JP6094034B2 - Sensor modules and electronics - Google Patents

Description

  The present invention relates to a sensor module that forms a structure by connecting a plurality of substrates.

  As a sensor module, for example, as disclosed in Patent Documents 1 to 3, a structure is known in which a sensor is mounted on each of a plurality of substrates and the substrates are assembled together. As the sensor, a sensor that detects an angular velocity or acceleration around a predetermined axis is used, and a substrate is connected to each other so that each sensor is in an orthogonal relationship to form a structure.

Japanese Patent Laid-Open No. 7-306047 JP 2005-197493 A JP-A-11-211481

  Considering the response of the sensor when vibration is input from the outside of the sensor module, vibration (for example, pressurization under use environment, impact when dropped) is input from the outside of the structure on which the sensor is mounted. In the substrate constituting the structure, resonance occurs at a natural frequency determined by the material and shape of the substrate, and the vibration of the sensor mounted on the substrate is induced, which may cause fluctuation in sensor output. The higher the Q value of the natural vibration of the substrate, the greater the amplitude of resonance and the greater the influence on the sensor output.

  According to at least one aspect of the present invention, it is possible to provide a sensor module in which the Q value of the natural vibration of the substrate of the structure is lowered to reduce fluctuations in sensor output due to vibration from the outside of the structure. Can do.

(1) In one embodiment of the present invention, a structure including a first substrate and a second substrate in which plate surfaces are connected to each other , and a hexahedron that is determined by using the first substrate and the second substrate as two side surfaces are stored. A first sensor supported on a plate surface of the first substrate on the storage space side, and a second sensor supported on a plate surface of the second substrate on the storage space side, The present invention relates to a sensor module in which the area of the plate surface of the first substrate and the area of the plate surface of the second substrate in the storage space are different from each other.

  Even if vibration is input from the outside of the structure, vibration energy loss occurs at a discontinuous portion (connection portion) between the substrates of the first substrate and the second substrate, and the Q value of the vibration decreases. Furthermore, by making the area of the first substrate and the area of the second substrate on the storage space side of the structure different from each other, the symmetry of the structure is lost, energy dispersion is increased, and the Q value of the natural vibration is descend. Thereby, the sensors mounted on each of the first substrate and the second substrate can detect physical quantities such as angular velocity and acceleration with high accuracy.

  (2) The distance from the connection portion of the second substrate to the first sensor in the first substrate may be different from the distance from the connection portion of the first substrate to the second sensor in the second substrate. it can. Since the vibration of the first substrate and the vibration of the second substrate behave differently depending on the distance from the connecting portion of the first substrate and the second substrate, if the two distances are different, the vibration of the first substrate and the second substrate Mutual effects between the vibrations of the two substrates can be avoided. This can greatly contribute to the prevention of mutual interference.

  (3) When the storage space is viewed from the second substrate side, at least a part of the second sensor can overlap the first sensor. Thus, the space between the first sensor and the second substrate can be effectively utilized. Use of such a space can contribute to downsizing of the sensor module.

(4) The sensor module is connected to the first substrate and the second substrate so as to intersect with each other, and is supported by a third substrate forming a side wall of the storage space and a plate surface of the third substrate on the storage space side. And an area of the plate surface of the first substrate, an area of the plate surface of the second substrate, and an area of the plate surface of the third substrate may be different from each other.

(5) The distance from the connecting portion of the third substrate to the first sensor in the first substrate may be different from the distance from the connecting portion of the first substrate to the third sensor in the third substrate. . Since the vibration of the first substrate and the vibration of the third substrate behave differently depending on the distance from the connecting portion of the first substrate and the third substrate, if the two distances are different, the vibration of the first substrate and the vibration of the first substrate Mutual influences between the vibrations of the three substrates can be avoided. This can greatly contribute to the prevention of mutual interference.

(6) When the storage space is viewed from the first substrate side, at least a part of the first sensor can overlap the third sensor. Thus, the space between the third sensor and the first substrate can be effectively used. Use of such a space can contribute to downsizing of the sensor module.

  Even if vibration is input from the outside of the structure, the discontinuity between the substrates of the first substrate and the third substrate (connection portion) and the discontinuity between the substrates of the second substrate and the third substrate (connection portion) ), Loss of vibration energy occurs and the Q value of vibration decreases. Furthermore, the symmetry of the structure can be improved by making the area of the first substrate and the area of the third substrate on the storage space side of the structure different from each other and making the area of the second substrate different from the area of the third substrate. When collapsed, energy dispersion increases, and the Q value of the natural vibration decreases. Thereby, the sensors mounted on each of the first substrate, the second substrate, and the third substrate can detect physical quantities such as angular velocity and acceleration with high accuracy.

(7) the distance from the connecting portion of the third substrate to the second sensor in the second substrate, to be different from the distance to the third sensor from the connection portion of the second substrate in the third substrate it can. Since the vibration of the vibration and the third substrate of the second substrate behave differently depending on the distance from the connecting portion of the second substrate and the third substrate, if the two distances are different, the vibration of the second substrate and the Mutual influences between the vibrations of the three substrates can be avoided. This can greatly contribute to the prevention of mutual interference.

(8) When the storage space is viewed from the second substrate side, at least a part of the second sensor can overlap the third sensor. Thus, the space between the third sensor and the second substrate can be effectively used. Use of such a space can contribute to downsizing of the sensor module.

(9) In the sensor module, the third sensor may be a vibration gyro sensor.

(10) The first substrate may have a first plate surface, the second substrate may have a second plate surface and an end surface, and the end surface may be directed to the first plate surface of the first substrate. The second plate surface may be arranged so as to intersect the first plate surface.

(11) In the sensor module, the first substrate may be provided with an overhang area at an end portion of the first plate surface, and the second substrate may be connected to the first substrate inside the overhang area. .

  (12) The structure may further include an interface board coupled to at least one of the first member and the second member and forming a side wall of the storage space. The interface board includes the interface board. An arithmetic processing circuit supported on a plate surface on the storage space side and an interface component supported on a plate surface opposite to the plate surface on the storage space side can be mounted.

  The sensor module can be mounted on a printed wiring board as an interface component. The interface component establishes conduction between the arithmetic processing circuit and the printed wiring board. In general, since the conductive material has a high heat transfer coefficient, the interface component can efficiently transfer the heat of the arithmetic processing circuit to the printed wiring board. In this way, heat dissipation of the arithmetic processing circuit can be promoted.

  (13) The structure may be provided with a temperature sensor. The temperature sensor may be attached to a substrate other than the interface substrate. Thus, the temperature sensor can be moved away from the arithmetic processing circuit. The temperature sensor can be separated as much as possible from the heat of the processing circuit. As a result, the temperature sensor can accurately detect the temperature in the storage space.

  (14) The sensor module can be used by being incorporated in an electronic device. The electronic device may be provided with a sensor module.

It is a perspective view showing roughly the appearance of the sensor module concerning one embodiment. It is a perspective view which shows roughly the external appearance of a sensor module from the back. FIG. 5 is a partially exploded perspective view of a sensor module schematically showing an interface board of the board assembly. It is a perspective view of the substrate assembly which shows the whole structure of a substrate assembly roughly. It is a perspective view of a substrate assembly which shows the appearance of a substrate assembly roughly. It is a front view of a board | substrate assembly. It is a side view of the storage space which shows the structure of a board | substrate assembly roughly. It is a top view of the storage space which shows the structure of a board | substrate assembly roughly. It is a side view of the storage space which shows the structure of a board | substrate assembly roughly.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are essential as means for solving the present invention. Not necessarily.

(1) Configuration of Sensor Module FIG. 1 schematically shows a sensor module 11 according to an embodiment. The sensor module 11 includes a housing 12. The housing 12 is formed in a rectangular parallelepiped box shape, for example. The housing 12 defines a rectangular parallelepiped internal space. The housing 12 can be divided into a box 12a and a base 12b. The box 12a covers the top surface and four side surfaces of the internal space. The base 12b covers the bottom surface of the internal space. The box 12a and the base 12b can be formed from, for example, an aluminum material. The surfaces of the box 12a and the base 12b can be covered with, for example, a nickel plating film.

  As shown in FIG. 2, the base 12b closes the open surface of the box 12a. A sealing material 13 is packed in a gap between the base 12b and the box 12a along the outline of the base 12b. An opening 14 is formed in the base 12b. A connector (interface part) 15 is disposed in the opening 14. The connector 15 has a conducting member 16. The conducting member 16 has conductivity and high thermal conductivity. The conducting member 16 can be formed from, for example, a metal material. The connector 15 can be received by a receiving connector (not shown). The connector 15 constitutes an external terminal of the sensor module 11. A sealing material 17 is packed in the gap between the connector 15 and the base 12 b along the outline of the connector 15. Thus, the internal space of the housing 12 is hermetically sealed.

  As shown in FIG. 3, the structure 18 is accommodated in the internal space of the box 12a. The structure 18 includes an interface substrate 19. The interface board 19 is composed of a rigid board. The base of the rigid substrate can be formed of, for example, a resin plate or a ceramic plate. The resin plate can be formed of a resin material impregnated with glass fiber, for example. The connector 15 is mounted on an outwardly facing plate surface (corresponding to the back surface of the interface substrate) 21 of the interface substrate 19. The conducting member 16 only needs to have a thermal conductivity higher than that of at least the base of the interface substrate 19.

  A ground terminal 22 is formed on the back surface of the interface substrate 19. Corresponding to each ground terminal 22, a notch 23 is formed at the edge of the base 12b. Solder (not shown) is deposited on the ground terminal 22 inside the notch 23. The solder joins the base 12 b to the ground terminal 22. Thus, the interface board 19 is grounded to the base 12b.

  As shown in FIG. 4, the structure 18 includes an interface board 19, a top board (third board) 24, a first side board (second board) 25, and a second side board (second board) 26. The third side plate (first substrate) 27 and the fourth side plate 28 are provided. A hexahedron box is formed by the interface substrate 19, the top plate 24, and the side plates 25 to 28. The top plate 24 and the first to fourth side plates 25 to 28 are configured by a rigid substrate. The base of the rigid substrate can be formed of, for example, a resin plate or a ceramic plate. The resin plate can be formed of a resin material impregnated with glass fiber, for example.

In the structure 18, a frame 29 is formed by the first to fourth side plates 25 to 28. The first to fourth side plates 25 to 28 are connected to each other. The frame 29 surrounds the storage space 31. The frame 29 closes four sides of the hexahedral storage space 31. First plate surfaces 25a, 26a, 27a, 28a facing outward are defined on the first to fourth side plates 25-28, respectively. Inward second plate surfaces 25b, 26b, 27b, and 28b are defined on the back side of the first plate surfaces 25a to 28a. The first to fourth side plates 25 to 28 partition the storage space 31 on the back side of the first plate surfaces 25a to 28a, that is, the second plate surfaces 25b to 28b. The frame 29 is sandwiched between the interface board 19 and the top plate 24. The interface board 19 closes the bottom surface of the hexahedral storage space 31. The top plate 24 closes the upper surface of the hexahedral storage space 31. The interface board 19 and the top plate 24 face each other at the plate surfaces 19a and 24a. The interface board 19, the top plate 24, and the first to fourth side plates 25 to 28 form side walls of the storage space 31.

  The first side plate 25 and the third side plate 27 spread in parallel to each other. The second plate surface 25b of the first side plate 25 and the second plate surface 27b of the third side plate 27 face each other. Thus, the storage space 31 is sandwiched between the first side plate 25 and the third side plate 27. The second plate surfaces 25b and 27b facing the storage space 31 are formed in a first size (area) L × H. Here, the first size L × H corresponds to the size of the first side plate 25 and the third side plate 27.

  The second side plate 26 and the fourth side plate 28 extend parallel to each other. The second plate surface 26b of the second side plate 26 and the second plate surface 28b of the fourth side plate 28 face each other. The first side plate 25 and the third side plate 27 are sandwiched between the second side plate 26 and the fourth side plate 28. Thus, the storage space 31 is sandwiched between the second plate surface 26 b of the second side plate 26 and the second plate surface 28 b of the fourth side plate 28. The second plate surfaces 26b and 28b facing the storage space 31 are formed in a second size (area) W × H (W <L) smaller than the first size L × H. Here, the sizes of the second side plate 26 and the fourth side plate 28 are different from the sizes of the first side plate 25 and the third side plate 27.

  The first side plate 25 and the third side plate 27 are abutted against the second plate surfaces 26b and 28b of the second side plate 26 and the fourth side plate 28 at the end surfaces 25c and 27c. The first and third side plates 25, 27 intersect the second plate surface 26 b of the second side plate 26 and the second plate surface 28 b of the fourth side plate 28. The intersection angle can be arbitrarily set. Here, the crossing angle is set to a right angle. At this time, the “butting” is performed only when the end surfaces 25c, 27c of the first and third side plates 25, 27 are in direct contact with the second plate surfaces 26b, 28b of the bottom plate second side plate 26 or the fourth side plate 28. Instead, the end surfaces 25c and 27c are indirectly supported by the second plate surfaces 26b and 28b by sandwiching a bonding material or the like, or a space is formed between the end surfaces 25c and 27c and the second plate surfaces 26b and 28b. This is also included. Hereinafter, the definition of “butting” is the same.

  An overhang region 32 is formed in the second side plate 26 and the fourth side plate 28. The overhang area 32 is formed by the second side plate 26 and the fourth side plate 28 that project from the storage space 31 outward from the first plate surface 25 a of the first side plate 25 or the first plate surface 27 a of the third side plate 27. . The overhang amount of the overhang area 32 is set to the first length G. The overhang amount may be measured in the vertical direction from the first plate surfaces 25 a and 27 a of the first side plate 25 or the third side plate 27.

  The interface board 19 and the top plate 24 spread in parallel to each other. The outlines of the interface board 19 and the top board 24 have four sides in contact with a rectangle. The plate surface 19a of the interface board 19 and the plate surface 24a of the top plate 24 face each other. Thus, the storage space 31 is sandwiched between the interface board 19 and the top plate 24. The plate surfaces 19a and 24a facing the storage space 31 are formed in a third size (area) L × W larger than the first size L × H and the second size W × H. Here, the sizes of the interface board 19 and the top plate 24 themselves differ from the sizes of the first to fourth side plates 25 to 28.

  The first to fourth side plates 25 to 28 are abutted against the plate surface 19 a of the interface substrate 19 and the plate surface 24 a of the top plate 24 at the end surfaces 25 d to 28 d. The first to fourth side plates 25 to 28 intersect the plate surface 19 a of the interface board 19 and the plate surface 24 a of the top plate 24. The intersection angle can be arbitrarily set. Here, the crossing angle is set to a right angle.

  A first overhang area 33 and a second overhang area 34 are formed in the interface board 19 and the top plate 24. The first overhang region 33 is formed by the interface board 19 and the top plate 24 projecting from the storage space 31 outward from the first plate surface 26 a of the second side plate 26 or the first plate surface 28 a of the fourth side plate 28. . The overhang amount of the first overhang area 33 is set to the second length F. As a result, the first overhanging area 33 of the interface board 19 and the first overhanging area 33 of the top plate 24 sandwich the first pocket space PK1. The overhang amount may be measured in the vertical direction from the first plate surfaces 26a, 28a of the second side plate 26 or the fourth side plate 28. A first pocket space PK <b> 1 is defined by a first overhang area 33 along the first plate surface 26 a of the second side plate 26 and the first plate surface 28 a of the fourth side plate 28.

  The second projecting region 34 is formed by the interface board 19 and the top plate 24 projecting from the first plate surface 25 a of the first side plate 25 or the first plate surface 27 a of the third side plate 27 toward the outside from the storage space 31. . The overhang amount of the second overhang area 34 is set to the first length G. As a result, the overhanging region 32 of the second side plate 26 and the fourth side plate 28 and the second overhanging region 34 of the interface board 19 and the top plate 24 both sandwich the second pocket space PK2. The overhang amount may be measured in the vertical direction from the first plate surfaces 25 a and 27 a of the first side plate 25 or the third side plate 27. The second pocket space PK2 is partitioned by the overhang area 32 and the second overhang area 34 along the first plate surfaces 25a and 27a of the first side plate 25 and the third side plate 27.

  As shown in FIG. 5, the interface board 19 has a first conductive wiring 35. The first conductive wiring 35 is formed from a conductive material. For example, a metal material such as copper can be used as the conductive material. The first conductive wiring 35 has a first conductive pad 35a and a second conductive pad 35b. The first conductive pads 35 a and the second conductive pads 35 b are formed on the plate surface 19 a of the interface substrate 19 outside the frame 29. The first conductive pads 35 a are arranged in a line between one side of the contour of the interface substrate 19 and the first plate surface 25 a of the first side plate 25. The one side extends in parallel to the first plate surface 25a. The second conductive pads 35 b are arranged in a line between one side of the contour of the interface substrate 19 and the second plate surface 26 a of the second side plate 26. The one side extends parallel to the first plate surface 26a. The first conductive pad 35a and the second conductive pad 35b can be formed as a thin film extending on the surface of the substrate.

  The first to fourth side plates 25 to 28 have second conductive wirings 36. The second conductive wiring 36 is formed from a conductive material. For example, a metal material such as copper can be used as the conductive material. The second conductive wiring 36 has a first connection terminal 36a and a second connection terminal 36b. The first connection terminal 36 a is formed on the first plate surface 25 a of the first side plate 25. The second connection terminal 36 b is formed on the first plate surface 26 a of the second side plate 26. Each of the first connection terminal 36a and the second connection terminal 36b can be formed as a thin film extending on the plate surface of the substrate without entering the end surface of the substrate. The insulator of the base body is exposed on the end surfaces of the side plates 25 to 28. The end surfaces of the side plates 25 to 28 are formed of an insulator.

  The structure 18 includes a first bonding material 37. The first bonding material 37 is bonded to the first conductive wiring 35 and the second conductive wiring 36. The first bonding materials 37 are individually fixed to the first conductive pads 35a and the corresponding first connection terminals 36a of the first side plate 25 at the same time. The first conductive pads 35a are connected to the first connection terminals 36a on a one-to-one basis. Similarly, the first bonding material 37 is individually fixed to the second conductive pad 35b and the corresponding second connection terminal 36b of the second side plate 26 at the same time. The second conductive pads 35b are connected to the second connection terminals 36b on a one-to-one basis. The first bonding material 37 has conductivity. The first bonding material 37 is made of, for example, a solder material. For example, a conductive adhesive may be used instead of the solder material. The interface substrate 19 and the first side plate 25 are connected to each other by the first bonding material 37. Similarly, the interface board 19 and the second side plate 26 are connected to each other by the first bonding material 37.

  In the first side plate 25 and the second side plate 26, an electronic component 38 is mounted on the first plate surfaces 25a and 26a. The electronic component 38 can be electrically connected to the second conductive wiring 36, for example. The electronic component 38 is accommodated in the pocket spaces PK1, PK2. The first length G and the second length F are set to be larger than the maximum height h of the electronic component 38. The maximum height h may be measured in the vertical direction from the first plate surfaces 25 a and 26 a of the first side plate 25 or the second side plate 26.

  As shown in FIG. 6, the top plate 24 has a third conductive wiring 41. The third conductive wiring 41 is configured in the same manner as the first conductive wiring 35. The third conductive wiring 41 has a third conductive pad 41a and a fourth conductive pad 41b. The third conductive pad 41 a and the fourth conductive pad 41 b are formed on the plate surface 24 a of the top plate 24 outside the frame 29. The third conductive pads 41 a are arranged in a line between one side of the contour of the top plate 24 and the first plate surface 25 a of the first side plate 25. The one side extends in parallel to the first plate surface 25a. The fourth conductive pads 41 b are arranged in a line between one side of the contour of the top plate 24 and the second plate surface 26 a of the second side plate 26. The one side extends parallel to the first plate surface 26a.

  The first to fourth side plates 25 to 28 have fourth conductive wirings 42. The fourth conductive wiring 42 is configured in the same manner as the second conductive wiring 36. The fourth conductive wiring 42 has a third connection terminal 42a and a fourth connection terminal 42b. The third connection terminal 42 a is formed on the first plate surface 25 a of the first side plate 25. The fourth connection terminal 42 b is formed on the first plate surface 26 a of the second side plate 26.

  The structure 18 includes a second bonding material 43. The second bonding material 43 is bonded to the third conductive wiring 41 and the fourth conductive wiring 42. The second bonding materials 43 are individually fixed to the third conductive pads 41 a and the corresponding third connection terminals 42 a of the first side plate 25 at the same time. The third conductive pads 41a are connected to the third connection terminals 42a on a one-to-one basis. Similarly, the second bonding material 43 is individually fixed to the fourth conductive pads 41b and the corresponding fourth connection terminals 42b of the second side plate 26 at the same time. The fourth conductive pads 41b are connected to the fourth connection terminals 42b on a one-to-one basis. The second bonding material 43 has conductivity. The second bonding material 43 is made of, for example, a solder material. For example, a conductive adhesive may be used instead of the solder material. The top plate 24 and the first side plate 25 are connected to each other by the second bonding material 43. Similarly, the top plate 24 and the second side plate 26 are connected to each other by the second bonding material 43.

  The second side plate 26 has a first metal pad 44. The first metal pad 44 is formed on the second plate surface 26 b of the second side plate 26. The first metal pad 44 is disposed in the overhanging area 32 of the second side plate 26 outside the storage space 31. The first metal pad 44 can be formed as a thin film extending on the surface of the substrate. The first metal pad 44 may be conductive. The first metal pad 44 can be connected to the second conductive wiring 36 and / or the fourth conductive wiring 42. The first metal pad 44 can be formed of the same material as the second conductive wiring 36 and the fourth conductive wiring 42.

  The first side plate 25 has a second metal pad 45. The second metal pad 45 is formed on the first plate surface 25 a of the first side plate 25. The second metal pad 45 may be formed as a thin film that spreads on the plate surface of the substrate without entering the end surface of the substrate. The second metal pad 45 may have conductivity. The second metal pad 45 can be connected to the second conductive wiring 36 and / or the fourth conductive wiring 42. The second metal pad 45 can be formed of the same material as the second conductive wiring 36 and the fourth conductive wiring 42.

  The structure 18 includes a third bonding material 46. The third bonding material 46 is bonded to the first metal pad 44 and the second metal pad 45. The third bonding material 46 is simultaneously fixed to the first metal pad 44 and the corresponding second metal pad 45. The first metal pads 44 are connected to the second metal pads 45 on a one-to-one basis. The third bonding material 46 can have conductivity. The third bonding material 46 is formed of, for example, a solder material. For example, a conductive adhesive may be used instead of the solder material. The third bonding material 46 can be formed of the same material as the first bonding material 37. The first side plate 25 and the second side plate 26 are connected to each other.

  As apparent from FIG. 6, the fourth side plate 28 has the same structure as the second side plate 26. A second connection terminal 36 b and a fourth connection terminal 42 b are formed on the first plate surface 28 a of the fourth side plate 28 in the same manner as the second side plate 26. Correspondingly, the first conductive wiring 35 has a second conductive pad 35b. The second conductive pads 35 b are arranged in a line between one side of the contour of the interface substrate 19 and the first plate surface 28 a of the fourth side plate 28. The one side extends parallel to the first plate surface 28a. The first bonding materials 37 are individually fixed to the second conductive pads 35b and the corresponding second connection terminals 35b of the fourth side plate 28 at the same time. The second conductive pads 35b are connected to the second connection terminals 35b on a one-to-one basis. Similarly, the third conductive wiring 41 has a fourth conductive pad 41b. The fourth conductive pads 41 b are arranged in a line between one side of the contour of the top plate 24 and the first plate surface 28 a of the fourth side plate 28. The one side extends parallel to the first plate surface 28a. The second bonding members 43 are individually fixed to the fourth conductive pads 41b and the corresponding fourth connection terminals 42b of the fourth side plate 28 at the same time. The fourth conductive pads 41b are connected to the fourth connection terminals 42b on a one-to-one basis. The first pocket space PK1 may be formed in contact with the first plate surface 28a of the fourth side plate 28.

  Similar to the first side plate 25, the fourth side plate 28 has a first metal pad 44. The first metal pad 44 is formed on the second plate surface 28 b of the fourth side plate 28. The first metal pad 44 is disposed in the overhanging region of the fourth side plate 28 outside the storage space. The overhang area is formed by a fourth side plate 28 that projects from the first plate surface 25a of the first side plate 25 toward the outside from the storage space. The structure of the third side plate 27 is the same as that of the first side plate 25. Therefore, redundant explanation is omitted.

  As shown in FIG. 7, the electronic component group is stored in the storage space 31. The electronic component group includes an arithmetic processing circuit, that is, a microprocessor unit (MPU) 51, an oscillator 52, a first sensor 53, a second sensor 54, and a third sensor 55. The first to third sensors 53 to 55 are constituted by vibration gyro sensors, for example. The vibration gyro sensor detects the angular velocity around the measurement axis from the vibration of the detection piece accompanying the vibration of the vibration piece. For example, as shown in Japanese Patent No. 3999377, the vibration gyro sensor includes a pair of drive vibration arms extending from the base to the left and right along the X axis and a pair of detection vibrations from the base to the top and bottom along the Y axis. There is a so-called vibration-type gyro sensor that extends the arm. In this vibration-type gyro sensor, when the driving vibration arm is always driven in the X-axis direction and rotation (angular velocity) is applied around the Z-axis, the driving vibration arm moves between the Z-axis of the rotation axis and the X-axis of the vibration direction. The drive vibrating arm vibrates along the Y-axis direction under the Coriolis force in the Y-axis direction orthogonal to both. As a result, the detection vibrating arm vibrates in the X-axis direction, and the charge generated by the vibration distortion is detected, whereby the angular velocity around the Z-axis is detected. In Japanese Patent No. 3999377, each vibrating arm is made of quartz, and the driving vibrating arm is vibrated or electric charges are generated in the detecting vibrating arm using the piezoelectric characteristics of the quartz. In addition to the piezoelectric, there is also an electrostatic drive type vibration gyro sensor using an electrostatic force.

  The MPU 51 is mounted on the plate surface 19 a of the interface board 19. The MPU 51 is electrically connected to the first conductive wiring 35. The MPU 51 can be connected to the connector 15 through the first conductive wiring 35. For such connection, conductive vias and wiring patterns can be formed in the base of the interface board 19. The MPU 51 can exchange signals with the outside through the connector 15.

  The oscillator 52 is mounted on the second plate surface 28b of the fourth side plate 28, for example. The oscillator 52 is electrically connected to at least the second conductive wiring 36. Since the second connection terminal 36 b of the second conductive wiring 36 is connected to the second conductive pad 35 b of the first conductive wiring 35, the oscillator 52 is electrically connected to the MPU 51 via the second conductive wiring 36 and the first conductive wiring 35. Can be connected to. For such connection, conductive vias and wiring patterns can be formed in the base of the fourth side plate 28. The oscillator 52 can supply a clock signal to the MPU 51.

  The third sensor 55 is mounted on the plate surface 24 a of the top plate 24. The third sensor 55 has a single measurement axis on a vertical axis orthogonal to the plate surface 24 a of the top plate 24. The third sensor 55 is electrically connected to the third conductive wiring 41. The third conductive pads 41a and / or the fourth conductive pads 41b of the third conductive wiring 41 are connected to the third connection terminals 42a and / or the fourth connection terminals 42b of the fourth conductive wiring 42, and the individual side plates 25 to 25 are connected. The fourth conductive wiring 42 is connected to the second conductive wiring 36 every 28, and the first connection terminal 36 a and / or the second connection terminal 36 b of the second conductive wiring 36 is the first conductive pad 35 a of the first conductive wiring 35. And / or is connected to the second conductive pad 35 b, the detection signal of the third sensor 55 is transmitted through the third conductive wiring 41, the fourth conductive wiring 42, the second conductive wiring 36, and the first conductive wiring 35 to the MPU 51. Can be supplied. The MPU 51 can supply a control signal to the third sensor 55. For such connection, conductive vias and wiring patterns can be formed in the base of the top plate 24.

  A temperature sensor 56 is further mounted on the plate surface 24 a of the top plate 24. The temperature sensor 56 faces the MPU 51 with a space in between. The temperature sensor 56 detects the temperature in the storage space 31. The temperature sensor 56 is electrically connected to the third conductive wiring 41. Similar to the third sensor 55, the temperature sensor 56 can be electrically connected to the MPU 51. The temperature sensor 56 supplies a temperature information signal to the MPU 51. The temperature information signal specifies the temperature detected by the temperature sensor 56. The MPU 51 can perform temperature compensation of the first sensor 53, the second sensor 54, and the third sensor 55 according to the temperature detected by the temperature sensor 56.

  The second sensor 54 is mounted on the second plate surface 26 b of the second side plate 26. The second sensor 54 has a single measurement axis on a vertical axis orthogonal to the second plate surface 26b of the second side plate 26. The second sensor 54 is electrically connected to at least the second conductive wiring 36. Since the second connection terminal 36 b of the second conductive wiring 36 is connected to the second conductive pad 35 b of the first conductive wiring 35, the detection signal of the second sensor 54 passes through the second conductive wiring 36 and the first conductive wiring 35. Can be supplied to the MPU 51. The MPU 51 can supply a control signal to the second sensor 54. For such connection, conductive vias and wiring patterns can be formed in the base of the second side plate 26.

  The first distance D1 from the second side plate 26 to the third sensor 55 is different from the second distance D2 from the top plate 24 to the second sensor 54. Here, the first distance D1 is set larger than the second distance D2. The second sensor 54 partially enters the space S 1 between the second side plate 26 and the third sensor 55. In other words, when the storage space 31 is viewed from the second side plate 26 side in the direction perpendicular to the plate surface, at least a part of the second sensor 54 overlaps the third sensor 55. As a result, regardless of the installation of the third sensor 55, the second distance D2 can be reduced as much as possible. Thus, the third sensor 55 can be as close to the plate surface 19a of the interface board 19 as possible. As a result, the sensor module 11 can be thinned. The third distance D3 from the fourth side plate 28 to the third sensor 55 is different from the first distance D1. Accordingly, the third sensor 55 is arranged on the plate surface 24a of the top plate 24 so as to be deviated from the center position (center of gravity position).

  As apparent from FIG. 8, the first sensor 53 is mounted on the second plate surface 27 b of the third side plate 27. The first sensor 53 has a measurement axis on a vertical axis orthogonal to the second plate surface 27 b of the third side plate 27. The first sensor 53 is electrically connected to at least the second conductive wiring 36. Since the first connection terminal 36 a of the second conductive wiring 36 is connected to the first conductive pad 35 a of the first conductive wiring 35, the detection signal of the first sensor 53 passes through the second conductive wiring 36 and the first conductive wiring 35. Can be supplied to the MPU 51. The MPU 51 can supply a control signal to the first sensor 53. For such connection, conductive vias and wiring patterns can be formed in the base of the third side plate 27.

  The electronic component group further includes a fourth sensor 57. The fourth sensor 57 is mounted on the second plate surface 25 b of the first side plate 25. The fourth sensor 57 is constituted by, for example, a triaxial detection type acceleration sensor. The acceleration sensor detects acceleration in the axial direction from the vibration of the detection piece accompanying the vibration of the vibration piece. The fourth sensor 57 is orthogonal to the vertical axis orthogonal to the plate surface 24 a of the top plate 24, the vertical axis orthogonal to the second plate surface 26 b of the second side plate 26, and the second plate surface 27 b of the third side plate 27. Acceleration can be detected in the direction of the vertical axis. The fourth sensor 57 is electrically connected to at least the second conductive wiring 36. Since the first connection terminal 36 a of the second conductive wiring 36 is connected to the first conductive pad 35 a of the first conductive wiring 35, the detection signal of the fourth sensor 57 passes through the second conductive wiring 36 and the first conductive wiring 35. Can be supplied to the MPU 51. The MPU 51 can supply a control signal to the fourth sensor 57. For such connection, conductive vias and wiring patterns can be formed in the base of the first side plate 25.

  The fourth distance D4 from the second side plate 26 to the first sensor 53 is different from the fifth distance D5 from the second side plate 27 to the second sensor 54. Here, the fourth distance D4 is set larger than the fifth distance D5. The second sensor 54 partially enters the space S <b> 2 between the second side plate 26 and the first sensor 53. In other words, when the storage space 31 is viewed from the second side plate 26 side in the direction perpendicular to the plate surface, at least a part of the second sensor 54 overlaps the first sensor 53. As a result, regardless of the installation of the first sensor 53, the fifth distance D5 can be reduced as much as possible. Thus, the first sensor 53 can be as close to the second plate surface 25b of the first side plate 25 as possible. As a result, the sensor module 11 can be reduced in size. The sixth distance D6 from the fourth side plate 28 to the first sensor 53 is different from the fourth distance D4. Accordingly, the first sensor 53 is arranged on the second plate surface 27b of the third side plate 27 so as to be deviated from the center position (center of gravity position).

  The seventh distance D7 from the second side plate 26 to the fourth sensor 57 is different from the eighth distance D8 from the first side plate 25 to the second sensor 54. Here, the seventh distance D7 is set larger than the eighth distance D8. The second sensor 54 partially enters the space S <b> 3 between the second side plate 26 and the fourth sensor 57. In other words, when the storage space 31 is viewed in the direction perpendicular to the plate surface from the second side plate 26 side, at least a part of the second sensor 54 overlaps the fourth sensor 57. As a result, the eighth distance D8 can be reduced as much as possible regardless of the installation of the fourth sensor 57. Thus, the fourth sensor 57 can be as close to the second plate surface 27b of the third side plate 27 as possible. As a result, the sensor module 11 can be reduced in size. Here, the fifth distance D5 is different from the eighth distance D8. Accordingly, the second sensor 54 is arranged on the second plate surface 26b of the second side plate 26 so as to be deviated from the center position (center of gravity position). Similarly, the ninth distance D9 from the fourth side plate 28 to the fourth sensor 57 is different from the seventh distance D7. Accordingly, the fourth sensor 57 is arranged on the second plate surface 25b of the first side plate 25 so as to be deviated from the center position (center of gravity position).

  The tenth distance D10 from the third side plate 27 to the third sensor 55 is different from the eleventh distance D11 from the top plate 24 to the first sensor 53. Here, the tenth distance D10 is set larger than the eleventh distance D11. The first sensor 53 partially enters the space S4 between the third side plate 27 and the third sensor 55. (It can also be said that when the storage space 31 is viewed from the third side plate 27 side, at least a part of the first sensor 53 overlaps the third sensor 55.) The 11 distance D11 can be reduced as much as possible. Thus, the third sensor 55 can be as close to the plate surface 19a of the interface board 19 as possible. As a result, the sensor module 11 can be thinned. The twelfth distance D12 from the interface board 19 to the first sensor 53 may be different from the eleventh distance D11.

  The thirteenth distance D13 from the first side plate 25 to the third sensor 55 is different from the fourteenth distance D14 from the top plate 24 to the fourth sensor 57. Here, the thirteenth distance D13 is set larger than the fourteenth distance D14. The fourth sensor 57 partially enters the space S5 between the first side plate 25 and the third sensor 55. In other words, when the storage space 31 is viewed in the direction perpendicular to the plate surface from the first side plate 25 side, at least a part of the fourth sensor 57 overlaps the third sensor 55. As a result, the 14th distance D14 can be reduced as much as possible regardless of the installation of the third sensor 55. Thus, the third sensor 55 can be as close to the plate surface 19a of the interface board 19 as possible. As a result, the sensor module 11 can be thinned. The fifteenth distance D15 from the interface board 19 to the fourth sensor 57 may be different from the fourteenth distance D14. The tenth distance D10 and the thirteenth distance D13 may be different from each other.

(2) Operation of sensor module In the sensor module 11, acceleration is detected by the fourth sensor 57 in the directions of three orthogonal axes, and the angular velocity around each axis is detected by the first sensor 53, the second sensor 54, and the third sensor 55. Detected. Detection signals from the first to fourth sensors 87 to 79 are supplied to the MPU 51. The MPU 51 calculates acceleration and angular velocity based on the detection signal. The calculation result can be output from the connector 15 to the outside. The sensor module 11 can function as an inertial measurement unit (IMU).

  With such a configuration, even when vibration is input from the outside of the structure 18, discontinuous portions between the interface substrate 19, the top plate 24, and the first to fourth side plates 25 to 28 ( Loss of vibration energy occurs at the connecting portion), and the Q value of vibration decreases. Further, as a feature of the present invention, the size of the third side plate 27 in contact with the storage space 31, the size of the second side plate 26 and the size of the top plate 24 are different from each other. The energy dispersion increases and the natural vibration Q value decreases. Thereby, the angular velocity can be detected with high accuracy in each of the first sensor 53, the second sensor 54, and the third sensor 55.

  Moreover, since the size of the first side plate 25 in contact with the storage space 31 differs from the size of the second side plate 26 in contact with the storage space 31 and the size of the top plate 24, the symmetry of the structure 18 is lost. The energy dispersion increases and the Q value of the natural vibration decreases. Thereby, the angular velocity can be detected with high accuracy in each of the fourth sensor 57, the second sensor 54, and the third sensor 55.

  Further, when vibration gyro sensors are used for the sensors 53, 54, and 55, the sensors 53, 54, and 55 mounted on the third side plate 27, the second side plate 26, and the top plate 24 have vibrations from the outside of the structure 18. In addition to acting as a receiver that is exposed to fluctuations in the output signal according to the input, it also serves as a vibration source that radiates its own drive vibration to the surroundings. That is, the driving vibration of the sensors 53, 54, and 55 may propagate to the acceleration sensor 57, appear as noise in the output signal of the fourth sensor 57 (acceleration sensor), and deteriorate the detection sensitivity. However, as in the present embodiment, the sensors 53, 54, 55 (vibration gyro sensor) and the sensor 57 (acceleration sensor) are mounted on different substrates, and the side walls of the storage space 31 are different in size and symmetrical. As a result, the drive vibration of the vibration gyro sensor is prevented from propagating to the acceleration sensor.

  In addition, the first to fourth sensors 53, 54, 55, and 57 are arranged on the third side plate 27, the second side plate 26, the top plate 24, and the first side plate 25 so as to be deviated from the respective gravity center positions. Depending on such deviation, the symmetry of the structure 18 can be broken. As a result, the Q value of the natural vibration can be reliably reduced.

  The first distance D1 corresponds to the distance from the connection point of the top plate 24 and the second side plate 26 to the third sensor 55. Similarly, the second distance D2 corresponds to the distance from the connection point of the top plate 24 and the second side plate 26 to the second sensor 54. The vibration of the top plate 24 and the vibration of the second side plate 26 behave differently depending on the distance from the connection point of the top plate 24 and the second side plate 26. Therefore, if the two distances differ, the vibration of the top plate 24 And the mutual influence between the vibration of the second side plate 26 can be avoided. This can greatly contribute to the prevention of mutual interference. Similarly, the relationship between the fourth distance D4 and the fifth distance D5, the relationship between the seventh distance D7 and the eighth distance D8, the relationship between the tenth distance D10 and the eleventh distance D11, and the thirteenth distance D13 and the fourteenth distance D14. This relationship can greatly contribute to the prevention of mutual interference.

  The second sensor 54, the first sensor 53, and the fourth sensor 57 partially enter the spaces S1, S4, and S5 partitioned around the third sensor 55, respectively. As a result, regardless of the installation of the second sensor 54, the first side plate 25 and the third side plate 27 can be as close to each other as possible. Thus, downsizing of the sensor module 11 can be realized.

  The sensor module 11 can be mounted on an external printed wiring board, for example, by a connector 15. The connector 15 establishes conduction between the MPU 51 and the printed wiring board. Since the conducting member has a high heat transfer rate, the connector 15 can efficiently transfer the heat of the MPU 51 to the printed wiring board. Thus, the heat radiation of the MPU 51 can be promoted.

  The temperature sensor 56 faces the MPU 51 with a space in between. Thus, the temperature sensor 56 can be moved away from the MPU 51. The temperature sensor 56 can be separated from the heat of the MPU 51 as much as possible. As a result, the temperature sensor 56 can accurately detect the temperature in the storage space 31.

(3) Electronic equipment The structure 18 and the sensor module 11 described above include a digital still camera, a video camera, a navigation device, a vehicle body posture detection device, a pointing device, a game controller, a head mounted display (HMD), and a mobile phone. It can be used in radio control helicopters, cleaning robots, etc. However, the uses of the structure 18 and the sensor module 11 are not limited to these electronic devices.

  Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term described with a different term having a broader meaning or the same meaning at least once in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings. Further, the configurations and operations of the sensor module 11, the structure 18, the electronic component, the electronic device, and the like are not limited to those described in the present embodiment, and various modifications can be made.

  DESCRIPTION OF SYMBOLS 11 Sensor module, 15 Interface component (connector), 18 Structure, 19 Interface board, 24 3rd board | substrate (top plate), 25 2nd board | substrate (1st side board), 26 2nd board | substrate (2nd side board), 27 1st 1 substrate (third side plate), 31 storage space, 51 arithmetic processing circuit (microprocessor unit), 53 first sensor, 54 second sensor, 55 third sensor, 56 temperature sensor, 57 first sensor (fourth sensor) , D1 distance (first distance), D2 distance (second distance), D4 distance (fourth distance), D5 distance (fifth distance), D7 distance (seventh distance), D8 distance (eighth distance), D10 Distance (10th distance), D11 distance (11th distance), D13 distance (13th distance), D14 distance (14th distance).

Claims (15)

A structure including a first rigid substrate and a second rigid substrate in which plate surfaces are connected to each other;
When the inside of a hexahedron , which is determined as two adjacent side walls, is the storage space, the first rigid substrate and the second rigid substrate are supported by a plate surface on the storage space side of the first rigid substrate. A sensor,
A second sensor supported on a plate surface on the storage space side of the second rigid substrate;
With
The area of the plate surface of the first rigid substrate and the area of the plate surface of the second rigid substrate in the storage space are different from each other ,
The second rigid board has an overhanging area in which the plate surface on the storage space side projects to the outer space side than the first rigid board,
A metal pad formed in the projecting area of the second rigid substrate, and a metal pad formed on a plate surface on the external space side opposite to the plate surface on the storage space side of the first rigid substrate; The sensor module is provided with a conductive bonding material for connecting the first rigid substrate and the second rigid substrate .   The sensor module according to claim 1,
  The structure includes a third rigid substrate that is another sidewall connected adjacent to the first rigid substrate and the second rigid substrate,
  The third rigid board has an overhanging area in which the plate surface on the storage space side projects to the external space side from each of the first rigid board and the second rigid board,
  Conductivity for connecting a metal pad formed in the overhanging region of the third rigid substrate and a metal pad formed on a plate surface on the external space side of each of the first rigid substrate and the second rigid substrate. The sensor module is provided with a connecting portion between the third rigid substrate and each of the first rigid substrate and the second rigid substrate. The sensor module according to claim 1,
The distance from the connecting portion of the second rigid substrate to the first sensor on the first rigid substrate is different from the distance from the connecting portion of the first rigid substrate to the second sensor on the second rigid substrate. Sensor module characterized by The sensor module according to claim 1 or 3 ,
A sensor module, wherein when the storage space is viewed from the second rigid substrate side, at least a part of the second sensor overlaps the first sensor. The sensor module according to claim 1 ,
A third rigid substrate connected adjacent to the first rigid substrate and the second rigid substrate and forming another side wall of the storage space;
A third sensor supported on a plate surface of the third rigid board on the storage space side,
The sensor module according to claim 1, wherein an area of the plate surface of the first rigid substrate, an area of the plate surface of the second rigid substrate, and an area of the plate surface of the third rigid substrate in the storage space are different from each other. The sensor module according to claim 5, wherein
The third rigid board has an overhanging area in which a plate surface on the storage space side protrudes from each of the first rigid board and the second rigid board,
Conductivity for connecting a metal pad formed in the overhanging region of the third rigid substrate and a metal pad formed on a plate surface on the external space side of each of the first rigid substrate and the second rigid substrate. A sensor module , comprising: a connecting member that connects the third rigid substrate and each of the first rigid substrate and the second rigid substrate . The sensor module according to claim 5 or 6 ,
The distance from the connection portion of the third rigid substrate to the first sensor in the first rigid substrate is different from the distance from the connection portion of the first rigid substrate to the third sensor in the third rigid substrate. Features sensor module. The sensor module according to claim 6 or 7 ,
The sensor module, wherein when the storage space is viewed from the first rigid board side, at least a part of the first sensor overlaps with the third sensor. In the sensor module according to any one of claims 5 to 8 ,
The distance from the connecting portion of the third rigid substrate to the second sensor in the second rigid substrate is different from the distance from the connecting portion of the second rigid substrate to the third sensor in the third rigid substrate. Sensor module characterized by The sensor module according to any one of claims 5 to 9 ,
The sensor module, wherein when the storage space is viewed from the second rigid substrate side, at least a part of the second sensor overlaps with the third sensor. The sensor module according to any one of claims 5 to 10 ,
The sensor module, wherein the third sensor is a vibration gyro sensor. The sensor module according to any one of claims 1 to 11 ,
The structure is
An interface board connected to the first rigid board and the second rigid board and forming another side wall of the storage space;
The interface board includes an arithmetic processing circuit supported on the board surface of the interface board on the storage space side, and an interface component supported on a board surface opposite to the board surface on the storage space side. A sensor module characterized by being made. The sensor module according to claim 12 , wherein
The structure is provided with a temperature sensor,
The temperature sensor is attached to a substrate other than the interface substrate.   A structure in which the interior of a hexahedron composed of six side walls including the adjacent first rigid substrate and second rigid substrate is used as a storage space;
  A first sensor supported by a plate surface of the first rigid board on the storage space side;
  A second sensor supported on a plate surface on the storage space side of the second rigid substrate;
With
  The area of the plate surface of the first rigid substrate and the area of the plate surface of the second rigid substrate in the storage space are different from each other,
  One of the two side walls adjacent to each other among the six side walls has an overhanging area in which the plate surface on the storage space side protrudes to the outer space side than the other of the two side walls,
  A conductive bonding material for connecting a metal pad formed in the projecting region of one of the two side walls and a metal pad formed on a plate surface on the other external space side of the two side walls; A sensor module comprising a connecting portion between the two side walls.   An electronic apparatus comprising the sensor module according to claim 1.

Images