JP2005300749A - Electro-optical device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a construction of an electro-optical device, in which the temperature compensating performance of an electro-optical panel is improved more than that in the conventional ones, while retaining the flexibility of device construction, by optimizing a temperature detection state of a temperature sensor in the electro-optical device which has temperature-compensating function with respect to the electro-optical panel. <P>SOLUTION: In the electro-optical device which is equipped with the electro-optical panel 110 formed by disposing an electro-optical material inside, a circuit board 121 with a control circuit, including electronic componenets for controlling the electrooptical panel 110 and the temperature sensor, cases 101, 102, 103 to contain the electro-optical panel 110 and the circuit board 121 and a space section formed inside the cases, the electro-optical device 100 is characterized, by having the temperature sensor 124 electrically connected to the circuit board 121 and placed in the space section at a position separated from the circuit board 121. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electro-optical device and an electronic apparatus, and more particularly to a structure of an electro-optical device including an electro-optical panel and a circuit board on which a control circuit for controlling the electro-optical panel is configured.

  In general, an electro-optical panel in which an electro-optical material such as a liquid crystal or an organic electroluminescent material is disposed between a pair of substrates is used as various display devices. In such an electro-optical panel, various control circuits are required to display a predetermined image or the like on the electro-optical panel. For example, the electro-optical panel is provided with a drive circuit that outputs a drive signal, and a display control circuit is used to supply display data and a clock signal to the drive circuit.

Since the electro-optical panel generally has a temperature characteristic that the display state changes when the environmental temperature changes, a temperature compensation function may be added to the display control circuit. For example, in the liquid crystal display panel, the threshold voltage of the liquid crystal varies according to the temperature change, so that the light transmittance of each pixel also changes with the temperature change. In an active matrix liquid crystal display panel provided with active elements such as TFTs (thin film transistors) and TFDs (thin film diodes) for each pixel, the display mode of the pixels changes with temperature changes depending on the temperature characteristics of the active elements. Then, the contrast may deteriorate due to these causes, or normal display may not be performed. Therefore, normally, a temperature compensation circuit unit is configured in the display control circuit, and the drive voltage for the electro-optical panel is adjusted according to the temperature detected by the temperature sensor included in the temperature compensation circuit unit. The change in the display mode caused is reduced (see, for example, Patent Document 1 below).
JP-A-11-7001

  However, in the electro-optical device having the above-described temperature compensation function, the temperature sensor is brought into contact with the electro-optical panel to detect the temperature, so that the location of the temperature sensor with respect to the electro-optical panel is limited, and the electro-optical device There is a problem in that a large restriction is imposed on the arrangement configuration of each member inside.

  In the conventional display control circuit, since the temperature sensor is arranged on the circuit board, the temperature detected by the temperature sensor is affected by the heat transmitted from other electronic components on the circuit board. There is a problem that temperature control cannot be performed.

  Furthermore, when a non-light emitting element such as a liquid crystal display device is used, an illumination unit such as a backlight must be provided in the electro-optic panel. The illumination unit is the largest heat source in the electro-optic device, and an edge light. Since the distribution of the light source is biased as in a lighting unit of a mold, the temperature distribution is often biased, so that the temperature sensor is affected by the temperature of the lighting unit and cannot perform appropriate temperature control. There is also a problem.

  Accordingly, the present invention solves the above-described problems, and the problem is that in an electro-optical device having a temperature compensation function for an electro-optical panel, the temperature detection state of the temperature sensor is optimized, thereby freeing the device configuration. An object of the present invention is to provide a configuration of an electro-optical device capable of improving the temperature compensation performance of an electro-optical panel as compared with the related art while securing the degree.

  In view of such circumstances, an electro-optical device of the present invention includes an electro-optical panel in which an electro-optical material is arranged, a circuit board having a control circuit including an electronic component for controlling the electro-optical panel and a temperature sensor. An electro-optical device comprising a case for housing the electro-optical panel and the circuit board, and a space formed in the case, wherein the temperature sensor is electrically connected to the circuit board and the circuit It arrange | positions in the said space in the position spaced apart from the board | substrate.

  According to the present invention, since the temperature sensor included in the control circuit is disposed in the space formed in the case at a position separated from the circuit board, the temperature sensor is less likely to receive heat generated in the circuit board. Therefore, it is possible to reduce the influence of heat generated by the control circuit itself and other components (for example, an illumination unit described later), and it is possible to perform accurate temperature detection. Accordingly, it is possible to perform appropriate temperature compensation according to the external temperature without directly contacting the temperature sensor with the electro-optical panel.

  In particular, since no great restriction is imposed on the positional relationship between the electro-optical panel and the temperature sensor, the degree of freedom of the configuration of the electro-optical device can be ensured. For example, it is not necessary to arrange the electro-optical panel and the circuit board adjacent to each other. For example, as will be described later, an illumination unit can be arranged between the electro-optical panel and the circuit board.

  In addition, since the circuit board is housed in the case, the electrical reliability and safety can be improved, the handling of the electro-optical device is improved, and the installation of the electro-optical device (for example, inside the electronic apparatus) Etc.).

  In the above invention, examples of the electronic components included in the control circuit configured on the circuit board include a semiconductor IC chip, a capacitor, an inductor, and an electric resistance. Examples of the temperature sensor included in the control circuit include various elements capable of deriving a detection value corresponding to the temperature in the control circuit, such as a thermistor, a diode, a thermocouple, and a CMOS temperature sensor.

  In the present invention, the case preferably has an opening communicating with the outside. According to this, since the opening part connected with the exterior is provided in the case, the outside part is introduced into the inside of the case by the circulation of air through the opening part, so that the space part formed in the case The temperature detected by the temperature sensor arranged in the can be brought close to the external temperature (the temperature of the electro-optical panel).

  According to another electro-optical device of the present invention, an electro-optical panel in which an electro-optical material is disposed, a circuit board having a control circuit including an electronic component for controlling the electro-optical panel and a temperature sensor, An electro-optical device comprising an electro-optical panel and a case for housing the circuit board, wherein the temperature sensor is electrically connected to the circuit board and disposed outside the case at a position spaced apart from the circuit board. It is characterized by.

  According to the present invention, since the temperature sensor is arranged outside the case at a position separated from the circuit board, the temperature sensor becomes less susceptible to the thermal influence of the circuit board, and the temperature reflecting the external temperature. Since detection becomes possible, more accurate temperature detection can be performed.

  In this invention, it is preferable that the said temperature sensor is arrange | positioned on the another board | substrate electrically connected to the said circuit board. According to this, since it becomes possible to reduce the thermal conductivity between a circuit board and another board | substrate, the temperature detection environment of a temperature sensor can be improved more. Further, by mounting the temperature sensor on a separate substrate, it becomes easy to perform maintenance work such as positioning, installation, replacement and repair of the temperature sensor.

  In this invention, it is preferable that the said another board | substrate is electrically connected via the connector arrange | positioned on the said circuit board, and is standingly arranged with respect to the said circuit board. As the separate board is electrically connected via a connector disposed on the circuit board, it is possible to easily assemble the apparatus. In addition, since the separate board is erected with respect to the circuit board, the temperature sensor is disposed at a position away from the surface of the circuit board, and the degree of exposure to the surrounding space of the temperature sensor is increased. Therefore, the external temperature can be detected more accurately.

  In the present invention, it is preferable to further include an illumination unit disposed between the electro-optical panel and the circuit board. According to this, since the circuit board is arranged behind the illumination unit with respect to the electro-optical panel, it is possible to sufficiently secure the board area of the circuit board and to make the electro-optical device compact. become. In addition, since the electro-optical panel is disposed on one side of the illumination unit and the circuit board is disposed on the other side of the illumination unit, the thermal influence of the illumination unit is applied to the electro-optical panel and the circuit board almost evenly. As a result, a measurement value that more accurately reflects the temperature environment of the electro-optical panel can be obtained by the temperature sensor.

  Next, an electronic apparatus according to an aspect of the invention includes any one of the electro-optical devices described above and a control unit that controls the electro-optical device. In particular, the electronic device is preferably a portable electronic device such as a mobile phone, a portable information terminal, or an electronic watch.

  In each of the above inventions, the electro-optical panel and the circuit board may be accommodated in separate cases, or may be accommodated in an integral case, but the electro-optical panel and the circuit board A partition may be formed between the two.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[First Embodiment]
FIG. 1 is a longitudinal sectional view of the electro-optical device 100 according to the first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a cross section of the electro-optical device 100 orthogonal to FIG. The electro-optical device 100 includes an electro-optical panel 110, a control circuit system 120, and an illumination unit 130.

  The electro-optical panel 110 is formed by bonding substrates 111 and 112 made of glass, plastic, or the like with a sealing material (not shown), and an electro-optical material such as liquid crystal is disposed therein. In the illustrated example, a liquid crystal display panel is shown as an example, and polarizing plates 113 and 114 are attached to the outer surfaces of the substrates 111 and 112. In addition, an electronic component 115 (see FIG. 2) incorporating a drive circuit is mounted on a substrate overhanging portion of the substrate 111 that protrudes outward from the outer shape of the substrate 112, and is outside the outer shape of the substrate 111 in the substrate 112. An electronic component 116 (see FIG. 1) having a built-in drive circuit is mounted on the substrate overhanging portion that overhangs.

  The electro-optical panel 110 is disposed inside the outer case 101 and the inner case 102. Specifically, the electro-optical panel 110 is accommodated in a state of being positioned in a planar direction on the upper part of the inner case 102, and the outer case 101 is fitted and fixed to the inner case 102 from the observation side of the electro-optical panel 110. Yes.

  As the electro-optical panel 110, those having various configurations can be used. In the present embodiment, a liquid crystal display panel is employed. In addition, an active matrix liquid crystal display panel including an active element corresponding to each pixel is preferable. In the case of a liquid crystal display panel, since the alignment state of the liquid crystal changes depending on the temperature, the contrast has temperature characteristics. The active device may also have temperature characteristics. In particular, in this embodiment, a TFD (thin film diode) having an MIM (metal-insulator-metal) structure or the like is used as an active element. It is known that the temperature characteristics of this TFD element are relatively large.

  The control circuit system 120 includes a circuit board (main control board) 121 disposed outside the inner case 102, and a wiring board 122 that conductively connects the circuit board 121 and the electro-optical panel 110. Here, the circuit board 121 is preferably composed of a rigid board whose base material is phenol resin, glass epoxy resin, or the like. The wiring board 122 is preferably composed of a flexible board (FPC) having a polyimide resin or the like as a base material. The wiring board 122 is conductively connected to an input terminal provided on the board overhanging portion of the electro-optical panel 110, led out from the inside of the inner case 122, and conductively connected to the circuit board 121.

  Another circuit board 123 having a smaller cross section than the circuit board 121 is connected and fixed to the circuit board 121, and a temperature sensor 124 is mounted on the other circuit board 123. The separate substrate 123 can be composed of a rigid substrate or a flexible substrate. The separate board 123 is erected on the board surface of the circuit board 121. In the illustrated example, the separate substrate 123 is fixed so as to have a substrate surface that is substantially orthogonal to the substrate surface of the circuit substrate 121. The temperature sensor 124 is conductively connected via a separate substrate 123 so as to constitute a part of a temperature compensation circuit unit described later on the circuit board 121. The temperature sensor 124 may be any device that can detect the temperature. For example, a thermistor, a diode, a thermocouple, a CMOS temperature sensor, or the like can be used. In this embodiment, a diode (small signal diode, switching diode) is used as the temperature sensor.

  The temperature sensor 124 is in a non-contact state with other members in a portion other than the mounting surface with respect to the separate substrate 123. That is, the temperature sensor 124 is not in contact with other members other than the separate substrate 123. As a result, the temperature sensor 124 is sufficiently exposed to the surrounding outside air, so that the temperature detected by the temperature sensor 124 becomes closer to the temperature of the air around the separate substrate 123.

  The circuit board 121 and the separate board 123 are covered with a circuit case 103. That is, the circuit board 121 and the separate board 123 are arranged in a space defined by the outer case 101 or the inner case 102 and the circuit case 103. More specifically, the circuit board 121 is accommodated between the circuit case 103 and the illumination unit 130. Further, the separate substrate 123 is disposed in a space formed between the circuit board 121 and the circuit case 103, so that the temperature sensor 124 is exposed in the space at a position separated from the circuit board 121. . The circuit case 103 is formed with a plurality of openings (vent holes) 103a, and the space communicates with the outside through the openings 103a.

  An inverter circuit 125 is disposed inside the circuit case 103. The inverter circuit 125 is for generating one or a plurality of power supply potentials for driving the electro-optical panel 110. Note that the circuit case 103 covers the inverter circuit 125 having a high voltage portion to ensure safety.

  The illumination unit 130 includes a light source 131 composed of a white light emitting diode and the like, and light from the light source 131 is incident on the side end surface thereof and propagates through the interior and is derived as illumination light from the surface on the electro-optical panel 110 side. And a light guide plate 132 configured as described above. On the surface of the light guide plate 132, an optical filter member 133 such as a light diffusing plate or a light collecting plate, a light shielding sheet 134, or the like is disposed as necessary. The light source 131 is mounted on a substrate 135, and the substrate 135 is conductively connected to the circuit substrate 121. In the present embodiment, a plurality of light sources 131 are mounted on the substrate 135.

  The light guide plate 132 is formed with light deflecting means in an appropriate distribution form from the side where the light source 131 is arranged to the opposite side so that uniform light can be emitted over the entire surface. preferable. This light deflecting means is constituted by, for example, a fine surface irregularity formed on the back surface of the light guide plate 132 or a light scattering layer formed on the back surface. Further, it is preferable that a light reflecting means such as a light reflecting sheet is disposed behind the light guide plate 132. In this case, a light reflecting layer made of a metal film or the like deposited on the inner surface of the inner case 102 may be used as the light reflecting means.

  The illumination unit 130 is accommodated in the inner case 120 and is in contact with the electro-optical panel 110 at the upper part thereof. That is, the illumination unit 130 is accommodated in the inner case 120, and the electro-optical panel 110 is accommodated in the inner case 120 above the illumination unit 130.

  In the present embodiment, a case body is configured by the outer case 101 and the circuit case 103, and the inside of the case body is partitioned by the inner case 102. The partition constituted by the inner case 102 is provided between a space where the electro-optical panel 110 and the illumination unit 130 are arranged and a space where the control circuit system 120 is arranged.

  FIG. 6 is a schematic configuration diagram of the display control circuit 150 configured in the control circuit system 120. The main part of the display control circuit 150 is composed of the circuit board 121 (the wiring pattern, electronic components, etc.). The display control circuit 150 includes an input unit 151 connected to an external control unit, a data supply source or a potential supply source, and a basic control unit that generates a clock signal and display data necessary for controlling the electro-optical panel 110. 152 and an output unit 153 for outputting various control signals to the electro-optical panel 110.

  In addition, a display adjustment unit 154 for adjusting a display mode such as contrast of the electro-optical panel 110 with respect to display data generated by the basic control unit 152 is provided. The display adjustment unit 154 includes a temperature compensation circuit unit including the temperature sensor 134 described above.

  The temperature sensor 134 includes a plurality of diode elements 155. The display adjustment unit 154 modulates the display data generated by the basic control unit 152 according to the temperature detected by the temperature sensor 134, and reduces the variation of the display mode of the electro-optical panel 110 due to the temperature. It has a function of adjusting the voltage applied to the substance.

  In the present embodiment, since the temperature sensor 124 is disposed away from the circuit board 121, it is less susceptible to the heat generated by the electronic elements mounted on the circuit board 121, and stable temperature detection is possible. It can be carried out. In particular, the separate substrate 123 connected to the circuit board 121 constitutes a small cross section having a smaller cross section than the circuit board 121, so that the amount of heat transferred from the circuit board 121 to the temperature sensor 124 can be reduced. Further, since the temperature sensor 124 is in a non-contact state with respect to other members except for the mounting surface with respect to the separate substrate 123, the ambient temperature of the temperature sensor 124 is sufficiently reflected because the degree of exposure to the surroundings is high. Temperature detection is possible.

  In the present embodiment, heat is generated not only in the circuit board 121 but also in the light source 131 of the illumination unit 130. Heat generated by the light source 131 is transmitted to the circuit board 121 via the inner case 102. The heat caused by the light source 131 is also transferred away from the circuit board 121 in the same manner as described above, and is transmitted to the temperature sensor 124 connected to the circuit board 121 via another board 123 having a small cross section. Hateful.

  In particular, in the present embodiment, since the circuit board 121 is covered with the circuit case 103 as described above, the temperature of the circuit board 121 is likely to rise due to heat generated in the circuit board 121 and the lighting unit 130. Therefore, when the temperature sensor 124 is directly mounted on the circuit board 121, the temperature detected by the temperature sensor 124 is greatly affected by the heat source. However, in the present embodiment, the degree of thermal contact between the circuit board 121 and the temperature sensor 124 is reduced by the above configuration, and the degree of exposure of the temperature sensor 124 is increased. Can be secured.

  In the electro-optical device 100 of the present embodiment, the electro-optical panel 110 is disposed on the observation side of the illumination unit 130, and the control circuit system 120 is disposed on the opposite side of the illumination unit 130 from the observation side. Regarding the heat generated by 130, the temperature sensor 124 is in an environment that is relatively close to that of the electro-optical panel 110. Therefore, although the temperature sensor 124 is not in direct contact with the electro-optical panel 110, it is possible to detect a temperature substantially equal to the temperature environment of the electro-optical panel 110. As a result, the temperature sensor 124 detects the temperature. By performing the temperature compensation of the electro-optical panel 110 based on the measured temperature, it is possible to suppress the display mode variation caused by the temperature change of the electro-optical panel 110.

  In this embodiment, the temperature compensation of the electro-optical panel 110 (particularly, temperature compensation by contrast adjustment) is performed by changing the control signal of the electro-optical panel 110 according to the temperature detected by the temperature sensor 124. . However, the temperature compensation aspect of the present invention is not limited to such an aspect, and may be a method of changing the power supply potential or changing the circuit constant of the drive circuit, or may be controlled. Instead of changing the signal and the drive signal, the temperature of the electro-optical panel 110 may be controlled by a separately provided temperature control unit (such as a heating resistor or a Peltier element). That is, a method in which temperature control means is operated according to the temperature detected by the temperature sensor 124 to suppress temperature fluctuations of the electro-optical panel 110 may be used.

[Second Embodiment]
Next, a second embodiment according to the present invention will be described with reference to FIG. FIG. 3 is a longitudinal sectional view of the electro-optical device 200 according to the second embodiment. The electro-optical device 200 includes the same outer case 101, inner case 102, circuit case 103, electro-optical panel 110, and illumination unit 130 as those in the first embodiment. Reference numerals are assigned and their explanation is omitted.

  The electro-optical device 200 is different from the first embodiment in that, in the control circuit system 220, the circuit board 221 is installed not on the illumination unit 130 side but on the inner surface of the circuit case 103 opposite to the illumination unit 130. There is in point. In other words, the illumination unit 130 and the circuit board 221 are arranged to be separated from each other, and there is a space portion between them. The wiring board 222 is led out of the inner case 102 from a conductive connection portion with respect to the electro-optical panel 110, and is conductively connected to the circuit board 221 after passing through the inside of the circuit case 103.

  A separate substrate 223 is connected to the circuit board 221, and a temperature sensor 224 is mounted on the separate substrate 223. The temperature sensor 224 is disposed away from the circuit board 221, the temperature sensor 224 is connected to the circuit board 221 through another board 223 having a small cross-sectional area, and the temperature sensor 224 is mounted on the surface. Except for the above, it is completely the same as the first embodiment in that it is in a non-contact state with respect to other members. The inverter 225 is fixed to the inner case 102 as in the first embodiment.

  However, this embodiment is different from the first embodiment in that another substrate 223 is disposed in the space formed between the illumination unit 130 and the circuit board 221. However, the temperature sensor 224 is the same as that of the first embodiment in that the temperature sensor 224 is disposed in a space formed inside the case at a position separated from the circuit board 221, thereby improving the accuracy of the detected temperature. . In the present embodiment, since the circuit board 221 is not in direct contact with the lighting unit 130, the amount of heat conduction from the lighting unit 221 to the circuit board 121 can be reduced, and as a result, the temperature sensor 224 can be reduced. The thermal influence of the lighting unit 130 can be greatly reduced.

[Third Embodiment]
Next, a third embodiment according to the present invention will be described with reference to FIG. FIG. 4 is a longitudinal sectional view of the electro-optical device 300 according to the third embodiment. The electro-optical device 300 according to this embodiment also includes the same outer case 101, inner case 102, electro-optical panel 110, and illumination unit 130 as those of the first embodiment. Reference numerals are assigned and their explanation is omitted.

  The control circuit system 320 of this embodiment includes a circuit board 121 and a wiring board 122 similar to those of the first embodiment, but a connector 326 is mounted on the circuit board 121, and another board 323 is provided via this connector 326. Is detachably connected to the circuit board 121. A temperature sensor 324 similar to the above is mounted on another substrate 323.

  Further, the circuit case 303 of the present embodiment is provided with an opening 303a, and the other substrate 323 is led out to the outside through the opening 303a. The temperature sensor 324 is disposed outside the circuit case 303. That is, the temperature sensor 324 is mounted on a portion of the separate substrate 323 that is led out of the circuit case 303.

  In this embodiment, since the separate board 323 is configured to be detachable from the circuit board 121, the circuit board 121 and the separate board 323 can be easily connected even during manufacture, and the circuit board 121 can be provided after manufacture. And the separate substrate 323 can be easily separated from each other, which facilitates maintenance work.

  Further, since the temperature sensor 324 is disposed outside the circuit case 303 at a position separated from the circuit board 121, the thermal influence of the illumination unit 130 and the circuit board 121 is further reduced, and the external temperature can be measured more accurately. It becomes like this.

  In each of the above embodiments, the circuit board and the separate substrate on which the temperature sensor is mounted are configured as separate members. However, a portion corresponding to the separate substrate is obtained by bending a part of the circuit board. It is also possible to configure the circuit board as an integral part of the circuit board. For example, a part of the circuit board may be arranged as a narrow strip-shaped extension so as to rise from the main surface of the circuit board, and the temperature sensor may be mounted on the strip-shaped extension.

[Fourth Embodiment]
Next, a fourth embodiment according to the present invention will be described with reference to FIG. FIG. 5 is a longitudinal sectional view of the electro-optical device 400 according to the fourth embodiment. The electro-optical device 400 according to this embodiment also includes the same inner case 102, electro-optical panel 110, and illumination unit 130 as those in the first embodiment. These descriptions are omitted.

  The control circuit system 420 of the present embodiment is the same as the above embodiments in that another substrate 423 is connected to the circuit substrate 421 and a temperature sensor 424 is mounted on the other substrate 423. However, in this embodiment, the separate substrate 423 is led out through the opening 403a of the circuit case 403 and the opening 401a of the outer case 401, and is extended to the side opposite to the electro-optical panel 110 along the side surface of the case body. This is different from the above embodiments. The temperature sensor 424 is disposed on the separate substrate 423 at a position separated from the electro-optical panel 110 outside the outer case 401. Specifically, the separate substrate 423 is refracted or bent outside the outer case 401 and is disposed on the side surface of the outer case 401 in a state of extending to the side opposite to the electro-optical panel 110. The temperature sensor 424 is mounted on a portion of the separate substrate 423 that is disposed on the opposite side of the electro-optical panel 110 from the position led out from the external case 401.

  In this embodiment, the temperature sensor 424 is not only disposed outside the circuit case 403, but is disposed on a portion of the separate substrate 423 that extends on the opposite side to the electro-optical panel 110. Since it becomes difficult to receive the thermal influence by the illumination unit 130, it becomes possible to perform more exact temperature compensation.

  That is, as shown in the present embodiment, the temperature sensor is arranged outside the case so as to be separated from the electro-optical panel, so that the temperature detected by the temperature sensor can be brought closer to the actual external temperature, so that temperature compensation can be performed more accurately. It becomes possible to do.

  In the present embodiment, the circuit board and the separate substrate on which the temperature sensor is mounted are configured as separate members. However, a part of the circuit board is formed to be thin and extend as it is. Accordingly, it is possible to configure the portion corresponding to the separate substrate as an integral part of the circuit board. For example, a part of the circuit board may be configured to extend from the end of the circuit board as a narrow strip-shaped extension, and the temperature sensor may be mounted on the strip-shaped extension.

[Electronics]
Finally, the configuration of an electronic apparatus using the electro-optical device 100 of the above embodiment will be described with reference to FIGS. FIG. 7 is a schematic configuration diagram showing a configuration of a display system in the electronic apparatus of the present embodiment. The electronic apparatus shown here includes a display control unit 1100 including a display information output source 1110 and a timing generator 1140. The electro-optical device 100 is provided with the electro-optical panel 110, the control circuit system 120, and the illumination unit 130 having the above-described configuration. The electro-optical panel 110 is formed with a drive circuit 110D configured by the electronic components 115 and 116 described above. The control circuit system 120 includes the display control circuit 150, the light source control circuit 160, and the power supply circuit 170.

  The display information output source 1110 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. The display information is supplied to the display control circuit 150 in the form of an image signal of a predetermined format based on various clock signals generated by the timing generator 1140.

  The display control circuit 150 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, executes processing of input display information, and outputs the image information. It is supplied to the drive circuit 110D together with the clock signal CLK. The drive circuit 110D includes a scanning line drive circuit, a signal line drive circuit, and an inspection circuit.

  The light source control circuit 160 supplies the power supplied from the power supply circuit 170 to the light source 131 of the lighting unit 130 based on a control signal introduced from the outside (for example, the main control device of the electronic device main body). The light emitted from the light source 131 enters the light guide plate 132 and is irradiated from the light guide plate 132 to the electro-optical panel 110. The light source control circuit 160 controls lighting / non-lighting of each light source 131 according to the control signal. It is also possible to control the luminance of each light source 131. Further, the power supply circuit 170 supplies predetermined voltages to the drive circuit 110D, the display control circuit 150, and the light source control circuit 160, respectively.

  FIG. 8 shows an appearance of a mobile phone which is an embodiment of the electronic apparatus according to the present invention. The electronic device 1000 includes an operation unit 1001 and a display unit 1002, and a circuit board 1003 is disposed inside a housing of the display unit 1002. The electro-optical device 100 is mounted on the circuit board 1003. In addition, the display screen of the electro-optical panel 110 can be viewed on the surface of the display unit 1002.

  Note that the electro-optical device of the present invention is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. For example, in the above embodiment, the electro-optical panel is basically assumed to be a liquid crystal display panel, but the liquid crystal display panel may be a passive matrix type liquid crystal display device or an active matrix type liquid crystal. A display panel (for example, a liquid crystal display panel provided with a TFT (thin film transistor) or TFD (thin film diode) as a switching element) can be given. In particular, it is effective to apply the present invention to a liquid crystal display panel provided with a TFD as a switching element because it has a large influence on display quality due to temperature characteristics. In addition to liquid crystal display devices, electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron-emitting devices (Field Emission Display, Surface-Conduction Electron-Emitter Display, etc.), etc. Various electro-optical panels can be used.

1 is a longitudinal sectional view of an electro-optical device according to a first embodiment of the invention. FIG. 3 is a longitudinal sectional view showing a cross section orthogonal to FIG. 1 of the electro-optical device according to the first embodiment. FIG. 6 is a longitudinal sectional view of an electro-optical device according to a second embodiment of the invention. FIG. 10 is a longitudinal sectional view of an electro-optical device according to a third embodiment of the invention. FIG. 10 is a longitudinal sectional view of an electro-optical device according to a fourth embodiment of the invention. The schematic block diagram of the display control circuit of 1st Embodiment. 1 is a schematic configuration diagram showing a configuration of a display system of an electronic device according to the present invention. The external appearance perspective view which shows an example of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Electro-optical device 101 ... Outer case 102 ... Inner case 103 ... Circuit case 110 ... Electro-optical panel 120 ... Control circuit system 121 ... Circuit board 122 ... Wiring board 123 ... Separate board 124 ... Temperature sensor, 130 ... illumination unit, 131 ... light source, 132 ... light guide plate, 150 ... display control circuit, 152 ... basic control unit, 154 ... display adjustment unit, 155 ... diode, 160 ... light source control circuit

Claims (7)

An electro-optical panel in which an electro-optical material is disposed, a circuit board having a control circuit including an electronic component for controlling the electro-optical panel and a temperature sensor, and a case for housing the electro-optical panel and the circuit board In the electro-optical device comprising a space formed in the case,
The electro-optical device, wherein the temperature sensor is disposed in the space portion at a position electrically connected to the circuit board and spaced apart from the circuit board.   The electro-optical device according to claim 1, wherein the case is provided with an opening communicating with the outside. An electro-optical panel in which an electro-optical material is disposed, a circuit board having a control circuit including an electronic component for controlling the electro-optical panel and a temperature sensor, and a case for housing the electro-optical panel and the circuit board In an electro-optical device comprising:
The electro-optical device, wherein the temperature sensor is electrically connected to the circuit board and disposed outside the case at a position separated from the circuit board.   4. The electro-optical device according to claim 1, wherein the temperature sensor is disposed on another substrate that is electrically connected to the circuit board. 5.   The electro-optical device according to claim 4, wherein the another substrate is electrically connected via a connector disposed on the circuit board and is erected with respect to the circuit board.   6. The electro-optical device according to claim 1, further comprising an illumination unit disposed between the electro-optical panel and the circuit board. An electronic apparatus comprising the electro-optical device according to claim 1 and a control unit that controls the electro-optical device.

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