by joining the convex portion 21 of the sub-substrate 2 and the positioning hole 11 of the main substrate 1 with the solder 4. At this time, the sub-board 2 is positioned and fixed so as to be in a vertical state with respect to the main board 1 as will be described later.

  A first sensor element 5 is pre-assembled on the main substrate 1, and a second sensor element 6 is pre-assembled on the sub-substrate 2. As the first sensor element 5 and the second sensor element 6, for example, an acceleration sensor that detects acceleration in each of the yaw axis, pitch axis, and roll axis, or around the yaw axis, pitch axis, and roll axis An angular velocity sensor for detecting the angular velocity is included. The sensor unit 10 is configured as described above, for example, vehicle attitude information (yaw angle, yaw angular velocity, yaw angular acceleration, pitch angle, pitch angular velocity, pitch angular acceleration, roll angle, roll angular velocity, roll angular acceleration, etc.). Can be detected.

  FIG. 2A is a side view showing a schematic configuration of the positioning jig fixed to the sensor unit according to the first embodiment. FIG. 2B is a front view showing a schematic configuration of the positioning jig fixed to the sensor unit according to the first embodiment.

  The positioning jig 7 includes a box-shaped jig main body 71 opened on one side, a pair of front and rear positioning pins 72 provided on the opened edge of the jig main body 71 and projecting downward, and a lower part inside the jig main body 71. And a movable projecting block 73 that projects in the left-right direction along the upper surface of the jig body 71 (a direction toward or away from the positioning projecting portion 73). And. The positioning pins 72 are provided in a pair of front and rear and a pair of left and right. However, the present invention is not limited to this, and the number and positions of the positioning pins 72 may be arbitrary as long as the positioning jig 7 can be appropriately fixed to the first substrate 1. .

  In the main substrate 1, positioning holes 12 are formed at positions corresponding to the positioning pins 72 of the positioning jig 7. Each positioning pin 72 of the positioning jig 7 is inserted and fitted into each positioning hole 12 of the main board 1, whereby the positioning jig 7 is positioned and fixed at a predetermined position on the main board 1 set in advance. Thus, the positioning jig 7 can be easily positioned on the main board 1.

  The positioning convex portion 73 is formed with a vertical surface 73a that is perpendicular to the main substrate 1 when the positioning jig 7 is fixed on the main substrate 1.

  The movable block 74 is moved in the right direction (vertical surface 73a side) to press the pressing surface 74a of the movable block 74 against the upper end of the sub-substrate 2, and the upper end of the sub-substrate 2 is set to the vertical surface of the positioning convex portion 73. By sandwiching between 73a and the pressing surface 74a of the movable block 74, the sub-board 2 is positioned according to the vertical surface 73a of the positioning convex portion 73. At this time, the sub-board 2 is positioned in a vertical state with respect to the main board 1 in accordance with the vertical surface 73a of the positioning convex portion 73.

  In this state, a flow duct 8 for sending flow solder (or local flow solder) 9 is attached to the joint between the convex portion 21 of the sub-board 2 and the positioning hole 11 of the main board 1. And the convex-shaped part 21 of the sub-board | substrate 2 and the positioning hole 11 of the main board | substrate 1 are joined by the flow solder 9 sent from this flow duct 8. FIG. In this manner, the sub board 2 can be easily positioned and fixed in a vertical state with respect to the main board 1 using the positioning jig 7.

  In addition, the flow duct 8 includes not only a joint portion between the convex portion 21 of the sub-board 2 and the positioning hole 11 of the main board 1 but also a joint portion of another component 13 positioned on the main board 1. Even if the convex portion 21 of the sub-board 2 inserted in the positioning hole 11 of the main board 1 and the component 13 positioned on the main board 1 are soldered to the first board 1 at the same time. Good (Figure 3). As a result, the efficiency of the soldering operation can be improved, and the manufacturing cost can be reduced.

  Next, a method for assembling the sensor unit according to the first embodiment will be described in detail. First, the convex portion 21 of the sub board 2 is inserted into the positioning hole 11 of the main board 1, and the sub board 2 is temporarily fixed to the main board 1 (FIG. 4A).

  Next, each positioning pin 72 of the positioning jig 7 is inserted and fitted into each positioning hole 12 of the main board 1, and the positioning jig 7 is fixed at a predetermined position on the main board 1 set in advance (FIG. 4 ( b)). Thereby, the vertical surface 73 a of the positioning jig 7 is set in a vertical state with respect to the first substrate 1.

  Thereafter, the movable block 74 is moved rightward to press the pressing surface 74 a of the movable block 74 against the upper end of the sub-substrate 2, and the upper end of the sub-substrate 2 is movable with the vertical surface 73 a of the positioning convex portion 73. By sandwiching between the pressing surface 74a of the block 74, the sub-board 2 is positioned according to the vertical surface 73a of the positioning convex portion 73 (FIG. 4C).

  Further, the flow duct 8 is installed at the joint between the convex portion 21 of the sub-board 2 and the positioning hole 11 of the main board 1, and the flow solder 9 is sent to the joint, so that the convex portion 21 of the sub-board 2 The positioning hole 11 of the main board 1 is joined (FIG. 4D).

  Finally, the positioning jig 7 and the flow duct 8 are removed from the sensor unit 10 to complete the assembly of the sensor unit 10 (FIG. 4 (e)).

  As described above, according to the method for assembling the sensor unit 10 according to the first embodiment, there is no need to provide a positioning-dedicated bracket or sensor block in the sensor unit 10 as in the prior art, and it is not necessary to secure the space. Therefore, the sensor unit 10 can be easily downsized. Further, when the main board 1 and the sub board 2 are assembled, the positioning accuracy of the main board 1 and the sub board 2 can be easily secured by using only the positioning jig 7, and then the work such as calibration needs to be performed. This reduces the number of work steps. That is, cost reduction can be realized while downsizing the sensor unit 10.

Embodiment 2. FIG.
FIG. 5A is a side view showing a schematic configuration of a sensor unit according to Embodiment 2 of the present invention. FIG.5 (b) is a front view which shows schematic structure of the sensor unit based on Embodiment 2 of this invention. In the sensor unit 20 according to the second embodiment, the joint between the convex portion 21 of the sub-board 2 and the positioning hole 11 of the main board 1 joined by the solder 4 is sealed with, for example, a resin member 22 such as epoxy. You may stop.

  As a result, the solder 4 at the joint does not generate cracks even when stressed from the external environment such as aging, temperature change, vibration, etc., so that the positioning accuracy of the main board 1 and the sub board 2 in the vertical state Is maintained. In addition, in this Embodiment 2, since another structure is as substantially the same as the said Embodiment 1, the same code | symbol is attached | subjected to the same part and detailed description is abbreviate | omitted.

Embodiment 3 FIG.
FIG. 6A is a side view showing a schematic configuration of the positioning jig fixed to the sensor unit according to the third embodiment. FIG. 6B is a front view showing a schematic configuration of the positioning jig fixed to the sensor unit according to the third embodiment.

  The positioning jig 7 according to the first embodiment presses the pressing surface 74 a of the movable block 74 against the upper end of the sub substrate 2, thereby positioning the sub substrate 2 vertically according to the vertical surface 73 a of the positioning convex portion 73. However, the positioning jig 30 according to the second embodiment holds the both side edges of the sub-board 2 between the pair of support members 75 at a position below the center of gravity G of the sub-board 2 and supports them. Positioning may be performed. At the tip of each support member 75, an elastic member 75a such as urethane or rubber is provided.

  The sub-board 2 contacts the vertical surface 73a of the positioning convex portion 73 by the action of gravity with the position supported by each support member 75 as a fulcrum. Thereby, the sub board | substrate 2 will be in the perpendicular | vertical state with respect to the main board | substrate 1 according to the vertical surface 73a of the positioning convex-shaped part 73, and is positioned. In the third embodiment, since the other configurations are substantially the same as those of the first embodiment, the same parts are denoted by the same reference numerals and detailed description thereof is omitted.

  Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 Main board | substrate 2 Sub board | substrate 3 Fixing screw 4 Solder 5 1st sensor element 6 2nd sensor element 7 Positioning jig 10, 20 Sensor unit 71 Jig body 72 Positioning pin 73 Positioning convex part 73a Vertical surface 74 Movable block 75 Support Element

Claims (10)

Fixing the positioning jig to the first substrate such that the first substrate on which the first sensor is assembled and the vertical plane of the positioning jig form a vertical state;
A step of abutting one end of a second substrate on which a second sensor is assembled with a vertical surface of the positioning jig, and positioning the second substrate according to the vertical surface;
Joining the first substrate and the other end of the positioned second substrate;
A method for assembling the sensor unit, comprising: A method for assembling a sensor unit according to claim 1,
Inserting the other end of the second substrate into a positioning hole formed in the first substrate;
A method of assembling a sensor unit, comprising joining the other end of the second substrate and a positioning hole of the first substrate. A method for assembling the sensor unit according to claim 1 or 2,
By moving the movable block to the vertical plane side of the positioning jig and sandwiching one end of the second substrate between the vertical plane of the positioning jig and the pressing surface of the movable block, according to the vertical plane of the positioning jig The method for assembling a sensor unit further comprising the step of positioning the second substrate. A method for assembling the sensor unit according to claim 1 or 2,
The sensor unit assembling method further comprising a step of supporting the second substrate so as to sandwich both side edges thereof at a position below the center of gravity of the second substrate. A method for assembling a sensor unit according to any one of claims 2 to 4,
The method further includes the step of simultaneously soldering the other end of the second substrate inserted into the positioning hole of the first substrate and the component positioned on the first substrate to the first substrate. To install the sensor unit. A sensor unit assembly method according to any one of claims 1 to 5,
The method of assembling a sensor unit, further comprising the step of sealing a joint between the first substrate and the second substrate with a resin member. Assembling the first sensor to the first substrate;
Attaching the second sensor to the second substrate;
Fixing the positioning jig to the first substrate such that the first substrate and the vertical plane of the positioning jig are in a vertical state;
Pressing one end of the second substrate against the vertical surface of the positioning jig to position the second substrate along the vertical surface;
Bonding the first substrate and the other end of the second substrate;
A method for manufacturing a sensor unit, comprising: A jig for positioning the second substrate on which the second sensor is assembled on the first substrate on which the first sensor is assembled,
A box-shaped jig body,
A positioning pin provided at an end of the jig body, for engaging the first substrate and positioning the jig body on the first substrate;
A positioning convex portion provided so as to protrude inside the jig main body, and a vertical plane that is perpendicular to the first substrate is formed when the jig main body is positioned on the first substrate;
Abutting means for abutting an end portion of the second substrate with a vertical surface of the positioning convex portion;
A jig characterized by comprising. The jig according to claim 8, wherein
The jig, wherein the contact means is a movable block that presses an end portion of the second substrate against a vertical surface of the positioning convex portion. The jig according to claim 8, wherein
The jig is characterized in that the abutting means is a pair of support members that are supported at a position below the center of gravity of the second substrate so as to sandwich both side edges of the second substrate.

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