JP2019057606A - Electronic module - Google Patents

Abstract

To provide an electronic module that comprises a ceramic wall part and can be easily made into a complex shape or a large shape.SOLUTION: An electronic module comprises: a substrate 1 that has a pair of principal surfaces; electronic components 7 to 10 that are mounted on at least one principal surface of the substrate 1; and a wall part 11 that is formed on at least one principal surface of the substrate 1. The wall part 11 is manufactured by ceramic, includes a bottom face 11B facing the substrate 1, a pair of side faces, and a top face 11T, and is formed by joining a plurality of wall members 12a to 12f.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic module, and more particularly to an electronic module in which a wall portion is formed on a main surface of a substrate.

  An electronic module in which an electronic circuit is configured by mounting a plurality of electronic components on a substrate is widely used in electronic devices. In the electronic module, a region where the electronic component on the main surface of the substrate is mounted may be surrounded by a wall portion to protect the mounted electronic component from the outside. In general, the area where the electronic components on the main surface of the board are mounted is surrounded by a wall and the top plate is attached to the top surface of the wall, and the area where the electronic components are mounted is externally attached. It is often shielded.

  Such an electronic module is disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 10-112517). 18A and 18B show an electronic module (electronic component storage package) 1000 disclosed in Patent Document 1. FIG. 18A is a perspective view of a main part of the electronic module 1000, and FIG. 18B is a cross-sectional view of the electronic module 1000.

  The electronic module 1000 includes a substrate 101. A wall (frame) 102 is formed in a rectangular ring shape on the upper main surface of the substrate 101. The wall 102 is made of resin or ceramic.

  An electronic component 103 is mounted on the upper main surface of the substrate 101 surrounded by the wall 102. A top plate (metal lid) 104 is attached to the top surface of the wall 102.

Japanese Patent Laid-Open No. 10-112517

  As described above, in the electronic module 1000, the wall 102 is made of resin or ceramic.

  When the wall portion 102 is made of a resin, there are advantages that it is easy to process and that it can be formed into a complicated shape.

  However, when the wall portion 102 is made of a resin, moisture resistance is low and moisture passes therethrough, so that the electrode formed on the main surface of the substrate and the mounted electronic component are likely to be oxidized. The heat resistance is low, and there is a problem that it cannot be used at high temperatures.

  On the other hand, when the wall portion 102 is made of ceramic, it has high moisture resistance and does not allow moisture to pass therethrough, so that the electrode formed on the main surface of the substrate and the mounted electronic component are not easily oxidized, and heat resistance There is an advantage that it can be used even at high temperatures.

  However, when the wall portion 102 is made of ceramic, there is a problem that it is difficult to make the wall portion 102 into a complicated shape or a large shape. That is, in the case where the wall portion 102 is made of ceramic, a firing process is required, so that it is difficult to make a complicated shape or a large shape, or to make a complicated shape or a large shape. Even if it could, there was a problem that it required a lot of labor and time.

  On the other hand, recently, electronic modules are required to have high functionality, high complexity, high reliability, etc., and the wall portion 102 is made of ceramic having high moisture resistance and heat resistance. And it is calculated | required to produce in a complicated shape or a big shape.

  The present invention has been made in order to solve the above-described conventional problems, and as its means, the electronic module of the present invention is mounted on a substrate having a pair of main surfaces and at least one main surface of the substrate. An electronic component, and a wall portion formed on at least one main surface of the substrate. The wall portion is made of ceramic, and the wall portion is a bottom surface facing the substrate, a pair of side surfaces, and a top surface. And the wall portion is formed by joining a plurality of wall members.

  It is preferable to form a bonding electrode on each of the two wall members to be bonded, and bond the bonding electrode of one wall member and the bonding electrode of the other wall member. In this case, the wall members can be easily joined together.

  Preferably, a step portion is formed on at least one of the two wall members to be joined, and a joining electrode is formed on the step portion. In this case, it is possible to easily and accurately align the two wall members to be joined using the step portion.

  More preferably, a step portion is formed on each of the two wall members to be joined, and a joining electrode is formed on each of the step portions of the two wall members. In this case, the alignment of the two wall members to be joined can be performed more easily and more accurately using the step portion.

  It is preferable that the step portion has a surface parallel to the bottom surface and the top surface of the wall portion, and the bonding electrode is formed on the surface. In this case, the joining electrodes can be easily joined.

  It is also preferable that the step portion has a plurality of steps. In this case, electrical connection of a plurality of systems can be performed at the joint portion. Or the joint strength of two wall members improves.

  The bonding electrode is preferably a bump. In this case, the two wall members can be easily joined by applying ultrasonic waves or heat.

  It is also preferable that the bonding electrode is used for electrical connection. In this case, the shield electrode (or metal top plate) formed on the wall member or the top plate can be connected to the ground using the electrical connection. Moreover, the electrical connection between the distant parts can be performed by the wiring formed on the wall member using the electrical connection.

  It is preferable that the wall member has a multilayer structure in which ceramic layers are laminated. In this case, via electrodes and interlayer electrodes can be easily formed on the wall member.

  In this case, it is also preferable that the ceramic layer is laminated in parallel with the bottom surface and the top surface of the wall portion. In this case, via electrodes and interlayer electrodes can be more easily formed on the wall member.

  Preferably, a second bonding electrode is formed on the main surface of the substrate, and a third bonding electrode for bonding to the second bonding electrode is formed on the bottom surface of the wall member facing the substrate. In this case, the substrate and the wall member can be easily joined.

  It is preferable that the second bonding electrode and the third bonding electrode are also used for electrical connection. In this case, the shield electrode (or the metal top plate) formed on the wall member or the top plate can be connected to the ground using the second and third junction electrodes. Moreover, the electrical connection between the distant parts can be performed by the wiring formed on the wall member by using the second bonding electrode and the third bonding electrode.

  A top plate is preferably attached to the top surface of the wall so as to cover the electronic component. In this case, the area where the electronic component is mounted can be protected from the outside by the wall portion and the top plate.

  The top plate is a metal plate, a ceramic plate with a shield electrode formed thereon, or a resin plate with a shield electrode formed thereon, and a fourth bonding electrode is formed on the top surface of the wall member facing the top plate, It is preferable that at least one fourth bonding electrode is electrically connected to a metal plate, a shield electrode of a ceramic plate, and a shield electrode of a resin plate. In this case, by connecting the fourth bonding electrode to the ground, the metal plate or the shield electrode can be easily connected to the ground, and a shielding function can be exhibited.

  It is preferable that wiring is formed on the wall member. In this case, the shield electrode (or metal top plate) formed on the wall member or the top plate can be connected to the ground using the wiring. In addition, it is possible to make an electrical connection between distant parts by using the wiring.

  In this case, the wiring preferably includes a via electrode, a side electrode, an interlayer electrode, and the like. In this case, a desired wiring can be configured using via electrodes, side conductors, interlayer conductors, and the like.

  It is preferable that a shield electrode is formed on at least one side surface of the wall member, and the shield electrode is connected to the wiring. In this case, by connecting the wiring to the ground, the shield electrode can be easily connected to the ground, and a shielding function can be exhibited.

  In the electronic module of the present invention, since the wall portion is formed by joining a plurality of wall members, the ceramic wall portion can be easily formed into a complicated shape or a large shape.

1 is a perspective view of an electronic module 100 according to a first embodiment. 2A and 2B are perspective views showing the substrate 1 of the electronic module 100, respectively. 2 is an exploded perspective view of the electronic module 100. FIG. 2 is an exploded perspective view of the electronic module 100. FIG. FIG. 5A is a perspective view of the wall portion 11 of the electronic module 100. FIG. 5B is an exploded perspective view of the wall portion 11. 2 is a perspective view of a main part of the electronic module 100. FIG. 7A, 7B, and 7C are cross-sectional views of main parts of the electronic module 100, respectively. FIG. 8A is a perspective view illustrating steps performed in an example of a method for manufacturing the electronic module 100. FIGS. 9B and 9C are continuations of FIG. 8A, and are perspective views illustrating steps performed in an example of a method for manufacturing the electronic module 100. FIGS. 10D and 10E are continuations of FIG. 9C, and are perspective views illustrating steps performed in an example of a method for manufacturing the electronic module 100. FIGS. 11F and 11G are continuations of FIG. 10E and are perspective views showing steps performed in an example of a method for manufacturing the electronic module 100, respectively. It is a principal part perspective view of the electronic module 200 concerning 2nd Embodiment. It is a principal part perspective view of the electronic module 300 concerning 3rd Embodiment. It is a perspective view which shows the wall member 62a of the electronic module 400 concerning 4th Embodiment. It is principal part sectional drawing of the electronic module 500 concerning 5th Embodiment. It is principal part sectional drawing of the electronic module 600 concerning 6th Embodiment. It is a front view of the electronic module 700 concerning 7th Embodiment. FIG. 18A is a perspective view of main parts of an electronic module 1000 disclosed in Patent Document 1. FIG. FIG. 18B is a cross-sectional view of the electronic module 1000.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. Each embodiment shows an embodiment of the present invention exemplarily, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping the understanding of the specification, and may be schematically drawn, and the drawn components or the ratio of dimensions between the components are described in the specification. There are cases where the ratio of these dimensions does not match. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.

[First Embodiment]
1, 2 (A), (B), FIG. 3, FIG. 4, FIG. 5 (A), (B), FIG. 6, FIG. 7 (A), (B), (C) 1 shows an electronic module 100 according to a form. However, FIG. 1 is a perspective view of the electronic module 100. 2A and 2B are perspective views showing the substrate 1 of the electronic module 100, respectively. FIG. 2A shows the lower main surface 1B of the substrate 1, and FIG. 2B shows the substrate. 1 shows an upper main surface 1T. FIG. 3 is an exploded perspective view of the electronic module 100 and shows a state in which the wall portion 11 is removed from the substrate 1. FIG. 4 is also an exploded perspective view of the electronic module 100 and shows a state in which the top plate 18 is removed from the wall portion 11. 5A and 5B show the wall 11 of the electronic module 100, respectively. FIG. 5A is a perspective view of the wall 11, and FIG. 5B is an exploded perspective view of the wall 11. is there. FIG. 6 is a see-through perspective view of a main part of the electronic module 100, and mainly shows wiring formed inside the wall portion 11. FIGS. 7A, 7B, and 7C are cross-sectional views of the main part of the electronic module 100, respectively, FIG. 7A is a dashed-dotted line XX portion of FIG. 1, and FIG. The one-dot chain line YY portion in FIG. 1 and FIG. 7C show the one-dot chain line ZZ portion in FIG.

  The electronic module 100 includes a substrate 1. The substrate 1 has a lower main surface 1B and an upper main surface 1T. In the present embodiment, a ceramic multilayer substrate is used as the substrate 1. However, the material of the substrate 1 is arbitrary, and instead of the ceramic substrate, a resin substrate may be used. The structure of the substrate 1 is also arbitrary, and a single layer substrate may be used instead of the multilayer substrate.

  On the lower main surface 1B of the substrate 1, as shown in FIG. 2A, an external electrode 2 used for mounting the electronic module 100 on a circuit board or the like of an electronic device is formed.

  As shown in FIGS. 2B and 3, the upper main surface 1 </ b> T of the substrate 1 is provided with an annular wall forming region 3 that forms a wall 11 described later. In FIG. 2B and FIG. 3, the wall forming region 3 is indicated by a broken line.

  A land electrode 4 for mounting electronic components 7, 8, 9, 10, which will be described later, and a ground potential electrode 5 connected to the ground when in use, inside the wall portion formation region 3 of the upper main surface 1 T of the substrate 1. Is formed. Further, a third junction electrode 16 (signal third junction electrode 16S, ground third junction electrode) formed on the bottom surface 11B of the wall 11 described later on the wall portion formation region 3 of the upper main surface 1T of the substrate 1. 16G is included), the second bonding electrode 6 is formed. Of the second junction electrodes 6, one used for electrical connection as a part of the signal line wiring is shown as a signal second junction electrode 6 </ b> S. In addition, among the second junction electrodes 6, one used for electrical connection as a part of the wiring connected to the ground is shown as a ground second junction electrode 6 </ b> G.

  The predetermined land electrode 4 and the predetermined second signal junction electrode 6S are electrically connected. Further, the predetermined ground potential electrode 5 and the predetermined second ground junction electrode 6G are electrically connected.

  Although not shown, via electrodes and interlayer electrodes are formed inside the substrate 1. A desired substrate internal wiring is formed inside the substrate 1 by the via electrode and the interlayer electrode. The substrate internal wiring electrically connects the external electrode 2 formed on the lower main surface 1B of the substrate 1 with the land electrode 4 and the ground potential electrode 5 formed on the upper main surface 1T of the substrate 1. Yes.

  Electronic components 7, 8, 9, and 10 are mounted on a land electrode 4 formed on the upper main surface 1 </ b> T of the substrate 1 by a bonding material (not shown) such as solder or a conductive adhesive. In the present embodiment, the electronic components 7 and 8 are semiconductor integrated circuit devices, and the electronic components 9 and 10 are chip-type electronic components such as resistors, capacitors, and inductors. However, the electronic components 7, 8, 9, and 10 are exemplarily shown, and the type and number of electronic components are arbitrary.

  The electronic module 100 includes a wall portion 11. In the present embodiment, as can be clearly understood from FIGS. 5A and 5B, the wall portion 11 has six wall members 12a, 12b, 12c, 12d, 12e, and 12f joined in order, and the wall member 12f. Is joined to the wall member 12a to form an annular shape in plan view. The wall portion 11 has an inner side surface on the inner side of the ring and an outer side surface on the outer side of the ring. The number of wall members 12a to 12f constituting the wall portion 11 is not limited to six and can be arbitrarily increased or decreased.

  The wall 11 (wall members 12a to 12f) is made of ceramic. Although not shown, the wall portion 11 (wall members 12a to 12f) is formed by laminating a plurality of ceramic layers in multiple layers. The ceramic component for producing the wall portion 11 is arbitrary, and for example, a dielectric ceramic such as low temperature co-fired ceramics (LTCC) can be used. In addition, when a magnetic material ceramic is used for the ceramic which produces the wall part 11, the function which interrupts | blocks a low frequency noise can be expressed in the wall part 11. FIG.

  In the wall portion 11, the wall member 12a and the wall member 12b, the wall member 12b and the wall member 1c, the wall member 12c and the wall member 12d, the wall member 12d and the wall member 12e, the wall member 12e and the wall member 12f, and the wall member 12f and the wall The members 12a are joined at right angles to each other in plan view. As a result, the wall 11 is formed in a hexagonal shape in which each corner is a right angle in plan view.

  The wall portion 11 has a bottom surface 11B joined to the upper main surface 1T of the substrate 1 and a top surface 11T to which a top plate 18 described later is joined.

  Each of the wall members 12a to 12f has a strip shape (rectangular and plate shape) as can be seen from FIG. 5B. As for wall member 12a-12f, the level | step-difference part 13 is formed in the side which opposes the board | substrate 1, or the side which opposes a top plate, respectively. In other words, the wall members 12a to 12f are formed to have a convex shape, and have a shape such that the side facing the substrate or the side facing the top plate is replaced. The step portions 13 have surfaces parallel to the bottom surface 11B and the top surface 11T of the wall portion 11, respectively.

  Bonding electrodes 14 made of bumps are formed on surfaces of the step portions 13 of the wall members 12a to 12f that are parallel to the bottom surface 11B and the top surface 11T of the wall portion 11. In addition, the kind of bump is arbitrary, For example, a solder bump and a gold bump can be used. Of the bonding electrodes 14, one used for electrical connection as a part of the wiring of the signal line is shown as a signal bonding electrode 14 </ b> S.

  The wall portion 11 is formed by sequentially joining the six wall members 12a, 12b, 12c, 12d, 12e, and 12f by joining the joining electrode 14 and the joining electrode 14 or the signal joining electrode 14S and the signal joining electrode 14S. It is joined to. In addition, the bonding between the bonding electrode 14 and the bonding electrode 14 and between the signal bonding electrode 14S and the signal bonding electrode 14S, that is, the bonding between the bumps is performed by superimposing the two and applying ultrasonic waves, heat, or the like. Can be done.

  A shield electrode 15 for shielding noise is formed on the outer side surface of the wall portion 11.

  For joining to the bottom surface 11B of the wall portion 11 with the second junction electrode 6 (including the signal second junction electrode 6S and the ground second junction electrode 6G) formed on the upper main surface 1T of the substrate 1. A three-junction electrode 16 is formed. In addition, among the 3rd junction electrodes 16, what is used for an electrical connection as a part of wiring of a signal line is shown as the signal 3rd junction electrode 16S. Further, among the third junction electrodes 16, a part used for electrical connection as a part of the wiring connected to the ground is shown as a ground third junction electrode 16G.

  The second junction electrode 6 and the third junction electrode 16, the signal second junction electrode 6S and the signal third junction electrode 16S, the ground second junction electrode 6G and the ground third junction electrode 16G are connected by solder or conductive. The wall portion 11 is joined to the wall portion forming region 3 of the upper main surface 1T of the substrate 1 by joining with a joining material (not shown) such as an adhesive.

  A fourth junction electrode for joining to the top surface 11T of the wall portion 11 with a fifth junction electrode 19 (including a ground fifth junction electrode 19G) formed on a lower main surface 18B of the top plate 18 described later. 17 is formed. In addition, as a part of wiring connected to the ground among the fourth bonding electrodes 17, those used for electrical connection are shown as ground fourth bonding electrodes 17 </ b> G.

  The electronic module 100 includes a top plate 18. The top plate 18 has a lower main surface 18B and an upper main surface 18T. The top plate 18 is made of ceramic. The ceramic component for producing the top plate 18 is arbitrary, and for example, a dielectric ceramic such as Low Temperature Co-fired Ceramics (LTCC) can be used. In addition, when a magnetic ceramic is used for the ceramic for producing the top plate 18, the top plate 18 can exhibit a function of blocking low frequency noise.

  A fifth bonding electrode 19 is formed on the lower main surface 18B of the top plate 18. Note that, among the fifth junction electrodes 19, a part used for electrical connection as a part of the wiring connected to the ground is shown as a ground fifth junction electrode 19 </ b> G.

  A shield electrode 20 for shielding noise is formed on the upper main surface 18T and the side surface of the top plate 18. The shield electrode 20 is connected to the ground fifth junction electrode 19G by a via electrode 21 (see FIG. 7B) formed so as to penetrate between the lower main surface 18B and the upper main surface 18T of the top plate 18. Electrically connected.

  The fourth bonding electrode 17 and the fifth bonding electrode 19, and the fourth bonding electrode for ground 17G and the fifth bonding electrode for ground 19G are bonded by a bonding material (not shown) such as solder or conductive adhesive. Thus, the lower main surface 18B of the top plate 18 is joined to the top surface 11T of the wall portion 11.

  Next, the wiring formed inside the wall portion 11 will be described mainly with reference to FIGS. 6, 7 </ b> A, 7 </ b> B, and 7 </ b> C.

  A via electrode 22 and an interlayer electrode 23 are formed inside the wall portion 11 (wall members 12a to 12f) as necessary. A wiring is formed inside the wall portion 11 by the via electrode 22 and the interlayer electrode 23. As described above, the wall portion 11 (wall members 12a to 12f) includes a plurality of ceramic layers laminated, the via electrode 22 is formed through the ceramic layer, and the interlayer electrode 23 is a ceramic. It is formed between the layers. Of the interlayer electrodes 23, as a part of the wiring connected to the ground, one used for electrical connection is shown as a ground interlayer electrode 23G.

  6 and 7A, in the wall member 12a, the signal third junction electrode 16S is formed in the step portion 13 via the via electrode 22 and the interlayer electrode 23. It is electrically connected to the bonding electrode 14S for use. Further, in the wall member 12b, the signal joining electrode 14S formed in the step portion 13 passes through the via electrode 22, the interlayer electrode 23, and the other via electrode 22, and the signal third joining electrode 16S. Are electrically connected. The electronic module 100 uses these wirings to electrically connect the two land electrodes 4 formed on the upper main surface 1T of the substrate 1.

  6 and 7B, in the portion of the wall member 12f indicated by the alternate long and short dash line YY in FIG. 1, the ground third junction electrode 16G passes through the via electrode 22 and the ground. The fourth junction electrode 17G is electrically connected. The electronic module 100 uses this wiring to connect the shield electrode 20 formed on the top plate 18 to the ground potential electrode 5 formed on the upper main surface 1T of the substrate 1.

  As can be clearly seen from FIGS. 6 and 7C, the ground third junction electrode 16 </ b> G passes through the via electrode 22 in the portion of the wall member 12 f indicated by the alternate long and short dash line ZZ in FIG. 1. It is electrically connected to the interlayer electrode 23G for use. One end of the ground interlayer electrode 23G is exposed on the outer side surface of the wall member 12f, and is electrically connected to the shield electrode 15 formed on the outer side surface of the wall portion 11. The electronic module 100 uses this wiring to connect the shield electrode 15 formed on the outer side surface of the wall portion 11 to the ground potential electrode 5 formed on the upper main surface 1T of the substrate 1.

  The electronic module 100 has the above structure.

  In the electronic module 100, the external electrode 2, the land electrode 4, the ground potential electrode 5, the bonding electrode 14, the second bonding electrode 6, the third bonding electrode 16, the fourth bonding electrode 17, the fifth bonding electrode 19, the via electrode 22, The material of the interlayer electrode 23 and the like is arbitrary, but for example, copper or silver can be used. Of these electrodes, those exposed to the outside are preferably plated on the surface as necessary.

  The material and configuration of the shield electrodes 15 and 20 are also arbitrary. For example, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, or a conductive layer made of Cu, Al, Ag, or an alloy thereof. , Ti, Ni, Cr, or an alloy thereof can be formed into a three-layer structure of a corrosion-resistant layer. However, in the figure, the shield electrodes 15 and 20 are not divided into an adhesion layer, a conductive layer, and a corrosion-resistant layer, but are shown as one layer so that the drawing is not complicated.

  As described above, in the electronic module 100, since the wall portion 11 is formed by joining a plurality of wall members 12a to 12f, the wall portion 11 can be easily formed into a complicated shape or a large shape. Can be.

  Moreover, since the electronic module 100 forms the level | step-difference part 13 in the junction part of wall member 12a-12f, the alignment in the case of joining is easy. Further, the wall members 12a to 12f can be joined with high accuracy.

  In the electronic module 100, the wall members 12a to 12f are joined to each other by the joining electrode 14 (including the signal joining electrode 14S) made of bumps, so that the wall members 12a to 12f are easily joined to each other. .

  In the electronic module 100, wiring is formed in the wall portion 11 by the via electrode 22 and the interlayer electrode 23 (including the ground interlayer electrode 23G). Connection can be made. The wiring formed inside the wall portion 11 can also be used to electrically connect the shield electrode 15 formed on the wall portion 11 and the shield electrode formed on the top plate 18 to the ground. .

  The electronic module 100 can be manufactured, for example, by the following method.

  First, wall members 12a to 12f constituting the wall portion 11 are produced. Here, a method of manufacturing a large number of wall members 12b at a time will be described using the wall member 12b as an example.

  As described above, the wall member 12b has a multilayer structure in which a plurality of ceramic layers are stacked. First, a ceramic green sheet for producing a ceramic layer is produced. Specifically, ceramic powder, a binder, and a solvent are mixed at a predetermined ratio to produce a ceramic slurry. Next, the ceramic slurry is formed into a film shape by, for example, a doctor blade method to obtain a plurality of ceramic green sheets.

  Next, a through-hole for forming the via electrode 22 is formed in the ceramic green sheet as necessary. Subsequently, the through hole is filled with a conductive paste for forming the via electrode 22. In addition, a conductive paste is printed in a predetermined shape on the main surface of the ceramic green sheet as necessary to form a conductive material for forming the third bonding electrode 16, the fourth bonding electrode 17, and the interlayer electrode 23. A paste pattern is formed.

  Next, as shown in FIG. 8A, ceramic green sheets are laminated in a predetermined order. In FIG. 8A, eight ceramic green sheets 52a to 52h are stacked in order from the bottom.

  Although not shown in the drawing, one of the main surfaces of the ceramic green sheet 52a (the lower main surface in FIG. 8A) is provided with the fourth bonding electrode 17 (including the ground fourth bonding electrode 17G). A conductive paste pattern for forming is formed. A conductive paste pattern 53 for forming the interlayer electrode 23 is formed on one main surface (the upper main surface in FIG. 8A) of the ceramic green sheet 52b. The ceramic green sheets 52c to 52h are each formed with a through hole and filled with a conductive paste 54 for forming the via electrode 22 in the through hole. Furthermore, a conductive paste pattern for forming the third bonding electrode 16 (including the signal third bonding electrode 16S) on one main surface (the upper main surface in FIG. 8A) of the ceramic green sheet 52h. 56 is formed.

  Next, as shown in FIG. 9B, the ceramic green sheets 52 a to 52 h are pressed and integrated to obtain a ceramic green sheet laminate 57.

  Next, the pair of opposing side portions of the ceramic green sheet laminate 57 are cut by, for example, an MC drill or the like to form the stepped portion 58 for forming the stepped portion 13. The conductive paste 54 filled in the through holes is exposed on the main surface of the ceramic green sheet 52d exposed at the stepped portion 58.

  Next, as shown in FIG. 10 (D), the ceramic green sheet laminate 57 is divided at the portion indicated by the alternate long and short dash line by, for example, a microcutter or disa dicing, and as shown in FIG. A wall member 12b 'is obtained.

  Next, the unfired wall member 12b 'is fired with a predetermined profile to obtain the wall member 12b shown in FIG. The wall member 12b includes a step portion 13, a third bonding electrode 16 (including the signal third bonding electrode 16S), and a fourth bonding electrode 17 (including the ground fourth bonding electrode 17G) (not shown). Is formed. Further, the via electrode 22 is exposed at the step portion 13.

  Next, as shown in FIG. 11G, a bonding electrode 14 or a signal bonding electrode 14S made of a bump is formed on the via electrode 22 exposed by the step portion 13 by a plating method, a stud bump method, or the like. The wall member 12b is completed.

  The wall member 12a and the wall members 12c to 12f are manufactured by the same method.

  Next, the wall members 11a to 12f are joined using the joining electrode 14 (including the signal joining electrode 14S), and the wall portion 11 is produced.

  Next, for example, sputtering is performed on the outer side surface of the wall portion 11 to form the shield electrode 15.

  Next, the substrate 1 is prepared. The substrate 1 is previously provided with an external electrode 2, a land electrode 4, a ground potential electrode 5, a second junction electrode 6 (including a signal second junction electrode 6S and a ground second junction electrode 6G), internal wiring, and the like. Form it.

  Next, the bottom surface 11 </ b> B of the wall portion 11 is joined to the wall portion forming region 3 of the upper main surface 1 </ b> T of the substrate 1. Specifically, the second bonding electrode 6 and the third bonding electrode 16, the signal second bonding electrode 6S and the signal third bonding electrode 16S, the ground second bonding electrode 6G and the ground third bonding electrode 16G are connected. These are joined with solder or a conductive adhesive.

  Next, the electronic components 7, 8, 9, and 10 are mounted on the land electrode 4 formed on the upper main surface 1 </ b> T of the substrate 1 using solder or a conductive adhesive.

  Next, the top plate 18 is prepared. A fifth bonding electrode 19 (including a ground fifth bonding electrode 19G), a via electrode 21, a shield electrode 20, and the like are formed on the top plate 18 in advance.

  Next, the lower main surface 18B of the top plate 18 is joined to the top surface 11T of the wall 11. Specifically, the fourth bonding electrode 17 and the fifth bonding electrode 19, and the fourth ground bonding electrode 17G and the fifth ground bonding electrode 19G are bonded to each other by solder or a conductive adhesive.

  Thus, the electronic module 100 is completed.

  In addition, in the manufacturing method of the electronic module 100 described above, the wall members 11a to 12f are joined to produce the wall portion 11, and then the wall portion 11 is joined to the substrate 1. The wall members 12a, 12c, and 12e may be bonded together, and the wall members 12b, 12d, and 12f may be bonded to the wall members 12a, 12c, and 12e bonded to the substrate 1 to form the wall portion 11.

[Second Embodiment]
FIG. 12 shows an electronic module 200 according to the second embodiment. However, FIG. 12 is a perspective view of a main part of the electronic module 200.

  The electronic module 200 has changed a part of the configuration of the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, the wall portion 11 is formed by joining the wall members 12a to 12f, and the wall portion 11 is annularly closed in a plan view. The electronic module 200 changes this, and in the wall portion 31 configured by joining the wall members 32a to 32f, the wall member 32f and the wall member 32a are not joined, and the wall portion 31 is not annular. .

  Thus, the wall portion does not have to completely surround the region where the electronic component is mounted.

[Third Embodiment]
FIG. 13 shows an electronic module 300 according to the third embodiment. However, FIG. 13 is a perspective view of a main part of the electronic module 300.

  The electronic module 300 has also changed a part of the configuration of the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, the wall portion 11 is formed by joining the wall members 12a to 12f, and the wall members 12a to 12f are all the same height. In the electronic module 300, this is changed, and the wall portion 41 in which the wall members 42a to 42e are annularly joined is formed on the upper main surface 1T of the substrate 1, but the height of the wall member 42a is changed to the wall members 42b to 42e. Half of the height. And the wall member 42a was joined between the wall member 42b and the wall member 42e, while providing the clearance gap C between the upper main surfaces 1T of the board | substrate 1. FIG.

  As described above, the shape and dimensions of the wall member can be arbitrarily changed.

[Fourth Embodiment]
In FIG. 14, the wall member 62a used for the electronic module 400 concerning 4th Embodiment is shown. However, FIG. 14 is a perspective view of the wall member 62a.

  In the electronic module 100 according to the first embodiment, the third ground junction electrode 16G and the fourth ground junction electrode 17G are electrically connected by the via electrode 22. In the electronic module 400, this is changed, the side electrode 65 is formed on the side surface of the wall member 62a, and the ground third junction electrode 16G and the ground fourth junction electrode 17G are electrically connected by the side electrode 65. did.

  Thus, side electrodes may be used for the wiring formed on the wall member.

[Fifth Embodiment]
FIG. 15 shows an electronic module 500 according to the fifth embodiment. However, FIG. 15 is a cross-sectional view of a main part of the electronic module 500.

  The electronic module 500 has also changed a part of the configuration of the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, one stepped portion 13 is provided at the end of each of the wall members 12a to 12f. In the electronic module 500, this is changed, and two step portions 63 are formed at the end of the wall member 62a and the end of the wall member 62b, respectively.

  In the electronic module 500, as can be seen from FIG. 15, a plurality of systems (two systems) of wiring can be provided on the wall members 62a and 62b.

[Sixth Embodiment]
FIG. 16 shows an electronic module 600 according to the sixth embodiment. However, FIG. 16 is a cross-sectional view of a main part of the electronic module 600.

  The electronic module 600 has also changed a part of the configuration of the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, a simple one-step portion 13 is provided at the end of each of the wall members 12a to 12f. In the electronic module 600, this is changed, and key-shaped two-stepped portions 73 are formed at the end of the wall member 72a and the end of the wall member 72b, respectively.

  In the electronic module 600, the wall member 72a and the wall member 72b are joined more firmly.

[Seventh Embodiment]
FIG. 17 shows an electronic module 700 according to the seventh embodiment. However, FIG. 17 is a front view of the electronic module 700.

  The electronic module 700 also changes the configuration of the electronic module 100 according to the first embodiment. Specifically, in the electronic module 100, the wall portion 11 is joined to the substrate 1, and the top plate 18 is joined to the wall portion 11. The electronic module 700 changes this, joins the wall 11 to the substrate 1, joins the second substrate 81 to the wall 11, joins the second wall 91 to the second substrate 81, and connects the second wall 81. The third substrate 82 is bonded to 91, the third wall portion 92 is bonded to the third substrate 82, and the top plate 18 is bonded to the third wall portion 92.

  Thus, if the wall part of this invention is used, an electronic module can be multilayered and it can contribute to high functionality of an electronic module.

  The electronic modules 100, 200, 300, 400, 500, 600, and 700 according to the first to seventh embodiments have been described above. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.

  For example, in the electronic module 100, the bonding electrode 14 or the signal bonding electrode 14S is formed in the step portion 13 of the wall members 12a to 12f, but the ground electrode is replaced with the bonding electrode 14 and the signal bonding electrode 14S. A ground bonding electrode 14G used for wiring to the wiring may be formed.

  Further, in the electronic module 100, the shield electrode 15 is formed on the wall 11 and the shield electrode 20 is formed on the top plate 18. However, the shield electrodes 15 and 20 are not essential in the present invention and are omitted. It is also possible.

  In the electronic module 100, the top plate 18 is joined to the top surface 11T of the wall portion 11. However, the joining of the top plate 18 to the top surface 11T of the wall portion 11 is stopped, and instead the annular wall portion is joined. 11 may be filled with resin or the like.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 1B ... Lower main surface 1T ... Upper main surface 2 ... External electrode 3 ... Wall part formation area 4 ... Land electrode 5 ... Ground potential electrode 6 ... Second junction electrode 6S ... Signal second junction electrode 6G ... Ground second junction electrode 7, 8, 9, 10 ... Electronic component 11, 31, 41 ... Wall 11B -Bottom surface 11T ... Top surfaces 12a-12f, 32a-32f, 42a-42e, 62a, 62b, 72a, 72b ... Wall members 13, 58, 63, 73 ... Step part 14 ... Joining electrode 14S... Signal junction electrode 15, 20... Shield electrode 16... Third junction electrode 16S... Signal third junction electrode 16G. Junction electrode 17G ... Ground fourth junction electrode 18 ... Top plate 18B ... Lower main surface 8T ... upper main surface 19 ... fifth junction electrode 19G ... fifth fifth junction electrodes 21, 22 ... via electrode 23 ... interlayer electrode 23G ... ground interlayer electrode 65 ... Side electrode 81 ... second substrate 82 ... third substrate 91 ... second wall 92 ... third wall

Claims (19)

A substrate having a pair of major surfaces;
An electronic component mounted on at least one main surface of the substrate;
An electronic module comprising: a wall portion formed on at least one main surface of the substrate;
The wall is made of ceramic;
The wall includes a bottom surface facing the substrate, a pair of side surfaces, and a top surface;
An electronic module in which the wall portion is formed by joining a plurality of wall members. A joining electrode is formed on each of the two wall members to be joined,
The electronic module according to claim 1, wherein the two wall members are joined by joining the joining electrode of one of the wall members and the joining electrode of the other wall member. A step portion is formed on at least one of the two wall members to be joined,
The electronic module according to claim 2, wherein the bonding electrode is formed on the stepped portion. The step portions are respectively formed on the two wall members to be joined,
The electronic module according to claim 3, wherein the bonding electrode is formed at each of the step portions of the two wall members.   5. The electronic module according to claim 3, wherein the stepped portion includes a surface parallel to the bottom surface and the top surface of the wall portion, and the bonding electrode is formed on the surface.   The electronic module according to claim 3, wherein the step portion includes a plurality of steps.   The electronic module according to claim 1, wherein the bonding electrode is a bump.   The electronic module according to claim 1, wherein the bonding electrode is also used for electrical connection.   The electronic module according to claim 1, wherein the wall member has a multilayer structure in which ceramic layers are laminated.   The electronic module according to claim 9, wherein the ceramic layer is laminated in parallel with the bottom surface and the top surface of the wall portion. A second bonding electrode is formed on the main surface of the substrate;
11. The electronic module according to claim 1, wherein a third bonding electrode for bonding to the second bonding electrode is formed on a bottom surface of the wall member facing the substrate.   The electronic module according to claim 11, wherein the second bonding electrode and the third bonding electrode are also used for electrical connection.   The electronic module according to any one of claims 1 to 12, wherein a top plate is attached to the top surface of the wall portion so as to cover the electronic component. The top plate is a metal plate, a ceramic plate on which a shield electrode is formed, or a resin plate on which a shield electrode is formed,
A fourth bonding electrode is formed on the top surface of the wall member facing the top plate,
The electronic module according to claim 13, wherein at least one fourth joining electrode is electrically connected to the metal plate, the shield electrode of the ceramic plate, and the shield electrode of the resin plate.   The electronic module according to claim 1, wherein wiring is formed on the wall member.   The electronic module according to claim 15, wherein the wiring includes a via electrode.   The electronic module according to claim 14 or 16, wherein the wiring includes a side conductor formed on a side surface of the wall member. The wall member has a multilayer structure in which ceramic layers are laminated,
The electronic module according to claim 15, wherein the wiring includes an interlayer electrode formed between layers of the ceramic layer. A shield electrode is formed on at least one side surface of the wall member,
The electronic module according to claim 15, wherein the shield electrode is connected to the wiring.

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