JP2013253863A - Sensor unit, electronic device, moving body and method of manufacturing board assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress vibration transmission more than before.SOLUTION: A first substrate 12 has a plate surface 15. The plate surface 15 is provided with a first conductive wire 28. A second substrate 13 has a plate surface 17 and an end surface 16. The end surface 16 faces the plate surface 15 of the first substrate 12 with a space therebetween. The plate surface 17 of the second substrate 13 is provided with a second conductive wire 29. A joint member 31 joins the first conductive wire 28 to the second conductive wire 29. The joint member 31 intersects a contour 41 of the plate surface 17 defined by the end surface 16 and extends from the second conductive wire 29 to the first conductive wire 28.

Description

  The present invention relates to a sensor unit, an electronic device and a moving body using the sensor unit, a method for manufacturing a substrate assembly used for the sensor unit, and the like.

  As described in Patent Document 1, a sensor chip such as an acceleration sensor has a measurement axis in a specific direction. If the sensor chip is mounted on the substrate on the bottom surface of the sensor chip, the measurement axis is orthogonal to the surface of the substrate. If the sensor chip is mounted on the substrate on the side surface of the sensor chip, the measurement axis can be set parallel to the surface of the substrate.

US Pat. No. 5,503,016 JP 2005-197493 A

  In Patent Document 1, the sensor chip is bonded to the substrate on the side surface of the sensor chip. The bonding material bonds the plate surface of the substrate and the side surface of the sensor chip to each other. Therefore, the vibration path is established with the shortest distance between the substrate and the sensor chip. The transmission length of vibration is minimized. The vibration path coincides with the vibration transmission direction. As a result, vibration is directly transferred between the substrate and the sensor chip.

  According to at least one aspect of the present invention, transmission of vibration can be suppressed as compared to the past.

  (1) According to one aspect of the present invention, a first substrate having a first plate surface provided with a first conductive line, a first sensor mounted on the first substrate and having a measurement axis on a first axis, And a second plate surface provided with a second conductive line and an end surface on the side of the second plate surface, the end surface facing the first plate surface of the first substrate with a space therebetween. A second substrate to be disposed, a second sensor mounted on the second substrate and having a measurement axis on a second axis intersecting the first axis, and the first conductive line and the second conductive line are joined. And a conductive bonding material.

  The bonding material bonds the first conductive line and the second conductive line to each other. With this bonding, the first substrate and the second substrate are connected to each other. The bonding material ensures electrical connection between the first conductive line and the second conductive line, and at the same time establishes a physical coupling between the first substrate and the second substrate. In accordance with such physical coupling, a positional relationship other than a parallel posture can be established between the first substrate and the second substrate. At this time, the conductive material does not couple the plate surface of the first substrate and the end surface of the second substrate to each other. Therefore, a vibration path is established between the first substrate and the second substrate at the shortest distance. Do not mean. Since the bonding material couples the plate surfaces of the two substrates to each other, the vibration path between the first substrate and the second substrate bypasses the shortest path. The transmission length of vibration increases, and the transmission direction of vibration is diverted. As a result, vibration can be damped between the first substrate and the second substrate. Transmission of vibration can be suppressed.

  (2) The second conductive line may be disposed away from the outline of the second plate surface. The transmission length of vibration can be further increased. As a result, vibration transmission between the first substrate and the second substrate can be further suppressed.

  (3) The second substrate may be provided with a spacer that protrudes from the end surface toward the first plate surface of the first substrate and contacts the first plate surface. The external force acting on the second substrate can be partially supported by the spacer. Therefore, transmission of external force from the second substrate toward the bonding material can be suppressed. The durability of the bonding material can be improved.

  (4) A depression is provided on the first plate surface of the first substrate, the first conductive line is provided on a bottom surface of the depression, and a part of the end surface of the second substrate is a peripheral edge of the depression. Can be joined to. The external force acting on the second substrate is transmitted from the end surface of the second substrate to the support surface. The external force is supported by the support surface. Therefore, transmission of external force from the second substrate toward the bonding material can be suppressed. The durability of the bonding material can be improved.

  (5) A part of the first conductive line may be provided so as to overlap the end surface in a plan view. The positional deviation between the first conductive line and the second substrate can be reliably absorbed. Even if misalignment occurs, the bonding material can reliably bond the first conductive line and the second conductive line to each other.

  (6) The first sensor may be mounted on the first plate surface, and the second sensor may be mounted on the second plate surface. Thus, the first sensor can be coupled to the first conductive line. The second sensor can be coupled to the second conductive line.

  (7) The sensor unit can be used by being incorporated in an electronic device. The electronic device can include a sensor unit.

  (8) The sensor unit can be used by being incorporated in a moving body. The moving body may include a sensor unit.

  (9) According to still another aspect of the present invention, a first substrate having a first plate surface provided with a first conductive line, a second plate surface provided with a second conductive wire, and the second plate surface A step of setting a second substrate having an end face located on the side of the second substrate to a jig in a specific positional relationship, and a step of bonding the first conductive line and the second conductive line with a conductive bonding material. And the step of setting on the jig includes placing the first substrate and the second substrate in a positional relationship in which the end surfaces of the second substrate face each other with an interval from the first plate surface of the first substrate. The present invention relates to a method for manufacturing a substrate assembly that is set on a jig. Thus, the substrate assembly can be manufactured. The substrate assembly can be used in a sensor unit.

  (10) The jig rises from a surface of the bottom plate having a holding portion that holds the posture of the second substrate in an upright posture, and horizontally positions the first substrate on the end surface of the second substrate. And a supporting member to be held. An interval between the end surface of the second substrate and the first plate surface of the first substrate can be ensured by the function of the jig.

  (11) The method for manufacturing a substrate assembly includes a step of applying the bonding material to a surface of the first conductive line, and the first plate surface is disposed on the end surface of the second substrate, and the bonding material is A step of bringing the second conductive line into contact with each other, and a step of spreading the bonding material on the second conductive line by the weight of the bonding material. Thus reflow can be utilized.

It is a fragmentary perspective view which shows roughly the external appearance of the board | substrate assembly which concerns on 1st Embodiment. It is a fragmentary perspective view which shows roughly the external appearance of a board | substrate assembly from an angle different from FIG. It is a partial top view of a board | substrate assembly. It is an enlarged side view of a 1st joining material (2nd joining material). FIG. 5 is an enlarged side view of a first bonding material (second bonding material) according to a modification corresponding to FIG. 4. It is a perspective view which shows roughly one specific example of the jig | tool utilized in manufacture of a board | substrate assembly. It is a front view of the jig | tool which shows the 1st and 2nd side plate set to the jig | tool roughly. It is a side view which shows a bottom plate schematically. It is a front view of the jig | tool which shows schematically the bottom plate set to the jig | tool. It is a front view of the jig | tool which shows schematically the baseplate joined to the 1st and 2nd side plate. It is an enlarged partial front view which shows roughly the 1st and 2nd side plate and bottom plate which are integrated in the board | substrate assembly which concerns on 2nd Embodiment. It is a perspective view which shows roughly one specific example of the jig | tool utilized in manufacture of a board | substrate assembly. It is an enlarged partial front view which shows roughly the 1st and 2nd side plate and bottom plate which are integrated in the board | substrate assembly which concerns on 3rd Embodiment. It is a perspective view showing roughly the appearance of a sensor unit concerning one embodiment. It is a perspective view which shows roughly the external appearance of a sensor unit from the back. It is a perspective view of the substrate assembly which shows the whole structure of a substrate assembly roughly. It is a perspective view of a substrate assembly which shows the appearance of a substrate assembly roughly. It is a side view of the storage space which shows the structure of a board | substrate assembly roughly. It is a top view of the storage space which shows the structure of a board | substrate assembly roughly. It is a block diagram which shows roughly the structure of the electronic device which concerns on one Embodiment. It is a block diagram which shows roughly the structure of the moving body which concerns on one Embodiment. It is a block diagram showing roughly the composition of the machine concerning one embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are essential as means for solving the present invention. Not necessarily.

(1) Substrate Assembly According to First Embodiment FIG. 1 schematically shows a substrate assembly 11 according to the first embodiment. The substrate assembly 11 includes a bottom plate (first substrate) 12, a first side plate (second substrate) 13, and a second side plate (second substrate) 14. The bottom plate 12 and the first and second side plates 13 and 14 are rigid substrates. The base of the rigid substrate can be formed of an insulator such as a resin plate or a ceramic plate. The resin plate can be formed of a resin material impregnated with glass fiber, for example.

  The first and second side plates 13 and 14 are coupled to the plate surface (first plate surface) 15 of the bottom plate 12. The first and second side plates 13 and 14 establish a standing posture with respect to the plate surface 15 of the bottom plate 12. The first side plate 13 has an end surface 16 that faces the plate surface 15 of the bottom plate 12. In the first side plate 13, the end surface 16 connects an outward first plate surface (second plate surface) 17 and an inward second plate surface 18 to each other. The first plate surface 17 and the second plate surface 18 have a front-back relationship. The first side plate 13 partitions the storage space by the second plate surface 18. The end surface 16 defines the contours of the first plate surface 17 and the second plate surface 18, respectively. A vertical virtual plane (first virtual plane) 21 including the first plate surface 17 of the first side plate 13 intersects a horizontal virtual plane (second virtual plane) 22 including the plate surface 15 of the bottom plate 12. The intersection angle can be arbitrarily set. Here, the crossing angle is set to a right angle.

  Similarly, the second side plate 14 has an end surface 23 that faces the plate surface 15 of the bottom plate 12. In the second side plate 14, the end surface 23 connects an outward first plate surface (second plate surface) 24 and an inward second plate surface 25 to each other. The first plate surface 24 and the second plate surface 25 have a front-back relationship. The second side plate 14 partitions the storage space by the second plate surface 25. The end surface 23 defines the contours of the first plate surface 24 and the second plate surface 25. The vertical virtual plane 26 including the first plate surface 24 of the second side plate 14 intersects the horizontal virtual plane 22 including the plate surface 15 of the bottom plate 12. The intersection angle can be arbitrarily set. Here, the crossing angle is set to a right angle.

  The bottom plate 12 has a first conductive wiring (first conductive line) 28. The first conductive wiring 28 is formed from a conductive material. For example, a metal material such as copper can be used as the conductive material. The first conductive wiring 28 has a first conductive pad 28a and a second conductive pad 28b. The first conductive pad 28 a and the second conductive pad 28 b are formed on the plate surface 15 of the bottom plate 12. The first conductive pad 28a and the second conductive pad 28b can be formed as a thin film extending on the surface of the substrate.

  The first side plate 13 and the second side plate 14 have a second conductive wiring 29. The second conductive wiring 29 is formed from a conductive material. For example, a metal material such as copper can be used as the conductive material. The second conductive wiring 29 has a connection terminal 29a. The connection terminal 29 a is formed on the first plate surfaces 17 and 24 of the side plates 13 and 14. The connection terminal 29a can be formed as a thin film that spreads on the plate surface of the substrate without entering the end surfaces 16 and 23 of the substrate. The insulator of the base body is exposed on the end surfaces 16 and 23 of the side plates 13 and 14. The end surfaces 16 and 23 of the side plates 13 and 14 are formed of an insulator.

  The substrate assembly 11 includes a first bonding material (bonding material) 31. The first bonding material 31 is bonded to the first conductive wiring 28 and the second conductive wiring 29. The first bonding material 31 is individually fixed to the first conductive pad 28a and the corresponding connection terminal 29a of the first side plate 13 at the same time. The first conductive pads 28a are connected to the connection terminals 29a on a one-to-one basis. Similarly, the first bonding material 31 is individually fixed to the second conductive pad 28b and the corresponding connection terminal 29a of the second side plate 14 at the same time. The second conductive pads 28b are connected to the connection terminals 29a on a one-to-one basis. The first bonding material 31 has conductivity. The first bonding material 31 is formed of, for example, a solder material. For example, a conductive adhesive may be used instead of the solder material. The bottom plate 12 and the first side plate 13 are connected to each other by the first bonding material 31. Similarly, the bottom plate 12 and the second side plate 14 are connected to each other by the first bonding material 31. Here, the connection between the first and second side plates 13 and 14 and the bottom plate 12 is not established except for the first bonding material 31.

  In the first side plate 13 and the second side plate 14, electronic components 32 are mounted on the first plate surfaces 17 and 24. The electronic component 32 can be electrically connected to the second conductive wiring 29, for example. The electronic component 32 is accommodated in the pocket space 33. The pocket space 33 is defined by the first plate surfaces 17 and 24 of the first side plate 13 or the second side plate 14 and the overhanging areas 12 a and 12 b of the bottom plate 12. The overhanging areas 12a and 12b are formed by the bottom plate 12 projecting from the first plate surfaces 17 and 24 of the first side plate 13 or the second side plate 14 toward the outside from the storage space.

  As shown in FIG. 2, the first side plate 13 has a first metal pad 34. The first metal pad 34 is formed on the second plate surface 18 of the first side plate 13. The first metal pad 34 is disposed in the overhanging region 13a of the first side plate 13 outside the storage space. The overhang area 13a is formed by the first side plate 13 that projects from the first plate surface 24 of the second side plate 14 toward the outside from the storage space. The first metal pad 34 can be formed as a thin film extending on the surface of the substrate. The first metal pad 34 may have conductivity, and the first metal pad 34 may be connected to the second conductive wiring 29. The first metal pad 34 can be formed of the same material as the second conductive wiring 29.

  The second side plate 14 has a second metal pad 35. The second metal pad 35 is formed on the first plate surface 24 of the second side plate 14. The second metal pad 35 may be formed as a thin film that spreads on the plate surface of the substrate without entering the end surface of the substrate.

  The substrate assembly 11 includes a second bonding material (bonding material) 36. The second bonding material 36 is bonded to the first metal pad 34 and the second metal pad 35. The second bonding material 36 is simultaneously fixed to the first metal pad 34 and the corresponding second metal pad 35. The first metal pads 34 are connected to the second metal pads 35 on a one-to-one basis. The second bonding material 36 can have conductivity. The second bonding material 36 is made of, for example, a solder material. For example, a conductive adhesive may be used instead of the solder material. The second bonding material 36 can be formed of the same material as the first bonding material 26. Thus, the first side plate 13 and the second side plate 14 are connected to each other. Here, the joining of the first and second side plates 13 and 14 is not established except for the second joining material 36.

  As shown in FIG. 3, the first electronic component 37 is mounted on the plate surface 15 of the bottom plate 12. The first electronic component 37 is electrically connected to the first conductive wiring 28. A second electronic component 38 is mounted on the second plate surface 18 of the first side plate 13. The second electronic component 38 is electrically connected to the second conductive wiring 29. A third electronic component 39 is mounted on the second plate surface 25 of the second side plate 14. The third electronic component 39 is electrically connected to the second conductive wiring 29. The first electronic component 37 and the second electronic component 38 are electrically connected by the first conductive pad 28a, the first bonding material 31, and the connection terminal 29a. The first electronic component 37 and the third electronic component 39 are electrically connected by the second conductive pad 28b, the first bonding material 31, and the connection terminal 29a.

  The first bonding material 31 bonds the first conductive wiring 28 and the second conductive line 29 to each other. By this joining, the first and second side plates 13 and 14 and the bottom plate 12 are connected to each other. The first bonding material 31 establishes physical coupling between the first and second side plates 13 and 14 and the bottom plate 12 at the same time as ensuring conduction between the first conductive wiring 28 and the second conductive wiring 29. According to such physical coupling, a positional relationship other than a parallel posture can be established between the bottom plate 12 and the first and second side plates 13 and 14.

  Similarly, the second bonding material 36 bonds the second metal pad 35 to the first metal pad 34. By this joining, the first side plate 13 and the second side plate 14 are connected to each other. The second bonding material 36 establishes physical coupling between the first side plate 13 and the second side plate 14 at the same time as ensuring conduction between the first metal pad 34 and the second metal pad 35. According to such physical coupling, a positional relationship other than a parallel posture can be established between the first side plate 13 and the second side plate 14.

  In the board assembly 11, the first plate surfaces 17 and 24 of the first and second side plates 13 and 14 are disposed outward. The second conductive wiring 29 is formed on the outward plate surfaces 17 and 24. Accordingly, the first bonding material 31 can be supplied from the outside of the substrate assembly 11 when the first and second conductive pads 28 a and 28 b are coupled to the connection terminal 29 a. The supply path of the first bonding material 31 can be easily ensured up to the supply position of the first bonding material 31. In assembling the board assembly 11, work efficiency is improved. Similarly, since the first metal pad 34 and the second metal pad 35 are disposed outside the storage space, the supply path of the second bonding material 36 is easily ensured up to the supply position of the second bonding material 36. Can do.

  As shown in FIG. 4, a gap C is formed between the end surfaces 16 and 23 of the first and second side plates 13 and 14 and the plate surface 15 of the bottom plate 12. The first bonding material 31 extends from the connection terminals 29 a of the first and second side plates 13 and 14 to the first and second conductive pads 28 a and 28 b of the bottom plate 12. The first bonding material 31 intersects the outline 41 of the first plate surfaces 17 and 24 defined by the end surfaces 16 and 23. The first bonding material 31 does not connect the plate surface 15 of the bottom plate 12 and the end surfaces 16 and 23 of the first and second side plates 13 and 14 to each other, but the bottom plate 12 and the first and second side plates 13 and 14. The vibration path is not established with the shortest distance between the two. Since the first bonding material 31 connects the plate surface 15 of the bottom plate 12 and the first plate surfaces 17 and 24 of the first and second side plates 13 and 14 to each other, the bottom plate 12 and the first and second side plates 13, The vibration path to 14 bypasses the shortest path. The transmission length of vibration increases, and the transmission direction of vibration is diverted. As a result, vibration can be damped between the bottom plate 12 and the first and second side plates 13 and 14. Transmission of vibration can be suppressed. In particular, the second conductive wiring 29 is disposed away from the outline 41 of the first plate surfaces 17 and 24 of the first and second side plates 13 and 14. As a result, the transmission length of vibration can be further increased. Transmission of vibration between the bottom plate 12 and the first and second side plates 13 and 14 can be further suppressed.

  In addition, the first conductive wiring 28 can enter the space 42 sandwiched between the plate surface 15 of the bottom plate 12 and the end surfaces 16 and 23 of the first and second side plates 13 and 14. That is, a part of the first conductive wiring 28 overlaps the end surfaces 16 and 23 in a plan view from a direction orthogonal to the bottom plate 12 field plate surface 15. At this time, the positional deviation between the first conductive wiring 28 and the first and second side plates 13 and 14 can be reliably absorbed. Even if the positional deviation occurs, the first bonding material 31 can reliably bond the first conductive wiring 28 and the second conductive wiring 29 to each other. Here, the first metal pad 34, the second metal pad 35, and the second bonding material 36 can be configured similarly to the first conductive wiring 28, the second conductive wiring 29, and the first bonding material 31.

  As shown in FIG. 5, the end surfaces 16 and 23 of the first and second side plates 13 and 14 may be received by the plate surface 15 of the bottom plate 12. However, although the end surfaces 16 and 23 of the first and second side plates 13 and 14 are in contact with the plate surface 15 of the bottom plate 12, bonding is not established except for the first bonding material 31. Even in such a case, the vibration path can bypass the shortest path, and as a result, the vibration can be damped between the bottom plate 12 and the first and second side plates 13 and 14. Transmission of vibration can be suppressed.

(2) Manufacturing Method of Substrate Assembly Next, a manufacturing method of the substrate assembly 11 will be briefly described. A jig 43 is prepared for manufacturing. As shown in FIG. 6, the jig 43 includes a bottom plate 44. Grooves 45a and 45b are formed in the bottom plate 44. The grooves 45a and 45b have contours reflecting the contours of the end surfaces of the first side plate 13 and the second side plate 14 (end surfaces opposite to the end surfaces 16 and 23). The first and second side plates 13 and 14 can be inserted into the grooves 45a and 45b, respectively. The grooves 45a and 45b hold the postures of the first side plate 13 and the second side plate 14 in the standing posture. Here, the first plate surfaces 17 and 24 of the first and second side plates 13 and 14 are parallel to the direction of gravity. The end surfaces 16 and 23 of the first and second side plates 13 and 14 can face in the opposite direction (upward) in the direction of gravity.

  The jig 43 includes a support member 46. The support member 46 is composed of four columns 46a. Each column 46 a rises from the surface of the bottom plate 44. A recess 47 is formed at the upper end of the column 46a to model the outline of the bottom plate 12. The height of the recess 47 is set to be higher than the height of the first and second side plates 13 and 14 inserted into the grooves 45a and 45b. The bottom plate 12 can be fitted into the recess 47.

  As shown in FIG. 7, the first and second side plates 13 and 14 are set on the jig 43. A second conductive wiring 29 including a connection terminal 29a is formed on the first and second side plates 13 and 14 in advance. The first and second side plates 13 and 14 are inserted into the grooves 45a and 45b. The first and second side plates 13 and 14 are held in an upright posture.

  As shown in FIG. 8, the bottom plate 12 is prepared. A first conductive wiring 28 including first and second conductive pads 28 a and 28 b is formed in advance on the plate surface 15 of the bottom plate 12. A conductive material 48 such as solder paste is applied to the surfaces of the first and second conductive pads 28a and 28b.

  As shown in FIG. 9, the bottom plate 12 is set on the jig 43. The bottom plate 12 is fitted into the recess 47 of the support member 46. In the jig 43, a predetermined positional relationship is established between the first and second side plates 13, 14 and the bottom plate 12. The bottom plate 12 covers the end surfaces 16 and 23 of the first and second side plates 13 and 14. Here, the bottom plate 12 is held in a horizontal posture by the function of the support member 46. The vertical virtual planes 21 and 26 including the first plate surfaces 17 and 24 of the first and second side plates 13 and 14 are orthogonal to the horizontal virtual plane including the plate surface 15 of the bottom plate 12. The plate surface 15 of the bottom plate 12 is opposed to the end surfaces 16 and 23 of the first and second side plates 13 and 14 with a gap C therebetween. The plate surface 15 of the bottom plate 12 is disposed at a position away from the end surfaces 16 and 23 of the first and second side plates 13 and 14 in the direction opposite to the gravity direction. At this time, it is desirable that the conductive material 48 on the first and second conductive pads 28a and 28b be in contact with the connection terminal 29a.

  As shown in FIG. 10, the conductive material 48 spreads wet along the connection terminal 29 a by its own weight. When thermal energy is applied to the conductive material 48, the conductive material 48 melts. Reflow can be performed in the application of such heat energy. Thereafter, the conductive material 48 is cooled. Thus, the first bonding material 31 bonds the first and second conductive pads 28a and 28b to the connection terminal 29a. After cooling, the first and second side plates 13, 14 and the bottom plate 12 may be removed from the jig 43.

(3) Substrate Assembly According to Second Embodiment FIG. 11 schematically shows a substrate assembly 11a according to the second embodiment. In the substrate assembly 11 a, the first and second side plates 13 and 14 are formed with spacers 49 that protrude from the end surfaces 16 and 23 toward the plate surface 15 of the bottom plate 12. The spacer 49 can contact the plate surface 15 of the bottom plate 12. A distance C can be ensured between the end surfaces 16 and 23 and the plate surface 15 of the bottom plate 12 by the function of the spacer 49. In this substrate assembly 11 a, the external force acting on the first and second side plates 13 and 14 from the direction orthogonal to the plate surface 15 of the bottom plate 12 can be partially supported by the spacer 49. Therefore, transmission of external force from the first and second side plates 13 and 14 toward the first bonding material 31 can be suppressed. The durability of the first bonding material 31 can be improved. Other structures are the same as those of the first embodiment.

  In the manufacture of the substrate assembly 11a, the jig 43a can be used as described above. As shown in FIG. 12, the jig 43 a includes a bottom plate 44 and a guide member 51. The guide member 51 is composed of four columns 51a. Each column 51 a rises from the surface of the bottom plate 44. Each column 51a is formed with a guide path 52 having a horizontal cross section that is shaped like four corners of the bottom plate 12. Thus, the guide member 51 can maintain the horizontal posture of the bottom plate 12 while allowing the displacement of the bottom plate 12 in the vertical direction. When the bottom plate 12 is guided by the guide member 51, the spacer 49 protrudes upward from the end surfaces 16 and 23 of the first and second side plates 13 and 14. The spacer 49 receives the plate surface 15 of the bottom plate 12. In this way, a gap C can be reliably ensured between the end surfaces 16 and 23 of the first and second side plates 13 and 14 and the plate surface 15 of the bottom plate 12. The spacer 49 may be formed on the plate surface 15 of the bottom plate 12 instead of the first and second side plates 13 and 14 side.

(4) Board Assembly According to Third Embodiment FIG. 13 schematically shows a board assembly 11b according to the third embodiment. In the substrate assembly 11 b, a support surface 53 is defined on the plate surface 15 of the bottom plate 12. The support surface 53 supports the end surfaces 16 and 23 of the first and second side plates 13 and 14. A recess 54 is defined in the plate surface 15 of the bottom plate 12. The recess 54 defines a connection surface 55 at a position away from the end surfaces 16 and 23 of the first and second side plates 13 and 14. First and second conductive pads 28 a and 28 b of the first conductive wiring 28 are disposed on the connection surface 55. With the function of the recess 54, a gap C can be reliably ensured between the end surfaces 16, 23 of the first and second side plates 13, 14 and the first and second conductive pads 28a, 28b. External forces acting on the first and second side plates 13 and 14 are transmitted from the first and second side plates 13 and 14 to the support surface 53. The external force is supported by the support surface 53. Therefore, transmission of external force from the first and second side plates 13 and 14 toward the first bonding material 31 can be suppressed. The durability of the first bonding material 31 can be improved. Other structures are the same as those in the first embodiment.

(5) Sensor Unit FIG. 14 schematically shows a sensor unit 61 according to an embodiment. The sensor unit 61 includes a housing 62. The housing 62 is formed in a rectangular parallelepiped box shape, for example. The housing 62 defines a rectangular parallelepiped internal space. The housing 62 can be divided into a box 62a and a base 62b. The box 62a covers the top surface and the four side surfaces of the internal space. The base 62b covers the bottom surface of the internal space. The box 62a and the base 62b can be formed from an aluminum material, for example. The surfaces of the box 62a and the base 62b can be covered with, for example, a nickel plating film.

  As shown in FIG. 15, the base 62b closes the open surface of the box 62a. A sealing material 63 is packed in a gap between the base 62b and the box 62a along the outline of the base 62b. An opening 64 is formed in the base 62b. A connector 65 is disposed in the opening 64. The connector 65 can be received by a receiving connector (not shown). The connector 65 constitutes an external terminal of the sensor unit 61. A sealing material 66 is packed in the gap between the connector 65 and the base 62 b along the outline of the connector 65. Thus, the internal space of the housing 62 is hermetically sealed.

  A substrate assembly 68 is accommodated in the internal space of the box 62a. As shown in FIG. 16, the board assembly 68 includes an interface board (first board) 69, a top board (first board) 71, and first to fourth side boards (second boards) 72, 73, 74, 75. Prepare. The interface substrate 69, the top plate 71, and the side plates 72 to 75 form a hexahedral box. The connector 65 is mounted on the outwardly facing plate surface of the interface board 69 (corresponding to the back surface of the interface board). The interface substrate 69, the top plate 71, and the first to fourth side plates 72 to 75 are rigid substrates. The base of the rigid substrate can be formed of, for example, a resin plate or a ceramic plate. The resin plate can be formed of a resin material impregnated with glass fiber, for example.

  In the board assembly 68, a frame 76 is formed by the first to fourth side plates 72 to 75. The first to fourth side plates 72 to 75 are connected to each other. The frame 76 surrounds the storage space 77. The frame 76 closes four sides of the hexahedral storage space 77. The first to fourth side plates 72 to 75 have first plate surfaces (second plate surfaces) 72a, 73a, 74a, and 75a facing outward. Inward second plate surfaces 72b, 73b, 74b, and 75b are defined on the back side of the first plate surfaces 72a to 75a. The first to fourth side plates 72 to 75 partition the storage space 77 on the back side of the first plate surfaces 72a to 75a, that is, the second plate surfaces 72b to 75b.

  The outlines of the interface board 69 and the top board 71 have four sides in contact with a rectangle. The storage space 77 and the frame 76 are sandwiched between the interface board 69 and the top plate 71. The interface substrate 69 and the top plate 71 face each other at the plate surfaces 69a and 71a. Therefore, the end surfaces of the first to fourth side plates 72 to 75 are opposed to the plate surface (first plate surface) 69 a of the interface substrate 69 and the plate surface (first plate surface) 71 a of the top plate 71 with a space therebetween. The vertical virtual planes including the second plate surfaces 72 b to 75 b of the first to fourth side plates 72 to 75 are horizontal virtual planes including the plate surface 69 a of the interface substrate 69 and horizontal virtual planes including the plate surface 71 a of the top plate 71. Intersect the plane. The intersection angle can be arbitrarily set. Here, the crossing angle is set to a right angle.

  In forming the frame 76, the first side plate 72 and the third side plate 74 are sandwiched between the second side plate 73 and the fourth side plate 75. As a result, the end surfaces of the first side plate 72 and the third side plate 74 are opposed to the second plate surfaces 73b and 75b of the second side plate 73 and the fourth side plate 75 with a space therebetween. The vertical virtual planes including the second plate surfaces 72b and 74b of the first and third side plates 72 and 74, respectively, are the vertical virtual planes including the second plate surface 73b of the second side plate 73 and the second plate surface 75b of the fourth side plate 75, respectively. Intersect the plane. The intersection angle can be arbitrarily set. Here, the crossing angle is set to a right angle.

  As shown in FIG. 17, the interface board 69 has a first conductive wiring (first conductive line) 78. The first conductive wiring 78 is made of a conductive material. For example, a metal material such as copper can be used as the conductive material. The first conductive wiring 78 has a first conductive pad 78a and a second conductive pad 78b. The first conductive pads 78 a and the second conductive pads 78 b are formed on the plate surface 69 a of the interface substrate 69 outside the frame 76. The first conductive pads 78 a are arranged in a line between one side of the contour of the interface board 69 and the first plate surface 72 a of the first side plate 72. The one side extends in parallel to the first plate surface 72a. The second conductive pads 78 b are arranged in a line between one side of the contour of the interface board 69 and the second plate surface 73 a of the second side plate 73. The one side extends in parallel to the first plate surface 73a. The first conductive pad 78a and the second conductive pad 78b can be formed as a thin film extending on the surface of the substrate.

  The first to fourth side plates 72 to 75 have a second conductive wiring (second conductive line) 79. The second conductive wiring 79 is formed from a conductive material. For example, a metal material such as copper can be used as the conductive material. The second conductive wiring 79 has a first connection terminal 79a and a second connection terminal 79b. The first connection terminal 79 a is formed on the first plate surface 72 a of the first side plate 72. The second connection terminal 79 b is formed on the first plate surface 73 a of the second side plate 73. Each of the first connection terminal 79a and the second connection terminal 79b can be formed as a thin film that spreads on the plate surface of the substrate without entering the end surface of the substrate. The insulator of the base body is exposed on the end surfaces of the side plates 72 to 75. The end surfaces of the side plates 72 to 75 are formed of an insulator.

  The substrate assembly 68 includes a bonding material 81. The bonding material 81 is bonded to the first conductive wiring 78 and the second conductive wiring 79. The bonding material 81 is individually fixed to the first conductive pads 78a and the corresponding first connection terminals 79a of the first side plates 72 at the same time. The first conductive pads 78a are connected to the first connection terminals 79a on a one-to-one basis. Similarly, the bonding material 81 is fixed to the second conductive pads 78b and the corresponding second connection terminals 79b of the second side plates 73 at the same time. The second conductive pads 78b are connected to the second connection terminals 79b on a one-to-one basis. The bonding material 81 has conductivity. The bonding material 81 is formed of, for example, a solder material. For example, a conductive adhesive may be used instead of the solder material. The interface substrate 69 and the first side plate 72 are connected to each other by the bonding material 81. Similarly, the interface substrate 69 and the second side plate 73 are connected to each other by the bonding material 81.

  In the first side plate 72 and the second side plate 73, the electronic component 82 is mounted on the first plate surfaces 72a and 73a. The electronic component 82 can be electrically connected to the second conductive wiring 79, for example. Similar to the electronic component 32 described above, the electronic component 82 is accommodated in the pocket spaces PK1, PK2. The pocket spaces PK1 and PK2 are sandwiched between the overhanging area of the interface board 69 and the overhanging area of the top plate 71. The pocket space PK1 is sandwiched between the second side plate 73 and the fourth side plate 75. The overhanging area is formed by the interface board 69 and the top board 71 protruding from the first plate surface 72 a or 73 a of the first side plate 72 or the second side plate 73 toward the outside from the storage space 77. The overhang amount of the overhang area is set to be larger than the maximum height of the electronic component 82.

  As shown in FIG. 18, the electronic component group is accommodated in the accommodation space 77. The electronic component group includes a microprocessor unit (MPU) 84, an oscillator 85, a first sensor 86, a second sensor 87, and a third sensor 88. The MPU 84 is mounted on the plate surface 69 a of the interface board 69. The MPU 84 is electrically connected to the first conductive wiring 78. The MPU 84 can be connected to the connector 65 through the first conductive wiring 78. For such connection, conductive vias and wiring patterns can be formed in the base of the interface board 69. The MPU 84 can exchange signals with the outside through the connector 65.

  For example, the oscillator 85 is mounted on the second plate surface 75 b of the fourth side plate 75. The oscillator 85 is electrically connected to at least the second conductive wiring 79. Since the second connection terminal 79 b of the second conductive wiring 79 is connected to the second conductive pad 78 b of the first conductive wiring 78, the oscillator 85 is electrically connected to the MPU 84 via the second conductive wiring 79 and the first conductive wiring 78. Can be connected to. For such connection, conductive vias and wiring patterns can be formed in the base of the fourth side plate 75. The oscillator 85 can supply a clock signal to the MPU 84.

  The first sensor 86 is mounted on the plate surface 71 a of the top plate 71. The first sensor 86 is constituted by a uniaxial gyro sensor, for example. The single axis gyro sensor is configured as a vibration type. That is, the angular velocity is detected from the vibration of the detection piece accompanying the vibration of the vibration piece. The uniaxial gyro sensor has a measurement axis on a vertical axis orthogonal to the plate surface 71 a of the top plate 71. The first sensor 86 is connected to the second conductive wiring 79, and the first connection terminal 79 a and / or the second connection terminal 79 b of the second conductive wiring 79 is the first conductive pad 78 a and / or the first conductive wiring 78. Since it is connected to the second conductive pad 78 b, the detection signal of the first sensor 86 can be supplied to the MPU 84 via the second conductive wiring 79 and the first conductive wiring 78. The MPU 84 can supply a control signal to the first sensor 86. For such connection, conductive vias and wiring patterns can be formed in the base of the top plate 71.

  The second sensor 87 is mounted on the second plate surface 73 b of the second side plate 73. The second sensor 87 is constituted by a uniaxial gyro sensor, for example. The single axis gyro sensor is configured as a vibration type. The uniaxial gyro sensor has a measurement axis on a vertical axis orthogonal to the second plate surface 73 b of the second side plate 73. The second sensor 87 is electrically connected to at least the second conductive wiring 79. Since the second connection terminal 79 b of the second conductive wiring 79 is connected to the second conductive pad 78 b of the first conductive wiring 78, the detection signal of the second sensor 87 passes through the second conductive wiring 79 and the first conductive wiring 78. Can be supplied to the MPU 84. The MPU 84 can supply a control signal to the second sensor 87. For such connection, a conductive via or a wiring pattern can be formed in the base of the second side plate 73.

  As apparent from FIG. 19, the third sensor 88 is mounted on the second plate surface 74 b of the third side plate 74. The third sensor 88 is composed of, for example, a single axis gyro sensor. The single axis gyro sensor is configured as a vibration type. The uniaxial gyro sensor has a measurement axis on a vertical axis perpendicular to the second plate surface 74 b of the third side plate 74. The third sensor 88 is electrically connected to at least the second conductive wiring 79. Since the first connection terminal 79 a of the second conductive wiring 79 is connected to the first conductive pad 78 a of the first conductive wiring 78, the detection signal of the third sensor 88 passes through the second conductive wiring 79 and the first conductive wiring 78. Can be supplied to the MPU 84. The MPU 84 can supply a control signal to the third sensor 88. For such connection, conductive vias and wiring patterns can be formed in the base of the third side plate 74.

  The electronic component group further includes a fourth sensor 89. The fourth sensor 89 is mounted on the second plate surface 72 b of the first side plate 72. The fourth sensor 89 is constituted by a triaxial acceleration sensor, for example. The triaxial acceleration sensor is perpendicular to the vertical axis orthogonal to the plate surface 71 a of the top plate 71, perpendicular to the second plate surface 73 b of the second side plate 73, and orthogonal to the second plate surface 74 b of the third side plate 74. Acceleration can be detected in the direction of the vertical axis. The fourth sensor 89 is electrically connected to at least the second conductive wiring 79. Since the first connection terminal 79 a of the second conductive wiring 79 is connected to the first conductive pad 78 a of the first conductive wiring 78, the detection signal of the fourth sensor 89 passes through the second conductive wiring 79 and the first conductive wiring 78. Can be supplied to the MPU 84. The MPU 84 can supply a control signal to the fourth sensor 89. For such connection, a conductive via or a wiring pattern can be formed in the base of the first side plate 72.

  In the sensor unit 61, acceleration is detected by the fourth sensor 89 in the directions of three orthogonal axes, and angular velocities are detected by the first sensor 86, the second sensor 87, and the third sensor 88 around each axis. Detection signals from the first to fourth sensors 86 to 89 are supplied to the MPU 84. The MPU 84 calculates acceleration and angular velocity based on the detection signal. The calculation result can be output from the connector 65 to the outside. The sensor unit 61 can function as an inertial measurement unit (IMU).

  The bonding material 81 establishes continuity between the first conductive wiring 78 and the second conductive wiring 79 and at the same time establishes physical coupling between the interface substrate 69 and the side plates 72 to 75. At this time, a gap C is formed between the end surfaces of the side plates 72 to 75 and the plate surfaces 69a and 71a of the interface substrate 69 and the top plate 71 in the same manner as the substrate assemblies 11, 11a and 11b described above. The bonding material 81 extends from the connection terminals 79 a and 79 b of the side plates 72 to 75 to the first and second conductive pads 78 a and 78 b of the interface substrate 69 and the top plate 71. The bonding material 81 intersects the contours of the first plate surfaces 72a to 75a defined by the end surfaces. The bonding material 81 does not mutually connect the plate surfaces 69a and 71a of the interface substrate 69 and the top plate 71 and the end surfaces 72a to 75a of the side plates 72 to 75, but the interface substrate 69 and the top plate 71 and the side plates 72 to 75a. The vibration path is not established with the shortest distance from 75. Since the bonding material 81 mutually connects the plate surfaces 69a and 71a of the interface board 69 and the top plate 71 and the first plate surfaces 72a to 75a of the side plates 72 to 75, the interface substrate 69 and the top plate 71 and the side plates 72 to The vibration path to 75 bypasses the shortest path. The transmission length of vibration increases, and the transmission direction of vibration is diverted. As a result, vibration can be damped between the interface board 69, the top plate 71, and the side plates 72 to 75. Transmission of vibration can be suppressed. In particular, the second conductive wiring 79 is disposed away from the outlines of the first plate surfaces 72a to 75a of the side plates 72 to 75. As a result, the transmission length of vibration can be further increased. Transmission of vibration between the interface board 69 and the top plate 71 and the side plates 72 to 75 can be further suppressed.

  In the sensor unit 61, prior to the assembly of the board assembly 68, the first to fourth sensors 86 to 89 can be inspected on the top plate 71 and the individual side plates 72 to 75 individually. Therefore, even if a defect is detected in any of the sensors 86 to 89 after mounting as a result of the inspection, the top plate 71 and the individual side plates 72 to 75 can be replaced alone. On the other hand, when the first to fourth sensors 86 to 89 are mounted on a single substrate, the first to fourth sensors 86 to 89 must be replaced at the same time even if any one of them is defective.

  The end surfaces of the side plates 72 to 75 are formed of an insulator. The insulator of the base body can be exposed as it is on the end surfaces of the side plates 72 to 75. When the bonding material 81 is used, no special processing is required for the side plates 72 to 75. For example, a wiring pattern need not be formed on the end face. As a result, complication of the manufacturing process can be avoided.

  In the board assembly 68, the side plates 72 to 75 partition the storage space 77 on the back side of the first plate surfaces 72a to 75a, that is, the second plate surfaces 72b to 75b. The first plate surfaces 72a to 75a face outward. Therefore, it is only necessary to supply the bonding material 81 to the outward plate surface when the interface board 69 and the side plates 72 to 75 are coupled and the top plate 71 and the side plates 72 to 75 are coupled. Therefore, the storage space 77 can be formed as a completely closed space. Even if the storage space 77 is surrounded by the frame 76 of the side plates 72 to 75, the bonding material can be supplied to the first plate surfaces 72 a to 75 a of the side plates 72 to 75 without being obstructed by the side plates 72 to 75. In assembling the board assembly 68, work efficiency is not impaired. When the substrate assembly 68 is thus formed in a hexahedral box shape, the structural strength of the substrate assembly 68 can be increased. On the other hand, since the inward second plate surfaces 72b to 75b face the storage space 77, when the bonding material is supplied to the inward second plate surfaces 72b to 75b, the storage space 77 is completely formed. Cannot be closed.

  In the sensor unit 61, the pocket spaces PK 1 and PK 2 are partitioned by being sandwiched between the protruding area of the interface substrate 69 and the protruding area of the top plate 71. Since the electronic component 82 is accommodated in the pocket spaces PK 1 and PK 2, the overhanging area of the interface board 69 and the top plate 71 can restrict access to the electronic component 82. The electronic component 82 can be protected in the pocket spaces PK1, PK2. The pocket spaces PK1, PK2 can be used effectively.

(6) Application Example of Sensor Unit The board assembly plates 11, 11 a, 11 b and the sensor unit 61 as described above can be used by being incorporated in the electronic device 101 as shown in FIG. 20, for example. In the electronic device 101, for example, an arithmetic processing circuit 103 and a connector 104 are mounted on the main board 102. For example, a connector 65 of the sensor unit 61 can be coupled to the connector 104. A detection signal can be supplied from the sensor unit 61 to the arithmetic processing circuit 103. The arithmetic processing circuit 103 processes the detection signal from the sensor unit 61 and outputs a processing result. Examples of the electronic device 101 include a motion sensing unit, a consumer game device, a motion analysis device, a surgical navigation system, and a car navigation system.

  The board assembly plates 11, 11 a, 11 b and the sensor unit 61 can be used by being incorporated in the moving body 105, for example, as shown in FIG. 21. In the moving body 105, for example, a control circuit 107 and a connector 108 are mounted on the control board 106. For example, a connector 65 of the sensor unit 61 can be coupled to the connector 108. A detection signal can be supplied from the sensor unit 61 to the control circuit 107. The control circuit 107 can process the detection signal from the sensor unit 61 and control the movement of the moving body 105 according to the processing result. Examples of such control include behavior control of a moving body, navigation control of an automobile, activation control of an airbag for an automobile, inertial navigation control of an airplane or a ship, guidance control, and the like.

  The board assembly plates 11, 11 a, 11 b and the sensor unit 61 can be used by being incorporated in a machine 109 as shown in FIG. 22, for example. In the machine 109, for example, a control circuit 112 and a connector 113 are mounted on the control board 111. For example, the connector 65 of the sensor unit 61 can be coupled to the connector 113. A detection signal can be supplied from the sensor unit 61 to the control circuit 112. The control circuit 112 can process the detection signal from the sensor unit 61 and control the operation of the machine 109 according to the processing result. Examples of such control include vibration control and operation control of industrial machines and motion control of robots.

  Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term described with a different term having a broader meaning or the same meaning at least once in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings. Further, the configurations and operations of the substrate assemblies 11, 11a, 11b, the sensor unit 61, the electronic device 101, the moving body 105, the machine 109, and the like are not limited to those described in the present embodiment, and various modifications are possible. .

11 substrate assembly, 11a substrate assembly, 11b substrate assembly, 12 first substrate (bottom plate), 13 second substrate and first substrate (first side plate), 14 second substrate (second side plate), 15 first Plate surface (plate surface), 16 end surface, 17 second plate surface (first plate surface), 23 end surface, 24 second plate surface (first plate surface), 28 first conductive line (first conductive wiring), 29 Second conductive wire (second conductive wiring), 31 bonding material (first bonding material), 36 bonding material (second bonding material), 41 contour, 43 jig, 43a jig, 44 bottom plate, 47 depression, 48 bonding Material (conductive material), 49 spacer, 54 depression, 61 sensor unit, 68 substrate assembly, 69 first substrate (interface substrate), 71 first substrate (top plate), 72 second substrate (first side plate), 72a Second plate surface (first plate surface), 73 Second substrate (second side plate) 73a Second plate surface (first plate surface), 74 Second substrate (third side plate), 74a Second plate surface (first plate surface), 75 Second substrate (fourth side plate), 75a Second plate surface ( First plate surface), 81 bonding material, 86 first sensor, 87 second sensor, 88 third sensor, 101 electronic device, 105 moving body.

Claims (11)

A first substrate having a first plate surface provided with a first conductive line;
A first sensor mounted on the first substrate and having a measurement axis on a first axis;
A second plate surface provided with a second conductive line and an end surface located on the side of the second plate surface are arranged with the end surface facing the first plate surface of the first substrate with a space therebetween. A second substrate,
A second sensor mounted on the second substrate and having a measurement axis on a second axis intersecting the first axis;
A conductive bonding material for bonding the first conductive line and the second conductive line;
A sensor unit comprising:   2. The sensor unit according to claim 1, wherein the second conductive line is disposed away from an outline of the second plate surface. 3.   3. The sensor unit according to claim 1, wherein a spacer that protrudes from the end surface toward the first plate surface of the first substrate and contacts the first plate surface is formed on the second substrate. Sensor unit characterized by that.   3. The sensor unit according to claim 1, wherein a recess is provided in the first plate surface of the first substrate, the first conductive line is provided on a bottom surface of the recess, and the second substrate has the first conductive line. A sensor unit, wherein a part of the end surface is joined to the periphery of the recess.   5. The sensor unit according to claim 1, wherein a part of the first conductive wire is provided so as to overlap the end surface in a plan view. 6.   The sensor unit according to claim 1, wherein the first sensor is mounted on the first plate surface, and the second sensor is mounted on the second plate surface. Sensor unit to perform.   An electronic apparatus comprising the sensor unit according to claim 1.   A moving body comprising the sensor unit according to claim 1. A first substrate having a first plate surface provided with a first conductive line; and
Setting a second substrate having a second plate surface provided with a second conductive line and an end surface on the side of the second plate surface in a specific positional relationship to a jig;
Bonding the first conductive line and the second conductive line with a conductive bonding material,
The step of setting on the jig includes the step of placing the first substrate and the second substrate in a positional relationship in which the end surface of the second substrate faces the first plate surface of the first substrate. A method for manufacturing a substrate assembly, comprising: The method of manufacturing a substrate assembly according to claim 9, wherein the jig is
A bottom plate having a holding portion for holding the posture of the second substrate in a standing posture;
And a support member that rises from the surface of the bottom plate and holds the first substrate in a horizontal position on the end surface of the second substrate. In the manufacturing method of the board assembly according to claim 9 or 10,
Applying the bonding material to the surface of the first conductive wire;
Disposing the first plate surface on the end surface of the second substrate and bringing the second conductive line into contact with the bonding material;
Spreading the bonding material on the second conductive wire by the weight of the bonding material;
A method for manufacturing a substrate assembly, comprising:

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