JP2002252438A - Board fixing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board fixing structure by which costs and man-hours for assembly are reduced, a space for mounting parts can be effectively used and high resistance to vibrations can be obtained. SOLUTION: The board fixing structure is composed of fixing at least one upright sub board 2 to the surface of a main board 1 and electrically connecting the sub board 2 and the main board 1. The structure is provided with a board holder 30 having fixing members 32a and 32b for holding the sub board 2 and being fixed to the main board 1 and holder supporters 12a and 12b which are placed on the side of the main board 1 and support the board holder 30 by the fixing members 32a and 32b. The sub board 2 can be fixed to the main board 1 while being supported by the board holder 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board mounting structure for mounting at least one sub-board on a main board in an upright state.

[0002]

2. Description of the Related Art Various sizes of boards are mounted inside electronic devices such as audio devices. Each of the substrates may be used alone, or the other substrate may be connected to a certain substrate in a state of being set up vertically. FIG.
FIG. 3 is a diagram showing a state in which another board 2 (called a sub board 2) is vertically connected to a surface of a board 1 (called a main board 1) via connectors 3a and 3b.

In order to obtain the state shown in FIG. 8, the connector 3a is attached to the main board 1 by soldering, etc.
It is necessary to attach the other connector 3b to the side by soldering or the like. Next, the connector 3a and the connector 3b are connected. Thus, the main board 1 and the sub board 2 are electrically connected via the connectors 3a and 3b.

[0004]

However, the component cost of the connector is often higher than that of the board itself.
For this reason, if a connector is used to connect the boards, there is a problem that the price of electronic devices such as audio devices incorporating the boards increases. Further, a step of soldering the connector 3a and the connector 3b to the main board 1 and the sub-board 2, respectively, is required. Therefore, there is a problem that the number of assembling steps is increased.

Further, it is necessary to provide a space for mounting the connector 3a and the connector 3b on the main board 1 and the sub-board 2, respectively. For this reason, there is a restriction on the mounting position of another component or a restriction on the connection position between the substrates due to the space. As a result,
There is a problem that various restrictions arise in the design of the substrate. In particular, since the area of the sub-substrate 2 is often small,
It is difficult for the sub-board 2 to secure a space for mounting the connector 3b.

Further, a substrate used for a vehicle-mounted electronic device such as a car audio is required to have vibration resistance. For this reason, there is also a problem that a sufficient connection strength cannot be obtained by connecting the boards via the connectors 3a and 3b as described above. In addition, it is conceivable to further increase the connection strength by applying an adhesive to the contact surfaces between the substrates. However, since the bonding surface between the substrates is only the thickness portion of the sub-substrate 2, there is a problem in terms of durability against vibration generated by running of an automobile or the like.

[0007] In view of the above problems, an object of the present invention is to provide a substrate mounting structure capable of reducing costs and man-hours for assembling, effectively utilizing a space for mounting components, and obtaining high vibration resistance. I do.

[0008]

According to the present invention, at least one sub-board is attached to a main board in an upright state, and the sub-board and the main board are electrically connected. A substrate mounting structure for holding a sub-substrate and having a fixing member for fixing to the main substrate; and a holder supporting portion on the main substrate side for supporting the substrate holder by the fixing member. Is a substrate mounting structure that is configured to be fixed to the main substrate while being held by the substrate holder.

As described above, according to the present invention, the boards can be connected to each other without using an expensive connector requiring a large installation space, so that cost can be reduced and a space for mounting parts can be effectively used. Since the size of the substrates and the connection positions between the substrates are not restricted by the connectors, the degree of freedom in designing the substrates can be increased.
After the sub-board is attached to the main board, the sub-board is held by the board holder, so that the sub-board is securely held in a stable state at the mounting position,
It is rarely affected by external forces such as vibration.

In another aspect of the invention, the holder support portion is a holder support hole penetrating the main board or a holder support recess recessed when viewed from the mounting direction of the sub-board, and the fixing member is provided in the holder support hole or the holder support recess. The board mounting structure has an engaging projection that engages. For this reason, a substrate mounting structure can be manufactured at lower cost than providing a convex portion on the main substrate side and a concave portion on the substrate holder side.

In another aspect of the present invention, a substrate mounting structure is provided in which a substrate holder has a substrate holding groove for holding a part of a sub-substrate. For this reason, when attaching the sub-board to the main board, the sub-board can be attached while being held firmly. Further, even after the attachment, the connection between the sub-board and the main board becomes strong.

Another aspect of the present invention is a substrate mounting structure provided with a substrate holder and an arm for fixing the sub-substrate to the upper end of the sub-substrate held in the substrate holding groove along the thickness direction of the upper end. I am trying to do it. Therefore, after the sub-board is attached to the main board, the connection between the sub-board and the main board is further strengthened.

In another aspect of the invention, a substrate mounting structure having a sub-substrate support groove or a sub-substrate support hole for inserting and fixing a lower end portion of a sub-substrate to a main substrate is provided. For this reason, the mounting position of the sub-board is determined by itself. Thus, if the sub-substrate is mounted on the main substrate while being held by the substrate holder, the mounting position of the sub-substrate relative to the main substrate is automatically determined. In addition, when the subsequent soldering process is performed, the sub-board is fixed to the main board at a fixed position by the board holder. For this reason, the soldering work is facilitated, and the efficiency of the assembling work can be improved. Thus, the efficiency of the assembling work can be greatly improved.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a substrate mounting structure according to the present invention.

FIG. 1 shows a first embodiment of the substrate mounting structure of the present invention.
FIG. 2 is an exploded perspective view showing the embodiment. Also, FIG.
It is a perspective view showing the completion state of attachment of a 1st embodiment of a substrate attachment structure. The substrate mounting structure of the present invention,
As shown in FIGS. 1 and 2, the structure is such that the sub-board 2 is connected to the surface of the main board 1 at right angles via the board holder 30. Hereinafter, this structure will be described in detail.

In FIG. 1, a connection terminal portion 11 for making an electrical connection to the sub-board 2 is formed on the main board 1 side. The main board 1 has a holder support hole 12 serving as a holder support for supporting the board holder 30.
a and 12b are provided. On the other hand, on the sub-substrate 2,
The connection terminal portion 21 is formed so as to correspond to the connection terminal of the connection terminal portion 11 formed on the main substrate 1. Thus, when the sub-board 2 is mounted at right angles to the main board 1, the connection terminals of the connection terminal 21 and the connection terminal 11 come into contact. The holder support hole 1
Instead of 2a and 12b, a concave portion (holder supporting concave portion) that does not penetrate the back side of the main substrate 1 may be used.

On the other hand, a substrate holder 30 made of a material such as a synthetic resin includes a frame portion 31 for holding the sub-substrate 2,
Holder support holes 12a, 12b provided in main board 1
And claw portions 32a and 32b as engaging projections (an embodiment of a fixing member) that respectively engage with the projections 32a and 32b. Frame part 3
Reference numeral 1 denotes substrate holding grooves 31a and 31b each having a U-shaped cross section capable of sandwiching an end portion of the sub-substrate 2 (in this embodiment, left and right end portions of the sub-substrate 2). The sub-board 2 is held by the board holder 30 by inserting both end portions of the sub-board 2 into the board holding grooves 31a and 31b.

The claw portions 32a and 32b are provided so as to protrude downward from lower end portions on both sides of the frame portion 31.
The claw portions 32a, 32b can bend in the directions indicated by arrows xx ', respectively. For this reason, when the tips of the claws 32a and 32b of the frame 31 are aligned with the holder support holes 12a and 12b provided in the main board 1 and the board holder 30 is pushed down from above, the slopes 33a and 33 are formed.
b contacts the sides of the holder support holes 12a and 12b. As a result, the claw portions 32a and 32b are each bent inward (in the direction of the arrow x 'in the drawing) by their elastic force.

The pressing force is released when the slopes 33a and 33b have passed the ends. Then, the claw portions 32a and 32b are engaged with the holder support holes 12a and 12b by the restoring force of the claw portions 32a and 32b outward (in the direction of the arrow x in the drawing), and the state shown in FIG. 2 is obtained. In this way, the engagement of the claws 32a, 32b with the holder support holes 12a, 12b of the main board 1 restricts the upward and leftward movement of the board holder 30. The downward movement of the substrate holder 30 is caused by the claw portions 32a, 32
It is regulated by steps 34a and 34b provided at the base of b.

FIG. 3 is a view of the state of FIG. 2 viewed from a plurality of directions. 3A is a front view of FIG. 2, FIG. 3B is a plan view of FIG. 2, and FIG. 3C is a rear view of FIG. The same parts as those in FIG. 2 are denoted by the same reference numerals. In FIGS. 3B and 3C, an accessory 35 such as an LED (light emitting diode) is attached to the back (back) side of the sub-board 2. When performing such an attaching operation, the attaching operation may be performed with an adhesive applied to a contact surface of the sub-substrate 2 with the main substrate 1. Thereby, the connection strength between the two can be further strengthened in the connection state shown in FIG.

After being mounted in the state shown in FIG. 2, the contact portions of the connection terminal portions 21 on the sub-board 1 side and the connection terminal portions 11 on the main board 1 side are soldered, so that the The electrical connection of the substrate 1 is made,
The work of attaching both ends.

As shown in FIG. 3B, the substrate holder 30 has a thickness t1 of the entire portion for holding the sub-substrate 2.
If the thickness is made approximately the same as or slightly greater than the thickness t2 when the accessory 35 such as an LED is attached to the sub-board 2, the accessory 35 can be protected. That is, as shown in FIG. 2, when performing some assembly process after attaching the sub-board 2 to the main board 1, it is difficult for an operator's hand or the like to directly touch the accessory 35. For this reason, damage to the accessory 35 can be prevented.

Further, as shown in FIG.
0 may be set in a direction opposite to the direction shown in FIG. That is, the substrate holder 30 may be set on the main substrate 1 such that the substrate holding grooves 31a and 31b are behind the connection terminals 11. In this case, the thickness t3 of the frame portion 31 above the substrate holder 30 is changed to the thickness t4 of the accessory 35 itself.
If the thickness is as large as or slightly larger than the above, the accessory 35 can be protected.

Next, a second embodiment of the substrate mounting structure of the present invention will be described with reference to FIG. In addition,
The same members as those in the first embodiment are denoted by the same reference numerals.

As shown in FIG. 5, there is a case where the two sub-boards (the sub-board 2 and the sub-board 4) are connected to the main board 1 at right angles so as to be L-shaped.
In this case, as the substrate holder 30, an L-shaped substrate holder 30 as shown in FIG. 5 may be created, and each of the sub-substrates 2 and 4 may be held by the L-shaped substrate holder 30. The method of attaching the two sub-boards 2 and 4 to the main board 1 using the board holder 30 may be performed according to the procedure according to the first embodiment.

In order to electrically connect the newly provided sub-board 4 to the main board 1, connection terminals 13 for the sub-board 4 are formed on the main board 1 side.
On the other hand, a connection terminal portion 41 is formed on the sub-substrate 4. Further, substrate holding grooves 31c and 31d for holding the sub-substrate 4 are formed in the substrate holder 30. In addition to the claw portions 32a and 32b, another claw portion 32c is formed, and holder support holes 12a, 12b and 12c corresponding to the respective claw portions 32a, 32b and 32c are formed on the main board 1 side. Is formed. As described above, the present invention can correspond to various shapes of the sub-substrate.

Note that the present invention is not limited to the above-described first and second embodiments. For example, as shown in FIG. 6, a protrusion 22 is formed on an end of the sub-board 2 on the side where the sub-board 2 is attached to the main board 1, and
A sub-substrate support hole 14 into which the protrusion 22 of the sub-substrate 2 can be fitted may be formed on the side. Then, a connection terminal portion (not shown) is formed on the back surface side of the main substrate 1, and the projection 22 of the sub-substrate 2 is fitted and attached to the sub-substrate support hole 14 of the main substrate 1. The connection terminal 11 of the main board 1 and the connection terminal 21 of the sub board 2 may be soldered from the back surface of the substrate. The sub-substrate support hole 14
Instead, a concave portion (sub-substrate support groove) that does not penetrate to the back side of the main substrate 1 may be used. Further, even in the example shown in FIG. 5, the above structure can be adopted.

The procedure for attaching the sub-board 2 to the main board 1 is not limited to the above-described embodiments. That is, in each of the above embodiments,
The sub substrate 2 held by the substrate holder 30 is attached to the main substrate 1. However, the substrate holder 30 may be attached after the sub-substrate 2 is first positioned on the main substrate 1.

Specifically, first, the sub-substrate 2 is positioned vertically at a predetermined position on the main substrate 1. In this state, the substrate holder 30 is attached so as to cover the sub-substrate 21. At this time, the frame portion 31 is slid downward from above so that both sides of the sub-board 2 enter the substrate holding grooves 31a and 31b of the frame portion 31. Next, the tips of the claws 32 a and 32 b protruding from the lower end of the frame 31 are inserted into holder support holes 12 a and 12 b provided in the main board 1. In this state, the frame part 31 is further pushed down. Lastly, after the state shown in FIG.
1 and the connection terminal 21 of the sub-board 2 are soldered. Note that an adhesive may be applied to a contact surface of the sub substrate 2 with the main substrate 1.

The angle at which the sub-board 2 is erected on the main board 1 is not limited to the case where it is perpendicular to the surface of the main board 1. It may be oblique. Further, as shown in FIG. 1, the substrate holder 30 does not have to have a shape that holds the sub-substrate 2 on both sides. In order to secure the holding of the sub-board 2, as shown in FIG. 7, an arm section 36 is provided on the board holding frame 31, and the arm section 36 sandwiches the vicinity of the center of the upper end of the sub-board 2. Is also good. Further, a hole or a groove may be provided as a fixing member of the substrate holder 30, and a convex portion may be provided on the main substrate 1 as a holder supporting portion.

[0031]

According to the present invention, it is possible to provide a substrate mounting structure capable of reducing costs and man-hours for assembling, effectively utilizing a space for mounting components, and obtaining high vibration resistance.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view for explaining a first embodiment of a substrate mounting structure according to the present invention.

FIG. 2 is a perspective view showing a completed state after the sub-board is attached to the main board in FIG.

3A is a view showing a state after the sub-board shown in FIG. 2 is attached to a main board, viewed from a plurality of directions. FIG.
2B is a plan view of FIG. 2, and FIG. 3C is a rear view of FIG.

FIG. 4 is a diagram showing a substrate mounting structure in which a substrate holder is set in the direction opposite to that of FIG. 2;

FIG. 5 is an exploded perspective view for explaining a second embodiment of the substrate mounting structure according to the present invention.

FIG. 6 is a diagram illustrating an example in which the method of connecting the connection terminals on the sub-board side and the connection terminals on the main board shown in FIG. 1 is changed.

FIG. 7 is a view for explaining a modification of the substrate holder, taking the mounting state shown in FIG. 2 as an example.

FIG. 8 is a diagram for explaining an example of connection between boards using a conventional connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main board 2 Sub board 12a Holder support hole (holder support part) 12b Holder support hole (holder support part) 12c Holder support hole (holder support part) 14 Sub board support hole 30 Substrate holder 31 Frame part 31a Substrate holding groove 31b Substrate Holding groove 32a Claw (engaging projection, fixing member) 32b Claw (engaging projection, fixing member) 32c Claw (engaging projection, fixing member) 36 Arm

Claims (5)

[Claims] 1. A board mounting structure in which at least one sub-board is mounted upright on a surface of a main board to electrically connect the sub-board and the main board. A substrate holder having a fixing member fixed to the main substrate; and a holder supporting portion on the main substrate side, the holder supporting the substrate holder by the fixing member, wherein the sub-substrate is held by the substrate holder. A board mounting structure characterized in that the board mounting structure can be fixed to the main board in a state where the board is mounted. 2. The holder support portion is a holder support hole penetrating through the main board or a holder support recess recessed when viewed from a mounting direction of the sub-board, and the fixing member is the holder support hole or the holder support recess. 2. The board mounting structure according to claim 1, wherein said board mounting structure is formed as an engaging projection which engages with said board. 3. The substrate mounting structure according to claim 1, wherein said substrate holder has a substrate holding groove for holding a part of said sub-substrate. 4. An apparatus according to claim 1, wherein said substrate holder has an arm portion for fixing an upper end of said sub-substrate held in said substrate holding groove along a thickness direction of said upper end. Item 3. The substrate mounting structure according to Item 3. 5. A sub-board supporting groove or a sub-board supporting hole for inserting and fixing a lower end portion of the sub-board in the main board. The board mounting structure described in the above.